DE102006051379A1 - Transponder for textiles has first elastic wire antenna of known length stuck to textile substrate and wire ends in region of chip module with embroidery pattern - Google Patents

Abstract

The transponder has at least one radio frequency identification (RFID) chip module (3) and an RFID antenna on the textile substrate (1). The chip module has one chip in the first plane and two chip module connection surfaces connected to a connector in the second plane. The elastic wire antenna, of known length, is stuck to the textile substrate. Ends of the antenna carry an embroidery pattern.

Description

The The invention relates to a transponder having at least one RFID chip module and at least one associated first RFID antenna mounted on a textile substrate are arranged, wherein the RFID chip module a chip in a first plane and two chip module pads, the each connected to a chip terminal, in a second Level, according to the preamble of Claim 1. Furthermore, the invention relates to a method for connecting RFID chip modules with first RFID antennas on one Textile substrate according to the preamble of claim 13.

traditionally, be chip modules that have a chip and an interposer, a bridge or a strap, for the production of transponders, RFID labels or RFID Wovenlabels with RFID antennas having antenna pads connected. Therefor the RFID antennas are common on a belt-like substrate continuously one or more rows arranged, wherein the substrate tape is usually paper or Plastic material acts.

The subsequently Applied to the paper substrate RFID chip modules are by means of Adhesive, soldering, Laser point or the like method connected to the substrate, being common Conductive adhesives for electrical connections of the antenna pads with the RFID chip modules are used in the field of chip module pads. Here, the chip module pads during the application to the Substrate and the RFID pads frequently down.

method for the electrical and mechanical connection of RFID chip modules or RFID straps or RFID interposers with textile substrates for Production of RFID textile labels, which are arranged on or in textiles or with plastic film substrates are so far little known. The previously known connection method using adhesives are limited to the manufacture of RFID textile labels applicable because of the textile structure of textile substrates a permanent connection with the previously known adhesives is not ensured. This is additionally due to the flexibility of textiles or substances.

on the other hand is the use of textile substrates for the production of RFID labels desirable, because in this way the incorporation of transponders during the Textile processing and / or textile manufacturing process in the Textiles can be realized. For this the assembly and the Connecting RFID chip modules in a continuous work process within a textile industry / production plant.

So far be in the textile field for certain RFID applications uses RFID inlays, which are made from the RFID chip and the RFID antenna exist, these two elements be applied to a polyester substrate (PET). This PET substrate will follow glued onto the fabric to be equipped with RFID technology or sewn on. The disadvantage here is that the entire PET substrate as relative inflexible element on the mostly very flexible trained Textile fabric is arranged and connected, whereby the the Textile wearing person receives a lower wearing comfort. moreover For example, such textile PET-substrate connections are often lightweight destructible by carelessness, because an unwanted kinking or bending of the PET substrate due to the underneath arranged very flexible designed textile to do so leads, that the RFID antenna itself and / or in particular the pads between the RFID antenna and the RFID chip or the chip module break. this leads to to an electrical interruption in the RFID inlay and thus to a lack of functionality of the entire system.

It is also known to use so-called hang tags in the textile sector, which are RFID inlays, the substrate substitute a have two-sided lamination, which one with the antenna pattern include printed paper. Also such Hang Tags will be then on garments sewn, or attached to them loosely and, because of their rigidity, they are the ones already described Problems in terms of breaking strength and lack of function.

As a result, The present invention is based on the object, a transponder and to provide a process for its production which which a flexible design for placement in a textile substrate has / enables is a simple and fast production of such Transponders as well as a reliable permanent electrical and mechanical connection between the connections ensured by an RFID chip module and the RFID antenna of the transponder should be.

These Task is product side according to the characteristics of claim 1 and method side according to the features of claim 13 solved.

An essential point of the invention is that in a transponder with at least one RFID chip module and at least one associated first RFID antenna on a Textile substrate are arranged, wherein the RFID chip module consists of a chip in a first plane and two chip module pads, each connected to a chip terminal, in a second plane, the first antenna is embroidered as a preferably elastic wire with a predetermined course of the textile substrate and Each end of the elastic wire in the region of the chip module connection surfaces have an embroidery pattern. By embroidering the first antenna on the textile substrate, which may for example be a garment and the use of an embroidery pattern as an antenna terminal, which is connected to one of the chip module pads, a cost and simple production of the RFID antenna and a connection of the RFID antenna terminals the chip module connections are made. By using embroidery patterns, which adapt as a flexible wire to the movements of the textile, which is equally flexible, it is ensured that a permanent connection between the chip module pads and the antenna terminals is present even if the textile is often kinked in this area becomes. Here, the probability that the chip module is damaged in itself, in particular broken, very low, since the dimensions of the chip module are very small compared to the dimensions of the antenna, which is designed to be flexible anyway. In this way, the use of PET substrates or hang tags, which often lead to breaks in the event of kinking of the textiles, can be avoided. A reliable functioning of the in or on the textile incorporated transponder is thus ensured even after prolonged use of the textile and after possibly took place washing operations.

The Application of an embroidery process advantageously allows subsequent incorporation the antenna and the antenna connections with a common continuous Thread in the textile, without this being an afterthought sewing for the Arranging a separate substrate is necessary. In addition, the Although antenna in an initial Web operation while in which the textile is made, woven into the textile be made possible the embroidery process according to the invention the abandonment of the initial Weaving the antenna into the textile fabric, which is time-consuming and costly due changing from the textile thread to the electric conductive and flexible wire can be. The opposite is the embroidery process In particular, therefore, as very advantageous because the wire or a electrical conductive thread for the Apply the entire transponder except the actual one Chip module can be used.

Of course, can be embroidered for the RFID antennas and their designs not just one but several electrical conductive Wires that are preferably designed to be elastic, for example to make an antenna with multiple coil turns.

According to one first embodiment According to the invention, the embroidery pattern has a chip module connecting surfaces and penetrate the textile substrate located immediately below Wireframe on. This means that the same wire, which already as an antenna has been embroidered on the textile substrate, to is used, the chip module pads and thus the actual Chip module on the textile substrate by means of a stick connection fix, thereby automatically making an electrical contact between the electrically conductive Wire of the antenna and the chip module pads results. This allows a simple, inexpensive and rapid production of a transponder in or on a textile substrate.

Of the Chip in the first level may be above the second level the chip module pads be arranged.

According to one second embodiment the invention, the embroidery pattern is a directly on the surface of the Textile substrates within a predetermined area multiple times in the plane of the surface of the textile substrate changing the direction of the wire, the is formed to form antenna pads such around with the chip module pads to contact. This flat Embroidered designs allow the direct arrangement of the chip module pads on this formed Antenna pads the antenna pads are very flexible. Here is the chip in the first Plane preferably arranged below the second level of the chip module pads, so that the chip is protective embedded in the textile fabric.

The Antenna pads with such a flat applied embroidery patterns can alternatively on the one surface of the textile substrate, while the chip module pads on the opposite surface of the textile substrate in direct contact with the textile substrate are arranged.

Regardless of whether the antenna pads are arranged on the same side of the textile substrate as the chip module pads or on opposite sides or surfaces, the antenna pads, the textile substrate and their associated chip module pads by means of an additionally electrically conductive or electrically non-conductive Fa sewn together or even stitched together. In this case, such a thread should be made as flexible as possible for stability and processing reasons. The flexibility of the thread can be achieved by a filament core of silicone-containing material, plastic or by a plurality of twisted electrically conductive wires. Such a wire can be used for both the mating of the antenna pads, the chip module pads and the textile substrate as well as the formation of the antenna itself and the associated embroidery patterns. Flexible wires are a quality factor for the woven antennas to withstand bending loads without damage.

at the plane Design of the embroidery pattern on the surface of the textile substrate, the Straps or the chip modules in a first preliminary step for mechanical fixation of those with the conductive chip module pads after placed on the bottom of the textile substrate and by means of an adhesive or a first sewing process be prefixed.

One such first prefixing step is also with the transponder its production method according to the first embodiment the invention possible wherein the antenna wire penetrates the chip module pads at its ends Wire course for the production of an electrical and mechanical Compound, including with the textile substrate, has.

If the chip module and the antennas with their embroidery patterns on two opposite Pages of the textile substrate are arranged, the chip in the be arranged first level above the second level, so that the chip is remote from the textile substrate. Alternatively, in turn the chip may be arranged below the first plane such that he protecting in the textile substrate is embedded.

alternative to the use of an electrically conductive thread for sewing or Embroidering the chip module pads, the antenna pads and of the textile substrate can solder, laser, laser welding and / or thermocompression compounds.

The Chip module connections can according to a third embodiment the invention with a second antenna, which together with the chip on a common separate, preferably small-area trained Plastic substrate are arranged to be connected, which is itself at the second antenna around a UHF antenna and at the plastic substrate can act to a PET substrate. This second antenna is opposite to the first antenna comparatively small area formed and provides a so-called "driver" or "booster" UHF antenna. The second antenna works on itself without the help of the first one Antenna already as UHF transponder in interaction with the chip. Indeed is connected by a connection or coupling of the second antenna the first antenna, which can also be designed as a UHF antenna, improved reading range of the transponder. This will be the two UHF antennas over an air gap with its magnetic fields in the so-called near field coupled. This results in advantageous that the first UHF antenna not be electrically connected to the strap or the chip module got to. Rather, a prefabrication of the second UHF antenna with their connection to the chip module also with a previous one Test procedure performed be before this second antenna at a defined distance is mounted and fixed to the first UHF antenna.

The Fixation of the second UHF antenna can by means of an adhesive connection or by embroidery. It may be the second driver UHF antenna first applied to the textile fabric together with the RFID chip and fixed in a second step, the first UHF antenna be embroidered on the textile fabric. A qualitatively stable and reliable permanent production of such a constructed transponder is due to the elimination of the electrical connection between the first antenna and the chip module pads manufactured.

Further advantageous embodiments emerge from the dependent claims.

advantages and expediencies are the following description in conjunction with the drawings refer to. Hereby show:

1 in a schematic representation of a textile substrate with a transponder according to a first embodiment of the invention;

2 a section of the transponder according to the first embodiment of the invention in cross-sectional view;

3 in a schematic plan view of a textile substrate with a transponder according to a second embodiment of the invention;

4 a section of the transponder according to the second embodiment of the invention in a cross-sectional view;

5 in a schematic plan view of a textile substrate with the transponder according to another variant of the second embodiment of the invention;

6 in a cross-sectional view of a section of the transponder according to the further variant of the second embodiment; and

7 in a schematic plan view of a textile substrate with the transponder according to a third embodiment of the invention.

In 1 In a schematic plan view, a section of a textile substrate with a transponder mounted thereon according to a first embodiment of the invention is shown. In 1 becomes the textile substrate 1 shown in detail. On this textile substrate is an embroidered antenna 2 arranged with a predetermined wire or thread course, which depends on an optimization of the readability of this transponder at a desired distance.

A chip module 3 or an RFID strap is with the RFID antenna 2 electrically and mechanically connected.

In 2 is a cross-sectional view of a section of the in 1 shown transponders according to the first embodiment of the invention, as indicated by the dashed arrow. This section concerns the range of chip module pads 10 . 11 that with chip connections 8th . 9 which on a chip 7 are arranged, have been electrically and mechanically connected in a previous step not described here in detail.

In the representation of the cutout 4 is clearly reproduced that the embroidered antenna wire 2 at its ends 2a continuously continues such that he in his wire 5 . 6 the chip module pads 10 . 11 and the textile substrate 1 penetrates. This automatically creates a contact between the chip module pads and the antenna 2 if an electrically conductive antenna wire, which also must be electrically conductive on its surface, is used.

The chip module pads are on a surface 1a the textile substrate arranged directly.

The chip 7 is in a first level 13 and the chip module pads 10 . 11 are in a second level 12 arranged.

In 3 a textile substrate with a transponder or an RFID strap according to a second embodiment of the invention is shown in a schematic plan view. The textile substrate 1 is again only partially shown. The on the textile substrate 1 embroidered antenna wire 2 again has a predeterminable shape and is connected to the chip module 3 electrically and mechanically connected.

In 4 becomes a section 4 of in 3 shown transponder according to the second embodiment of the invention. In this section 4 are the chip module pads 10 . 11 again directly on one surface 1a of the textile substrate 1 arranged, the second level 12 the chip module pads 10 . 11 above the first level 13 of the chip 7 are arranged. That way, the chip becomes 7 into the textile substrate, which is designed to be flexible, protective embedded and covered by this textile substrate on the underside.

The chip module pads thus have on their downwardly facing side electrical conductivity and are in direct contact with an embroidery design 17 of the antenna wire 2 ,

In an enlarged view, for example, the formation of the area embroidery pattern, which within a predeterminable area 16 can be arranged by, for example, the antenna wire 2 at its end 2a zigzag has an embroidery pattern shown.

Such embroidery designs are advantageously very flexible and durable on the surface 1a arranged on the textile substrate and have high breaking strength due to the use of an elastic conductive antenna wire.

The embroidery designs 17 at the ends of the antennas of the antenna wire are connected by means of an additional wire or thread, which may also be electrically or not electrically, with the chip pads 10 . 11 by an embroidery or sewing process on the textile substrate 1 fixed, so that both a mechanical and an electrical contact with great durability is achieved. The threads used here 18 . 19 are opposite the antenna pads 14 . 15 the the embroidery design 17 have, made of different materials, but also elastic.

In 5 is shown in a schematic plan view of the textile substrate with the transponder according to a further variant of the second embodiment. The textile substrate 1 is again shown in sections. The antenna wire 2 is in this case, as indicated by the dashed line, below the textile substrate 1 embroidered on this and again with a chip module attached on the top side 3 electrically and mechanically connected.

In 6 is a section 4 the transponder ders according to the further variant of the second embodiment, as in 5 is shown. This section 4 Enlarges the connection area between the chip module connections and the antenna connection surfaces. It can be clearly seen from this illustration that in this case the 4 reproduced structure, the chip module on top of a surface 1a of the textile substrate 1 and the antenna with the embroidery patterns formed at its ends 17 on the underside on another surface 1b of the textile substrate are arranged. As a result, the embroidery module and the embroidery patterns of the antenna connection surfaces 22 . 23 on opposite sides of the textile substrate 1 arranged. The chip module is preferably at its first level 13 above the second level 12 arranged so that the chip 7 above the chip module pads 10 . 11 lies.

Between the chip module pads 10 . 11 and the antenna pads 22 . 23 which the embroidery design 17 have, in turn, passes an electrically conductive and preferably elastic wire 20 . 21 containing the chip module pads 10 . 11 and the antenna pads 22 . 23 both mechanically and electrically in direct contact with the textile substrate 1 combines. This allows a permanent and electrically reliable connection between the pads.

In 7 a transponder according to a third embodiment of the invention is shown in a schematic plan view. The partial Texilsubstrat shown 1 has a top side embroidered antenna wire 2 on. The antenna wire 2 the first antenna is in turn incorporated into the textile substrate.

In addition, a second antenna, which may be formed as a UHF antenna, designed as a driver or booster antenna, said second antenna 25 together with a chip 26 , on whose chip pads it is electrically contacted, on a plastic substrate 24 is arranged. This plastic substrate 24 is prefabricated together with the transponder arranged thereon from the second antenna and the chip in a first step and then onto the textile substrate 1 fixed by means of an adhesive or embroidery or sewing connection. Anschießend or before, the first antenna 2 on the textile substrate 1 be embroidered.

Alternatively to the embroidery connections by means of the wires or threads 20 . 21 or 18 and 19 in the 6 and 4 Soldering, laser, thermo-compression and adhesive bonding can be used.

All in the various embodiments shown first and second antennas can be in both the RF and work in the UHF range, so from appropriate material and with the be formed corresponding shapes.

All Features disclosed in the application documents are considered to be essential to the invention as long as they are individually or in combination with respect to State of the art are new.

1

textile substrate

1a, 1b

Surfaces of the textile substrate

2

antenna wire

2a

end up of the antenna wire

3

chip module

4

neckline

5, 6

wire path of the antenna wire

8th, 9

chip connections

10 11

Chip module connections

12

second level

13

first level

14 15

Chip module connections

16

area

17

embroidery

18 19, 20, 21

thread or wire

22 23

embroidery the antenna pads

24

Plastic substrate

25

second antenna

26

chip

Claims (18)

Transponder with at least one RFID chip module ( 3 ) and at least one first RFID antenna ( 2 . 2a ) on a textile substrate ( 1 ), wherein the RFID chip module ( 3 ) from a chip ( 7 . 26 ) in a first level ( 13 ) and two chip module pads ( 10 . 11 ), each with a chip connection ( 8th . 9 ), in a second level ( 12 ), characterized in that the first antenna ( 2 ) as a preferably elastic wire with a predetermined course on the textile substrate ( 1 ) and ends ( 2a ) of the wire in the area of the chip module pads ( 10 . 11 ) each an embroidery design ( 5 . 6 ; 14 . 15 . 17 . 22 . 23 ) exhibit. Transponder according to claim 1, characterized in that the embroidery pattern has a chip module connection surfaces ( 10 . 11 ) and the textile substrate arranged immediately below ( 1 ) penetrating wire course ( 5 . 6 ) having. Transponder according to claim 2, characterized in that the chip ( 7 ) in the first level ( 13 ) above the second level ( 12 ) is arranged. Transponder according to claim 1, characterized in that the embroidery pattern is directly on the surface ( 1a ) of the textile substrate ( 1 ) within a predetermined area ( 16 ) several times in the plane of the surface ( 1a ) of the textile substrate ( 1 ) the direction changing wire path ( 17 ) for forming antenna pads ( 14 . 15 ; 22 . 23 ) to connect to the chip module pads ( 10 . 11 ). Transponder according to Claim 4, characterized in that the chip module connection pads ( 10 . 11 ) directly on the antenna connection surfaces ( 14 . 15 ) are arranged. Transponder according to claim 5, characterized in that the chip ( 7 ) in the first level ( 13 ) below the second level ( 12 ) is arranged. Transponder according to claim 4, characterized in that between the antenna pads ( 22 . 23 ) on one surface ( 1b ) of the textile substrate ( 1 ) and the chip module pads ( 10 . 11 ) on the opposite surface ( 1a ) of the textile substrate ( 1 ) the textile substrate ( 1 ) in direct contact with the pads ( 10 . 11 . 22 . 23 ) is arranged. Transponder according to claim 7, characterized in that the chip ( 7 ) in the first level ( 13 ) above the second level ( 12 ) is arranged. Transponder according to one of claims 4-8, characterized in that the chip module connection pads ( 10 . 11 ), the antenna pads ( 14 . 15 ; 22 . 23 ) and the textile substrate ( 1 ) by means of an electrically conductive thread ( 18 . 19 ; 22 . 21 ) are sewn together. Transponder according to one of claims 4-8, characterized in that the chip module connection pads ( 10 . 11 ), the antenna pads ( 14 . 15 ; 22 . 23 ) and the textile substrate ( 1 ) are connected to each other by means of a soldering, laser welding and / or thermocompression connection. Transponder according to Claim 1, characterized in that the chip module connections ( 8th . 9 ) with a second antenna ( 25 ), which together with the chip ( 26 ) on a common plastic substrate ( 24 ), are connected. Method for connecting RFID chip modules ( 3 ) with first RFID antennas ( 2 . 2a ) on a textile substrate ( 1 ), wherein the RFID chip module ( 3 ) from a chip ( 7 . 26 ) in a first level ( 13 ) and two chip module pads ( 10 . 11 ), each with a chip connection ( 8th . 9 ), in a second level ( 12 ), characterized in that the first antenna ( 2 ) as a preferably elastic wire with a predetermined course on the textile substrate ( 1 ) and ends ( 2 ) of the wire in the area of the chip module pads ( 10 . 11 ) each with an embroidery design ( 5 . 6 ; 14 . 15 . 17 . 22 . 23 ) are configured. A method according to claim 12, characterized in that the embroidery pattern as a preferably elastic conductive wire, the chip module pads ( 10 . 11 ) and the textile substrate arranged immediately below ( 1 ) run through. A method according to claim 12, characterized in that the embroidery pattern as a directly on the surface ( 1a ) of the textile substrate ( 1 ) within a predetermined area ( 16 ) several times in the plane of the surface ( 1a ) of the textile substrate ( 1 ) the direction of changing wire path to form antenna pads ( 14 . 15 ; 22 . 23 ) to connect to the chip module pads ( 10 . 11 ) is trained. A method according to claim 14, characterized in that the chip module pads ( 10 . 11 ) directly on the flat antenna connection surfaces ( 14 . 15 ) to be ordered. Method according to claim 14, characterized in that the antenna pads ( 22 . 23 ) on one surface ( 1b ) of the textile substrate ( 1 ) and the chip module pads ( 10 . 11 ) on the opposite surface ( 1a ) of the textile substrate ( 1 ) are placed in direct contact with the one. Method according to one of claims 14-16, characterized in that the chip module pads ( 10 . 11 ), the antenna pads ( 14 . 15 ; 22 . 23 ) and the textile substrate ( 1 ) by means of an electrically conductive thread ( 18 . 19 ; 22 . 21 ) are sewn together. Method according to claim 12, characterized in that the chip module connections ( 8th . 9 ) with a second antenna ( 25 ), which together with the chip ( 26 ) on a common plastic substrate ( 24 ) are arranged, wherein the embroidery patterns of the first antenna ( 2 ) with antenna connections of the second antenna ( 25 ) are electrically connected.