DE102004001661A1 - Method for electrically connecting an electrical conductor to an electronic component and device - Google Patents

Abstract

The invention relates to a method for electrically connecting an electrical conductor (12) to an electronic component (20) comprising the steps: DOLLAR A - Providing a textile material (10) in which at least one flexible, wire and / or thread-like electrical conductor (12) is arranged; DOLLAR A - positioning an electrically conductive contact point (24) of the electronic component (20) relative to the electrical conductor (12) of the textile material (10); DOLLAR A - bonding the textile material (10) to the structural member (20), the bonding step comprising the steps of: DOLLAR A - mechanically bonding the textile material (10) to the structural member (20) by gluing; DOLLAR A - electrically connecting the conductor (12) to the conductive pad (24) by indirectly and / or immediately contacting the conductor (12) with the pad (24) substantially simultaneously with the step of mechanically connecting. DOLLAR A Furthermore, the invention relates to a device.

Description

The The invention relates to a method for electrically connecting a electrical conductor with an electronic component according to claim 1 and a device according to claim 11th

In increasing will be an integration of microelectronics in large-scale technical textiles in order to be active from the purely passive functions (e.g. Displays) or interactive (e.g., sensor fields). to Realization of such a system will be conductive fibers for power supply and data transmission and optionally integrated as sensors in the flat textile. introduced Microelectronic systems in chip or module form must be electrically and mechanically fixedly connected to these conductive fibers.

So far became conductive Fibers in textiles are contacted by crimping with the modules. The tuft are enclosed and squeezed by a metal clip. However, crimp contacts in textiles are not very reliable because they do not have their own spring tension. Furthermore, it is known conductive fibers in textiles by soldering or to contact ironing. Hereby very high temperatures are required, whereby the textile fabric badly damaged becomes.

It is thus an object of the present invention, a method for electrically connecting an electrical conductor to a electronic component and to provide a device where the connection technology is cheap, reliable and is robust.

These Problem is in accordance with the present invention solved by a method having the features specified in claim 1 and a device having the features specified in claim 11. Preferred embodiments are content of dependent Claims.

• – Bereitstellen eines textilen Materials, in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter angeordnet ist;
• – Positionieren einer elektrisch leitfähigen Kontaktstelle des elektronischen Bauelements relativ zu dem elektrischen Leiter des textilen Materials;
• – Verbinden des textilen Materials mit dem Bauelement, wobei der Schritt des Verbindens die folgenden Schritte umfaßt: – mechanisches Verbinden des textilen Materials mit dem Bauelement durch Verkleben bzw. eine Klebeverbindung; – elektrisches Verbinden des Leiters mit der leitfähigen Kontaktstelle durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters mit der Kontaktstelle im wesentlichen gleichzeitig mit dem Schritt des mechanischen Verbindens bzw. Ausbilden einer elektrischen Verbindung bzw. eines elektrischen Kontakts durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters mit der Kontaktstelle, wobei die elektrische Verbindung mit Hilfe der mechanischen Klebeverbindung zwischen dem textilen Material und dem Bauelement gehalten wird.

According to the invention, a method for electrically connecting an electrical conductor to an electronic component is provided, comprising the steps:

• - Providing a textile material in which at least one flexible, wire and / or thread-like electrical conductor is arranged;
• - Positioning an electrically conductive contact point of the electronic component relative to the electrical conductor of the textile material;
• Bonding the textile material to the structural member, the bonding step comprising the steps of: mechanically bonding the textile material to the structural member by adhesive bonding; Electrically connecting the conductor to the conductive pad by indirectly and / or immediately contacting the conductor to the pad substantially simultaneously with the step of mechanically connecting an electrical contact by indirectly and / or directly contacting the conductor with the contact point, wherein the electrical connection is held by means of the mechanical adhesive bond between the textile material and the component.

Preferably the textile material is a fabric. Under a tissue is hereby a textile fabric of two, in particular at right angles intersecting thread systems understood, which - as usual - as a chain and shot are called.

The Chain lies lengthwise of the web process during the weft direction runs across the web direction.

Of the Ladder included preferably at least one weft and / or warp thread of the fabric.

Preferably comprises the ladder thin metal wires from e.g. Copper, silver-plated copper or steel or plastic-based Fibers, e.g. Polymer fibers, metal-coated polymer fibers, carbon fibers or similar ..

at The electronic component may be, for example, a integrated circuit or chip, a module, an RF-ID tag or a On an insulator applied conductor track, which with an external electronic component is connected, act.

To the step of positioning can be provided that the component already easily adheres to the textile material. Thus, the adjustment simplifies the parts to be joined.

By Gluing will be a safe and durable connection between ensured the electronic component and the textile material.

The electrical connection preferably takes place only by approaching and bringing the conductor and the conductive contact point into contact. In this case, it is not necessary to produce an additional electrical connection, for example by soldering, conductive bonding, welding or the like. With the help of mecha niche adhesive bond, the electrical connection can be maintained permanently. Thus, a stable and durable mechanical connection and a secure electrical connection between the electronic component and the textile material can be produced in a simple and cost-effective manner at the same time.

Prefers comprises the process is a step of at least areawise application an adhesive on the textile material and / or the component. More preferably, the adhesive is electrically conductive and electrically non-conductive areas of the electronic component and / or areas of the textile material corresponding to these areas applied or area of the textile material to which the Component to be arranged.

Of the Adhesive is preferably applied so that a reliable connection the component is achieved with the textile material. Especially can be provided that the Adhesive substantially on the entire surface side of the device, which comes into contact with the textile material, is provided.

Preferably the adhesive is an electrically non-conductive or insulating Adhesive or a so-called "Non-Conducting Adhesive "or NCA.

Such Adhesives preferably comprise single or multi-component epoxy resins or other suitable temperature and / or UV-curing adhesives.

alternative For example, the adhesive may be an anisotropic conductive adhesive so-called "anisotropic Conductive Adhesive " ACA, wherein the adhesive is preferably an insulating adhesive and in the adhesive comprises movable conductive elements or particles.

The conductive particles are preferably small metal coated spheres. The balls can be hard or solid and substantially non-deformable, e.g. made of glass, or soft and deformable, e.g. made of polyester, be formed. The Metal coating of the balls may e.g. be a NiAu coating.

anisotropic conductive adhesives are characterized in particular in that they are in Ground state are conductive in any spatial direction, since the conductive particles due to the small size and number do not touch each other in the adhesive. The conductivity comes off only when the glue and the contained therein conductive Particles between two contact surfaces be trapped. This is an electrical contact between the two contact surfaces educated.

Prefers comprises the step of bonding the textile material to the device a step of applying pressure at least to the pad of the electronic component and the electrical conductor of the textile Materials to be contacted with each other.

in this connection is the insulating adhesive or the insulating adhesive between the contact point of the electronic component and the electrical Ladder displaced and an electrical contact between the pad and the Ladder trained. Furthermore, a firm bonding of the device achieved with the textile material.

Further preferably comprises the step of bonding the textile material to the device Step of applying an elevated temperature at least the contact point of the electronic component and the electrical Head of the textile material, which are contacted with each other should.

With Help the raised Temperature, the adhesive effect of the adhesive is further increased. Of further it can be provided that the adhesive at elevated temperatures cures.

To the Applying the pressure and the elevated temperature is preferably a thermode used. The thermode is preferably designed such that at least the areas of the electronic component to be contacted with each other and the textile material are pressed firmly against each other or pressed against each other.

In a preferred embodiment comprises the device has a plurality of electrically conductive contact points and the textile material has a plurality of electrical conductors and the step of positioning simultaneously arranging the Ladder to the contact points.

Consequently can preferably substantially all contact points to be contacted of the device substantially simultaneously with conductors of the textile Materials are contacted. In this case, the thermode indicates preferably such a shape that all areas to be contacted simultaneously pressed against each other become. Thus can on cost-effective and time-saving manner, a component with a textile material electrically and mechanically connected.

Prefers comprises the method further comprises a step of severing the contacted one thread-like electrical conductor.

In particular, if two or more contact points of the device with the same conductor ver It may be necessary that the connection between these contact points, which would be formed by the conductor, is severed. The severing may preferably be done by cutting out a suitable area of the textile material.

• – einem textilen Material, in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter angeordnet ist;
• – zumindest einem elektronischen Bauelement, welches zumindest eine elektrisch leitfähige Kontaktstelle umfaßt und mit dem Leiter mechanisch und elektrisch verbunden ist; wobei
• – die mechanische Verbindung zwischen dem textilen Material und dem elektronischen Bauelement durch eine Klebeverbindung ausgebildet wird, und
• – die elektrische Verbindung durch einen elektrischen Kontakt zwischen der elektrisch leitfähigen Kontaktstelle des Bauelements und dem Leiter des textilen Materials durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters mit der Kontaktstelle ausgebildet wird, wobei der Kontakt mit Hilfe der mechanischen Klebeverbindung zwischen dem textilen Material und dem Bauelement gehalten wird.

According to the invention, a device is further provided with

• - A textile material in which at least one flexible, wire and / or thread-like electrical conductor is arranged;
• - At least one electronic component, which comprises at least one electrically conductive contact point and is mechanically and electrically connected to the conductor; in which
• - The mechanical connection between the textile material and the electronic component is formed by an adhesive bond, and
• - The electrical connection is formed by an electrical contact between the electrically conductive contact point of the device and the head of the textile material by indirectly and / or directly contacting the conductor with the contact point, wherein the contact by means of the mechanical adhesive bond between the textile material and the Component is held.

The electrical connection between the component and the textile Material is preferably added without further additional aids such as e.g. lot, Conductive adhesive or similar educated. In particular, are the conductive contact point of the device and the director of the textile material in indirect and / or direct electrical contact, these being either substantially directly abutting and / or over a respective adjacent intermediate conductive medium.

Preferably is the adhesive bond in electrically conductive and electrically non-conductive areas provided the electronic component.

The Adhesive bonding preferably surrounds each other electrically in conjunction standing parts of the component and the textile material. Thereby can also be a good mechanical connection of the device with the textile material can be achieved.

Prefers the adhesive bond is formed by means of an adhesive.

Further Preferably, the adhesive is an electrically non-conductive or insulating Adhesive or a so-called "Non-Conducting Adhesive" or NCA.

alternative the adhesive is an anisotropic conductive adhesive or an anisotropic conductive Adhesive "or ACA, wherein the adhesive is preferably an insulating adhesive and in the adhesive comprises movable conductive elements or particles.

In a preferred embodiment comprises the electrically conductive Contact point of the device, a projecting portion, which with the conductor indirectly and / or directly in electrical contact is brought.

Of the projecting portion is preferably formed as a so-called "bump" at the contact point. By providing the projecting portion can in the manufacture the device, in particular the connection of the device with the textile material, the pressure in the contact area between the Contact point and the leader increased become. Thus, a secure electrical and mechanical connection be formed.

Further can be provided that the Contact point itself formed protruding from the device is.

Prefers is the electronic component an integrated circuit or Semiconductor device or a chip, a module, an RF-ID tag or an applied on an insulator conductor, which with a external electronic component is connected ver.

Further Preferably, the textile material is a fabric and the conductor comprises at least a shot- and / or warp of the fabric.

Further Features, objects and advantages of the present invention obviously from the detailed description of preferred embodiments with reference to the figures, in which:

1A . 1B . 1C Sectional views of a device according to a first preferred embodiment of the present invention during the connection process;

2A to 2D schematic plan on the device according to the first preferred embodiment during the connection process; and

3A and 3B Sectional views of a device according to the second preferred embodiment of the present invention during the connection process.

A first embodiment of a device according to the invention during the connection process is in 1A . 1B and 1C on average and in 2A to 2D shown in schematic plan views.

1A shows a sectional view of the device according to the first embodiment before joining a textile material 10 with an electronic component 20 . 1B shows the device during bonding and 1C shows the ver affiliated device according to the invention according to the first embodiment.

2A shows the textile material 10 before joining, 2 B shows the textile material 10 after a first processing step, 2C shows a on the textile material 10 positioned component 20 and 2D shows the device during connection.

In the textile material 10 it is a tissue. Tissue in this case is understood to be a textile fabric made of two thread systems crossing each other in particular at right angles, which - as usual - are referred to as warp and weft. The strings 16 of the textile material 10 are formed of an electrically non-conductive material, such as polyester, polyamide, or the like.

In the textile material 10 are electrical conductors 12 woven. In the illustrated embodiment, the conductor consists 12 of five substantially parallel electrically conductive wires or yarns or fibers 14 , The leader 12 However, depending on the application, it can also have any other desired number of wires. In the illustrated embodiment, the wires of the conductor are 12 not provided with insulation.

The electronic component 20 In the illustrated embodiment, a wafer or semiconductor device is included 22 and metallic pads or pads 24 , The contact points 24 jump in the illustrated embodiment of the wafer 22 in front. The height of the contact points 24 is preferably 0 to 10 microns.

In the illustrated embodiment, the device 20 fer ner with an adhesive 30 Mistake. The adhesive 30 is hereby preferably substantially along the entire surface side of the component 20 , which with the textile material 10 is to be connected, provided. Alternatively, however, the adhesive may be used 30 also only partially, preferably in each case in the region of the contact points 24 be provided.

The adhesive 30 can in any suitable way on the device 20 be applied. In particular, the adhesive can 30 in the form of a film at a different time on the device 20 be applied. Alternatively, the device 20 just before the connection with the textile material 10 with the glue 30 be provided. Alternatively it can be provided that the adhesive 30 on the textile material 10 is applied.

According to the first preferred embodiment of the present invention, the adhesive is 30 an electrically non-conductive or insulating adhesive or a so-called "Non-Conductive Adhesive" or NCA. Preferably, single or multi-component epoxy resins or other suitable temperature and / or UV-curing adhesives are used for this purpose.

In the manufacture of the device according to the first preferred embodiment, first at the location of the textile material 10 on which the component 20 should be positioned, a the component 20 in a substantially corresponding area 18 from the textile material 10 cut out ( 2 B ). It is advantageous if the area 19 is slightly smaller than the area of the device 20 if the contact points 24 of the component 20 are arranged substantially along the circumference.

Alternatively, the cutting out of the material only after contacting or bonding of the device 20 respectively.

As an alternative to cutting, the conductive fibers can be processed overhead in the weaving process, so that only the non-conductive material is connected to a fabric (so-called. Jaquard technique). These relatively loosely resting surface conductive threads can then be easily cut or severed. Below this, a stable insulating fabric is obtained that additional mechanical stability for the device 20 brings.

In the illustrated embodiment, the area is located 18 at a crossing point of several conductors 12 of the textile material 10 , This will be the ladder 12 interrupted. At the now open ends 19 the leader 12 can subsequently the device 20 be contacted (described later).

The following is the component 20 concerning the textile material 10 aligned and on the textile material 10 arranged ( 1A and 2C ). In particular, the device 20 such on the textile material 10 arranged that the respective contact points 24 correct with respect to the respective electrical conductors to be contacted 12 are aligned. This is advantageously by the presence of the adhesive 30 slipping of the positioned component 20 prevented after the positioning and adjustment process. In particular, it is advantageous if the adhesive 30 even at room temperature has easy or re-releasable adhesive properties.

Subsequently, the areas to be contacted with pressure and an elevated temperature are applied. This is in 1B and 2D shown. For this purpose, a thermode 50 used, which is the textile material 10 and in particular the electrical conductor 12 to the contact point 24 of the component 20 against a circulation 52 presses. Due to the pressure and the elevated temperature, the adhesive becomes 30 between the electrical conductor 12 and the contact point 24 displaced and there is an electrical contact between the contact point 24 and the electrical conductor 12 educated. Due to the fact that the contact points 24 from the wafer 22 are formed protruding, the pressure through the thermode 50 be enlarged. Through the thermode 50 The contact regions are exposed to temperature and heat. In this case, the adhesive is hardened or hardened. Thus, a strong and durable mechanical connection between the wafer 22 and the textile material 10 educated.

In the thermode 50 Preferably, a temperature of less than 300 ° C and a pressure of about 1 - 100 N / m ^{2 is} used.

In 1C a device according to the first embodiment shown after the connection process. Here are the ladder 12 directly at the contact points 24 and an electrical connection is formed therebetween. Furthermore, there is a large area, solid and durable mechanical connection between the textile material 10 and the device 20 through the cured adhesive 30 ,

In 3A and 3B a device according to a second preferred embodiment of the present invention is shown in section.

The Components of the device according to the second embodiment of the invention, which with the components of the device according to the first preferred embodiment are identical or the same, are denoted by the same reference numerals and a detailed description of this is given in the Subsequent omitted.

In the device according to the second preferred embodiment of the invention, an anisotropic conductive adhesive or a so-called "Anisotropic Conductive Adhesive" or ACA 40 used. The adhesive 40 comprises an insulating adhesive or adhesive filling material 42 and small metal-coated beads or particles 44 , The insulating adhesive 42 preferably comprises single-component or multi-component epoxy resins or other suitable temperature and / or UV-curing adhesives. The metallic beads 44 are preferably glass beads, which are coated with an electrically conductive layer. Alternatively it can be provided that the metallic beads are soft and deformable, and are formed for example of polyester.

Anisotropic conductive adhesives are particularly characterized in that they are conductive in the ground state in any direction in space, since the conductive particles do not touch each other due to the small size and number in the adhesive. Conductivity only occurs when the adhesive and the conductive particles contained in it are between two contact surfaces, in this case the conductor 12 and the contact point 24 to be pinched. In this case, an electrical contact between the two contact surfaces is formed.

During the in 3B Connecting process becomes the adhesive 42 between the electrical conductor 12 and the contact point 24 displaced and the metallic beads 44 Press under heat and pressure into the electrical conductor 12 and the contact points 24 , Furthermore, it can be provided that the electrical conductor 12 directly with the contact point 24 comes into electrical contact. With the help of metallic beads 44 the electrical contact can be improved.

The conductive beads 44 are at such a distance in the insulating adhesive 42 present that no horizontal conductivity is achieved in the adhesive layer. An electrical connection only occurs between the contact points 24 of the component 20 and the directly underneath or opposite electrical conductors 10 or wires 14 ,

Furthermore, with the help of the adhesive 42 a strong mechanical connection between the component 20 and the textile material 10 substantially along the entire surface of the device 20 educated.

In a further embodiment, not shown, it can be provided that at the contact points 24 of the component 20 Projections or bumps are provided. The height of the projections is preferably 0 to 10 microns. With the help of the projections, the pressure in the contact area can be further increased.

As shown above, non-conductive or anisotropic conductive adhesives for contacting microelectronics or Mo dulen used in cloth woven in textile material or textiles conductive fibers. As a result, low processing temperatures, high adjustment tolerances and a large-scale mechanical adhesion can be achieved.

The devices described above can be used, for example, in soil or wall coverings to get integrated. Thereby, a system e.g. for people tracking, for burglary protection, fire alarm or for an intelligent person guidance system be formed. Furthermore, the device for crack detection be used in textile concrete.

With the inventive method can Furthermore, RFID tags are integrated into textiles. These are the RFID tag chips contacted to woven antennas.

10

textile material

12

electrical ladder

14

wire

16

textile thread

18

Area

19

The End

20

module

22

wafer

24

contact point

30

adhesive (NCA)

40

adhesive (ACA)

42

adhesive

44

metallic globule

50

thermode

52

edition

Claims (19)

Method for electrically connecting an electrical conductor ( 12 ) with an electronic component ( 20 ) comprising the steps of: - providing a textile material ( 10 ), in which at least one flexible, wire and / or thread-like electrical conductor ( 12 ) is arranged; Positioning an electrically conductive contact point ( 24 ) of the electronic component ( 20 ) relative to the electrical conductor ( 12 ) of the textile material ( 10 ); - bonding the textile material ( 10 ) with the component ( 20 ), wherein the bonding step comprises the following steps - mechanically bonding the textile material ( 10 ) with the component ( 20 ) by gluing; - electrical connection of the conductor ( 12 ) with the conductive contact point ( 24 ) by indirectly and / or directly contacting the conductor ( 12 ) with the contact point ( 24 ) substantially simultaneously with the step of mechanically joining. A method according to claim 1, further comprising a step of at least partially applying an adhesive ( 30 ; 40 ) on the textile material ( 10 ) and / or the component ( 20 ). Method according to claim 2, wherein the adhesive ( 30 ; 40 ) to electrically conductive and electrically non-conductive regions of the electronic component ( 20 ) and / or areas of the textile material corresponding to these areas ( 10 ) is applied. Method according to one of claims 2 or 3, wherein the adhesive ( 30 ) an electrically non-conductive adhesive ( 30 ). Method according to one of claims 2 or 3, wherein the adhesive ( 40 ) an anisotropic conductive adhesive ( 40 ). Method according to claim 5, wherein the adhesive ( 40 ) an insulating adhesive ( 42 ) and in the adhesive movable conductive particles ( 44 ). Method according to one of the preceding claims, wherein the step of bonding the textile material ( 10 ) with the component ( 20 ) a step of applying pressure at least to the contact point ( 24 ) of the electronic component ( 20 ) and the electrical conductor ( 12 ) of the textile material ( 10 ) which are to be contacted with each other. Method according to one of the preceding claims, wherein the step of bonding the textile material ( 10 ) with the component ( 20 ) a step of applying an elevated temperature at least to the contact point ( 24 ) of the electronic component ( 20 ) and the electrical conductor ( 12 ) of the textile material ( 10 ) which are to be contacted with each other. Method according to one of the preceding claims, wherein the component ( 20 ) a plurality of electrically conductive contact points ( 24 ) and the textile material ( 10 ) a plurality of electrical conductors ( 12 ) and the step of positioning the simultaneous placement of the conductors ( 12 ) to the contact points ( 24 ). Method according to one of the preceding claims, further comprising a step of severing the contacted thread-like electrical conductor ( 12 ). Device with - a textile material ( 10 ), in which at least one flexible, wire and / or thread-like electrical conductor ( 12 ) is arranged; At least one electronic component ( 20 ) which at least one electrically conductive contact point ( 24 ) and with the conductor ( 12 ) is mechanically and electrically connected; whereby the mechanical connection between the textile material ( 10 ) and the electronic component ( 20 ) is formed by an adhesive connection, and - the electrical connection by an electrical contact between the electrically conductive contact point ( 24 ) of the component ( 20 ) and the leader ( 12 ) of the textile material ( 10 ) by indirectly and / or directly contacting the conductor ( 12 ) with the contact point ( 24 ) is formed, wherein the contact by means of the mechanical adhesive bond between the textile material ( 10 ) and the component ( 20 ) is held. Device according to claim 11, wherein the adhesive connection in electrically conductive and electrically non-conductive regions of the electronic component ( 20 ) is provided. Device according to one of claims 11 or 12, wherein the adhesive bond by means of an adhesive ( 30 ; 40 ) is formed. Device according to claim 13, wherein the adhesive ( 30 ) an electrically non-conductive adhesive ( 30 ). Device according to claim 13, wherein the adhesive ( 40 ) an anisotropic conductive adhesive ( 40 ). Device according to claim 15, wherein the adhesive ( 40 ) an insulating adhesive ( 42 ) and in the adhesive ( 42 ) movable conductive particles ( 44 ). Device according to one of claims 11 to 16, wherein the electrically conductive contact point ( 24 ) of the component ( 20 ), a projecting portion which is connected to the conductor ( 12 ) is brought indirectly and / or directly into electrical contact. Device according to one of claims 11 to 17, wherein the electronic component ( 20 ) an integrated circuit, a module, an RF-ID tag, or an insulator-applied trace connected to an external electronic device. Device according to one of claims 11 to 18, wherein the textile material ( 10 ) is a tissue and the conductor ( 12 ) comprises at least one weft and / or warp thread of the fabric.