KR100964583B1 - Method and device for the manufacture of a transponder unit - Google Patents

Abstract

PURPOSE: A method for manufacturing a transponder unit and a manufacturing device thereof are provided to supply improved soldering by inducing a line conductor from a plane to an electrical part acceptance unit and forming a loop. CONSTITUTION: One or more receiving units(2) for electronic units(3) are provided to the area of a substrate(1). A line conductor(6) is induced to the substrate area. The line conductor is fixed on the substrate outside the receiving unit. The line conductor is used in the receiving unit from one side of the receiving unit. The line conductor forms a first loop(8). The line conductor is induced to be returned again from one side or the side(12) to the substrate.

Description

Method and device for the manufacture of a transponder unit

The present invention relates to a method of manufacturing a transponder unit comprising at least one monolayer substrate, at least one laid antenna and at least one electronic module.

DE 196 20 242 states that at a first phase a wire conductor is led over a connection area or a portion that receives the connection area, and in the portion allocated to the connection area or connection area. Of a transponder unit fixed on the substrate, the wire conductors being placed on the substrate, connected at the second face to the connection area by a connection device, comprising a wire coil and a chip unit. It describes a method and apparatus for contacting wire conductors during manufacture.

Electrical connections in chip cards, transponder cards, and ID documents are subject to high mechanical stress due to bending and twisting. Therefore, it can not be excluded that the years of use cause damage in the connection zone between the connection area and the wire conductor, and that each chip card, transponder or ID document is no longer available.

DE 10 2007 030 650 A1 is a chip card comprising a chip module having at least one contact surface, wherein the chip module can be inserted into a receiving position of a substrate, and one contacting eyelet is provided. Each formed from one wire conductor supplied by a wire guiding unit for at least one contact surface, wherein a first cross section of the wire conductor is attached to the substrate surface outside the receiving portion and is adjacent to the first cross section. The second end face of the wire conductor, which protrudes from the surface, together with the contact hole, and the third end face of the wire conductor along the two cross sections is attached to the substrate outside the receiver, and the chip module is connected to the receiver. A method of manufacturing a chip card which is inserted, wherein the second end surface is bent into the contacting area and electrically connected thereto is described. Compared with DE 196 20 242 A1, it is described here as an alternative, with the disadvantage that the contact holes protruding from the substrate must be bent to return to the area of the contact surface by the tool. Thus, if the chip module has a receiving substrate, or if the contact surface protrudes therefrom, then a separate tool is required that will cause the curved contact hole to protrude backwards and press the contact hole at the contact surface to be electrically connected to the surface. Has a bigger drawback to be made.

The present invention provides a method of manufacturing a transponder unit that provides for the acceptance of another electronic module (e.g., HF, UHF), the method being distinct from conventional techniques, wherein the wire conductors applied according to the method are characterized in that the electronic module It is an object of the present invention to provide a method for manufacturing a transponder unit that can be easily and simply placed on each substrate without a separate tool for pressing the wire conductors onto each contact surface of the substrate. In addition, the possibility of electrical connection is improved, and thus higher process stability is realized.

Furthermore, before the connection between each contact surface and the wire conductor is made, an apparatus is provided which can simply lay the wire conductors on the respective substrates to be used without any additional auxiliary means required.

The object, on the one hand, is a method of manufacturing a transponder unit comprising at least one monolayer substrate, at least one laid antenna and at least one electronic HF component.

At least one receptacle for the electronic component is provided in an area of the substrate,

A wire conductor used as an antenna is led to the substrate area and fixed on the substrate outside the receiving portion,

Starting from the anchor point, the wire conductor is introduced into the receiving portion from one side of the receiving portion and forms a first loop,

At one side of the receptacle or at a side provided with an offset relative to the one side of the receptacle, the wire conductor is guided back to the substrate,

The wire conductor is fixed on a substrate outside the receptacle,

The wire conductors are then placed on a substrate to become an antenna while winding several times,

The wire conductor is then guided back to the area at another side of the receptacle and fixed on a substrate outside the receptacle,

The wire conductor is led to the receptacle to form another loop, and again to exit the receptacle in the region of the same side or a side provided with an offset thereto,

The wire conductor is then fixed on the substrate outside the receptacle and, if necessary,

The loops can be achieved by a method of manufacturing a transponder unit which is connected in a way that is electrically conductive to the contact point of the electronic component located in the receptacle.

The object is, on the other hand, also a method of manufacturing a transponder unit comprising at least one monolayer substrate, at least one laid antenna and at least one electronic UHF component.

At least one receptacle for the electronic component is provided in an area of the substrate,

A wire conductor used as an antenna is led to the substrate area and fixed on the substrate outside the receiving portion,

Starting from the anchor point, the wire conductor is introduced into the receiving portion from one side of the receiving portion and forms a first loop,

At one side of the receptacle or at a side provided with an offset relative to the one side of the receptacle, the wire conductor is guided back to the substrate,

The wire conductor is fixed on the substrate outside the receptacle and continues to be guided,

The above-described operation is repeated on the other side of the receptacle while forming another loop,

The loops can be achieved by a method of manufacturing a transponder unit which is connected in a way that is electrically conductive to the contact point of the electronic component located in the receptacle.

Advantageous embodiments of the method according to the invention are disclosed by the related dependent claims relating to the method.

Furthermore, a device for carrying out the method according to the invention, comprising: a wire laying device comprising a wire guiding element, a fixing device for a wire conductor on a substrate, and a regulating device, wherein the regulating device is the wire at the substrate, respectively. Causing the laying device and the fixing device so that the wire conductor is fixed outside the receiving part for the electronic component, guided to the receiving part on one side of the receiving part, and out of the receiving part on the same side or at the side provided with an offset thereto. Can be induced again.

Advantageous embodiments of the method according to the invention are disclosed by the relevant subordinate claims.

Transponder configurations that include electronic HF components are remarkable in that they have a small range (up to 5 cm), whereby data cannot be read directly by third parties.

They can be used in the 13.56 MHz frequency range and can be used, for example, in documents such as passports, identity cards, access control cards, debit cards, transponder cards and the like.

Transponder configurations that include UHF modules are noticeable in that they have a wide range of reading and writing.

These may be used in the 860 to 950 MHz frequency range, for example in luggage tags, special personal documents (pass cards, border crossing cards) and the like.

At the same time the wire conductors can be induced without higher tension in the receptacle of the electronic module, so that stress relief in the part-related contact area by loop formation can be realized. These methods ensure the improvement of the operational reliability of the above-mentioned documents including the transponder unit.

According to the manufacturing method of each transponder unit, the electronic components used respectively may be introduced into the receiving portion from the top before laying the antenna, or may be introduced into the receiving portion from the bottom after laying the antenna.

An advantageous embodiment of the method is that after laying the antenna the wire conductor is guided back to the side of the receptacle located opposite the first loop, leading to and away from the receptacle while forming another loop. to provide. Here, the electronic component represents parallel contact points.

If no electronic component containing an offset, ie no parallel contact points, is present, the subject matter may also consider such a component.

Furthermore, it is proposed to fix the wire conductor on the substrate outside the receiving portion by, for example, ultrasonic means. If necessary, a part of the antenna at least laid by the ultrasonic waves may also be fixed on the substrate or introduced into the substrate.

According to another aspect of the invention, the wire conductors are introduced into the wire guidance element at a predetermined angle and guided in the direction of the substrate so that the wire conductors can be laid on the substrate by the wire laying apparatus as the respective antennas are formed.

Alternatively, the wire laying apparatus may be kept stationary and the substrate may be moved. This is particularly advantageous when the fixing device is part of the wire laying device.

It is further proposed to provide a braking device for wire conductors in the area of introduction of the wires into the wire guidance elements.

The braking device may be formed by a felt element in the form of a felt ring that includes, for example, a wire guide element and is provided in a lifting and lowering manner with respect to the wire guide element.

This has the advantage that the wire conductors can be guided in the direction of the substrate but cannot be retracted.

With the help of the method and the respective devices according to the invention it leads the wire conductor from the substrate plane to the receiving portion of each electronic component, while forming a loop, the contact surface of each used electronic component (e.g. HF, UHF) The technical possibility of laying a loosely induced loop onto the phase and connecting it to each contact point in an electrically conducting manner without any other auxiliary means can be provided. This method is particularly advantageous in that better solderability is given, which distinguishes it from the art in the art. Wire conductors laid in a linear path are provided over the wire conductors when the wires are offset and may not always be wetted with the brazing material by a soldering device aligned in the same direction. Thus, insufficient connection can be made resulting in rejection of the transponder unit. When wire conductors are laid in a loop, a soldering device that is aligned in the same way as for wire conductors laid in a linear manner can always wet a large portion of the loop with the solder material, even if the loop is offset. In this way, rejection is minimized.

The invention is represented and described by way of example in the following.

1 is a schematic view showing a method of manufacturing an HF transponder unit. In this embodiment, the monolayer substrate 1 has a receiving portion 2 which is located in sequence. In this embodiment, the receptacle 2 is already perforated from the substrate 1. The electronic component 3 used was introduced from the bottom into the receiver 2 after laying the antenna 4. The wire conductor 6 lies in the direction of the arrow for forming the antenna 4 in the plane of the substrate 1 only by the implicitly outlined wire laying device 5. According to the present invention, the wire conductor 6 used as the antenna 4 is guided to the region of the substrate 1, is fixed to the substrate surface 1 'outside the receiving portion 2, and forms the first anchor point 7. Starting from the fixation point 7, the wire conductor 6 is introduced into the receiving part 2 at one side 9 of the receiving part while forming the first loop 8. In this embodiment, the wire conductor 6 is again pulled away from the receiving part 2 on the side 9 to the substrate 1 and then fixed to the substrate outside the receiving part 2 'while forming another fixing point 10. The wire conductor 6 is then laid to form the antenna 4 at the substrate surface 1 'while forming several turns 11. The wire conductor 6 is then guided back to the other side 12 of the receptacle 2 and secured to the substrate surface 1 ′ of the substrate 1 outside the receptacle 2, while forming another anchor point 13. In the present embodiment, the regions 9 and 12 face each other. In the same manner as described above, another loop 14 is formed starting from the anchor point 13 so that the conductor conductor 6 is introduced into the receiver 2 starting from the anchor point 13 and led out of the receiver 2 at the side 12. . Finally, the wire conductor 6 is again fixed to the surface 1 'of the substrate 1 while forming another anchor point 15. In this embodiment, the electronic component 3, which is a chip module, can be introduced into the receiving portion 2 from below. Finally, the loops 8, 14 are connected in an electrically conductive manner, in this embodiment, to contact points 16, 17 of the electronic component 3 parallel to one another, for example by soldering.

Compared with FIG. 1, FIG. 2 is a schematic diagram of another method of manufacturing the HF transponder unit. Like elements are denoted by like reference numerals. The single layer substrate 1 is also used here. First, the receiving portion 2 was punched in the transfer direction of the substrate 1. Then, the electronic component 3 is inserted into the receiving portion 2 from the top. Then, the work for laying the antenna 4 is carried out as already described in Fig. 1, and is connected to the contact points 16, 17 of the electrical component 3 in such a manner that the loops 8, 14 are electrically conducted.

3 to 8 are schematic diagrams showing another wire laying technique for manufacturing an HF transponder unit. Like elements are denoted by like symbols.

In Fig. 3, the substrate 1 is shown to be composed of two layers 18 and 19, of which the recesses are not indicated in the layer 19, and the other layer 18 is provided with the receiving portion 2. As shown in Fig. 2, the electronic component 3 is inserted from the top into the associated receiving portion 2, where the antenna laid in the same manner as in Fig. 1 is not shown.

According to Fig. 4, a single layer or multi-layer substrate 1 with a corresponding receiving portion 2 can be used to position the electrical component 3. In contrast to FIG. 1, the loops 8, 14 face each other and the wire conductor 6 is laid as indicated by the direction of the arrow, so that the wire conductor is first introduced into the receiving portion 2 and therefrom from one side 9 Induced to deviate, while forming loop 8, antenna 4 is then laid. At side 12 provided with an offset (90 °) with respect to side 9 of receptacle 2, wire conductor 6 is introduced into receptacle 2 and guided away from said side 12, while forming another loop 14. This method can be realized when the electronic component 3 has contact points 16 and 17 which are offset from each other.

Another embodiment is shown in FIG. The wire conductor 6 is fixed to the substrate surface 1 ′ of the substrate 1 outside the receiving portion 2, while forming the first fixing point 7. In a region close to the corner 20 of the side 21, the wire conductor 6 is introduced into the receiving portion 2 starting from the fixing point 7 and out of the receiving portion 2 in the region of the side 22 provided at an offset (90 °) with respect to the side 20. While again induced, a first loop 8 is formed and fixed to the surface 1 'of the substrate 1 to form another anchor point 10. Then, antenna 4 is laid and the wire conductor 6 is fixed to the surface 1 'of the substrate 1, while forming another fixing point 13. In the area close to the corner 23, the wire conductor 6 is introduced into the receptacle 2 on the side 24 and is led back out of the receptacle 2 on the side 20, while forming a second loop 14 and fixed to the surface 1 'of the substrate 1 To form another anchor point 15.

6 shows another laying technique. In this embodiment, the electronic component 3 is inserted into the receiving portion 2 of the substrate 1 in which the receiving portion is formed into the groove. Contact points 16 and 17 slightly protrude from the substrate surface 1 'so that the conductor conductor 6 is lifted slightly from the laying plane of the antenna 4 to be laid in the region of the contact points for forming the loops 8 and 14 by means of a wire laying device not shown here. You must lose. Loops 8, 14 and antenna 4 may be placed in a manner similar to that in FIG.

FIG. 7 shows another thing from FIG. 6. In this embodiment, electronic component 3 is located on the substrate surface 1 'of the substrate. In this embodiment, the accommodating portion for receiving the electronic component 3 is not formed by the recessed portion, but is formed by the adhesive point where the electronic component 3 is located. It may proceed in the same manner as in FIG.

8 shows another method of laying wire conductor 6 on substrate 1. Here, the receiving portion 2 can be manufactured in the same manner as in FIG. Wire conductor 6 is guided to the area of the substrate and fixed to the surface 1 'of the substrate 1, while forming a fixed point 7. Starting from the anchor point 7, the wire conductor 6 is introduced into the receiving part 2 on one side 9 of the receiving part and guided back out of the same side 9 while forming a loop 8. In the adjacent approach of the fixation point 7, the wire conductor 6 is guided back in the direction of the same side and fixed to the surface 1 'of the substrate 1 while forming another fixation point 10. The antenna 4 is then placed in the plane of the substrate 1. The other loop 14 is formed in the same way as in the first side 9 on the opposite side 12 to the one side 9 of the receptacle 2, where two anchor points 13 and 15 which are located next to each other are formed on the surface 1 'of the substrate.

9 shows a different representation from FIGS. 1 to 8. Here the UHF transponder unit is formed rather than the HF. Compared with the HF transponder, antenna 4 is arranged differently in the UHF transponder unit. The first process is similar to that described in Figures 1-8 above. Here, the same reference numerals are used for the same component parts. Electronic component 3 is located in receptacle 2. The wire conductor 6 'is applied to the surface 1' of the substrate 1 and fixed on the surface 1 'of the substrate 1 outside the receiving portion 2', while forming the fixing point 7 '. Then, starting at the fixed point 7 ', the wire conductor 6' is led to the receiving portion 2 'and the contact point 16' of the electronic component, respectively, while forming a loop 8 '. On the same side as the introduction region, the wire conductor 6 'is guided back out of the receiving portion 2' and fixed to the surface 1 'of the substrate 1 while forming the fixing point 10'. Starting with the fixed point 10 ', the wire conductor 6' continues to be provided at its end point. The same method is carried out on the side opposite the loop 8 'of the receptacle 2'.

10 shows another method. In this embodiment, only the relief portion 2 is provided on the substrate 1. Fixed points 25 and 26 remain. Antenna 4 may be placed in the same manner as in FIG. After forming the loops 8, 14, the antenna 4 is placed and the receptacle 2 can be formed by drilling the regions 25, 26, while an electronic component, not shown, can be inserted into the open receptacle 2.

11 and 12 are schematic diagrams showing a wire laying device 27 that operates in conjunction with a control device, not shown. The wire laying device 27 includes a wire guiding element 28 for the supplied wire conductor 6.

Substrate 1 is also shown.

In order to install the electric wire conductor 6, the electric wire laying apparatus 27 or the board | substrate 1 can be moved. Coordinate axes are shown for the sake of simplicity.

A braking device 19 that can be lifted and lowered is located in the region of the wire guide element 26, which allows the wire conductor 6 to move unobstructed in the direction of the substrate 1, while the wire conductor 6 does not reverse. Prevent.

1 schematically illustrates a method of manufacturing an HF transponder unit on a single layer substrate.

Figure 2 schematically shows another method of manufacturing an HF transponder unit on a single layer substrate.

3 schematically illustrates another method of manufacturing an HF transponder unit on a multilayer substrate.

4-8 show another wire laying technique for the HF transponder unit.

Figure 9 schematically shows a method of manufacturing a UHF transponder unit.

10 shows another fabrication of a receptacle for receiving electronic components.

11 and 12 schematically show a wire laying device including a braking device.

[Description of Drawing Symbol]

1: substrate 1 ': substrate surface

2: receptacle 2 ': receptacle

3: electronic component 3 ': electronic component

4: antenna 4 ': antenna

5: wire laying device

6: wire conductor 6: wire conductor

7: fixed point 7 ': fixed point

8: loop 8 ': loop

9: side

10: fixed point 10 ': fixed point

11: wound

12: side

13: fixed point

14: loop

15: Fixed point

16: contact point 16 ': contact point

17: contact point

18: layer

19: layer

20: corner adjacent area

21: side

22: side

23: Corner Adjacent Area

24: side

25: area

26: area

27: wire laying device

28: wire induction element

29: braking system

Claims (15)

A method of manufacturing a transponder unit comprising at least one monolayer substrate (1), at least one laid antenna (4) and at least one electronic HF component (3) One or more receptacles 2 for the electronic component 3 are provided in the region of the substrate 1, A wire conductor 6 used as an antenna 4 is led to the area of the substrate 1 and fixed on the substrate 1 outside of the receiving portion 2 to form a fixed point 7, Starting from the fixing point 7, the wire conductor 6 is introduced into the receiving part 2 from one side 9 of the receiving part 2 while forming a first loop 8. , On the same side 9 or on the side 12 provided with an offset relative to the one side of the receiving portion 2, the wire conductor 6 is guided back to the substrate 1, The wire conductor 6 is fixed on the substrate 1 outside the receptacle 2, The wire conductor 6 is then laid on the substrate 1 to be the antenna 4 while several turns 1 are made, The wire conductor 6 is then guided back to the area at another side 12 of the receptacle 2 and fixed on the substrate 1 outside the receptacle 2, The wire conductor 2 is led to the receptacle 2 to form another loop 14, again in the region of the same side 12 or at the side provided with an offset thereto. To get out of The wire conductor 6 is then fixed on the substrate 1 outside the receptacle 2, -The loops (8, 14) are connected in an electrically conductive manner to a contact point (16, 17) of an electronic component (3) located in the receiving portion (2). A method of manufacturing a transponder unit comprising at least one monolayer substrate 1, at least one laid antenna 4 ′ and at least one electronic UHF component 3 ′, One or more receptacles 2 'for the electronic component 3' are provided in the region of the substrate 1, A wire conductor 6 'used as an antenna 4' is led to the substrate 1 area and fixed on the substrate 1 outside the receiving portion 2 'to fix a fixed point 7'. Forming, -Starting from the fixing point 7 ', the wire conductor 6' is introduced into the receiving part 2 'on one side of the receiving part 2' while the first loop 8 ' Forming, At the same side or at a side provided with an offset with respect to the one side of the receiving portion 2 ', the wire conductor 6' is guided back to the substrate 1, The wire conductor 6 'is fixed on the substrate 1 outside the receptacle 2', On the other side of the receiving portion 2'the above-described operation is repeated while another loop is formed, -The loops (8 ') are connected in an electrically conductive manner to a contact point (16') of an electronic component (3 ') located in the receiving portion (2'). The method according to claim 1 or 2, The electronic component (3, 3 ') is introduced into the receiving portion (2, 2') before the antenna (4, 4 ') is laid. The method according to claim 1 or 2, The electronic component (3, 3 ') is introduced into the receiving portion (2, 2') from the bottom after the antenna (4, 4 ') is laid. The method of claim 1, The wire conductor 6 is guided back to the side 12 of the receiving part 2 located opposite the first loop 8 after laying the antenna 4, into and out of the receiving part 2. A method of manufacturing a transponder unit, characterized in that it forms another loop (14) while being derived from the section (2). The method of claim 1, The loop (14) is a method of manufacturing a transponder unit, characterized in that the inlet and outlet areas are laid in the receiving part (2) so as to be offset from each other, specifically at a right angle or less. The method according to claim 1 or 2, The receiving portions 2, 2 'are given in the form of rectangles or squares, and the loops 8, 14 are placed in the proximal regions of the corners 20, 23 of the side surfaces 21, 22; 24, 21 adjacent to each other. Method of manufacturing a transponder unit, characterized in that. The method according to claim 1 or 2, Method for producing a transponder unit, characterized in that the receiving portion (2) is given in the form of a rectangle or a square, and the loops (8, 14) are laid at corners facing each other geometrically. The method according to claim 1 or 2, The wire conductor (6, 6 ') is fixed on the substrate (1) outside the receiving portion (2, 2') by ultrasonic waves. An apparatus for manufacturing the transponder unit of claim 1, wherein Wire laying device 27 comprising wire guide element 28, Fixing device for electric wire conductor 6 on the substrate 1 and Includes an adjusting device, The regulating device operates the wire laying device 27 and the fixing device on each substrate 1 so that the wire conductor 6 can be fixed outside the receiving portion 2 for the electronic component 3, in one aspect thereof. Apparatus for producing a transponder unit, characterized in that it is guided to the receptacle (2) and to be retracted from the receptacle (2) on the same side or on the side provided at offset thereof. The method of claim 10, The wire conductor 6 is introduced into the wire guide element 28 at a predetermined angle and guided in the direction of the substrate 1, and the wire conductor 6 is connected to the wire laying device 27 according to the formation of each antenna 4. Apparatus for producing a transponder unit, characterized in that it can be placed on the substrate (1) by. The method of claim 10, Apparatus for producing a transponder unit, characterized in that the fixing device is part of the wire laying device (27). The method of claim 10, Apparatus for producing a transponder unit, characterized in that a braking device (29) for the wire conductor (6) is provided in the region of introduction of the wire into the wire guidance element (28). The method of claim 13, Apparatus for producing a transponder unit, characterized in that the braking device is formed by a felt element, a sheet metal body, a plastic or a rubber element. The method of claim 13, The braking device 29 is annular, includes a wire guide element 28, and is produced in a lifting and lowering manner with respect to the wire guide element 28. Device.

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