DE19957609A1 - Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them - Google Patents

Abstract

The method involves first introducing conducting bodies between the connection contacts and then pressing the module, conducting body and component together. The conducting body (16,17) is arranged in a compressible fixing structure (10) for introduction between the module (25) and the electronic component (26). An Independent claim is also included for a chip card produced with the method.

Description

The invention is based on the production of a portable function unit with at least two components to be electrically connected. Function Units of this type are in the form of contactless chip cards customary, in the manufacture of which a module, in which a chip is located, is to be connected to an antenna prepared in a card body. On process suitable for establishing the electrical connection is from EP-A-512 546. Between the contacts to be connected nes chips and a circuit board is then a so-called anisotropic guide brought glue, d. H. a hot melt adhesive resin, wherein Leitkör are dispersed by. The chip is then pressed against the circuit board the resin will be heated immediately. Pressure continues until the Chip is only separated from the board by the lead body and the Lead body electrically connect the chip to the board. To do this in the con clock area between the chip and the circuit board as little contact wi to maintain the state without running the risk of spreading over an unfavorable Conductor distribution Short circuit current paths to neighboring contact surfaces Chen form, the conductive bodies are dispersed in the resin in microcap included, soft in the unprocessed state as an electrical isola gates appear. To form an electrically conductive connection the microcapsules are destroyed, thereby releasing the lead body become. The microcapsule concept provides a connection with very good anisotropic behavior, d. H. it reliably avoids the formation of unwanted short circuit current paths. It also allows for a large Microcapsule density the making of electrical connections with ge low contact resistance. However, the concept requires an elaborate process Production of suitable microcapsules, whereby the process in total velvet becomes complex.  

The invention has for its object a method for manufacturing a simultaneously adhesive and electrically conductive connection between to specify two components of a portable data carrier, the one with gerin is feasible according to the effort, but still a high short-circuit protection guaranteed as well as a low contact resistance.

This object is achieved by a method with the features of Main claim. According to the invention, a reliable electrical ani Sotropy achieved by defining guiding bodies on a compressible, elastic fixed structure and processed in a fixed form become. The guide body can be conductive towards the outside. Measure to prevent electrical wiring due to touch conditions with another guide body are not required. Particularly advantageous the contact consisting of guide bodies and fixation structure becomes sticky rurlgsmaterial provided in the form of a film. Such a film can be in a variety of existing manufacturing processes without this requires retrofitting to the existing manufacturing facilities are.

In an advantageous embodiment of the method according to the invention elastic guide bodies are used, who deform the contact surfaces to be electrically connected the, while the contours of the opposite Kon adjust tactical areas. In a simple way, it can even with bezo a large contact area on the fixation structure of low guide body density achieve the contacts to be connected. In support of Application, it can also be advantageous to be both elastic and rigid Provide guide body. The latter then define the final distance between  the contact surfaces to be connected or the degree of deformation of the elastic guide body.

According to a further advantageous embodiment of the proposed Ver driving is the contact made of guide bodies and fixation structure material covered with an adhesive layer, which between fixation structure and adjacent contact surface brings about an adhesive bond. Both surfaces of the contacting material with Kle are expedient provide layers and the entire arrangement is in the form of a fil mes before. In an advantageous further development, this is initially applied over the entire area applied adhesive layer at the locations before installation in the data carrier, where it lies on a contact surface in the installed state. There by additionally ensures that the contact between the guide body and adjacent contact area are not affected by adhesive material becomes.

With reference to the drawing below are execution examples of the invention explained in more detail.

Show it:

Fig. 1 shows a cross section through a consisting of a fixing structure, and is arranged therein baffles contacting material,

Fig. 2 shows the use of a bonding material prepared for producing a portable data carrier,

Figure 3 connecting contacts,. A cross section through two means of the proposed PLEASE CONTACT approximately materials associated

Fig. 4 shows a cross section through a formed with elastic guide bodies contacting material,

Fig. 5 is a cross-sectional view of an image formed with elastic and rigid baffles contacting material,

Fig. 6 is a duplex formed by applying adhesive films Kon taktierungsmaterial in cross-section,

Fig. 7 is a formed with adhesive layers contacting material after removing the adhesive layer in the region of the connection contacts,

Fig. 8 shows a functional configuration of the terminal contacts,

Fig. 9 shows a variant of the design according to Fig. 8,

Fig. 10 shows a cross section through a recess in the basic body of a portable data carrier with erhabenenen terminal contacts,

Fig. 11, the recess in plan view.

Before the components to be connected are brought together, a contacting material is produced in a preparatory process section by arranging guide bodies in a fixing structure. Fig. 1 shows a cross section through a provided in flat form, from a fixing structure 10 with guide bodies 16 , 17 formed therein Kontaktie approximately material. The guide bodies 16 , 17 are formed by pellet-like, pourable cubes made of electrically conductive material. You can be massive leads or, as shown in Fig. 1, consist of a hollow or insulating core 11 which is encased by a sheath 12 made of electrically conductive material. The guide bodies 16 , 17 expediently have a rotationally symmetrical geometry. The fixing structure 10 consists of a white chen, electrically insulating material, which is preferably compressible to a dimension corresponding to the dimension of the smallest guide body 16 . It preferably also shrinks when there is sufficient heat input and behaves elastically. In an expedient embodiment, the fixing structure 10 consists of an adhesive material. The finished contacting material formed from fi xing structure 10 and guide bodies 16 , 17 is preferably provided in film form.

In the production of a contacting material film, the thickness h of the fixing structure 10 is dimensioned such that the guide body 17 with the greatest extension is securely surrounded on all sides by fixing structure material, ie that the relationship h <d _{max is} fulfilled. The guide bodies 16 , 17 are uniformly distributed over the surface of the fixing structure 10 , being approximately at the intersection points of an imaginary surface grid structure with an average grid spacing a. The distance a is dimensioned such that adjacent guide bodies 16 , 17 do not touch each other even if their actual positions in the surface of the fixing structure 10 deviate from an average target position due to production-related fluctuations. For a given surface position, a central position of the guide bodies 17 ; with respect to the thickness of the fixing structure 10 ; a position of a guide body 16 offset from the central plane of the fixing structure is also possible. In a first embodiment, on which FIG. 1 is based, the fixing structure 10 consists of an adhesive material, e.g. B. a hot gel adhesive.

Fig. 2 illustrates the use of a contact material executed in this way for the production of a portable data carrier which has an electronic component 26 in the form of an antenna and a module 25 to be contacted therewith. The module 25 contains a chip, by means of which a function that can be carried out with the data carrier is implemented. To prepare for production, a recess 24 is made in a base body 23 of the data carrier and is adapted to the module 25 to be inserted therein. In the recess 24 are openly accessible against connection contacts 21 of the arranged in the base body 23 elecron's component 26th

If the base body 23 is prepared, the module 25 to be inserted into the portable data carrier is fastened to a module belt 22 in such a way that the module-side electrical connecting contacts 20 for making an electrical connection to the electronic component 26 are openly accessible. The contacting material present in film form is subsequently applied to the module outer surface 27 containing the contacts. The application is done so that the contacts 20 and preferably the entire installation side 27 are covered with contact material.

The module 25 coated with contact material is then punched out and inserted in a subsequent processing step into the recess 24 in the base body 23 . The insertion is carried out so that the module-side connection contacts 20 with the interposition of the contact material approximately located in the base body 23 Gegenanschlußkontak th 21 of the electronic component 26 opposite. Subsequently, the base body 23 with the inserted module 25 is subjected to a hottest pel step in order to implant the module 25 into the base body 23 . The contacting material is heated and pressurized at the same time. As a result of the supply of heat, the material of the fi xing structure 10 softens, and the pressure exerted at the same time compresses it. The application of pressure is continued until the fixing structure material located above and below the conductive bodies 16 , 17 is displaced and the conductive bodies have physical contact to the module-side and the base body soapy connection contacts 20 , 21 by 16 , 17 , ie until the connection contacts 20 , 21 opposite each other with a distance b that is not greater than the extent of the largest guide bodies 17 present . Fig. 3 shows in cross section the resulting structure after a functional unit in the region of mutually corresponding connection contacts 20, 21 of module 25 and electronic component 26.. At the contact surfaces between guide bodies 17 and connection contacts 20 , 21 , the material of the fixing structure 10 is completely displaced, between the guide bodies 17 and connection contacts 20 , 21 there is an electrically conductive connection. As indicated in Fig. 3, the guide body 17 may have partially penetrated into the component-side or card-side connection contacts. In the areas between the guide bodies 17, the fixing structure 10 has an adhesive effect and forms a firm connection between module 25 and base body 23 .

In order to obtain a particularly good electrical connection with low contact resistance between guide bodies 16 , 17 and contact connection surfaces 20 , 21 , it is expedient to design the surface of the guide bodies 16 , 17 to be non-adhesive, so that the material of the fixing structure 10 has no connection with the guide bodies 16 , 17 is received. It also makes sense to manufacture the guide bodies 16 , 17 from a material that has a higher coefficient of thermal expansion than the material of the fixing structure 10 . Terminal contacts 20 , 21 and fixing structure 10 are thereby displaceable around the guide body 16 , 17 , so that the following electrical connection between the contact connection surfaces 20 , 21 via the guide body 16 , 17 also results in a re generated, for example, by a bend in the base body relative movement of the contact pads against each other reliably he remains.

A further increase in contact security can be achieved in that the guide body 17 , as illustrated in Fig. 4, made elastically who. When the module 25 is implanted, the connection contacts 20 , 21 are then pressed against one another up to a distance c that is smaller than the mean largest dimension d of the guide body 17 . Due to their adaptability, elastic guide bodies 17 form in comparison to rigid size re contacting surfaces for the connection contacts 20 , 21 .

Advantageously, can also, as shown in Fig. 5, elastic and rigid guide body 16, using 17 together. The rigid guide body 16 define the distance e to which the contacts 20 , 21 are brought together during hot stamping. The arrangement of rigid guide bodies 16 between elastic ones ensures that the elastic guide bodies 17 are not excessively compressed and destroyed during hot stamping.

In an alternative embodiment of the proposed method, a material is used for the fixing structure 10 which is not in itself suitable for forming a good adhesive bond. To achieve an adhesive effect, the fixing structure 10 after the introduction of the Leitkör by 16 , 17 is therefore, as shown in Fig. 6, coated on one or both sides with adhesive layers 13 , 14 . Their composition is matched to the contact contacts 20 , 21 in each case to be connected, and the adhesive layers 13 , 14 can in particular be of different types. Their strength is dimensioned so that when a module 25 is implanted in a base body 23 it is ensured that the adhesive layers 13 , 14 are completely displaced from the spaces between the guide bodies 16 , 17 and connection contacts 20 , 21 during hot stamping. To support the displacement and to ensure electrical contacting, it is further advantageous, as shown in FIG. 7, to keep the areas 15 , which in the end stood between the connection contacts 20 , 21 , free of adhesive and accordingly the application of adhesive material there not at all. For this purpose, the adhesive material is preferably in film form and is punched out locally. Alternatively, adhesive layers 13 , 14 are first applied over the entire surface, then locally removed again.

An increase in the reliability of contact can also be achieved by a particularly suitable design of the connecting contacts 20 , 21 , as illustrated in FIGS. 8 and 9. At least one of the contact contacts 21 to be contacted is raised, in the form of a step 30 on a substrate 28 , which is expediently not itself electrically conductive. The raised arrangement of the connecting contacts 21 causes a partial pressure increase at the location of the stage 30 in the subsequent application of pressure to establish an electrical connection to the opposite connecting contacts 20 . The reliability speed of the electrical connection between the contacts 21 and 20 is thereby improved.

A particularly good result with regard to contact security can be achieved when using raised connection contacts in combination with a local removal of adhesive material at the contact locations, as indicated in FIG. 7.

The contact security can be further improved by additionally creating structures in raised connection contact surfaces 21 which bring about a defined position of the guide bodies 17 . Such structures 29 , as indicated in FIG. 9, may have a funnel shape or the shape of elongated depressions with a triangular cross section and may have been introduced into the connecting contacts 21, for example by laser ablation, etching or embossing.

Figs. 10 and 11 illustrate an implementation of the vorbeschriebe NEN terminal contact design of the example of a portable data carrier where, analogous to that indicated in Figure 2 arrangement, a -. Module is placed in a recess 24 in a body 23 - not shown. To establish an electrical connection between the module and Grundkör by 23 are in the recess 24 in the correct position to the module-side contacts corresponding counter-contacts 21st The Ge genanschlußkontakte 21 are raised against the immediate surrounding environment.

The majesty is achieved through a graded design of the recess 24 . For this purpose, the recess 24 is initially created, for example by milling, up to the height of a first step 30 . It is then deepened, leaving a web 43 in two separate sections 44 , 45 to the level of a second step 41 . The surface of the web 43 consists of electrically conductive material and forms the card-side counter terminal contacts 21st The material forming the web surface continues outside the recess 24 as a line connection 46 in the card body 40 . The center of step 41 is then deepened further to the level of a third step 42 , web 43 disintegrating into two sections. The result is a recess 24 with two low levels 41 , 42 and a two-part high level 43 starting from the first low level 41 . The sequence of processing steps assumed above for the development of the recess 24 is not mandatory. A recess with the same design can also be achieved by means of a modified processing sequence.

A module 25 can be inserted into the recess 24 , for example as described in connection with FIG. 2. The raised counter terminal contacts 21 ensure particularly reliable the establishment of an electrical connection between the module and the body-side counter terminal contacts 21st

The proposed method is particularly suitable for the production of portable data carriers, especially in the form of chip cards, is on these Application but not limited. Rather, it is in other processes can be used in which elements are structurally firm on the one hand and on the other are to be connected in an electrically conductive manner.

Claims (12)

1. A method for producing a simultaneously adhesive and electrically conductive connection between a module and an electronic component's, whereby in order to form the electrical connection between module and component between the respective connection contacts, first, guide bodies are brought in and the module, guide body and component are then pressed against one another, since characterized in that the guide bodies ( 16 , 17 ) for insertion between module ( 25 ) and electronic component ( 26 ) are arranged in a compressible fixing structure ( 10 ). 2. The method according to claim 1, characterized in that an adhesive is used as mate rial for the fixing structure ( 10 ). 3. The method according to claim 1, characterized in that for the manufacture of an adhesive effect between the fixing structure and connection contacts ( 20 , 21 ) on the fixing structure ( 10 ) with the guide bodies ( 16 , 17 ) a layer of adhesive material ( 13 , 14 ) applied becomes. 4. The method according to claim 3, characterized in that in the adhesive material layers ( 13 , 14 ) in the contact region of the Kontaktkon contacts ( 20 , 21 ) recesses ( 15 ) are generated. 5. The method according to claim 1, characterized in that two different types of pellet-like elastic cubes are used as the guide body ( 16 , 17 ) with respect to their elasticity behavior, the more elastic ones being larger than the less elastic ones. 6. The method according to claim 1, characterized in that first one of two connection contacts ( 20 , 21 ) to be connected in the form of a raised region ( 30 ) are formed on a substrate ( 28 ). 7. The method according to claim 6, characterized in that the erha bene connection contact area ( 30 , 21 ) has recesses ( 29 ) which define the position of the guide body ( 16 , 17 ). 8. The method according to claim 1, characterized in that the fixing structure ( 10 ) with the guide bodies ( 16 , 17 ) is provided in the form of a film. 9. Use of a method according to claim 1 for producing a a module with a chip and a component connected to it having portable data carrier. 10. The method according to claim 9, characterized in that the portable data carrier has a base body ( 23 ), in which a multi-stage recess ( 24 ) is introduced to accommodate the module, at least one stage ( 30 ) being raised against the immediate re Environment is running. 11. The method according to claim 9, characterized in that connection contacts ( 21 ) are formed on the raised step ( 30 ). 12. Chip card, produced by a method according to claim 1.