WO2007104634A1

WO2007104634A1 - Method for attaching and contacting rfid chip modules to produce transponders comprising a textile substrate, and transponder for fabrics

Info

Publication number: WO2007104634A1
Application number: PCT/EP2007/051699
Authority: WO
Inventors: Hans-Peter Monser; Volker Brod
Original assignee: Mühlbauer Ag
Priority date: 2006-03-10
Filing date: 2007-02-22
Publication date: 2007-09-20
Also published as: DE102006011596A1

Abstract

The invention relates to a method for continuously producing a plurality of transponders comprising at least one respective textile substrate (3). In order to produce said transponder, a chip module (1) is electrically connected to an antenna. At least one electrically conductive wire or thread (4) is woven into the textile substrate (3) in a first step to produce the antenna, and connecting areas (2) of the chip module (1) are pressed onto the textile substrate (3) in a connection zone (4b) of the wire or thread (4) that is assigned to the connecting areas (2) of the chip module in a second step until adhesive films (5) located between the connecting areas (2) and the connection zone (4b) penetrate the textile substrate and establish a permanent electrical contact between the connecting areas (2) and the connection zone (4b) and the chip module is attached by curing the adhesive films (5).

Description

PATENT CO. C. HANNKE

Aegidienplatz 7

93047 Regensburg

Mühlbauer AG February 13, 2007

Josef-Mühlbauer-Platz-1 MBR01-091-WOPT

HA / nh D-93426 Roding

Method for fixing and contacting RFID chip modules for producing transponders with a textile substrate and transponders for textile fabrics

description

The invention relates to a method for the continuous production of a plurality of transponders each having at least one textile substrate, wherein for the production of the transponder, a chip module (1) is electrically connected to an antenna, and the transponder, as an antenna and associated chip module for textile fabric according to the preambles of claims 1 and 13.

Conventionally, for the equipment of textile fabrics, such as garments with transponders, especially smart labels whose operation is based on the RFID technology, built up smart labels as inlets on a film substrate, prefabricated and then glued as a whole unit on the textile fabric. This can be done, for example, that the film substrate is provided on the underside with an adhesive surface, which is to enter into a permanent connection with a surface of the textile fabric.

Such RFID-provided textiles advantageously enable the tracking of these textile products from their place of manufacture to the point of sale. In addition, the shop can easily carry out an "online inventory" to determine the availability of frequently sold garments of certain sizes, as well as an anti-theft device in the form of a triggered alarm signal when leaving the premises with unapproved textiles using RFID technology are equipped, is bar. Furthermore, product manufacturing data, warranty data, etc. can be stored in such an RFID chip.

However, such textiles equipped with smart labels are not permanently connected to the smart label unit, since such textile smart labels - also due to the compelling minimum size of the antenna - have a rigid and relatively inflexible base area that is too large to accommodate the elastic movements, which a fabric can perform to follow. This has the consequence that the adhesive surfaces at least partially detach from the surface of the fabric again and there is a risk of complete replacement of the smart label of the fabric.

In addition, with such inflexible smart labels there is the danger that the antenna is interrupted and destroyed by the movements of the textile material, so that the permanent functioning of the antenna is not ensured.

It is known that metallic wires can be co-woven in textile materials during or after their manufacture to thereby produce, for example, electrical conduction paths within the textile fabric. This can be done for example during a weaving of the fabric material or by subsequent sewing or sewing the wire on or in the fabric. This can be done in a variety of textile fabrics in a continuous process, including automated.

From DE 100 47 972 A1 a method for producing a transponder coil is known in which the transponder coil is generated by using a sewing process directly on the data carrier or a carrier layer of the data carrier using one or more electrically conductive threads. In this case, at least one of the electrically conductive threads is used as sewing thread. Such sewing operations are time consuming and costly. In addition, the transponder coil can be used as sewing thread.

It is an object of the invention to provide a method for the continuous production of a plurality of transponders each having at least one textile substrate, by means of which a long-lasting and reliable incorporation of the transponder into the textile substrate or textile fabric is possible. Furthermore, it is an object of the invention, textile fabric with a transponder, which consists of an antenna and a chip module to provide, which are permanently and reliably connected to the transponder.

This object is achieved on the method side by the features of patent claim 1 and on the product side by the features of patent claim 13.

An essential point of the invention is that in a method for the continuous production of a plurality of transponders each having at least one textile substrate, wherein a chip module is electrically connected to an antenna for the production of the transponder, in a first step for producing the antenna at least one electrically conductive wire / thread is miteingewebt in the textile substrate, and in a second step, the chip module with pads on the textile substrate in the region of a the chip module pads associated terminal portion of the wire / thread is pressed until between the pads and the connection area - ordered adhesive films penetrate the textile substrate and have made a permanent electrical contact between the pads and the connection area by their curing. In this way, a fast fixation and contacting of the chip modules in the connection areas of the antenna is made possible for the production of smart labels.

In this case, chip modules, that is to say so-called interposers or RFID straps, are used, since due to the special mechanical properties of textile substrates or textile fabrics, which would disadvantageously affect the positioning of connection surfaces of a single chip onto the antenna thread woven into the fabric, the danger an unsuccessful electrical contact between the pads of the antenna and the pads of the chip would exist. On the other hand, chip modules have enlarged connection areas in relation to the chips, which allow a greater tolerance in the positioning of the chip in relation to the woven-in antenna.

The pads of the RFID Chipfmodules or the RFID strap point down when the module is placed on the wires or threads of the woven antenna. This also creates a direct contact of the RFID chip with the textile substrate or the textile fabric. This is fixed by the surrounding adhesive in this state and the chip is embedded thereby. The RFID chip is replaced by this embedding and fixing - A -

Process supported by the adhesive and by the textile substrate material itself on its back. This can for the later use of RFID labels for textiles, z. B. in terms of a washing process, be advantageous.

The woven-in antenna thread, which can also be formed as a ribbon or wire, not only increases the durability and flexibility of the entire transponder, since the antenna follows all the flexible movements of the textile without destruction, but also avoids the risk of a self-loosening superficially on the textile substrate or textile fabric glued transponder or smart labels, which are no longer present as a total unit, since those splices, which still exist in connection with the smart label attachment penetrate the textile substrate or textile fabric and are formed very small area.

The antenna threads or antenna bands can be connected not only by a Einwebvorgang but also by a subsequent sewing or sewing in or on the textile substrate or textile fabric with this.

Through the use of an adhesive, for example fluid adhesive films, which may be both liquid and gel-like, and has preferably been previously applied to the terminal surfaces of the chip module as a solid adhesive film and liquefied or crosslinked during a heating process, both during the Anpressvorganges a mechanical fixation of the chip module as well as an electrical connection to the incorporated in the textile fabric antenna thread or antenna wire produced. The adhesive can penetrate the textile fabric at these points at least up to the antenna thread and thus produces an electrically conductive connection between the antenna wire and the antenna thread and the first pads of the chip module.

During the heating and the pressing process, the solidification of the adhesive takes place, if appropriate by cooling the adhesive surface, and / or the use of an adhesive which readily crosslinks on its own. Hot melt adhesives are preferably used, although other rapidly curable adhesives of any type which should be suitable for mass production can also be used.

Such a hot-melt adhesive can be used in particular in a device for producing high-quality textile fabrics having smart labels, since the chip module, on the connecting surfaces of which the hot-melt adhesive is applied as adhesive film, can be automatically positioned over the connection region of the woven antenna thread, a short activation or Liquefaction of the Heißschmelzkleb- stofffilmes can be done automatically by heating at this placement and contacting position and then a short-term Anpressvorgang can take place with a predeterminable pressure, within a predeterminable period of time and with a predeterminable temperature. This allows a continuous supply of a large number of individual textile fabrics with chip modules, which form the smart labels in conjunction with the woven-in antennas.

Subsequently, the cooling process for curing the hot melt adhesive also takes place automatically.

Depending on the type of adhesive used, the structure of the textile fabric, the shape of the chip module or interposer and the applied Anpressparametern, such as temperature, time and pressure, different voltages are built within the Kontaktie- rungsbereiches between the pads, which differs from one another strong non-positive connection between the antenna threads and the pads of the interposer leads and thus influence the durability of these contact points and thus the entire smart label.

According to a preferred embodiment, the adhesive films on electrically conductive particles for generating the electrical connection between the antenna thread and the pads of the chip module.

The adhesive films are applied on the textile substrate with woven antenna on the chip modules before the assembly or storage of the RFID chip module takes place. In this case, the adhesive film must not be filled with conductive particles, but may be an unfilled, quick-setting adhesive with short cure times. An electrical contact then takes place by direct contact between parts of the electrically conductive thread / wire and the pads of the chip module due to the Anpressvorganges.

Preferably, the pads of the chip modules are structurally structured on their metallically formed surface in such a way that they have depressions and highlights for the point-by-point penetration of the adhesive during the pressing process. Likewise, second connection surfaces of the antenna thread can be designed in this way. As a result, not only is a more durable adhesive bond due to the textured surfaces obtained, but in addition the possibility created that the pads of the chip module directly in contact with the antenna thread, regardless of whether therebetween adhesive portions are arranged, can get. As a result, the reliability of the electrical connection is additionally increased.

The thread is preferably woven into the textile fabric in a wave form. It may additionally or instead be woven in such a way that it protrudes in the manner of a hill towards a surface of the textile fabric, in particular in the region of the connection region. This also leads to a direct contact between the antenna thread and the connection surfaces of the chip module.

The thread can either be formed as a plastic thread, which is covered with a metal layer, or consists of a solid metal wire.

The thread is either coiled to form a planar coil for RF transponder or shows the shape of a dipole. Of course, any other forms of transponder antennas are conceivable.

A transponder for textile fabric with an integrated antenna and a chip module connected electrically and mechanically advantageously has, in addition to the at least one electrically conductive thread / wire which is woven into the textile fabric, the chip module arranged on the outside with respect to the textile fabric with the connection surfaces, in contact with the antenna thread or whose connection region is in electrical and mechanical connection by the interposed adhesive films which penetrate the textile fabric.

Further advantageous embodiments will become apparent from the dependent claims.

Advantages and expediencies can be found in the following description in conjunction with the drawing. Hereby show:

1 is a schematic plan view of a plurality of ribbon-like textile fabrics with transponders according to the inventive method,

FIG. 2 is a schematic fragmentary cross-sectional view of a textile substrate or textile fabric with a part of a transponder according to a first embodiment of the invention, as can be produced by the method according to the invention, and FIG

3 shows, in a schematic partial cross-sectional illustration, a textile substrate or textile fabric with a part of a transponder according to a second embodiment of the invention, as can be produced by the method according to the invention.

In Fig. 1, a plurality of textile fabrics is shown in a schematic plan view like a band, on which chip modules 1 are arranged. The chip modules 1 are arranged on the textile fabrics 3, which are designed to be continuous in this production step, together with wires or threads 4 woven into the textile fabric, in order to thereby obtain an RFID textile label.

FIG. 2 shows, in a schematic cross-sectional representation, a detail of a textile fabric with a portion of a transponder arranged thereon. The transponder has a chip module 1 with a plastic film 1 a, on which a metallization layer with a lower-side surface 2 a is applied as the connection surface 2. On the metallization layer 2, an adhesive layer 5 is applied, which can be liquefied or activated as a hot melt adhesive layer by a heating process and cured by a cooling process.

A textile fabric 3 consists of individual web threads projecting into the image plane, which are wave-like surrounded by electrically conductive antenna threads 4. The antenna threads 4 have been co-woven into the fabric before the chip module is connected to the antenna and a functioning transponder is formed.

The antenna threads 4 have hill-like emphasis 4a, the top surfaces of which are in direct contact with the underside surface 2a of the terminal surface 2 of the transponder.

Surfaces of the antenna filament 4, which represent a connection region 4b of the antenna filament 4, are in electrically conductive contact with the connection surface 2 of the chip module by the initially liquefied or activated and subsequently hardened hot melt adhesive 5.

The hot-melt adhesive 5 not only ensures electrical contact between the connection surfaces 2 and the connection region 4b, but also for mechanical fixation of the entire composite of the textile fabric 3 and the interposer 1.

FIG. 3 shows a part of a transponder with textile fabric according to a second embodiment of the invention, as it can be produced by the method according to the invention in a further schematic fragmentary cross-sectional representation.

The reproduced in Fig. 3 textile fabric with the smart label thereon differs from the textile fabric shown in Fig. 2 with the smart label characterized in that in the adhesive layer 5 additionally electrically conductive particles 7 are arranged to thereby the electrical conductivity and connection between the pad 2 and the pads 4b of the antenna thread 4 - also in terms of reliability - to improve. An additional improvement of the electrically conductive connection between the connection surface 2 and the antenna threads 4 can be achieved by forming a structure of the surface 2a of the connection surface 2, not shown here, in such a way that individual highlights and depressions provide a direct contact between the antenna thread 4 and Ensure the connection surface 2.

Between the connection surfaces of the chip modules and the connection region of the wire / thread, instead of the adhesive films mentioned so far, solder connections may alternatively be arranged for their connection, which are preferably obtained by a low-temperature soldering process. These are also permanent electrical connections that represent a reliable contact between the pads and the connection area. The use of low-temperature soldering operations also makes it possible to quickly fix and contact the chip modules in the connection areas of the antennas. Such solder joints can be used with dedicated soldering tools having the required temperature in combination with soldering material having the appropriate properties to provide a quick connection.

All features disclosed in the application documents are claimed as essential to the invention insofar as they are novel individually or in combination with respect to the prior art.

LIST OF REFERENCE NUMBERS

1 chip module

1 a plastic film

2 connection area

2a Surface of the connection surface

3 textile threads, textile fabric 4 electrically conductive thread

4a hill-like highlighting of the electrically conductive thread

4b Connection area of the electrically conductive thread

5 adhesive film

6 contacting points 7 electrically conductive particles

Claims

Method for fixing and contacting RFID chip modules for the production of transponders with a textile substrate as well as transponders for textile fabric patents

1. A method for the continuous production of a plurality of transponders each having at least one textile substrate (3), wherein for the production of the transponder, a chip module (1) is electrically connected to an antenna, characterized in that in a first step for producing the antenna at least an electrically conductive wire or thread (4) is co-woven into the textile substrate (3), and in a second step the chip module (1) with contact surfaces (2) on the textile substrate (3) in a chip module connection surfaces (2) associated connection region (4b) of the wire or thread (4) is pressed until adhesive films (5) arranged between the connection surfaces (2) and the connection region (4b) penetrate the textile substrate (3) and a permanent electrical contact between the connection surfaces (2) and the connection area (4b) as well as a fixation of the chip module by hardening thereof.

2. The method according to claim 1, characterized in that the adhesive films (5) before the pressing of the chip module on the textile substrate (3) are applied to the pads (2) of the chip module.

3. The method according to claim 1 or 2, characterized in that for the production of the adhesive films (5) hot melt adhesives are used.

4. The method according to any one of the preceding claims, characterized in that the adhesive films (5) electrically conductive particles (7) are added.

5. The method according to any one of the preceding claims, characterized in that the connection surfaces (2) of the chip modules (1) are formed structured on their metallically formed surface (2a) such that they recesses and Hervorhe- applications for penetrating the adhesive film (5 ) during the Anpressvorganges.

6. The method according to any one of the preceding claims, characterized in that the connection region (4b) of the wire or thread (4) are formed structured on its metallically formed surfaces such that it depressions and highlights for the local penetration of the adhesive film (5) during the Has contact pressing.

7. The method according to any one of the preceding claims, characterized in that the pressing operation with a predeterminable pressure, in a predeterminable period of time and / or with a predeterminable temperature effect on the adhesive films (5) is performed.

8. The method according to any one of the preceding claims, characterized in that the wire or the thread (4) is woven in waveform in the textile fabric (3).

9. The method according to any one of the preceding claims, characterized in that the wire or the thread (4) is woven such that it in particular in the region of the connection region (4b) to a surface of the textile fabric (3) towards a hill (4a) to form from contact points (6) to the contact surfaces (2) protrudes.

10. The method according to any one of the preceding claims, characterized in that the thread (4) is encased as a plastic thread with a metal layer.

11. The method according to any one of the preceding claims, characterized in that the thread (4) is woven into a coil shape.

12. The method according to any one of claims 1-10, characterized in that the thread (4) is woven as forming an antenna dipole.

13. transponder for textile fabric, wherein the transponder comprises an antenna and a thus electrically and mechanically connected chip module (1, 2), characterized in that at least one of the antenna performing electrically conductive wire or thread (4) miteingewebt in the textile fabric (3) is and

Connection surfaces (2) of the respect to the textile fabric (3) arranged on the outside chip module (1) with a connection region (4b) of the wire or thread (4) by means of interposed adhesive films (5), which penetrate the textile fabric (3), electrically and mechanically connected are.

14. Transponder according to claim 13, characterized in that

Surfaces of the pads (2) and / or the terminal portion (4b) have a structure with recesses and highlights.

15. Transponder according to claim 13 or 14, characterized in that the adhesive films (5) are arranged on the surfaces of the connection surfaces (2).

16. Transponder according to one of claims 13-15, characterized in that the wire or the thread (4) is wavy woven into the textile fabric (3).