JPH08179348A - Liquid crystal element and its production - Google Patents
Liquid crystal element and its productionInfo
- Publication number
- JPH08179348A JPH08179348A JP32073794A JP32073794A JPH08179348A JP H08179348 A JPH08179348 A JP H08179348A JP 32073794 A JP32073794 A JP 32073794A JP 32073794 A JP32073794 A JP 32073794A JP H08179348 A JPH08179348 A JP H08179348A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- particles
- liquid crystal
- paste
- substrates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29399—Coating material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Liquid Crystal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は液晶を用いて光の透過を
制御する液晶素子およびその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal element which controls the transmission of light by using a liquid crystal and a manufacturing method thereof.
【０００２】[0002]
【従来の技術】液晶素子は、それぞれ透明電極を形成し
た一対の透明基板（ガラス基板またはフィルム基板）を
複数のスペーサを挟んで重ね合わせ、この両基板を枠状
のシール材を介して接合し、このシール材と両基板とで
囲まれる隙間内に液晶を封入してなる。2. Description of the Related Art In a liquid crystal device, a pair of transparent substrates (glass substrate or film substrate) each having a transparent electrode formed thereon are superposed with a plurality of spacers sandwiched therebetween, and these substrates are joined together through a frame-shaped sealing material. A liquid crystal is sealed in a gap surrounded by the seal material and both substrates.
【０００３】そして一方の基板の上には、他方の基板の
電極に通電するための導電部が設けられ、この導電部が
他方の基板の電極と対向して配置している。この導電部
は、例えば前記他方の基板の電極と駆動回路とを接続す
る端子であり、この端子と他方の基板の電極との対向間
に導通材として導電性ペーストが設けられ、この導電性
ペーストを介して前記端子と前記電極との導通が図ら
れ、一方の基板側から双方の基板の電極に電圧を印加し
て液晶を駆動することができるようになっている。On one of the substrates, a conductive portion is provided for energizing the electrode of the other substrate, and the conductive portion is arranged to face the electrode of the other substrate. The conductive portion is, for example, a terminal that connects the electrode of the other substrate to the drive circuit, and a conductive paste is provided as a conductive material between the terminal and the electrode of the other substrate, and the conductive paste is used. The terminals are electrically connected to the electrodes via the electrodes, and the liquid crystal can be driven by applying a voltage from one substrate side to the electrodes of both substrates.
【０００４】図４には、その基板間導通部分の構造を示
してあり、１および２が透明な基板で、これら基板１，
２にそれぞれ透明な電極３，４が形成され、さらに一方
の基板１に他方の基板２の電極４に対する駆動回路への
接続用端子５が形成されている。そして両基板１，２が
シール材６を介して互いに接合され、前記端子５と電極
４との対向間に導電性ペースト７が設けられている。FIG. 4 shows the structure of the conductive portion between the substrates, in which 1 and 2 are transparent substrates.
2, transparent electrodes 3 and 4 are formed respectively, and further, a terminal 5 for connecting to a drive circuit for the electrode 4 of the other substrate 2 is formed on one substrate 1. Both the substrates 1 and 2 are bonded to each other via a sealing material 6, and a conductive paste 7 is provided between the terminals 5 and the electrodes 4 facing each other.
【０００５】導電性ペースト７としては、銀ペーストに
代表される金属ペースト、あるいは樹脂ペーストが用い
られている。樹脂ペーストは、図５（Ａ）に示すよう
に、弾性変形が可能な微小な樹脂球１０の表面にＮｉ、
Ａｕ等の導電性薄膜１１をメッキ等の手法でコーティン
グした多数の導電粒子１２をペースト基材１３中に分散
させたものである。そしてこの樹脂ペーストを用いた場
合には、両基板１，２を接合したときの圧力で、図５
（Ｂ）に示すように、導電粒子１２がほぼ真円状態から
ほぼ楕円状態に弾性変形し、この変形で導電粒子１２の
表面の導電性薄膜１１が電極４および端子５に密着し、
この密着した導電性薄膜１１を介して電極４と端子５と
の電気的な導通が図られる。そして特にこの樹脂ペース
トの場合には、導電粒子１２が楕円状態に変形するた
め、導電性薄膜１１と電極４および端子５との密着接触
面積が拡がり、電極４と端子５との導通状態が安定する
利点がある。As the conductive paste 7, a metal paste typified by a silver paste or a resin paste is used. As shown in FIG. 5 (A), the resin paste contains Ni on the surface of the minute resin sphere 10 that is elastically deformable.
A large number of conductive particles 12 obtained by coating a conductive thin film 11 of Au or the like by a method such as plating are dispersed in a paste base material 13. When this resin paste is used, the pressure applied when the substrates 1 and 2 are bonded to
As shown in (B), the conductive particles 12 elastically deform from a substantially circular state to a substantially elliptical state, and the deformation causes the conductive thin film 11 on the surface of the conductive particles 12 to adhere to the electrodes 4 and the terminals 5.
Electrical conduction between the electrode 4 and the terminal 5 is achieved through the conductive thin film 11 that is in close contact. In particular, in the case of this resin paste, since the conductive particles 12 are deformed into an elliptical state, the contact area between the conductive thin film 11 and the electrodes 4 and the terminals 5 is expanded, and the conductive state between the electrodes 4 and the terminals 5 is stable. There is an advantage to
【０００６】[0006]
【発明が解決しようとする課題】ところが、導電粒子１
２の変形量が大きくなり過ぎると、液晶素子の製造工程
中や完成後の周囲の環境変化等により導電粒子１２の表
面の導電性薄膜１１にクラック等の欠陥が生じ、これが
原因で電極４と端子５との導通不良（抵抗変化）が発生
し、製造上の歩留りが低下してしまう。However, the conductive particles 1
If the deformation amount of 2 becomes too large, defects such as cracks occur in the conductive thin film 11 on the surface of the conductive particles 12 due to environmental changes in the manufacturing process of the liquid crystal element or after completion of the liquid crystal element, which causes the electrode 4 and Conduction failure (resistance change) with the terminal 5 occurs, and the manufacturing yield decreases.
【０００７】本発明はこのような点に着目してなされた
もので、その目的とするところは、上下基板導通材中に
含ませる導電粒子の変形量を適正な一定範囲に規制し
て、その表面の導電性薄膜にクラック等の欠陥が生じる
ことがないようにし、上下基板間の導通を安定して確保
できる液晶素子およびその製造方法を提供することにあ
る。The present invention has been made by paying attention to such a point, and an object thereof is to limit the deformation amount of the conductive particles contained in the upper and lower substrate conductive materials to an appropriate fixed range, and It is an object of the present invention to provide a liquid crystal element and a method for manufacturing the same in which defects such as cracks do not occur in the conductive thin film on the surface and the electric conduction between the upper and lower substrates can be stably ensured.
【０００８】[0008]
【課題を解決するための手段】本発明はこのような目的
を達成するために、所定の間隙を保って対向配置された
一対の透明基板と、前記一対の基板の各対向面にそれぞ
れ形成された透明電極と、前記一対の基板間の枠状シー
ル材で囲まれた空間内に封入された液晶と、前記一対の
基板の一方の基板に他方の基板の透明電極の一部分に対
向させて形成された導電部と、前記導電部と対向電極と
の間に介装された導通材とからなる液晶素子において、
前記導通材を、剛性粒子と、弾性変形可能な樹脂球に導
電性薄膜をコーティングしてなり弾性変形前の直径が前
記剛性粒子の直径よりも導電粒子とを、樹脂ペースト基
材に混合してなる導電性ペーストととしたものである。In order to achieve such an object, the present invention is formed on a pair of transparent substrates which are arranged to face each other with a predetermined gap therebetween, and on the respective facing surfaces of the pair of substrates. A transparent electrode, a liquid crystal enclosed in a space surrounded by a frame-shaped sealing material between the pair of substrates, and one of the pair of substrates facing a part of the transparent electrode of the other substrate. In a liquid crystal element consisting of a conductive part and a conductive material interposed between the conductive part and the counter electrode,
The conductive material, rigid particles, and a conductive thin film is formed by coating an elastically deformable resin sphere with a conductive thin film, and conductive particles having a diameter before elastic deformation that is larger than the diameter of the rigid particles are mixed with a resin paste base material. The conductive paste is as follows.
【０００９】そして、好ましくは、前記導電粒子の弾性
変形前の直径をＤ1 、前記剛性粒子の直径をＤ2 とした
とき、 0.8Ｄ1 ≦Ｄ2 ＜Ｄ1 の関係をみたすようにす
る。また前記剛性粒子は、液晶が封入される両基板間の
空間の高さと実質的に同一の直径とし、さらに前記剛性
粒子の材料を無機材料とする。Preferably, when the diameter of the conductive particles before elastic deformation is D1 and the diameter of the rigid particles is D2, the relationship of 0.8D1≤D2 <D1 is satisfied. The rigid particles have a diameter substantially the same as the height of the space between the substrates in which the liquid crystal is sealed, and the material of the rigid particles is an inorganic material.
【００１０】また本発明は、透明電極を形成した一対の
透明基板を枠状のシール材を介して互いに重合接着し、
その一方の基板の上には他方の基板の電極と対向する導
電部を設け、この導電部と前記電極との対向間に導電性
ペーストを設け、この導電性ペーストを介して前記導電
部を前記電極に導通させる液晶表示素子を製造する方法
であって、前記導電性ペーストは、ペースト基材中に、
樹脂球の表面に導電性薄膜をコーティングした導電粒子
と、この導電粒子よりも直径が小さい硬質の剛性粒子と
を分散させてなり、前記両基板を接合する際の圧力で前
記導電性ペーストの導電粒子を前記導電部とこれに対向
した前記電極とで挟圧して弾性的に変形させ、この変形
量を前記硬質の剛性粒子により規制し、前記変形させた
導電粒子の表面の導電性薄膜で前記導電部を前記電極に
導通させるようにしたものである。In the present invention, a pair of transparent substrates on which transparent electrodes are formed are polymerized and adhered to each other via a frame-shaped sealing material,
A conductive portion facing the electrode of the other substrate is provided on one of the substrates, a conductive paste is provided between the conductive portion and the electrode, and the conductive portion is formed through the conductive paste. A method of manufacturing a liquid crystal display element for conducting to electrodes, wherein the conductive paste is in a paste base material,
Conductive particles obtained by coating a conductive thin film on the surface of a resin sphere, and hard rigid particles having a diameter smaller than that of the conductive particles are dispersed, and the conductive paste is electrically conductive due to the pressure when joining the two substrates. The particles are elastically deformed by being sandwiched between the conductive portion and the electrode facing the conductive portion, the amount of this deformation is regulated by the hard rigid particles, and the conductive thin film on the surface of the deformed conductive particles is used. The conductive part is electrically connected to the electrode.
【００１１】[0011]
【作用】液晶素子を組み立てる際には、一方の基板の上
の所要部分にシール材を塗布し、また導電部の上に導電
性ペーストを塗布する。そしてこの基板の上に他方の基
板を重ね合わせて所定の圧力で押し付ける。この押し付
けによる圧力で前記導電性ペーストが一方の基板の導電
部と他方の基板の電極とで挟み付けられる。なお、前記
導電性ペーストは前記電極の上に塗布する場合であって
もよい。When assembling the liquid crystal element, the sealing material is applied to a required portion on one substrate, and the conductive paste is applied to the conductive portion. Then, the other substrate is superposed on this substrate and pressed with a predetermined pressure. The pressure caused by this pressing causes the conductive paste to be sandwiched between the conductive portion of one substrate and the electrode of the other substrate. The conductive paste may be applied on the electrodes.
【００１２】導電性ペースト中には導電粒子と剛性粒子
とが分散しているが、導電粒子の直径が剛性粒子の直径
よりも大きいから、その挟み付けによる圧力で導電性ペ
ースト中の導電粒子が押し潰されてほぼ楕円状態に弾性
変形する。しかし、導電粒子が一定量にまで変形する
と、前記導電部と電極との間隔が硬質の剛性粒子により
規制され、このため導電粒子の変形量は一定範囲内にと
どまり、導電粒子の過剰な変形が防止される。したがっ
て、導電粒子の表面の導電性薄膜にクラック等の欠陥が
生じることがなく、この導電性薄膜を介して前記導電部
と電極とが常に安定した状態で導通する。Although the conductive particles and the rigid particles are dispersed in the conductive paste, the diameter of the conductive particles is larger than the diameter of the rigid particles. It is crushed and elastically deformed into an almost elliptical state. However, when the conductive particles are deformed to a certain amount, the distance between the conductive portion and the electrode is regulated by the hard rigid particles, and therefore the amount of deformation of the conductive particles stays within a certain range, resulting in excessive deformation of the conductive particles. To be prevented. Therefore, a defect such as a crack does not occur in the conductive thin film on the surface of the conductive particles, and the conductive portion and the electrode are always electrically connected in a stable state via the conductive thin film.
【００１３】[0013]
【実施例】以下、本発明の実施例について図１ないし図
３を参照して説明する。図１にはアクティブマトリック
ス型の液晶表示素子の一部の構造を示してある。２１お
よび２２が対向配置されたガラス等からなる透明な基板
で、一方の基板２１の上に複数の透明な画素電極２３が
形成され、他方の基板２２の上（下面）に前記画素電極
２３のすべてに対向する透明な対向電極２４が形成され
ている。Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 shows a part of the structure of an active matrix type liquid crystal display device. 21 and 22 are transparent substrates made of glass or the like arranged opposite to each other, and a plurality of transparent pixel electrodes 23 are formed on one substrate 21, and the pixel electrodes 23 are formed on the other substrate 22 (lower surface). A transparent counter electrode 24 is formed so as to face all of them.
【００１４】なお、前記一方の基板２１の上には、図示
しないが前記各画素電極２３に対応する薄膜トランジス
タ（ＴＦＴ）と、これら薄膜トランジスタにゲート信号
を供給する複数のゲートラインおよびデータ信号を供給
する複数のデータラインが形成されている。Although not shown, thin film transistors (TFTs) corresponding to the pixel electrodes 23, a plurality of gate lines for supplying gate signals to these thin film transistors, and data signals are supplied on the one substrate 21. A plurality of data lines are formed.
【００１５】一方の基板２１と他方の基板２２は枠状の
シール材２５を介して互いに接合されている。そして両
基板２１，２２と前記シール材２５とで囲まれた空間内
に液晶が封入されるものである。The one substrate 21 and the other substrate 22 are bonded to each other via a frame-shaped sealing material 25. The liquid crystal is enclosed in the space surrounded by the substrates 21 and 22 and the sealing material 25.
【００１６】基板２２の上に形成された対向電極２４の
一部は端子２４ａとしてシール材２５の外側に突出し、
また基板２１の上にはシール材２５の外側において、導
電部として前記対向電極２４とその駆動回路（図示せ
ず）とを接続する端子２６が前記対向電極２４の端子２
４ａと対向して形成されている。そして対向電極２４の
端子２４ａと駆動回路の接続用の端子２６との間に、こ
れら両端子２４ａ，２６を電気的に導通させる導通材と
しての導電性ペースト２７が設けられている。A part of the counter electrode 24 formed on the substrate 22 protrudes outside the sealing material 25 as a terminal 24a,
On the outer side of the sealing material 25 on the substrate 21, a terminal 26 for connecting the counter electrode 24 and its drive circuit (not shown) as a conductive portion is provided as a terminal 2 of the counter electrode 24.
It is formed so as to face 4a. A conductive paste 27 is provided between the terminal 24a of the counter electrode 24 and the drive circuit connection terminal 26 as a conductive material for electrically connecting the terminals 24a and 26.
【００１７】この導電性ペースト２７は、図２（Ａ）に
示すように、樹脂からなるペースト基材２８中にそれぞ
れ複数の導電粒子２９と剛性粒子３０とをほぼ均等的に
分散させてなる。導電粒子２９は、適度な弾性を有する
微小な樹脂球２９ａの表面にメッキ等の手法でＮｉ、Ａ
ｕ等の導電性薄膜２９ｂをコーティングしてなる。ま
た、剛性粒子３０はシリカやグラスファイバー等の剛性
を有する硬質な無機材料で形成されている。そして導電
粒子２９の常圧下における直径をＤ1 、剛性粒子３０の
直径をＤ2 としたとき、Ｄ1 ＞Ｄ2 、好ましくはＤ1 ＞
Ｄ2 ≧ 0.8Ｄ1 としてある。As shown in FIG. 2A, the conductive paste 27 is composed of a paste base material 28 made of a resin, and a plurality of conductive particles 29 and rigid particles 30 dispersed therein substantially uniformly. The conductive particles 29 are formed by plating Ni or A on the surface of the minute resin spheres 29a having a proper elasticity.
It is formed by coating a conductive thin film 29b such as u. The rigid particles 30 are made of a rigid inorganic material such as silica or glass fiber. When the diameter of the conductive particles 29 under normal pressure is D1 and the diameter of the rigid particles 30 is D2, D1> D2, preferably D1>.
It is set as D2 ≥ 0.8D1.
【００１８】液晶表示素子を組み立てる際には、図２
（Ａ）に示すように、例えば一方の基板２１の上の所要
部分にシール材２５を塗布し、また端子２６の上に導電
性ペースト２７を塗布する。そしてこの基板２１の上に
他方の基板２２を重ね合わせて所定の圧力で押し付け
る。この押し付けによる圧力で前記導電性ペースト２７
が基板２２における対向電極２４の端子２４ａと、基板
２１における駆動回路接続用の端子２６とで挟み付けら
れる。When assembling the liquid crystal display device, as shown in FIG.
As shown in (A), for example, the sealing material 25 is applied to a required portion on one substrate 21, and the conductive paste 27 is applied to the terminals 26. Then, the other substrate 22 is superposed on this substrate 21 and pressed with a predetermined pressure. The pressure of this pressing causes the conductive paste 27
Is sandwiched between the terminal 24 a of the counter electrode 24 on the substrate 22 and the terminal 26 for connecting the drive circuit on the substrate 21.
【００１９】ここで、導電性ペースト２７中には導電粒
子２９と剛性粒子３０とが分散しているが、導電粒子２
９の直径Ｄ1 と剛性粒子３０の直径Ｄ2 との間にはＤ1
＞Ｄ2 の関係があり、したがってその挟み付けによる圧
力で図２（Ｂ）に示すように、導電性ペースト２７中の
導電粒子２９が押し潰されてほぼ楕円状態に変形する。Although the conductive particles 29 and the rigid particles 30 are dispersed in the conductive paste 27, the conductive particles 2
Between the diameter D1 of 9 and the diameter D2 of the rigid particle 30 is D1.
Therefore, as shown in FIG. 2B, the conductive particles 29 in the conductive paste 27 are crushed and deformed into an almost elliptical state due to the relationship of> D2.
【００２０】しかし、導電粒子２９が一定量にまで変形
すると、駆動回路接続用の端子２６と電極２４の端子２
４ａとの間の間隔が硬質の剛性粒子３０により規制さ
れ、このため導電粒子２９の変形量は一定範囲内にとど
まり、導電粒子２９の過剰な変形が防止される。However, when the conductive particles 29 are deformed to a certain amount, the terminals 26 for connecting the drive circuit and the terminals 2 of the electrodes 24 are connected.
The space between the conductive particles 29 and 4a is regulated by the hard rigid particles 30. Therefore, the amount of deformation of the conductive particles 29 remains within a certain range, and excessive deformation of the conductive particles 29 is prevented.
【００２１】導電粒子２９の直径Ｄ1 と剛性粒子３０の
直径Ｄ2 との関係をＤ1 ＞Ｄ2 ≧ 0.8Ｄ1 とした場合に
は、導電粒子２９の変形量は導電性薄膜２９ｂが破壊さ
れない程度つまりその直径の縮小率が２０％以内の値に
抑えられる。When the relationship between the diameter D1 of the conductive particles 29 and the diameter D2 of the rigid particles 30 is D1> D2 ≧ 0.8D1, the amount of deformation of the conductive particles 29 is such that the conductive thin film 29b is not destroyed, that is, its diameter. The reduction ratio of is suppressed to a value within 20%.
【００２２】そして導電粒子２９の変形でこの導電粒子
２９の表面の導電性薄膜２９ｂが対向電極２４の端子２
４ａおよび駆動回路接続用の端子２６に密着し、この導
電性薄膜２９ｂを介して両端子２４ａ，２６の電気的な
導通が確保される。By the deformation of the conductive particles 29, the conductive thin film 29b on the surface of the conductive particles 29 becomes the terminal 2 of the counter electrode 24.
4a and the drive circuit connection terminal 26 are closely attached, and electrical continuity between the terminals 24a and 26 is secured through the conductive thin film 29b.
【００２３】この状態でシール材２５および導電性ペー
スト２７のペースト基材２８を硬化させ、前記シール材
２５により両基板２１，２２を接着して液晶表示素子を
組み立てる。In this state, the sealing material 25 and the paste base material 28 of the conductive paste 27 are hardened, and the substrates 21 and 22 are bonded by the sealing material 25 to assemble a liquid crystal display element.
【００２４】このような液晶表示素子においては、導電
粒子２９がほぼ楕円状態に変形しており、このためこの
導電粒子２９の表面の導電性薄膜２９ｂと対向電極２４
の端子２４ａおよび駆動回路接続用の端子２６との密着
面積が拡がり、その両端子２４ａ，２６の導通状態が安
定する。In such a liquid crystal display element, the conductive particles 29 are deformed into a substantially elliptical state. Therefore, the conductive thin film 29b on the surface of the conductive particles 29 and the counter electrode 24.
The contact area between the terminal 24a and the drive circuit connecting terminal 26 is expanded, and the electrical connection between the terminals 24a and 26 is stabilized.
【００２５】そして、導電粒子２９の変形量が剛性粒子
３０により一定以内に規制されて過剰な変形が防止され
るから、この導電粒子２９の表面の導電性薄膜２９ｂに
クラック等の欠陥が生じることがなく、したがって両端
子２４ａ，２６間の導通状態を常に安定した状態に維持
することができる。Since the amount of deformation of the conductive particles 29 is regulated within a certain amount by the rigid particles 30 and excessive deformation is prevented, defects such as cracks may occur in the conductive thin film 29b on the surface of the conductive particles 29. Therefore, the conduction state between the terminals 24a and 26 can be always maintained in a stable state.
【００２６】なお、前記実施例においては、シール材２
５の外側で駆動回路接続用の端子２６と電極２４の端子
２４ｂとを導電性ペースト２７を介して導通させたが、
このような場合に限らず、図３に示すように、駆動回路
接続用の端子２６をシール材２５の内側にまで延長させ
てシール材２５の内側において、駆動回路接続用の端子
２６と電極２４の一部とを導電性ペースト２７を介して
導通させるような場合であってもよい。また、本発明
は、液晶表示素子に限らず、光の透過を制御する液晶シ
ャッタ等、種々の液晶素子に広く適用することができる
ものである。In the above embodiment, the sealing material 2
The terminal 26 for connecting the drive circuit and the terminal 24b of the electrode 24 were electrically connected to each other through the conductive paste 27 on the outside of 5.
Not limited to such a case, as shown in FIG. 3, the drive circuit connecting terminal 26 is extended to the inside of the seal material 25, and the drive circuit connecting terminal 26 and the electrode 24 are provided inside the seal material 25. There may be a case where a part of the above is electrically connected via the conductive paste 27. Further, the present invention is not limited to the liquid crystal display element, but can be widely applied to various liquid crystal elements such as a liquid crystal shutter that controls light transmission.
【００２７】[0027]
【発明の効果】以上説明したように本発明によれば、導
電性ペーストに含まれている導電粒子の変形量を、硬質
の剛性粒子を介して一定範囲内に規制することができ、
したがってその導電粒子の表面の導電性薄膜にクラック
等の欠陥が生じることがなく、このため一対の基板間の
確実な導通状態を常に安定して確保でき、液晶素子の製
造上の歩留りを向上させることができる。As described above, according to the present invention, the deformation amount of the conductive particles contained in the conductive paste can be regulated within a certain range through the hard rigid particles.
Therefore, defects such as cracks do not occur in the conductive thin film on the surface of the conductive particles, and thus a reliable conductive state between the pair of substrates can always be stably ensured, and the manufacturing yield of the liquid crystal element is improved. be able to.
【図１】本発明の一実施例に係る液晶表示素子の断面
図。FIG. 1 is a sectional view of a liquid crystal display element according to an embodiment of the present invention.
【図２】その液晶表示素子の組立時の工程を示す要部の
断面図。FIG. 2 is a cross-sectional view of a main part showing a step of assembling the liquid crystal display element.
【図３】本発明の他の実施例に係る液晶表示素子の断面
図。FIG. 3 is a sectional view of a liquid crystal display device according to another embodiment of the present invention.
【図４】従来の液晶表示素子の断面図。FIG. 4 is a sectional view of a conventional liquid crystal display element.
【図５】その液晶表示素子の組立時の工程を示す要部の
断面図。FIG. 5 is a cross-sectional view of a main part showing a step of assembling the liquid crystal display element.
２１…基板 ２２…基板 ２３…画素電極 ２４…対向電極 ２４ａ…対向電極の端子 ２５…シール材 ２６…駆動回路接続用の端子 ２７…導電性ペースト ２８…ペースト基材 ２９導電粒子 ２９ａ…樹脂球 ２９ｂ…導電性薄膜 ３０…剛性粒子 21 ... Substrate 22 ... Substrate 23 ... Pixel electrode 24 ... Counter electrode 24a ... Counter electrode terminal 25 ... Sealing material 26 ... Drive circuit connection terminal 27 ... Conductive paste 28 ... Paste base material 29 Conductive particles 29a ... Resin sphere 29b ... Conductive thin film 30 ... Rigid particles
Claims (5)
透明基板と、 前記一対の基板の各対向面にそれぞれ形成された透明電
極と、 前記一対の基板間の枠状シール材で囲まれた空間内に封
入された液晶と、 前記一対の基板の一方の基板に他方の基板の透明電極の
一部分に対向させて形成された導電部と、 前記導電部と対向電極との間に介装された導通材とから
なる液晶素子において、 前記導通材が剛性粒子と、弾性変形可能な樹脂球に導電
性薄膜をコーティングしてなり弾性変形前の直径が前記
剛性粒子の直径よりも導電粒子とを、樹脂ペースト基材
に混合してなる導電性ペーストであることを特徴とする
液晶素子。1. A pair of transparent substrates, which are opposed to each other with a predetermined gap therebetween, transparent electrodes formed on the respective opposing surfaces of the pair of substrates, and a frame-shaped sealing material between the pair of substrates. A liquid crystal enclosed in a closed space, a conductive portion formed on one of the pair of substrates so as to face a part of a transparent electrode of the other substrate, and an intermediate portion between the conductive portion and the counter electrode. In a liquid crystal element composed of a conductive material mounted, the conductive material is rigid particles, and a conductive thin film is formed by coating a conductive thin film on an elastically deformable resin sphere. The diameter of the conductive particles is larger than the diameter of the rigid particles. A liquid crystal element, which is a conductive paste obtained by mixing and a resin paste base material.
前記剛性粒子の直径をＤ2 としたとき、 0.8Ｄ1 ≦Ｄ2 ＜Ｄ1 の関係をみたす請求項１に記載の液晶素子。2. The diameter of the conductive particles before elastic deformation is D1,
The liquid crystal device according to claim 1, wherein the relationship of 0.8D1≤D2 <D1 is satisfied, where D2 is the diameter of the rigid particles.
高さと実質的に同一の直径を備えている請求項１または
２に記載の液晶素子。3. The liquid crystal device according to claim 1, wherein the rigid particles have a diameter substantially the same as the height of the space in which the liquid crystal is enclosed.
１ないし３のいずれかに記載の液晶素子。4. The liquid crystal device according to claim 1, wherein the rigid particles are made of an inorganic material.
のシール材を介して接合し、その一方の基板の上には他
方の基板の電極と対向する導電部を設け、この導電部と
前記電極との間に導電性ペーストを介装し、この導電性
ペーストを介して前記導電部を前記電極に導通させる液
晶素子を製造する方法であって、 前記導電性ペーストは、ペースト基材中に、樹脂球の表
面に導電性薄膜をコーティングした導電粒子と、この導
電粒子よりも直径が小さい硬質の剛性粒子とを分散させ
てなり、前記両基板を接合する際の圧力で前記導電性ペ
ーストの導電粒子を前記導電部とこれに対向した前記電
極とで挟圧して弾性的に変形させ、この変形量を前記硬
質の剛性粒子により規制し、前記変形させた導電粒子の
表面の導電性薄膜を介して前記導電部を前記電極に導通
させることを特徴とする液晶素子の製造方法。5. A pair of transparent substrates on which transparent electrodes are formed are joined via a frame-shaped sealing material, and a conductive portion facing the electrode of the other substrate is provided on the one substrate, and the conductive portion is provided. And a method of manufacturing a liquid crystal element in which a conductive paste is interposed between the electrode and the conductive portion is electrically connected to the electrode through the conductive paste, wherein the conductive paste is a paste base material. Inside, conductive particles coated with a conductive thin film on the surface of the resin sphere, and hard rigid particles having a diameter smaller than the conductive particles are dispersed, the conductive by the pressure when joining the two substrates. The conductive particles of the paste are elastically deformed by being sandwiched between the conductive portion and the electrode facing the conductive portion, and the amount of deformation is regulated by the hard rigid particles, and the conductivity of the surface of the deformed conductive particles is controlled. The conductive part through the thin film A method for manufacturing a liquid crystal element, characterized in that the electrode is electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32073794A JPH08179348A (en) | 1994-12-22 | 1994-12-22 | Liquid crystal element and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32073794A JPH08179348A (en) | 1994-12-22 | 1994-12-22 | Liquid crystal element and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08179348A true JPH08179348A (en) | 1996-07-12 |
Family
ID=18124744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32073794A Pending JPH08179348A (en) | 1994-12-22 | 1994-12-22 | Liquid crystal element and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08179348A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2788192A1 (en) * | 1998-12-30 | 2000-07-07 | Giesecke & Devrient Gmbh | Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
| US6806938B2 (en) | 2001-08-30 | 2004-10-19 | Kyocera Corporation | Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device |
| KR100525226B1 (en) * | 1999-01-06 | 2005-10-28 | 마츠시타 덴끼 산교 가부시키가이샤 | Liquid crystal display panel |
| US7847311B2 (en) | 2005-09-30 | 2010-12-07 | Samsung Mobile Display Co., Ltd. | Organic light emitting display (OLED) with conductive spacer and its method of manufacture |
| JP2011154406A (en) * | 2011-05-05 | 2011-08-11 | Semiconductor Energy Lab Co Ltd | Display device |
| JP2012238020A (en) * | 2012-08-03 | 2012-12-06 | Semiconductor Energy Lab Co Ltd | Display device |
| US8908138B2 (en) | 1997-03-27 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure |
| CN105934704A (en) * | 2014-07-02 | 2016-09-07 | 积水化学工业株式会社 | Liquid crystal display element and liquid crystal display element sealing agent |
| JP2020092334A (en) * | 2018-12-05 | 2020-06-11 | ミツミ電機株式会社 | Imaging device, imaging system and industrial robot |
-
1994
- 1994-12-22 JP JP32073794A patent/JPH08179348A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9217901B2 (en) | 1997-03-27 | 2015-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure |
| US8908138B2 (en) | 1997-03-27 | 2014-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Contact structure |
| FR2788192A1 (en) * | 1998-12-30 | 2000-07-07 | Giesecke & Devrient Gmbh | Making electrically conducting adhesive connection between module and electronic component e.g. for chip card, involves first introducing conducting body arranged in compressible fixing structure between them |
| KR100525226B1 (en) * | 1999-01-06 | 2005-10-28 | 마츠시타 덴끼 산교 가부시키가이샤 | Liquid crystal display panel |
| US7164461B2 (en) | 2001-08-30 | 2007-01-16 | Kyocera Corporation | Liquid crystal display device, portable terminal and display equipment provided with the liquid crystal display device |
| USRE43505E1 (en) | 2001-08-30 | 2012-07-10 | Kyocera Corporation | Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device |
| KR100495499B1 (en) * | 2001-08-30 | 2005-06-16 | 쿄세라 코포레이션 | Liquid crystal display device, portable terminal and display equipment provided with the liquid crystal display device |
| US6806938B2 (en) | 2001-08-30 | 2004-10-19 | Kyocera Corporation | Liquid crystal display device with particular on substrate wiring, portable terminal and display equipment provided with the liquid crystal display device |
| US7847311B2 (en) | 2005-09-30 | 2010-12-07 | Samsung Mobile Display Co., Ltd. | Organic light emitting display (OLED) with conductive spacer and its method of manufacture |
| JP2011154406A (en) * | 2011-05-05 | 2011-08-11 | Semiconductor Energy Lab Co Ltd | Display device |
| JP2012238020A (en) * | 2012-08-03 | 2012-12-06 | Semiconductor Energy Lab Co Ltd | Display device |
| CN105934704A (en) * | 2014-07-02 | 2016-09-07 | 积水化学工业株式会社 | Liquid crystal display element and liquid crystal display element sealing agent |
| CN105934704B (en) * | 2014-07-02 | 2020-03-27 | 积水化学工业株式会社 | Liquid crystal display element and sealant for liquid crystal display element |
| JP2020092334A (en) * | 2018-12-05 | 2020-06-11 | ミツミ電機株式会社 | Imaging device, imaging system and industrial robot |
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