DE102009038620B4 - Method and device for producing a transponder unit - Google Patents

Abstract

Method for producing a transponder unit consisting of an at least single-layered substrate (1), at least one antenna (4) and at least one electronic HF component (3), in which - at least one receiving area (2) in the area of the substrate (1) the electronic component (3) is provided, - the wire conductor (6) to be used for the antenna (4) is guided into the area of the substrate (1) and fixed outside the receiving area (2) on the substrate (1), Wire conductor (6) by using a wire guide element (28) containing a braking device (29) to form a first loop (8), starting from the fixing point (7) in the plane of the substrate (1) on one side (9) of the receiving area (Fig. 2) introduced into the receiving area (2), - the wire conductor (6) on the same (9) or a side (12) of the receiving area (2) provided offset thereto is again guided onto the substrate (1) and - the wire conductor (6 ) a Outside the reception area (2) on the ...

Description

The invention relates to a method for producing a, consisting of a at least single-layer substrate, at least one antenna formed and at least one electronic module transponder unit.

The DE 196 20 242 A1 describes a method and a device for contacting a wire conductor in the manufacture of a transponder unit arranged on a substrate, comprising a wire coil and a chip unit, in which in a first phase the wire conductor is guided over the connection surface or a region receiving the connection surface and relative to the connection surface ., The area associated with the pad is fixed on the substrate and in a second phase, the connection of the wire conductor to the pad by means of a connecting device.

Electrical connections in chip cards, transponder cards or ID documents are subject to strong mechanical loads as a result of bending and twisting. Here it can not be ruled out that, in the case of multi-year use, there will be damage in the connection area connecting surface wire conductor and then the respective chip card, transponder card or the ID document can no longer be used.

The DE 10 2007 030 650 A1 describes a method for producing a chip card, comprising a chip module having at least one contacting surface, wherein the chip module is insertable into a receiving position of a substrate, wherein for at least one of the contacting surfaces of a supplied by a wire guide unit wire each a Kontaktierungsöse is formed by a first section the wire conductor is adhered to a surface of the substrate outside the receiving position, wherein a second portion of the wire conductor adjacent to the first portion is guided so as to form, together with the surface and out of the projecting, the Kontaktierungsöse, wherein a subsequent third portion of the wire conductor on the surface is tacked out of the pickup position, the chip module being inserted into the pickup position and the second portion being bent around and electrically connected to the contacting surface. Here is one opposite the DE 196 20 242 A1 described alternative method, but with the disadvantage that the projecting from the substrate Kontaktierungsöse must be bent back by means of a tool in the region of the contact surface. Depending on whether the chip module is just provided with the receiving substrate or the contacting surface protrudes therefrom, it may also be disadvantageous that the bent Kontaktierungsöse springs back, so that a further tool is needed to press the Kontaktierungsöse on the contact surface so that she can be electrically connected to her.

By the WO 2008/037592 A1 For example, a method of connecting an antenna to a transponder chip has become known wherein an antenna wire is positioned on the surface of a substrate. Outside the transponder chip, respectively a self-receiving recess, the wire is fixed, with free-standing loops are formed. These loops are then bent in the direction of the transponder chip, respectively in the self-receiving recess, and subsequently connected to the transponder chip by soldering. After winding the antenna is carried out on the other side of the transponder chip, respectively the selbigen receiving recess, the same operation again. Due to the necessary bending of the loops produced, an increased need for tools is necessary and, in addition, weakening of the laying wire may occur as a result of the bending operation, which may result in subsequent use of articles equipped therewith, such as personalization documents.

In the US 2001/0054230 A1 For example, a method and apparatus for laying a wire conductor on a substrate is described. A laying device is used, which acts ultrasonically on the wire conductor, wherein the wire conductor is subjected to ultrasound in a direction transverse to the laying plane and the transverse movement of the laying device generated by the ultrasound application is superimposed on the laying movement running in the laying plane.

The aim of the subject invention is to provide a deviating from the prior art method for producing a for receiving different electronic modules (eg HF, UHF) serving transponder unit, by means of which the used reaching wire conductor can be laid on the respective substrate in a simple manner, without that it requires further tools to press the wire conductor on the respective contact surface of the electronic module. Furthermore, the electrical connectivity is to be improved and thus a higher process reliability can be achieved.

In addition, a device is to be provided which allows easy laying of the wire conductor on the particular substrate used, without the need for further additional aids before a connection between the respective contacting surface and the wire conductor can be brought about.

This object is achieved on the one hand by the features of claim 1.

On the other hand, this object is also achieved by the features of claim 2.

Advantageous developments of the method according to the invention can be found in the associated subclaims.

In addition, a device for carrying out the method according to the invention is specified in claim 10.

Advantageous developments of the device can be found in the associated dependent subclaims.

With the method according to the invention, respectively, the device according to the invention, a technical possibility is provided to lead a wire conductor in the plane of the substrate, forming loops, in the receiving area of the respective electronic component and the loosely guided loops on the respective contact surface of the respective Use reaching electronic component (for example, HF, UHF) hang up and electrically connected to the respective contact point without the use of other tools. This method stands out from the prior art particularly advantageous in that there is better solderability. A wire conductor which has been laid in a straight line can not always be wetted with soldering material by means of a soldering device provided above the wire conductor and oriented in the same direction when the wire is displaced. As a result, a defective connection can be generated, which leads to rejects of the transponder unit. In a loop-laid wire conductor, the soldering device with the same orientation, as in a rectilinear wire conductor capable, even with staggered loop, always to wet a large part of the loop with soldering material. Scrap is minimized in this way.

Transponder elements, including electronic HF components, are characterized by the fact that they have a short range (up to 5 cm), whereby the data can not be read out directly by third parties.

They can be used in the frequency range of 13.56 MHz and are used, for example, in the following documents: passports, identity cards, access control cards, debit cards, transponder cards.

Transponder elements, including electronic UHF modules, are characterized by having a high read and write range.

They can be used in the frequency range from 860 to 950 MHz and are used, for example, in the following documents: luggage tags, special identity documents (pass cards, border crossing cards) or the like.

At the same time a strain relief is formed by the generation of a loop in the associated contact region of the component, since the wire conductor can be performed in the receiving area of the electronic module without greater voltages. As a result of this measure, compared to the prior art, a significant increase in the operational safety of the transponder units including the aforementioned documents is ensured.

Depending on the type of production of the respective transponder unit, the electronic component used in each case can either be introduced into the receiving area from above before the antenna is formed, or can be inserted from below into the receiving area after the antenna has been formed.

A preferred embodiment of the method provides that after forming the antenna, the wire conductor is guided back to the side of the receiving region opposite the first loop and is introduced and executed in the receiving region to form a further loop. Here electronic components are used, which have parallel contact points.

If electronic components with staggered, d. H. not parallel, contact points should be given, these components can also be taken into account with the subject invention.

In addition, it is proposed that the wire conductor outside the receiving area is fixed, for example by means of ultrasound on the substrate. If necessary, at least a part of the antenna to be formed can also be fixed on the substrate by means of ultrasound or introduced into the substrate.

According to a further aspect of the invention, the wire conductor is inserted at a predeterminable angle into the wire guide element and guided in the direction of the substrate, wherein the wire conductor, the shape of the respective antenna according to the wire laying device on the substrate can be laid.

Alternatively, it is possible to hold the wire laying device stationary and to move the substrate.

It is particularly advantageous if the fixing device is part of the wire laying device.

In addition, it is proposed to provide a braking device for the wire conductor in the region of the wire inlet into the wire guide element.

The same can be formed, for example, by a felt element embodied as a felt ring, which encloses the wire guide element and is provided so that it can be raised and lowered relative to the wire guide element. Alternatively, sheet metal body, plastic or rubber elements can be used.

This has the advantage that, although the wire conductor is guided in the direction of the substrate, it can not retreat.

Alternatively, as a brake and a wire feed device can be used, which is however structurally expensive.

The subject invention is illustrated by means of an embodiment in the drawing and will be described as follows. Show it:

1 Schematic outline of a procedure for producing an RF transponder unit on a single-layer substrate;

2 Schematic diagram of an alternative process sequence for producing an RF transponder unit on a single-layer substrate;

3 Schematic diagram of an alternative process sequence for producing an RF transponder unit on a multilayer substrate;

4 to 8th Alternative Wire Routing Techniques for Making RF Transponder Units;

9 Schematic outline of a procedure for the production of a UHF transponder unit;

10 Alternative preparation of a receiving area for receiving an electronic component;

11 + 12 Schematic diagrams of a wire laying device including brake device.

1 shows a schematic diagram of a procedure for the production of an RF transponder unit. Used in this example is a single-layer substrate 1 , with consecutive receiving areas 2 is provided. In this example, the shooting areas are 2 already out of the substrate 1 punched out. The electronic component used 3 is only after the training of an antenna 4 from below into the receiving area 2 introduced. By means of an only indicated wire laying device 5 becomes in the plane of the substrate 1 a wire conductor 6 in the direction of the arrow to the antenna 4 educated. According to the invention for the antenna 4 to use wire conductors 6 in the area of the substrate 1 guided and outside the reception area 2 on the substrate surface 1' forming a first fixation point 7 fixed. Forming a first loop 8th becomes the wire conductor 6 , starting from the fixation point 7 , on one side 9 of the recording area 2 introduced in the same. In this example, the wire conductor becomes 6 on the same page 9 from the reception area 2 back to the substrate 1 guided and outside the reception area 2 forming another fixation point 10 on the substrate surface 1' fixed. Subsequently, the wire conductor 6 , forming several turns 11 , on the substrate surface 1' to the antenna 4 educated. Then the wire conductor becomes 6 then in the area of another page 12 of the recording area 2 returned and outside the reception area 2 , forming another fixation point 13 , on the substrate surface 1' of the substrate 1 fixed. In this example are the pages 9 . 12 opposite each other. In the same way as already described above, starting from the fixing point 13 , another loop 14 formed such that the wire conductor 6 , starting from the fixation point 13 , in the reception area 2 introduced and on the same page 12 again from the reception area 2 is led out. Finally, the wire conductor 6 , forming another fixation point 15 , on the surface 1' of the substrate 1 fixed again. Now, the formed in this example as a chip module electronic component 3 from below into the receiving area 2 be introduced. Finally, the loops 8th . 14 with the parallel to each other in this example contact points 16 . 17 of the electronic component 3 , electrically connected, for example by soldering.

2 shows as a schematic diagram to one 1 alternative process for producing an HF transponder unit. Identical components are provided with the same reference numerals. Again, a single-layer substrate comes 1 for use. In the transport direction of the substrate 1 First, the recording area 2 punched out. Thereafter, the electronic component 3 from the top into the receiving area 2 inserted. Subsequently, the, as already in 1 described process for forming an antenna 4 executed and the loops 8th . 14 with the contact points 16 . 17 of the electronic component 3 electrically connected.

The 3 to 8th show schematic diagrams of alternative wire laying techniques for the production of RF transponder units. The same components are provided here with the same reference numerals.

In 3 implied is one of two layers 18 . 19 formed substrate 1 one of which is one location 19 without recesses and the other location 18 with the recording areas 2 is provided. Analogous to 2 becomes the electronic component 3 from above into the corresponding receiving area 2 used, the training of the antenna not shown here in analogy to 1 can be done.

According to 4 can be single or multi-layer substrate 1 used for the positioning of electronic components 3 with corresponding recording areas 2 is provided. Deviating from 1 in which the loops 8th . 14 face each other becomes the wire conductor 6 laid in the direction of arrow misplaced that the wire conductor 6 initially forming a loop 8th on one side 9 in the recording area 2 is in and out, and then the antenna 4 is trained. At one side 9 of the recording area 2 offset (90 °) provided side 12 becomes the wire conductor 6 on the side 12 forming another loop 14 on the same page 12 in the recording area 2 in and out again. This measure can be useful if the electronic component 3 with staggered contact areas 16 . 17 is provided.

Another alternative is in 5 shown. The wire conductor 6 will be outside the recording area 2 , forming a first fixation point 7 , on the substrate surface 1' of the substrate 1 fixed. In the corner 20 one page 21 becomes the wire conductor 6 , starting from the fixation point 7 , in the reception area 2 introduced and forming a first loop 8th in the area of an offset (90 °) to the side 20 of the recording area 2 provided side 22 again from the reception area 2 led out and forming another fixation point 10 on the surface 1' of the substrate 1 fixed.

Subsequently, the antenna 4 trained and the wire conductor 6 forming another fixation point 13 on the surface 1' of the substrate 1 fixed. In the corner 23 becomes the wire conductor 6 on the side 24 in the recording area 2 introduced and forming a second loop 14 on the side 20 again from the reception area 2 taken out and, forming another fixation point 15 , on the surface 1' of the substrate 1 fixed.

6 shows an alternative laying technique. In this example, the electronic component becomes 3 in a trained as a groove receiving area 2 a substrate 1 inserted. The contact points 16 . 17 stand opposite to the substrate surface 1' slightly in front, leaving the wire conductor 6 , respectively, the wire laying device, not shown here, to form the loops 8th . 14 contact site side something from the laying plane of the trainee antenna 4 must be raised. Laying the loops 8th . 14 , respectively the training of the antenna 4 , can be analogous to 1 respectively.

7 shows another alternative too 6 , In this example, the electronic component is located 3 on the substrate surface 1' of the substrate 1 on. The electronic component 3 receiving area 2 is not formed in this example by a recess, but by a splice on which the electronic component 3 is attached. Here, in analogy to 6 be moved.

8th shows a further alternative for laying a wire conductor 6 on a substrate 1 , It can be a recording area 2 in analogy to the 1 or 2 be generated. The wire conductor 6 gets into the area of the substrate 1 guided and forming a fixation point 7 on the surface 1' of the substrate 1 fixed. Starting from this fixation point 7 becomes the wire conductor 6 forming a loop 8th on the side 9 of the recording area 2 in the recording area 2 one and the same side 9 brought out again. In the immediate vicinity of the fixation point 7 becomes the wire conductor 6 returned in the direction of the same and to form another fixation point 10 on the surface 1' of the substrate 1 fixed. Subsequently, in the plane of the substrate 1 the antenna 4 educated. On the side 9 of the recording area 2 opposite side 12 takes place in analogy to the first page 9 the formation of the further loop 14 , whereby also here two immediately adjacent fixing points 13 . 15 on the surface 1' of the substrate 1 be formed.

9 shows one to the 1 to 9 different presentation. Here, no HF, but a UHF transponder unit is to be formed. By way of derogation from an HF transponder unit, the UHF transponder unit is the antenna 4 formed differently. The first procedures are similar to those already to the 1 to 9 described. Again, the same reference numerals are used for the same components. In a reception area 2 is an electronic component 3 positioned. A wire conductor 6 ' will be on the surface 1' a substrate 1 applied and outside the receiving area 2 ' forming a fixation point 7 ' on the surface 1' of the substrate 1 fixed. Subsequently, the wire conductor 6 ' , starting from the fixation point 7 ' , forming a loop 8th' in the recording area 2 ' , respectively the contact point 16 ' , the electronic component 3 ' guided. On the same side as the entrance area is the wire conductor 6 again from the reception area 2 ' led out and forming a fixation point 10 ' on the surface 1' of the substrate 1 fixed. Starting from the fixation point 10 ' becomes the wire conductor 6 ' its further purpose. The same measure will be on the loop 8th' opposite side of the receiving area 2 ' carried out.

10 shows another alternative. This example is on a substrate 1 an only impressed recording area 2 intended. There remain attachment points 25 . 26 , For example, in analogy to 1 can the antenna 4 be formed. After creating the loops 8th . 14 and training the antenna 4 can the recording area 2 now by punching out the areas 25 . 26 formed and not shown electronic component in the now open receiving area 2 be used.

The 11 and 12 show as a schematic diagram of a wire laying device 27 , which is in operative connection with a control device, not shown. The wire laying device 27 includes a wire guide element 28 for the supplied wire conductor 6 ,

Also visible is a substrate 1 ,

For laying the wire conductor 6 Either the wire laying device 27 or the substrate 1 to be moved. For simplified representation, coordinate crosses are indicated.

In the area of the wire guide element 28 is a raisable and lowerable braking device 19 positioned the wire conductor 6 unhindered in the direction of the substrate 1 running, a retreat of the wire conductor 6 however prevented.

LIST OF REFERENCE NUMBERS

1

substratum

1'

But substrate surface

2

reception area

2 '

reception area

3

electronic component

3 '

electronic component

4

antenna

4 '

antenna

5

Wire laying device

6

wire conductor

6 '

wire conductor

7

fixation point

7 '

fixation point

8th

loop

8th'

loop

9

page

10

fixation point

10 '

fixation point

11

convolution

12

page

13

fixation point

14

loop

15

fixation point

16

contact point

16 '

contact point

17

contact point

18

location

19

location

20

near corner area

21

page

22

page

23

near corner area

24

page

25

Area

26

Area

27

Wire laying device

28

Wire guide element

29

braking means

Claims (12)

Process for the preparation of, from a substrate at least single-layered ( 1 ), at least one trained antenna ( 4 ) and at least one electronic HF component ( 3 ) transponder unit, by - in the area of the substrate ( 1 ) at least one receiving area ( 2 ) for the electronic component ( 3 ), - for the antenna ( 4 ) to be used wire conductor ( 6 ) in the region of the substrate ( 1 ) and outside the reception area ( 2 ) on the substrate ( 1 ) is fixed, - the wire conductor ( 6 ) by using a braking device ( 29 ) containing wire guide element ( 28 ) to form a first loop ( 8th ), starting from the fixation point ( 7 ), in the plane of the substrate ( 1 ) on one side ( 9 ) of the recording area ( 2 ) in the reception area ( 2 ), - the wire conductor ( 6 ) on the same ( 9 ) or an offset page ( 12 ) of the recording area ( 2 ) back onto the substrate ( 1 ) and - the wire conductor ( 6 ) outside the reception area ( 2 ) on the substrate ( 1 ), - then the wire conductor ( 6 ) forming several turns ( 11 ) on the substrate ( 1 ) to the antenna ( 4 ), - the wire conductor ( 6 ) then into the area of another page ( 12 ) of the recording area ( 2 ) and outside the reception area ( 2 ) on the substrate ( 1 ), - the wire conductor ( 6 ) to form another loop ( 14 ) in the plane of the substrate ( 1 ) in the reception area ( 2 ) and within the same ( 12 ) or a side which is offset therefrom, again out of the receiving area ( 2 ), - the wire conductor ( 6 ), if necessary, then outside the receiving area ( 2 ) on the substrate ( 1 ), - the loops ( 8th . 14 ) with contact points ( 16 . 17 ) in the reception area ( 2 ) positioned electronic component ( 3 ) are electrically connected. Process for the preparation of, from a substrate at least single-layered ( 1 ), at least one trained antenna ( 4 ' ) and at least one electronic UHF component ( 3 ' ) transponder unit, by - in the area of the substrate ( 1 ) at least one receiving area ( 2 ' ) for the electronic component ( 3 ' ), - for the antenna ( 4 ' ) to be used wire conductor ( 6 ' ) in the region of the substrate ( 1 ) and outside the reception area ( 2 ' ) on the substrate ( 1 ), - the wire conductor ( 6 ' ) by using a braking device ( 29 ) containing wire guide element ( 28 ) forming a loop ( 8th' ), starting from the fixation point ( 7 ' ), in the plane of the substrate ( 1 ) on one side of the receiving area ( 2 ' ) in the reception area ( 2 ' ), - the wire conductor ( 6 ' ) on the same or an offset side of the receiving area ( 2 ' ) back onto the substrate ( 1 ) and - the wire conductor ( 6 ' ) outside the reception area ( 2 ' ) on the substrate ( 1 ) is fixed and continued, - on another side of the reception area ( 2 ' ) the operations described above are repeated to form another loop, - the loops ( 8th' ) with contact points ( 16 ' ) in the reception area ( 2 ) positioned electronic component ( 3 ' ) are electrically connected. Method according to claim 1 or 2, characterized in that the electronic component ( 3 . 3 ' ) before forming the antenna ( 4 . 4 ' ) in the reception area ( 2 . 2 ' ) is introduced. Method according to claim 1 or 2, characterized in that the electronic component ( 3 . 3 ' ) following the formation of the antenna ( 4 . 4 ' ) from below into the receiving area ( 2 . 2 ' ) is introduced. Method according to one of claims 1, 3 or 4, characterized in that the wire conductor ( 6 ) after forming the antenna ( 4 ) on the first loop ( 8th ) opposite side ( 12 ) of the recording area ( 2 ) and forming the further loop ( 14 ) in the reception area ( 2 ) is executed and executed. Method according to one of claims 1, 3 or 4, characterized in that the loops ( 14 ) in the receiving area ( 2 ), that the entry and exit areas in sections of the receiving area which are offset in particular at a right angle (FIG. 2 ) are arranged. Method according to one of claims 1 to 6, characterized in that the receiving area ( 2 . 2 ' ) is formed rectangular or square, wherein the loops ( 8th . 14 ) in corners ( 20 . 23 ) of adjacent sides ( 21 . 22 ; 24 . 21 ). Method according to one of claims 1 to 7, characterized in that the receiving area ( 2 ) is formed rectangular or square, wherein the loops ( 8th . 14 ) are laid in each other geometrically opposite corners. Method according to one of claims 1 to 8, characterized in that the wire conductor ( 6 . 6 ' ) outside the reception area ( 2 . 2 ' ) by means of ultrasound on the substrate ( 1 ) is fixed. Device for producing a transponder unit according to one of Claims 1 to 9, comprising a wire guiding element ( 28 ) wire laying device ( 27 ), a fixing device for the wire conductor ( 6 ) on the ( 1 ) Substrate and a control device, wherein the control device, the wire laying device ( 27 ), respectively the substrate ( 1 ), and the fixing device controls in such a way that the wire conductor ( 6 ) outside a reception area ( 2 ) for the electronic component ( 3 ) and at least one loop ( 8th . 14 ) on one side of the receiving area ( 2 ) in this one and either at the same or a side provided offset it from the receiving area ( 2 ) is executable, wherein the wire conductor ( 6 ) at a predeterminable angle in the wire guide element ( 28 ) and in the direction of the substrate ( 1 ) is feasible, wherein the wire conductor ( 6 ), the shape of the respective antenna ( 4 ), by the wire laying device ( 27 ) on the substrate ( 1 ), wherein the fixing device is part of the wire laying device ( 27 ) and wherein in the region of the wire inlet into the wire guide element ( 28 ) a braking device ( 29 ) for the wire conductor ( 6 ) is provided. Apparatus according to claim 10, characterized in that the braking device ( 29 ) is formed by a felt element, a sheet metal body, a plastic or a rubber element. Device according to one of claims 10 or 11, characterized in that the braking device ( 29 ) is annular, the wire guide element ( 28 ) and relative to the wire guide element ( 28 ) is provided raised and lowered.

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