WO2005067042A1 - Method for electrically connecting an electrical conductor to an electronic component, and device - Google Patents

Method for electrically connecting an electrical conductor to an electronic component, and device Download PDF

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Publication number
WO2005067042A1
WO2005067042A1 PCT/EP2005/000139 EP2005000139W WO2005067042A1 WO 2005067042 A1 WO2005067042 A1 WO 2005067042A1 EP 2005000139 W EP2005000139 W EP 2005000139W WO 2005067042 A1 WO2005067042 A1 WO 2005067042A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive
textile material
component
conductor
conductive
Prior art date
Application number
PCT/EP2005/000139
Other languages
German (de)
French (fr)
Inventor
Christl Lauterbach
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2005067042A1 publication Critical patent/WO2005067042A1/en

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Classifications

    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D1/00—Woven fabrics designed to make specified articles
    • D03D1/0082—Fabrics for printed circuit boards
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
    • D03D15/283—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads synthetic polymer-based, e.g. polyamide or polyester fibres
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/20—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads
    • D03D15/242—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the material of the fibres or filaments constituting the yarns or threads inorganic, e.g. basalt
    • D03D15/25—Metal
    • D03D15/258—Noble metal
    • D—TEXTILES; PAPER
    • D03—WEAVING
    • D03D—WOVEN FABRICS; METHODS OF WEAVING; LOOMS
    • D03D15/00—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used
    • D03D15/50—Woven fabrics characterised by the material, structure or properties of the fibres, filaments, yarns, threads or other warp or weft elements used characterised by the properties of the yarns or threads
    • D03D15/593—Stiff materials, e.g. cane or slat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2101/00—Inorganic fibres
    • D10B2101/10—Inorganic fibres based on non-oxides other than metals
    • D10B2101/12—Carbon; Pitch
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2101/00—Inorganic fibres
    • D10B2101/20—Metallic fibres
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2331/00—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products
    • D10B2331/02—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products polyamides
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2331/00—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products
    • D10B2331/04—Fibres made from polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polycondensation products polyesters, e.g. polyethylene terephthalate [PET]
    • D—TEXTILES; PAPER
    • D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
    • D10B2401/00—Physical properties
    • D10B2401/16—Physical properties antistatic; conductive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01061—Promethium [Pm]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0281—Conductive fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor

Definitions

  • the invention relates to a method for electrically connecting an electrical conductor to an electronic component according to claim 1 and a device according to claim 11.
  • microelectronics in large-scale technical textiles is increasingly being sought in order to move from purely passive functions to active (e.g. displays) or interactive (e.g. sensor fields).
  • active e.g. displays
  • interactive e.g. sensor fields
  • conductive fibers are used
  • Microelectronic systems in chip or module form must be firmly and electrically connected to these conductive fibers.
  • a method for electrically connecting an electrical conductor to an electronic component comprising the steps of: providing a textile material in which at least one flexible, wire and / or thread-like electrical conductor is arranged; Positioning an electrically conductive contact point of the electronic component relative to the electrical conductor of the textile material; Connecting the textile material to the component, wherein the step of connecting comprises the following steps: mechanically connecting the textile material to the component by gluing or an adhesive connection; electrically connecting the conductor to the conductive contact point by indirectly and / or5 directly contacting the conductor with the contact point substantially simultaneously with the step of mechanically connecting or forming an electrical connection or an electrical contact by indirectly and / or directly contacting the conductor with der0 contact point, the electrical connection being held by means of the mechanical adhesive connection between the textile material and the component.
  • the textile material is preferably a woven fabric.
  • a fabric is understood to mean a textile fabric made up of two thread systems, in particular crossing one another at right angles, which - as usual - are referred to as warp and weft.
  • the warp lies in the longitudinal direction of the weaving process while the weft direction is transverse to the weaving direction.
  • the conductor preferably comprises at least one weft and / or warp thread of the fabric.
  • the conductor comprises thin metal wires made e.g. Copper, silver-plated copper or steel or plastic-based fibers, e.g. Polymer fibers, metal-coated polymer fibers, carbon fibers, etc.
  • thin metal wires made e.g. Copper, silver-plated copper or steel or plastic-based fibers, e.g. Polymer fibers, metal-coated polymer fibers, carbon fibers, etc.
  • the electronic component can be, for example, an integrated circuit or chip, a module, an RF-ID tag or an interconnect applied to an insulator, which is connected to an external electronic component.
  • the component After the positioning step, it can be provided that the component already adheres slightly to the textile material. This simplifies the adjustment of the parts to be connected.
  • the gluing ensures a secure and durable connection between the electronic component and the textile material.
  • the electrical connection is preferably carried out only by bringing the conductor and the conductive contact point closer and in contact. There is no need for an additional electrical connection such as soldering, conductive glue, To produce welding or the like. With the help of the mechanical adhesive connection, the electrical connection can be maintained permanently. Thus, a stable and durable mechanical connection and a secure 5. electrical connection between the electronic component and the textile material can be produced in a simple and inexpensive manner at the same time.
  • the method preferably comprises a step of applying an adhesive at least in regions to the textile material and / or the component.
  • the adhesive is further preferably applied to electrically conductive and electrically non-conductive regions of the electronic component and / or regions of the textile material 5 corresponding to these regions or region of the textile material on which the component is to be arranged.
  • the adhesive is preferably applied in such a way that a reliable connection of the component with the textile material is achieved.
  • the adhesive is provided essentially on the entire surface side of the component which comes into contact with the textile material.
  • the adhesive is preferably an electrically non-conductive or insulating adhesive or a so-called “non-conductive adhesive” or NCA.
  • Such adhesives preferably comprise one- or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives.
  • the adhesive can be an anisotropic conductive adhesive or a so-called “anisotropy conductive adhesive” or Be ACA, the adhesive preferably comprising an insulating adhesive and moveable conductive elements or particles in the adhesive.
  • the conductive particles are preferably small metal-coated balls.
  • the balls can be hard or solid and essentially non-deformable, e.g. made of glass, or soft and deformable, e.g. made of polyester.
  • the metal coating of the balls can e.g. be a NiAu coating.
  • Anisotropic conductive adhesives are particularly characterized in that they are not conductive in any spatial direction in the basic state, since the conductive particles do not touch one another due to the small size and number in the adhesive. The conductivity only comes about when the adhesive and the conductive particles it contains are clamped between two contact surfaces. An electrical contact is formed between the two contact surfaces.
  • the step of connecting the textile material to the component preferably comprises a step of applying pressure at least to the contact point of the electronic component and the electrical conductor of the textile material which are to be contacted.
  • Component and the electrical conductor displaced and an electrical contact between the contact point and the conductor is formed.
  • the component is firmly bonded to the textile material.
  • the step of connecting the textile material to the component comprises a step of applying an elevated temperature at least to the contact point of the electronic component and the electrical conductor of the textile material which are to be contacted.
  • the adhesive effect of the adhesive is further increased. It can further be provided that the adhesive cures at elevated temperatures.
  • thermode is preferably used to apply the pressure and the elevated temperature.
  • the thermode is preferably designed such that at least the areas of the electronic component and the textile material to be contacted are pressed firmly onto one another or pressed onto one another.
  • the component comprises a multiplicity of electrically conductive contact points and the textile material a multiplicity of electrical conductors and the step of positioning the simultaneous arrangement of the conductors at the contact points.
  • thermode preferably has a shape such that all areas to be contacted are pressed onto one another at the same time.
  • the method preferably further comprises a step of severing the contacted thread-like electrical conductor.
  • the connection between these contact points may be severed.
  • the cutting can preferably be done by cutting out a suitable area of the textile material.
  • a device is further provided with a textile material, in which at least one flexible, wire and / or thread-like electrical conductor is arranged; at least one electronic component which comprises at least one electrically conductive contact point and is mechanically and electrically connected to the conductor; wherein the mechanical connection between the textile material and the electronic component is formed by an adhesive connection, and the electrical connection by an electrical contact between the electrically conductive contact point of the component and the conductor of the textile material by indirectly and / or directly contacting the conductor with the Contact point is formed, the contact being held by means of the mechanical adhesive connection between the textile material and the component.
  • the electrical connection between the component and the textile material is preferably made without further additional aids such as solder, conductive adhesive or the like educated.
  • the conductive contact point of the component and the conductor of the textile material are in indirect and / or direct electrical contact, which either lie essentially directly against one another and / or via a conductive intermediate medium in each case thereon.
  • the adhesive connection is preferably provided in electrically conductive and electrically non-conductive regions of the electronic component.
  • the adhesive connection preferably surrounds the parts of the component and the textile material which are electrically connected to one another. As a result, a good mechanical connection of the component to the textile material can also be achieved.
  • the adhesive connection is preferably formed by means of an adhesive.
  • the adhesive is further preferably an electrically non-conductive or insulating adhesive or a so-called “non-conductive adhesive” or NCA.
  • the adhesive is an anisotropic conductive adhesive or a so-called “anisotropy conductive adhesive” or ACA, the adhesive preferably being an insulating one
  • Adhesive and conductive elements or particles movable in the adhesive Adhesive and conductive elements or particles movable in the adhesive.
  • the electrically conductive contact point of the component comprises a projecting section which is brought into direct and / or electrical contact with the conductor.
  • the projecting section is preferably designed as a so-called "bump" at the contact point.
  • the electronic component is preferably an integrated circuit or semiconductor device or a chip, a module, an RF-ID tag or an interconnect applied to an insulator, which is connected to an external electronic component.
  • the textile material is more preferably a woven fabric and the conductor comprises at least one weft and / or warp thread of the woven fabric.
  • FIGS 2A to 2D schematic plan views of the device according to the first preferred Embodiment during the connection process.
  • FIGS. 3A and 3B are sectional views of a device according to 5. the second preferred embodiment of the present invention during the connection process.
  • FIGS. 1A, IB and IC A first embodiment of a device 0 according to the invention during the connection process is shown in section in FIGS. 1A, IB and IC and in FIGS. 2A to 2D in schematic plan views.
  • FIG. 1A shows a sectional view of the device according to the first embodiment before the connection of a textile material 10 to an electronic component 20
  • FIG. 1B shows the device during the connection
  • FIG. IC shows the connected device according to the invention according to the first embodiment
  • 2A shows the textile material 10 before the connection
  • FIG. 2B shows the textile material 10 after a first processing step
  • FIG. 2C shows a component 20 positioned on the textile material 10
  • FIG. 2D shows the device during the connection.
  • the textile material 10 is a fabric.
  • fabric is understood to mean a textile fabric made up of two thread systems 0, in particular intersecting at right angles, which - as usual - are referred to as warp and weft.
  • the threads 16 of the textile material 10 are made of an electrically non-conductive material, such as polyester, polyamide, or the like.
  • Electrical conductors 12 are woven into the textile material 10.
  • the conductor 12 consists of five electrically conductive wires or yarns or 5 fibers 14 running essentially parallel to one another. However, depending on the application, the conductor 12 can also have any other desired number of wires. In the illustrated embodiment, the wires of the conductor 12 are not provided with insulation.
  • the electronic component 20 comprises a wafer or a semiconductor device 22 and metallic contact points or pads 24.
  • the contact sites 24 project from the wafer 22 in the embodiment shown.
  • the height of the contact points 24 is preferably 05 to 10 ⁇ m.
  • the component 20 is also provided with an adhesive 30.
  • the adhesive 30 is preferably provided essentially along the entire surface side of the component 20 which is to be connected to the textile material 10. Alternatively, however, the adhesive 30 can also be provided only in regions, preferably in the region of the contact points 24. 5
  • the adhesive 30 can be applied to the component 20 in any suitable manner. In particular, the adhesive 30 can be applied to the component 20 in the form of a film at another time. Alternatively, the component 20 can be provided with the adhesive 30 shortly before being connected to the textile material 10. Alternatively, it can be provided that the adhesive 30 is applied to the textile material 10.
  • the adhesive 30 is an electrically non-conductive or insulating adhesive or a so-called “non-conductive adhesive” or NCA.
  • non-conductive adhesive Single-component or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives are preferably used for this.
  • an area 18 essentially corresponding to the component 20 is cut out of the textile material 10 at the location of the textile material 10 at which the component 20 is to be positioned (FIG. 2B). It is advantageous here if the area 19 is somewhat smaller than the area of the component 20, if the contact points 24 of the component 20 are arranged essentially along the circumference.
  • the material can only be cut out after the component 20 has been contacted or glued. Technology). These relatively loosely lying surface conductive threads can then be cut or severed in a simple manner. Underneath, a stable, insulating fabric is retained that provides additional mechanical stability for the component 20.
  • the area 18 is located at a crossing point of a plurality of conductors 12 of the textile material 10. As a result, the conductors 12 are interrupted. The component 20 can subsequently be contacted at the now open ends 19 of the conductors 12 (described later). The component 20 is then aligned with respect to the textile material 10 and arranged on the textile material 10 (FIGS. 1A and 2C).
  • the 5th component 20 is arranged on the textile material 10 such that the respective contact points 24 are correctly aligned with respect to the electrical conductors 12 to be contacted therewith.
  • the presence of the adhesive 30 advantageously prevents the component 20 positioned from slipping after the positioning and adjustment process.
  • the adhesive 30 has light or releasable adhesive properties even at room temperature. 5
  • the areas to be contacted are then subjected to pressure and an elevated temperature. This is shown in Figures IB and 2D.
  • a thermode 50 is used, which presses the textile material 10 and in particular the electrical conductor 12 onto the contact point 24 of the component 20 against a support 52.
  • thermode 50 Due to the pressure and the elevated temperature, the adhesive 30 is displaced between the electrical conductor 12 and the contact point 24 and an electrical contact is formed between the contact point 24 and the electrical conductor 12. Because the 5 contact points 24 are protruding from the wafer 22, the pressure through the thermode 50 can be increased. Temperature and heat are applied to the contact regions by the thermode 50. This causes the adhesive to harden or harden. Thus, a firm and durable mechanical connection between the wafer 22 and the textile material 10 is formed. A temperature of less than 300 ° C. and a pressure of approximately 1 to 100 N / m 2 are preferably used in the thermode 50.
  • Fig. IC a device according to the first embodiment shown after the connection process.
  • the conductors 12 lie directly on the contact points 24 and an electrical connection is formed between them.
  • FIGS. 3A and 3B show a device according to a second preferred embodiment of the present invention in section.
  • an anisotropic conductive adhesive or a so-called "anisotropy conductive adhesive” or ACA 40 is used.
  • the adhesive 40 comprises an insulating adhesive or adhesive filler 42 and small metal-coated balls or particles 44.
  • the insulating adhesive 42 preferably comprises one- or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives.
  • the metallic spheres 44 are preferably glass spheres which are coated with an electrically conductive layer. Alternatively, it can be provided be that the metallic beads are soft and deformable, and are made of polyester, for example.
  • Anisotropic conductive adhesives are particularly characterized in that they are not conductive in any spatial direction in the basic state, since the conductive particles do not touch one another due to the small size and number in the adhesive.
  • the conductivity only comes about when the adhesive and the conductive particles contained therein are clamped between two contact surfaces, in the present case the conductor 12 and the contact point 24. An electrical contact is formed between the two contact surfaces.
  • the electrical conductor 12 is in direct electrical contact with the contact point 24 occurs.
  • the electrical contact can be improved with the aid of the metallic balls 44.
  • the conductive balls 44 are present in the insulating adhesive 42 at such a distance that no horizontal conductivity is achieved in the adhesive layer. An electrical connection is only established between the contact points 24 of the component 20 and the electrical conductors 10 or wires 14 directly below or opposite one another.
  • a firm mechanical connection is formed between the component 20 and the textile material 10 essentially along the entire surface of the component 20.
  • 20 projections or bosses are provided at the contact points 24 of the component.
  • the height of the projections is preferably 0 to 10 ⁇ m.
  • non-conductive or anisotropic conductive adhesives are used to contact
  • Components or microelectronic modules are used on conductive fibers woven into textile material or textiles. As a result, low processing temperatures, high adjustment tolerances and extensive mechanical adhesion can be achieved.
  • the devices described above can be integrated, for example, in floor or wall coverings. This enables a system e.g. be trained for personal tracking, burglar protection, fire detection or for an intelligent personal control system. Furthermore, the device for crack detection in textile concrete can be used.
  • RFID tags can also be integrated into textiles.
  • the RFID tag chips are contacted on woven antennas.

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  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
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Abstract

The invention relates to a method for electrically connecting an electrical conductor (12) to an electronic component (20) comprising the following steps: providing a textile material (10) in which at least one flexible wire-like and/or filament-like electrical conductor (12) is situated; positioning an electrically conductive contact point (24) of the electronic component (20) relative to the electrical conductor (12) of the textile material (10), and; connecting the textile material (10) to the component (20), whereby the connecting step involves the following steps: mechanically joining the textile material (10) to the component (20) by gluing, and; electrically connecting the conductor (12) to the conductive contact point (24) by indirectly and/or directly bringing the conductor (12) into contact with the contact point (24) essentially at the same time as the mechanical joining step. The invention also relates to a corresponding device for a carrying out the method.

Description

Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und VorrichtungMethod for electrically connecting an electrical conductor to an electronic component and device
Beschreibungdescription
Die Erfindung betrifft ein Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement gemäß Anspruch 1 sowie eine Vorrichtung gemäß Anspruch 11.The invention relates to a method for electrically connecting an electrical conductor to an electronic component according to claim 1 and a device according to claim 11.
In zunehmendem Maße wird eine Integration von Mikroelektronik in großflächigen technischen Textilien angestrebt, um so von den rein passiven Funktionen zu aktiven (z.B. Displays) bzw. interaktiven (z.B. Sensorfelder) zu gelangen. Zur Realisierung eines solchen Systems werden leitfähigen Fasern zurThe integration of microelectronics in large-scale technical textiles is increasingly being sought in order to move from purely passive functions to active (e.g. displays) or interactive (e.g. sensor fields). To implement such a system, conductive fibers are used
Stromversorgung und Datenübertragung und gegebenenfalls als Sensoren im flächigen Textil integriert. Eingebrachte mikroelektronische Systeme in Chip- oder Modulform müssen elektrisch und mechanisch fest mit diesen leitfähigen Fasern verbunden werden.Power supply and data transmission and possibly integrated as sensors in the flat textile. Microelectronic systems in chip or module form must be firmly and electrically connected to these conductive fibers.
Bisher wurden leitfähige Fasern in Textilien durch Crimpen mit den Modulen kontaktiert . Die Faserbüschel werden dabei durch eine Metallklammer umschlossen und gequetscht. Crimpkontakte in Textilien sind jedoch wenig zuverlässig, da sie keine eigeneSo far, conductive fibers in textiles have been contacted with the modules by crimping. The tufts of fibers are enclosed and squeezed by a metal clip. However, crimp contacts in textiles are not very reliable because they do not have their own
Federspannung besitzen. Ferner ist es bekannt leitfähige Fasern in Textilien durch Löten oder BügeIschweißen zu kontaktieren. Hierbei werden sehr hohe Temperaturen benötigt, wodurch das textile Gewebe stark beschädigt wird.Have spring tension. It is also known to contact conductive fibers in textiles by soldering or iron welding. Very high temperatures are required here, as a result of which the textile fabric is severely damaged.
Es ist somit eine Aufgabe der vorliegenden Erfindung, ein Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement und eine Vorrichtung bereitzustellen, bei welchen die Verbindungstechnologie preiswert , zuverlässig und robust ist .It is therefore an object of the present invention, a method for electrically connecting an electrical conductor to an electronic component and a device to provide, in which the connection technology is inexpensive, reliable and robust.
Diese Aufgabe wird gemäß der vorliegenden Erfindung gelöst 5. durch ein Verfahren mit den in Anspruch 1 angegebenen Merkmalen und eine Vorrichtung mit den in Anspruch 11 angegebenen Merkmalen. Bevorzugte Ausführungs formen sind Inhalt der abhängigen Ansprüche . 0 Gemäß der Erfindung wird ein Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement bereitgestellt mit den Schritten : Bereitstellen eines textilen Materials , in welchem zumindest ein flexibler, draht- und/oder fadenartiger5 elektrischer Leiter angeordnet ist ; Positionieren einer elektrisch leitfähigen Kontaktstelle des elektronischen Bauelements relativ zu dem elektrischen Leiter des textilen Materials ; Verbinden des textilen Materials mit dem Bauelement , wobei0 der Schritt des Verbindens die folgenden Schritte umfaßt : mechanisches Verbinden des textilen Materials mit dem Bauelement durch Verkleben bzw. eine Klebeverbindung; elektrisches Verbinden des Leiters mit der leitfähigen Kontaktstelle durch mittelbares und/oder5 unmittelbares Inkontaktbringen des Leiters mit der Kontaktstelle im wesentlichen gleichzeitig mit dem Schritt des mechanischen Verbindens bzw. Ausbilden einer elektrischen Verbindung bzw. eines elektrischen Kontakts durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters mit der0 Kontaktstelle , wobei die elektrische Verbindung mit Hilfe der mechanischen Klebeverbindung zwischen dem textilen Material und dem Bauelement gehalten wird. Vorzugsweise ist das textile Material ein Gewebe. Unter einem Gewebe wird hierbei ein textiles Flächengebilde aus zwei sich insbesondere rechtwinklig kreuzenden Fadensystemen verstanden, welche - wie üblich - als Kette und Schuß bezeichnet werden. Die Kette liegt in Längsrichtung des Webprozesses während die Schußrichtung quer zur Webrichtung verläuft .This object is achieved according to the present invention by a method with the features specified in claim 1 and a device with the features specified in claim 11. Preferred forms of execution are the content of the dependent claims. According to the invention, a method for electrically connecting an electrical conductor to an electronic component is provided, comprising the steps of: providing a textile material in which at least one flexible, wire and / or thread-like electrical conductor is arranged; Positioning an electrically conductive contact point of the electronic component relative to the electrical conductor of the textile material; Connecting the textile material to the component, wherein the step of connecting comprises the following steps: mechanically connecting the textile material to the component by gluing or an adhesive connection; electrically connecting the conductor to the conductive contact point by indirectly and / or5 directly contacting the conductor with the contact point substantially simultaneously with the step of mechanically connecting or forming an electrical connection or an electrical contact by indirectly and / or directly contacting the conductor with der0 contact point, the electrical connection being held by means of the mechanical adhesive connection between the textile material and the component. The textile material is preferably a woven fabric. In this case, a fabric is understood to mean a textile fabric made up of two thread systems, in particular crossing one another at right angles, which - as usual - are referred to as warp and weft. The warp lies in the longitudinal direction of the weaving process while the weft direction is transverse to the weaving direction.
Der Leiter umfaßt vorzugsweise zumindest einen Schuß- und/oder Kettfaden des Gewebes.The conductor preferably comprises at least one weft and / or warp thread of the fabric.
Vorzugsweise umfaßt der Leiter dünne Metalldrrähte aus z.B. Kupfer, versilbertem Kupfer oder Stahl oder kiunststoffbasierte Fasern, wie z.B. Polymerf sern, mit Metall beschichtete Polymerfasern, Carbonfasern o.a..Preferably the conductor comprises thin metal wires made e.g. Copper, silver-plated copper or steel or plastic-based fibers, e.g. Polymer fibers, metal-coated polymer fibers, carbon fibers, etc.
Bei dem elektronischen Bauelement kann es sich beispielsweise um eine integrierte Schaltung bzw. Chip, ein Modul, einen RF- ID-Tag oder eine auf einem Isolator aufgebrachte Leiterbahn, welche mit einem externen elektronischen Bauelement verbunden ist, handeln.The electronic component can be, for example, an integrated circuit or chip, a module, an RF-ID tag or an interconnect applied to an insulator, which is connected to an external electronic component.
Nach dem Schritt des Positionierens kann vorgesehen sein, daß das Bauelement bereits leicht an dem textilen Material haftet. Somit wird die Justierung der zu verbindenden Teile vereinfacht .After the positioning step, it can be provided that the component already adheres slightly to the textile material. This simplifies the adjustment of the parts to be connected.
Durch das Verkleben wird eine sichere und haltbare Verbindung zwischen dem elektronischen Bauelement und dem textilen Material gewährleistet .The gluing ensures a secure and durable connection between the electronic component and the textile material.
Das elektrische Verbinden erfolgt vorzugsweise lediglich durch Annähern und Inkontaktbringen des Leiters und der leitfähigen Kontaktstelle. Hierbei ist es nicht notwendig eine zusätzliche elektrische Verbindung wie z.B. durch Löten, Leitkleben, Schweißen oder ähnliches herzustellen. Mit Hilfe der mechanischen Klebeverbindung kann die elektrische Verbindung dauerhaft aufrechterhalten werden. Somit kann auf einfache und kostengünstige Art und Weise gleichzeitig eine stabile und 5. haltbare mechanische Verbindung und eine sichere elektrische Verbindung zwischen dem elektronischen Bauelement und dem textilen Material hergestellt werden.The electrical connection is preferably carried out only by bringing the conductor and the conductive contact point closer and in contact. There is no need for an additional electrical connection such as soldering, conductive glue, To produce welding or the like. With the help of the mechanical adhesive connection, the electrical connection can be maintained permanently. Thus, a stable and durable mechanical connection and a secure 5. electrical connection between the electronic component and the textile material can be produced in a simple and inexpensive manner at the same time.
Bevorzugt umfaßt das Verfahren einen Schritt des zumindest0 bereichsweisen Auftragens eines Klebstoffs auf das textile Material und/oder das Bauelement. Weiter bevorzugt wird der Klebstoff auf elektrisch leitende und elektrisch nicht-leitende Bereiche des elektronischen Bauelements und/oder diesen Bereichen entsprechende Bereiche des textilen Materials5 aufgetragen bzw. Bereich des textilen Materials, an welchen das Bauelement angeordnet werden soll .The method preferably comprises a step of applying an adhesive at least in regions to the textile material and / or the component. The adhesive is further preferably applied to electrically conductive and electrically non-conductive regions of the electronic component and / or regions of the textile material 5 corresponding to these regions or region of the textile material on which the component is to be arranged.
Der Klebstoff wird vorzugsweise derart aufgetragen, daß eine zuverlässige Verbindung des Bauelements mit dem textilen0 Material erreicht wird. Insbesondere kann vorgesehen sein, daß der Klebstoff im wesentlichen auf der gesamten Flächenseite des Bauelements, welche mit dem textilen Material in Kontakt kommt, vorgesehen ist. 5 Vorzugsweise ist der Klebstoff ein elektrisch nicht-leitender bzw. isolierender Klebstoff bzw. ein sog. "Non-Conducting Adhesive" bzw. NCA.The adhesive is preferably applied in such a way that a reliable connection of the component with the textile material is achieved. In particular, it can be provided that the adhesive is provided essentially on the entire surface side of the component which comes into contact with the textile material. 5 The adhesive is preferably an electrically non-conductive or insulating adhesive or a so-called "non-conductive adhesive" or NCA.
Solche Kleber umfassen vorzugsweise ein- oder mehrkomponentige0 Epoxidharze bzw. andere geeignete temperatur- und/oder UV- härtende Kleber.Such adhesives preferably comprise one- or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives.
Alternativ kann der Klebstoff ein anisotroper leitender Klebstoff bzw. ein sog. "Anisotropie Conductive Adhesive" bzw. ACA sein, wobei der Klebstoff vorzugsweise eine isolierende Klebmasse und in der Klebmasse bewegbare leitende Elemente bzw. Partikel umfaßt.Alternatively, the adhesive can be an anisotropic conductive adhesive or a so-called "anisotropy conductive adhesive" or Be ACA, the adhesive preferably comprising an insulating adhesive and moveable conductive elements or particles in the adhesive.
Die leitenden Partikel sind vorzugsweise kleine metallbeschichtete Kugeln. Die Kugeln können hart bzw. fest und im wesentlichen nicht verformbar, z.B. aus Glas, oder weich und verformbar, z.B. aus Polyester, ausgebildet sein. Die Metallbeschichtung der Kugeln kann z.B. eine NiAu-Beschichtung sein.The conductive particles are preferably small metal-coated balls. The balls can be hard or solid and essentially non-deformable, e.g. made of glass, or soft and deformable, e.g. made of polyester. The metal coating of the balls can e.g. be a NiAu coating.
Anisotrope leitende Klebstoffe sind insbesondere dadurch gekennzeichnet, daß sie im Grundzustand in keiner Raumrichtung leitfähig sind, da sich die leitfähigen Partikel auf Grund der geringen Größe und Anzahl im Klebstoff nicht gegenseitig berühren. Die Leitfähigkeit kommt erst zustande, wenn der Klebstoff und die darin enthaltenen leitfähigen Partikel zwischen zwei Kontaktflächen eingeklemmt werden. Hierbei wird ein elektrischer Kontakt zwischen den zwei Kontaktflächen ausgebildet.Anisotropic conductive adhesives are particularly characterized in that they are not conductive in any spatial direction in the basic state, since the conductive particles do not touch one another due to the small size and number in the adhesive. The conductivity only comes about when the adhesive and the conductive particles it contains are clamped between two contact surfaces. An electrical contact is formed between the two contact surfaces.
Bevorzugt umfaßt der Schritt des Verbindens des textilen Materials mit dem Bauelement einen Schritt des Aufbringens von Druck zumindest auf die Kontaktstelle des elektronischen Bauelements und den elektrischen Leiter des textilen Materials, welche miteinander kontaktiert werden sollen.The step of connecting the textile material to the component preferably comprises a step of applying pressure at least to the contact point of the electronic component and the electrical conductor of the textile material which are to be contacted.
Hierbei wird der isolierende Klebstoff bzw. die isolie -ende Klebmasse zwischen der Kontaktstelle des elektronischen. Bauelements und dem elektrischen Leiter verdrängt und ein elektrischer Kontakt zwischen der Kontaktstelle und dem Leiter ausgebildet. Des weiteren wird eine feste Verklebung des Bauelements mit dem textilen Material erreicht. Weiter bevorzugt umfaßt der Schritt des Verbindens des textilen Materials mit dem Bauelement einen Schritt des Aufbringens einer erhöhten Temperatur zumindest auf die Kontaktstelle des elektronischen Bauelements und den elektrischen Leiter des textilen Materials, welche miteinander kontaktiert werden sollen.Here, the insulating adhesive or the insulating adhesive between the contact point of the electronic. Component and the electrical conductor displaced and an electrical contact between the contact point and the conductor is formed. Furthermore, the component is firmly bonded to the textile material. More preferably, the step of connecting the textile material to the component comprises a step of applying an elevated temperature at least to the contact point of the electronic component and the electrical conductor of the textile material which are to be contacted.
Mit Hilfe der erhöhten Temperatur wird die Klebewirkung des Klebstoffs weiter erhöht. Des weiteren kann vorgesehen sein, daß der Klebstoff bei erhöhten Temperaturen aushärtet.With the help of the increased temperature, the adhesive effect of the adhesive is further increased. It can further be provided that the adhesive cures at elevated temperatures.
Zum Aufbringen des Drucks und der erhöhten Temperatur wird vorzugsweise eine Thermode verwendet . Die Thermode ist vorzugsweise derart ausgestaltet, daß zumindest die miteinander zu kontaktierenden Bereiche des elektronischen Bauelements und des textilen Materials fest aufeinander gedrückt bzw. aufeinander gepreßt werden.A thermode is preferably used to apply the pressure and the elevated temperature. The thermode is preferably designed such that at least the areas of the electronic component and the textile material to be contacted are pressed firmly onto one another or pressed onto one another.
In einer bevorzugten Ausführungsform umfaßt das Bauelement eine Vielzahl von elektrisch leitfähigen Kontaktstellen und das textile Material eine Vielzahl von elektrischen Leitern und der Schritt des Positionierens das gleichzeitige Anordnen der Leiter an die Kontaktstellen.In a preferred embodiment the component comprises a multiplicity of electrically conductive contact points and the textile material a multiplicity of electrical conductors and the step of positioning the simultaneous arrangement of the conductors at the contact points.
Somit können vorzugsweise im wesentlichen alle zu kontaktierenden Kontaktstellen des Bauelements im wesentlichen gleichzeitig mit Leitern des textilen Materials kontaktiert werden. In diesem Fall weist die Thermode vorzugsweise eine derartige Form auf, daß alle zu kontaktierenden Bereiche gleichzeitig aufeinander gepreßt werden. Somit kann auf kostengünstige und zeitsparende Weise ein Bauelement mit einem textilen Material elektrisch und mechanisch verbunden werden. Bevorzugt umfaßt das Verfahren ferner einen Schritt des Durchtrennens des kontaktierten fadenartigen elektrischen Leiters .Thus, preferably essentially all contact points of the component to be contacted can be contacted with conductors of the textile material essentially simultaneously. In this case, the thermode preferably has a shape such that all areas to be contacted are pressed onto one another at the same time. Thus, a component can be electrically and mechanically connected to a textile material in a cost-effective and time-saving manner. The method preferably further comprises a step of severing the contacted thread-like electrical conductor.
Insbesondere wenn zwei oder mehr Kontaktstellen des Bauelements mit demselben Leiter verbunden werden, kann es notwendig sein, daß die Verbindung zwischen diesen Kontaktstellen, welche durch den Leiter ausgebildet würde, durchtrennt wird. Das Durchtrennen kann vorzugsweise durch ein Ausschneiden eines geeigneten Bereichs des textilen Materials erfolgen.In particular, if two or more contact points of the component are connected to the same conductor, it may be necessary for the connection between these contact points, which would be formed by the conductor, to be severed. The cutting can preferably be done by cutting out a suitable area of the textile material.
Gemäß der Erfindung wird ferner eine Vorrichtung bereitgestellt mit einem textilen Material, in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter angeordnet ist; zumindest einem elektronischen Bauelement, welches zumindest eine elektrisch leitfähige Kontaktstelle umfaßt und mit dem Leiter mechanisch und elektrisch verbunden ist; wobei die mechanische Verbindung zwischen dem textilen Material und dem elektronischen Bauelement durch eine Klebeverbindung ausgebildet wird, und die elektrische Verbindung durch einen elektrischen Kontakt zwischen der elektrisch leitfähigen Kontaktstelle des Bauelements und dem Leiter des textilen Materials durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters mit der Kontaktstelle ausgebildet wird, wobei der Kontakt mit Hilfe der mechanischen Klebeverbindung zwischen dem textilen Material und dem Bauelement gehalten wird.According to the invention, a device is further provided with a textile material, in which at least one flexible, wire and / or thread-like electrical conductor is arranged; at least one electronic component which comprises at least one electrically conductive contact point and is mechanically and electrically connected to the conductor; wherein the mechanical connection between the textile material and the electronic component is formed by an adhesive connection, and the electrical connection by an electrical contact between the electrically conductive contact point of the component and the conductor of the textile material by indirectly and / or directly contacting the conductor with the Contact point is formed, the contact being held by means of the mechanical adhesive connection between the textile material and the component.
Die elektrische Verbindung zwischen dem Bauelement und dem textilen Material wird vorzugsweise ohne weitere zusätzliche Hilfsmittel wie z.B. Lot, Leitkleber oder ähnliches ausgebildet. Insbesondere stehen die leitfähige Kontaktstelle des Bauelements und der Leiter des textilen Materials in mittelbarem und/oder unmittelbarem elektrischen Kontakt, wobei diese entweder im wesentlichen direkt aneinanderliegen und/oder über ein jeweils daran anliegendes leitendes Zwischenmedium.The electrical connection between the component and the textile material is preferably made without further additional aids such as solder, conductive adhesive or the like educated. In particular, the conductive contact point of the component and the conductor of the textile material are in indirect and / or direct electrical contact, which either lie essentially directly against one another and / or via a conductive intermediate medium in each case thereon.
Vorzugsweise ist die Klebeverbindung in elektrisch leitenden und elektrisch nicht-leitenden Bereichen des elektronischen Bauelements vorgesehen.The adhesive connection is preferably provided in electrically conductive and electrically non-conductive regions of the electronic component.
Die Klebeverbindung umgibt bevorzugt die miteinander elektrisch in Verbindung stehenden Teile des Bauelements und des textilen Materials. Dadurch kann ferner eine gute mechanische Verbindung des Bauelements mit dem textilen Material erreicht werden.The adhesive connection preferably surrounds the parts of the component and the textile material which are electrically connected to one another. As a result, a good mechanical connection of the component to the textile material can also be achieved.
Bevorzugt wird die Klebeverbindung mittels eines Klebstoffs ausgebildet .The adhesive connection is preferably formed by means of an adhesive.
Weiter bevorzugt ist der Klebstoff ein elektrisch nicht- leitender bzw. isolierender Klebstoff bzw. ein sog. "Non- Conducting Adhesive" bzw. NCA.The adhesive is further preferably an electrically non-conductive or insulating adhesive or a so-called “non-conductive adhesive” or NCA.
Alternativ ist der Klebstoff ein anisotroper leitender Klebstoff bzw. ein sog. "Anisotropie Conductive Adhesive" bzw. ACA, wobei der Klebstoff vorzugsweise eine isolierendeAlternatively, the adhesive is an anisotropic conductive adhesive or a so-called "anisotropy conductive adhesive" or ACA, the adhesive preferably being an insulating one
Klebmasse und in der Klebmasse bewegbare leitende Elemente bzw. Partikel umfaßt .Adhesive and conductive elements or particles movable in the adhesive.
In einer bevorzugten Ausführungsform umfaßt die elektrisch leitfähige Kontaktstelle des Bauelements, einen vorspringenden Abschnitt, welcher mit dem Leiter mittelbar und/oder unmittelbar in elektrischen Kontakt gebracht wird. Der vorspringende Abschnitt ist vorzugsweise als ein sogenannten "Bump" an der Kontaktstelle ausgebildet. Durch da.s Vorsehen des vorspringenden Abschnitts kann bei der Herstellung der Vorrichtung, insbesondere der Verbindung des Bauelements 5. mit dem textilen Material, der Druck im Kontaktbereich zwischen der Kontaktstelle und dem Leiter erhöht werden. Somit kann eine sichere elektrische und mechanische Verbindung ausgebildet werden. 0 Ferner kann vorgesehen sein, daß die Kontaktstelle selbst von dem Bauelement vorspringend ausgebildet ist.In a preferred embodiment, the electrically conductive contact point of the component comprises a projecting section which is brought into direct and / or electrical contact with the conductor. The projecting section is preferably designed as a so-called "bump" at the contact point. By providing the projecting section, the pressure in the contact area between the contact point and the conductor can be increased during the manufacture of the device, in particular the connection of the component 5 with the textile material. A secure electrical and mechanical connection can thus be formed. Furthermore, it can be provided that the contact point itself is protruding from the component.
Bevorzugt ist das elektronische Bauelement eine integrierte Schaltung bzw. Halbleitervorrichtung bzw. ein Chip, ein Modul,5 ein RF-ID-Tag oder eine auf einem Isolator aufgebrachte Leiterbahn, welche mit einem externen elektronischen Bauelement verbunden ist.The electronic component is preferably an integrated circuit or semiconductor device or a chip, a module, an RF-ID tag or an interconnect applied to an insulator, which is connected to an external electronic component.
Weiter bevorzugt ist das textile Material ein Gewebe und der0 Leiter umfaßt zumindest einen Schuß- und/oder Kettfaden des Gewebes .The textile material is more preferably a woven fabric and the conductor comprises at least one weft and / or warp thread of the woven fabric.
Weitere Merkmale, Aufgaben und Vorteile der vorliegenden Erfindung werden offensichtlich aus der detaillierten5 Beschreibung bevorzugter Ausführungsformen mit Bezug auf die Figuren, in welchen zeigt:Further features, objects and advantages of the present invention will become apparent from the detailed description of preferred embodiments with reference to the figures, in which:
Figuren 1A, 1B, IC Schnittansichten einer Vorrichtung gemäß einer ersten bevorzugten Ausführungsform0 der vorliegenden Erfindung während des Verbindungsvorgangs ;FIGS. 1A, 1B, IC sectional views of a device according to a first preferred embodiment of the present invention during the connection process;
Figuren 2A bis 2D schematische Draufsichten auf die Vorrichtung gemäß der ersten bevorzugten Ausführungsform während des Verbindungsvorgangs; undFigures 2A to 2D schematic plan views of the device according to the first preferred Embodiment during the connection process; and
Figuren 3A und 3B Schnittansichten einer Vorrichtung gemäß 5. der zweiten bevorzugten Ausführungsform der vorliegenden Erfindung während des VerbindungsVorgangs .FIGS. 3A and 3B are sectional views of a device according to 5. the second preferred embodiment of the present invention during the connection process.
Eine erste Ausführungsform einer erfindungsgemäßen Vorrichtung0 während des Verbindungsvorgangs ist in Figuren 1A, IB und IC im Schnitt und in Figuren 2A bis 2D in schematischen Draufsichten dargestellt .A first embodiment of a device 0 according to the invention during the connection process is shown in section in FIGS. 1A, IB and IC and in FIGS. 2A to 2D in schematic plan views.
Fig. 1A zeigt eine Schnittansicht der Vorrichtung gemäß der5 ersten Ausführungsform vor dem Verbinden eines textilen Materials 10 mit einem elektronischen Bauelement 20, Fig. IB zeigt die Vorrichtung während des Verbindens und Fig. IC zeigt die verbundene erfindungsgemäße Vorrichtung gemäß der ersten Ausführungsform.0 Fig. 2A zeigt das textile Material 10 vor dem Verbinden, Fig. 2B zeigt das textile Material 10 nach einem ersten Verabeitungsschritt, Fig. 2C zeigt ein an dem textilen Material 10 positioniertes Bauelement 20 und Fig. 2D zeigt die5 Vorrichtung während des Verbindens .1A shows a sectional view of the device according to the first embodiment before the connection of a textile material 10 to an electronic component 20, FIG. 1B shows the device during the connection and FIG. IC shows the connected device according to the invention according to the first embodiment 2A shows the textile material 10 before the connection, FIG. 2B shows the textile material 10 after a first processing step, FIG. 2C shows a component 20 positioned on the textile material 10 and FIG. 2D shows the device during the connection.
Bei dem textilen Material 10 handelt es sich um ein Gewebe. Unter Gewebe wird hierbei ein textiles Flächengebilde aus zwei sich insbesondere rechtwinklig kreuzenden Fadensystemen0 verstanden, welche - wie üblich - als Kette und Schuß bezeichnet werden. Die Fäden 16 des textilen Materials 10 sind aus einem elektrisch nicht leitenden Material, wie z.B. Polyester, Polyamid, o.a., ausgebildet. In dem textilen Material 10 sind elektrische Leiter 12 eingewebt. In der dargestellten Ausführungsform, besteht der Leiter 12 aus fünf im wesentlichen parallel zueinander verlaufenden elektrisch leitenden Drähten bzw. Garnen bzw. 5. Fasern 14. Der Leiter 12 kann jedoch je nach Anwendung auch jede andere beliebige Anzahl an Drähten aufweisen. In der dargestellten Ausführungsform sind die Drähte des Leiters 12 nicht mit Isolierungen versehen. 0 Das elektronische Bauelement 20 umfaßt in der dargestellten Ausführungsform einen Wafer bzw. eine Halbleitervorrichtung 22 und metallische Kontaktstellen bzw. Pads 24. Die Kontaktstellen 24 springen in der dargestellten Ausführungsform von dem Wafer 22 vor. Die Höhe der Kontaktstellen 24 beträgt vorzugsweise 05 bis 10 μm.The textile material 10 is a fabric. In this context, fabric is understood to mean a textile fabric made up of two thread systems 0, in particular intersecting at right angles, which - as usual - are referred to as warp and weft. The threads 16 of the textile material 10 are made of an electrically non-conductive material, such as polyester, polyamide, or the like. Electrical conductors 12 are woven into the textile material 10. In the embodiment shown, the conductor 12 consists of five electrically conductive wires or yarns or 5 fibers 14 running essentially parallel to one another. However, depending on the application, the conductor 12 can also have any other desired number of wires. In the illustrated embodiment, the wires of the conductor 12 are not provided with insulation. In the embodiment shown, the electronic component 20 comprises a wafer or a semiconductor device 22 and metallic contact points or pads 24. The contact sites 24 project from the wafer 22 in the embodiment shown. The height of the contact points 24 is preferably 05 to 10 μm.
In der dargestellten Ausführungsform ist das Bauelement 20 ferner mit einem Klebstoff 30 versehen. Der Klebstoff 30 ist hierbei vorzugsweise im wesentlichen entlang der gesamten0 Flächenseite des Bauelements 20, welche mit dem textilen Material 10 verbunden werden soll, vorgesehen. Alternativ kann jedoch der Klebstoff 30 auch nur bereichsweise, vorzugsweise jeweils im Bereich der Kontaktstellen 24 vorgesehen sein. 5 Der Klebstoff 30 kann auf jede geeignete Art auf das Bauelement 20 aufgetragen werden. Insbesondere kann der Klebstoff 30 in Form einer Folie zu einem anderen Zeitpunkt auf das Bauelement 20 aufgetragen werden. Alternativ kann das Bauelement 20 kurz vor dem Verbinden mit dem textilen Material 10 mit dem0 Klebstoff 30 versehen werden. Alternativ kann vorgesehen sein, daß der Klebstoff 30 auf das textile Material 10 aufgebracht wird. Gemäß der ersten bevorzugten Ausführungsform der vorliegenden Erfindung ist der Klebstoff 30 ein elektrisch nicht leitender bzw. isolierender Klebstoff bzw. ein sogenannter "Non- Conductive Adhesive" bzw. NCA. Vorzugsweise werden hierfür ein- 5. oder mehrkomponentige Epoxidharze bzw. andere geeignete temperatur- und/oder UV-härtende Kleber verwendet .In the illustrated embodiment, the component 20 is also provided with an adhesive 30. The adhesive 30 is preferably provided essentially along the entire surface side of the component 20 which is to be connected to the textile material 10. Alternatively, however, the adhesive 30 can also be provided only in regions, preferably in the region of the contact points 24. 5 The adhesive 30 can be applied to the component 20 in any suitable manner. In particular, the adhesive 30 can be applied to the component 20 in the form of a film at another time. Alternatively, the component 20 can be provided with the adhesive 30 shortly before being connected to the textile material 10. Alternatively, it can be provided that the adhesive 30 is applied to the textile material 10. According to the first preferred embodiment of the present invention, the adhesive 30 is an electrically non-conductive or insulating adhesive or a so-called "non-conductive adhesive" or NCA. Single-component or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives are preferably used for this.
Bei der Herstellung der Vorrichtung gemäß der ersten bevorzugten Ausführungsform wird zunächst an der Stelle des0 textilen Materials 10, an welcher das Bauelement 20 positioniert werden soll, ein dem Bauelement 20 in wesentlichen entsprechender Bereich 18 aus dem textilen Material 10 herausgeschnitten (Fig. 2B) . Hierbei ist es vorteilhaft, wenn der Bereich 19 etwas kleiner ist, als die Fläche des5 Bauelements 20, wenn die Kontaktstellen 24 des Bauelements 20 im wesentlichen entlang des Umfangs angeordnet sind.In the manufacture of the device according to the first preferred embodiment, an area 18 essentially corresponding to the component 20 is cut out of the textile material 10 at the location of the textile material 10 at which the component 20 is to be positioned (FIG. 2B). It is advantageous here if the area 19 is somewhat smaller than the area of the component 20, if the contact points 24 of the component 20 are arranged essentially along the circumference.
Alternativ kann das Ausschneiden des Materials erst nach dem Kontaktieren bzw. Verkleben des Bauelements 20 erfolgen.0 Alternativ zum Ausschneiden können beim Webprozeß die leitfähigen Fasern obenliegend verarbeitet werden, so daß nur das nicht-leitfähige Material zu einem Gewebe verbunden wird (sog. Jaquard-Technik) . Diese relativ locker aufliegenden5 oberflächigen leitfähigen Fäden können dann auf einfache Weise gekappt bzw. durchtrennt werden. Darunter bleibt ein stabiles isolierendes Gewebe erhalten daß eine zusätzliche mechanische Stabilität für das Bauelement 20 bringt. 0 In der dargestellten Ausführungsform befindet sich der Bereich 18 an einem Kreuzungspunkt mehrerer Leiter 12 des textilen Materials 10. Dadurch werden die Leiter 12 unterbrochen. An den nun offenen Enden 19 der Leiter 12 kann nachfolgend das Bauelement 20 kontaktiert werden (später beschrieben) . Nachfolgend wird das Bauelement 20 bezüglich dem textilen Material 10 ausgerichtet und an dem textilen Material 10 angeordnet (Figuren 1A und 2C) . Insbesondere wird das 5. Bauelement 20 derart auf dem textilen Material 10 angeordnet, daß die jeweiligen Kontaktstellen 24 korrekt bezüglich den jeweils damit zu kontaktierenden elektrischen Leitern 12 ausgerichtet sind. Hierbei wird vorteilhafterweise durch das Vorhandensein des Klebstoffs 30 ein Verrutschen des0 positionierten Bauelements 20 nach dem Positionier- und Justiervorgang verhindert. Insbesondere ist es von Vorteil, wenn der Klebstoff 30 bereits bei Raumtemperatur leichte bzw. wieder-lösbare Klebeeigenschaften aufweist. 5 Nachfolgend werden die zu kontaktierenden Bereiche mit Druck und einer erhöhten Temperatur beaufschlagt. Dies ist in Figuren IB und 2D gezeigt. Hierzu wird eine Thermode 50 verwendet, welche das textile Material 10 und insbesondere den elektrischen Leiter 12 auf die Kontaktstelle 24 des Bauelements0 20 gegen eine Auflage 52 preßt. Durch den Druck und die erhöhte Temperatur wird der Klebstoff 30 zwischen dem elektrischen Leiter 12 und der Kontaktstelle 24 verdrängt und es wird ein elektrischer Kontakt zwischen der Kontaktstelle 24 und dem elektrischen Leiter 12 ausgebildet. Dadurch, daß die5 Kontaktstellen 24 von dem Wafer 22 vorspringend ausgebildet sind, kann der Druck durch die Thermode 50 vergrößert werden. Durch die Thermode 50 werden die Kontaktregionen mit Temperatur und Wärme beaufschlagt. Hierbei wird der Klebstoff fest bzw. härtet aus. Somit wird eine feste und haltbare mechanische0 Verbindung zwischen dem Wafer 22 und dem textilen Material 10 ausgebildet . In der Thermode 50 wird vorzugsweise eine Temperatur von weniger als 300°C und einen Druck von ca. 1 - 100 N/m2 verwendet .As an alternative, the material can only be cut out after the component 20 has been contacted or glued. Technology). These relatively loosely lying surface conductive threads can then be cut or severed in a simple manner. Underneath, a stable, insulating fabric is retained that provides additional mechanical stability for the component 20. In the embodiment shown, the area 18 is located at a crossing point of a plurality of conductors 12 of the textile material 10. As a result, the conductors 12 are interrupted. The component 20 can subsequently be contacted at the now open ends 19 of the conductors 12 (described later). The component 20 is then aligned with respect to the textile material 10 and arranged on the textile material 10 (FIGS. 1A and 2C). In particular, the 5th component 20 is arranged on the textile material 10 such that the respective contact points 24 are correctly aligned with respect to the electrical conductors 12 to be contacted therewith. In this case, the presence of the adhesive 30 advantageously prevents the component 20 positioned from slipping after the positioning and adjustment process. In particular, it is advantageous if the adhesive 30 has light or releasable adhesive properties even at room temperature. 5 The areas to be contacted are then subjected to pressure and an elevated temperature. This is shown in Figures IB and 2D. For this purpose, a thermode 50 is used, which presses the textile material 10 and in particular the electrical conductor 12 onto the contact point 24 of the component 20 against a support 52. Due to the pressure and the elevated temperature, the adhesive 30 is displaced between the electrical conductor 12 and the contact point 24 and an electrical contact is formed between the contact point 24 and the electrical conductor 12. Because the 5 contact points 24 are protruding from the wafer 22, the pressure through the thermode 50 can be increased. Temperature and heat are applied to the contact regions by the thermode 50. This causes the adhesive to harden or harden. Thus, a firm and durable mechanical connection between the wafer 22 and the textile material 10 is formed. A temperature of less than 300 ° C. and a pressure of approximately 1 to 100 N / m 2 are preferably used in the thermode 50.
In Fig. IC eine Vorrichtung gemäß der ersten Ausführungsform nach dem Verbindungsvorgang gezeigt. Hierbei liegen die Leiter 12 direkt an dem Kontaktstellen 24 an und es wird eine elektrische Verbindung dazwischen ausgebildet. Ferner besteht eine großflächige, feste und haltbare mechanische Verbindung zwischen dem textilen Material 10 und dem Bauelement 20 durch den ausgehärteten Klebstoff 30.In Fig. IC a device according to the first embodiment shown after the connection process. Here, the conductors 12 lie directly on the contact points 24 and an electrical connection is formed between them. Furthermore, there is a large-area, firm and durable mechanical connection between the textile material 10 and the component 20 through the hardened adhesive 30.
In Figuren 3A und 3B ist eine Vorrichtung gemäß einer zweiten bevorzugten Ausführungsform der vorliegenden Erfindung im Schnitt gezeigt.FIGS. 3A and 3B show a device according to a second preferred embodiment of the present invention in section.
Die Bestandteile der Vorrichtung gemäß der zweiten Ausführungsform der Erfindung, welche mit den Bestandteilen der Vorrichtung gemäß der ersten bevorzugten Ausführungsform der Erfindung identisch bzw. gleich sind, werden mit gleichenThe components of the device according to the second embodiment of the invention, which are identical or identical to the components of the device according to the first preferred embodiment of the invention, are the same
Bezugszeichen bezeichnet und auf eine detaillierte Beschreibung dieser wird im Nachfolgenden verzichtet.Designated reference numerals and a detailed description of these is omitted below.
Bei der Vorrichtung gemäß der zweiten bevorzugten Ausführungsform der Erfindung wird ein anisotroper leitender Klebstoff bzw. ein sogenannter "Anisotropie Conductive Adhesive" bzw. ACA 40 verwendet. Der Klebstoff 40 umfaßt eine isolierende Klebmasse bzw. klebende Füllmasse 42 und kleine metallbeschichtete Kügelchen bzw. Partikel 44. Die isolierende Klebmasse 42 umfaßt vorzugsweise ein- oder mehrkomponentige Epoxidharze bzw. andere geeignete temperatur- und/oder UV- härtende Kleber. Die metallischen Kügelchen 44 sind vorzugsweise Glaskügelchen, welche mit einer elektrisch leitfähigen Schicht überzogen sind. Alternativ kann vorgesehen sein, daß die metallischen Kügelchen weich und verformbar, und z.B. aus Polyester ausgebildet sind.In the device according to the second preferred embodiment of the invention, an anisotropic conductive adhesive or a so-called "anisotropy conductive adhesive" or ACA 40 is used. The adhesive 40 comprises an insulating adhesive or adhesive filler 42 and small metal-coated balls or particles 44. The insulating adhesive 42 preferably comprises one- or multi-component epoxy resins or other suitable temperature- and / or UV-curing adhesives. The metallic spheres 44 are preferably glass spheres which are coated with an electrically conductive layer. Alternatively, it can be provided be that the metallic beads are soft and deformable, and are made of polyester, for example.
Anisotrope leitende Klebstoffe sind insbesondere dadurch gekennzeichnet, daß sie im Grundzustand in keiner Raumrichtung leitfähig sind, da sich die leitfähigen Partikel auf Grund der geringen Größe und Anzahl im Klebstoff nicht gegenseitig berühren. Die Leitfähigkeit kommt erst zustande, wenn der Klebstoff und die darin enthaltenen leitfähigen Partikel zwischen zwei Kontaktflächen, im vorliegenden Fall der Leiter 12 und die Kontaktstelle 24, eingeklemmt werden. Hierbei wird ein elektrischer Kontakt zwischen den zwei Kontaktflächen ausgebildet .Anisotropic conductive adhesives are particularly characterized in that they are not conductive in any spatial direction in the basic state, since the conductive particles do not touch one another due to the small size and number in the adhesive. The conductivity only comes about when the adhesive and the conductive particles contained therein are clamped between two contact surfaces, in the present case the conductor 12 and the contact point 24. An electrical contact is formed between the two contact surfaces.
Während des in Fig. 3B Verbindungsvorgangs wird die KlebmasseDuring the bonding process in Fig. 3B, the adhesive
42 zwischen dem elektrischen Leiter 12 und der Kontaktstelle 24 verdrängt und die metallischen Kügelchen 44 drücken sich unter Hitze und Druck in den elektrischen Leiter 12 und die Kontaktstellen 24. Ferner kann vorgesehen sein, daß der elektrische Leiter 12 direkt mit der Kontaktstelle 24 in elektrischen Kontakt tritt. Mit Hilfe der metallischen Kügelchen 44 kann der elektrische Kontakt verbessert werden.42 displaced between the electrical conductor 12 and the contact point 24 and the metallic balls 44 press under heat and pressure into the electrical conductor 12 and the contact points 24. Furthermore, it can be provided that the electrical conductor 12 is in direct electrical contact with the contact point 24 occurs. The electrical contact can be improved with the aid of the metallic balls 44.
Die leitfähigen Kügelchen 44 sind in einem solchen Abstand in der isolierenden Klebmasse 42 vorhanden, daß keine horizontale Leitfähigkeit in der Klebeschicht erreicht wird. Eine elektrische Verbindung entsteht nur zwischen den Kontaktstellen 24 des Bauelements 20 und den direkt darunter- bzw. gegenüberliegenden elektrischen Leitern 10 bzw. Drähten 14.The conductive balls 44 are present in the insulating adhesive 42 at such a distance that no horizontal conductivity is achieved in the adhesive layer. An electrical connection is only established between the contact points 24 of the component 20 and the electrical conductors 10 or wires 14 directly below or opposite one another.
Ferner wird mit Hilfe der Klebmasse 42 eine feste mechanische Verbindung zwischen dem Bauelement 20 und dem textilen Material 10 im wesentlichen entlang der gesamten Fläche des Bauelements 20 ausgebildet. In einer weiteren nicht dargestellten Ausführungsform kann vorgesehen sein, daß an den Kontaktstellen 24 des Bauelements 20 Vorsprünge bzw. Bups vorgesehen sind. Die Höhe der Vorsprünge betragt vorzugsweise 0 bis 10 μm. Mit Hilfe der Vorsprünge kann der Druck im Kontaktbereich weiter erhöht werden.Furthermore, with the aid of the adhesive 42, a firm mechanical connection is formed between the component 20 and the textile material 10 essentially along the entire surface of the component 20. In a further embodiment, not shown, it can be provided that 20 projections or bosses are provided at the contact points 24 of the component. The height of the projections is preferably 0 to 10 μm. With the help of the projections, the pressure in the contact area can be increased further.
Wie vorstehend dargestellt, werden nicht-leitende oder anisotrope leitende Klebstoffe zur Kontaktierung vonAs shown above, non-conductive or anisotropic conductive adhesives are used to contact
Bauelementen bzw. Mikroelektronikmodulen an in textilem Material bzw. Textilien eingewebte leitfähige Fasern verwendet, Dadurch können niedrige Verarbeitungstemperaturen, hohe Justiertoleranzen und eine großflächige mechanische Haftung erreicht werden.Components or microelectronic modules are used on conductive fibers woven into textile material or textiles. As a result, low processing temperatures, high adjustment tolerances and extensive mechanical adhesion can be achieved.
Die vorstehend beschriebenen Vorrichtungen können beispielsweise in Boden- oder Wandbeläge integriert werden. Dadurch kann ein System z.B. zum Personentracking, zur Einbruchssicherung, Brandmeldung oder für ein intelligente Personenleitsystem ausgebildet werden. Ferner kann die Vorrichtung zur Rißdetektion in Textilbeton verwendet werden.The devices described above can be integrated, for example, in floor or wall coverings. This enables a system e.g. be trained for personal tracking, burglar protection, fire detection or for an intelligent personal control system. Furthermore, the device for crack detection in textile concrete can be used.
Mit den erfindungsgemäßen Verfahren können ferner RFID-Tags in Textilien integriert werden. Dazu werden die RFID-Tag-Chips an eingewobene Antennen kontaktiert. With the method according to the invention, RFID tags can also be integrated into textiles. For this purpose, the RFID tag chips are contacted on woven antennas.
BezugszeichenlisteLIST OF REFERENCE NUMBERS
textile Material elektrischer Leiter Draht textiler Faden Bereich Ende Bauelement Wafer Kontaktstelle Klebstoff (NCA) Klebstoff (ACA) Klebmasse metallisches Kügelchen Thermode Auflage textile material electrical conductor wire textile thread area end component wafer contact point adhesive (NCA) adhesive (ACA) adhesive metallic bead thermode pad

Claims

Ansprüche Expectations
1. Verfahren zum elektrischen Verbinden eines elektrischen Leiters (12) mit einem elektronischen Bauelement (20) mit den Schritten: - Bereitstellen eines textilen Materials (10) , in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter (12) angeordnet ist; Positionieren einer elektrisch leitfähigen Kontaktstelle (24) des elektronischen Bauelements (20) relativ zu dem elektrischen Leiter (12) des textilen Materials (10) ; Verbinden des textilen Materials (10) mit dem Bauelement (20) , wobei der Schritt des Verbindens die folgenden Schritte umfaßt : mechanisches Verbinden des textilen Materials (10) mit dem Bauelement (20) durch Verkleben; elektrisches Verbinden des Leiters (12) mit der leitfähigen Kontaktstelle (24) durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters (12) mit der Kontaktstelle (24) im wesentlichen gleichzeitig mit dem Schritt des mechanischen Verbindens.1. A method for electrically connecting an electrical conductor (12) to an electronic component (20), comprising the steps: - Providing a textile material (10) in which at least one flexible, wire and / or thread-like electrical conductor (12) is arranged is; Positioning an electrically conductive contact point (24) of the electronic component (20) relative to the electrical conductor (12) of the textile material (10); Connecting the textile material (10) to the component (20), the connecting step comprising the following steps: mechanically connecting the textile material (10) to the component (20) by adhesive bonding; electrically connecting the conductor (12) to the conductive contact point (24) by indirectly and / or directly contacting the conductor (12) with the contact point (24) substantially simultaneously with the step of mechanical connection.
2. Verfahren gemäß Anspruch 1, welches ferner einen Schritt des zumindest bereichsweisen Auftragens eines Klebstoffs (30; 40) auf das textile Material (10) und/oder das Bauelement (20) umfaßt.2. The method according to claim 1, further comprising a step of at least partially applying an adhesive (30; 40) to the textile material (10) and / or the component (20).
3. Verfahren gemäß Anspruch 2, wobei der Klebstoff (30; 40) auf elektrisch leitende und elektrisch nicht-leitende Bereiche des elektronischen Bauelements (20) und/oder diesen Bereichen entsprechende Bereiche des textilen Materials (lO) aufgetragen wird. 3. The method according to claim 2, wherein the adhesive (30; 40) is applied to electrically conductive and electrically non-conductive regions of the electronic component (20) and / or regions of the textile material (10) corresponding to these regions.
4. Verfahren gemäß einem der Ansprüche 2 oder 3, wobei der Klebstoff (30) ein elektrisch nicht-leitender Klebstoff (30) ist .4. The method according to any one of claims 2 or 3, wherein the adhesive (30) is an electrically non-conductive adhesive (30).
5. Verfahren gemäß einem der Ansprüche 2 oder 3, wobei der Klebstoff (40) ein anisotroper leitender Klebstoff (40) ist.5. The method according to any one of claims 2 or 3, wherein the adhesive (40) is an anisotropic conductive adhesive (40).
6. Verfahren gemäß Anspruch 5, wobei der Klebstoff (40) eine isolierende Klebmasse (42) und in der Klebmasse bewegbare leitende Partikel (44) umfaßt.6. The method according to claim 5, wherein the adhesive (40) comprises an insulating adhesive (42) and movable in the adhesive conductive particles (44).
7. Verfahren gemäß einem der vorangehenden Ansprüche, wobei der Schritt des Verbindens des textilen Materials (10) mit dem Bauelement (20) einen Schritt des Aufbringens von Druck zumindest auf die Kontaktstelle (24) des elektronischen Bauelements (20) und den elektrischen Leiter (12) des textilen Materials (10) , welche miteinander kontaktiert werden sollen, umfaßt.7. The method according to any one of the preceding claims, wherein the step of connecting the textile material (10) to the component (20) comprises a step of applying pressure at least to the contact point (24) of the electronic component (20) and the electrical conductor ( 12) of the textile material (10) which are to be contacted with one another.
8. Verfahren gemäß einem der vorangehenden Ansprüche, wobei Schritt des Verbindens des textilen Materials (10) mit dem Bauelement (20) einen Schritt des Aufbringens einer erhöhten Temperatur zumindest auf die Kontaktstelle (24) des elektronischen Bauelements (20) und den elektrischen Leiter (12) des textilen Materials (10) , welche miteinander kontaktiert werden sollen, umfaßt.8. The method according to any one of the preceding claims, wherein step of connecting the textile material (10) to the component (20) comprises a step of applying an elevated temperature at least to the contact point (24) of the electronic component (20) and the electrical conductor ( 12) of the textile material (10) which are to be contacted with one another.
9. Verfahren gemäß einem der vorangehenden Ansprüche, wobei das Bauelement (20) eine Vielzahl von elektrisch leitfähigen9. The method according to any one of the preceding claims, wherein the component (20) a plurality of electrically conductive
Kontaktstellen (24) und das textile Material (10) eine Vielzahl von elektrischen Leitern (12) und der Schritt des Positionierens das gleichzeitige Anordnen der Leiter (12) an die Kontaktstellen (24) umfaßt. Contact points (24) and the textile material (10) a plurality of electrical conductors (12) and the step of positioning comprises the simultaneous arrangement of the conductors (12) on the contact points (24).
10. Verfahren gemäß einem der vorangehenden Ansprüche, welches ferner einen Schritt des Durchtrennens des kontaktierten fadenartigen elektrischen Leiters (X2) umfaßt.10. The method according to any one of the preceding claims, further comprising a step of severing the contacted thread-like electrical conductor (X2).
11. Vorrichtung mit einem textilen Material (10) , in welchem zumindest ein flexibler, draht- und/oder fadenartiger elektrischer Leiter (12) angeordnet ist; - zumindest einem elektronischen Bauelement (20), welches zumindest eine elektrisch leitfähige Kontaktstelle (24) umfaßt und mit dem Leiter (12) mechanisch und elektrisch verbunden ist; wobei - die mechanische Verbindung zwischen dem textilen11. Device with a textile material (10), in which at least one flexible, wire and / or thread-like electrical conductor (12) is arranged; - at least one electronic component (20) which comprises at least one electrically conductive contact point (24) and is mechanically and electrically connected to the conductor (12); whereby - the mechanical connection between the textile
Material (10) und dem elektronischen Bauelement (20) durch eine Klebeverbindung ausgebildet wird, und die elektrische Verbindung durch einen elektrischen Kontakt zwischen der elektrisch leitfähigen Kontaktstelle (24) des Bauelements (20) und dem Leiter (12) des textilen Materials (10) durch mittelbares und/oder unmittelbares Inkontaktbringen des Leiters (12) mit der Kontaktstelle (24) ausgebildet wird, wobei der Kontakt mit Hilfe der mechanischen Klebeverbindung zwischen dem textilen Material (10) und dem Bauelement (20) gehalten wird.Material (10) and the electronic component (20) is formed by an adhesive connection, and the electrical connection by an electrical contact between the electrically conductive contact point (24) of the component (20) and the conductor (12) of the textile material (10) is formed by indirectly and / or directly bringing the conductor (12) into contact with the contact point (24), the contact being held by means of the mechanical adhesive connection between the textile material (10) and the component (20).
12. Vorrichtung gemäß Anspruch 11, wobei die Klebeverbindung in elektrisch leitenden und elektrisch nicht-leitenden Bereichen des elektronischen Bauelements (20) vorgesehen ist.12. The device according to claim 11, wherein the adhesive connection is provided in electrically conductive and electrically non-conductive regions of the electronic component (20).
13. Vorrichtung gemäß einem der Ansprüche 11 oder 12, wobei die Klebeverbindung mittels eines Klebstoffs (30; 40) ausgebildet wird. 13. Device according to one of claims 11 or 12, wherein the adhesive connection is formed by means of an adhesive (30; 40).
14. Vorrichtung gemäß Anspruch 13, wobei der Klebstoff (30) ein elektrisch nicht-leitender Klebstoff (30) ist.14. The apparatus of claim 13, wherein the adhesive (30) is an electrically non-conductive adhesive (30).
15. Vorrichtung gemäß Anspruch 13, wobei der Klebstoff (40) ein anisotroper leitender Klebstoff (40) ist.15. The apparatus of claim 13, wherein the adhesive (40) is an anisotropic conductive adhesive (40).
16. Vorrichtung gemäß Anspruch 15, wobei der Klebstoff (40) eine isolierende Klebmasse (42) und in der Klebmasse (42) bewegbare leitende Partikel (44) umfaßt.16. The apparatus of claim 15, wherein the adhesive (40) comprises an insulating adhesive (42) and movable in the adhesive (42) conductive particles (44).
17. Vorrichtung gemäß einem der Ansprüche 11 bis 16, wobei die elektrisch leitfähige Kontaktstelle (24) des Bauelements17. The device according to one of claims 11 to 16, wherein the electrically conductive contact point (24) of the component
(20) , einen vorspringenden Abschnitt umfaßt, welcher mit dem Leiter (12) mittelbar und/oder unmittelbar in elektrischen Kontakt gebracht wird.(20) comprises a projecting section which is brought into direct and / or electrical contact with the conductor (12).
18. Vorrichtung gemäß einem der Ansprüche 11 bis 17, wobei das elektronische Bauelement (20) eine integrierte Schaltung, ein Modul, ein RF-ID-Tag oder eine auf einem Isolator aufgebrachte Leiterbahn, welche mit einem externen elektronischen Bauelement verbunden ist, ist.18. Device according to one of claims 11 to 17, wherein the electronic component (20) is an integrated circuit, a module, an RF-ID tag or an interconnect applied to an insulator, which is connected to an external electronic component.
19. Vorrichtung gemäß einem der Ansprüche 11 bis 18, wobei das textile Material (10) ein Gewebe ist und der Leiter (12) zumindest einen Schuß- und/oder Kettfaden des Gewebes umfaßt. 19. Device according to one of claims 11 to 18, wherein the textile material (10) is a fabric and the conductor (12) comprises at least one weft and / or warp thread of the fabric.
PCT/EP2005/000139 2004-01-12 2005-01-10 Method for electrically connecting an electrical conductor to an electronic component, and device WO2005067042A1 (en)

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