DE102007030650B4 - Method for producing a chip card - Google Patents

Abstract

Method for producing a chip card, comprising a chip module (3) having at least one contacting surface (4.1, 4.2), the chip module (3) being insertable into a receiving position (6) of a substrate (1), wherein for at least one of the contacting surfaces (4.1 , 4.2) from a supplied by a wire guide unit wire conductor (5) each a Kontaktierungsöse is formed by a first portion (7) of the wire conductor (5) on a surface of the substrate (1) outside the receiving position (6) is attached, wherein a the second section (8) of the wire conductor (5) adjacent to the first section (7) is guided in such a way that it forms the contact hole together with the surface and out of it, with a subsequent third section (9) of the wire conductor (5) the surface outside the receiving position (6) is attached, wherein the chip module (3) is inserted into the receiving position (6) and wherein the second portion (8) bent to the contact surface (4.1, 4.2) around and is electrically connected thereto, wherein the second section (8) by ...

Description

The invention relates to a method for producing a chip card. Documents such as passports, identity documents and identity cards, especially in the ID-1, ID-2 and ID-3 formats, are often equipped with RFID systems according to the ICAO 9303 specification. Normally, an RFID transponder with an antenna coil is used for this purpose. The antenna coil can be produced by etching a copper or aluminum foil, by screen printing or by inkjet printing with electrically conductive pastes. Alternatively, thin enamel-insulated copper wires with a thickness of 30 μm to 150 μm are laid on the inner layer of a substrate. A chip module is arranged on the inner layer or in a recess of the inner layer and the wire ends are electrically connected to the chip module.

The European patent EP 0 880 754 B1 discloses a method of contacting a wire conductor during fabrication of a transponder unit disposed on a substrate and comprising a wire coil, wherein in a first phase the wire conductor is routed across a terminal or terminal receiving area, the wire conductor on the substrate with respect to the connection point or the area associated with the connection point is fixed; and wherein in a second phase, a connection of the wire conductor to the connection point is made with a connection instrument and the wire conductor is connected while being fixed on the substrate and extending parallel to the surface plane of the turns of the wire coil. The problem with this and other known techniques is that electrical connections in smart cards are subject to mechanical stress as a result of bending and twisting and are therefore susceptible to failure. For credit cards, which are usually replaced after two years, this is more of a minor problem. However, for passports and personal documents, which should last for about ten years, it is a significant disadvantage.

From the DE 196 16424 A1 discloses a method of manufacturing smart cards with antenna coils, in which the antenna coils in the vicinity of an electronic module are looped in order to achieve a tension compensation.

From the post-published WO 2008/037579 A1 For example, a method for connecting an antenna to a transponder chip and to an associated inlay substrate is known in which end sections of an antenna wire fastened to the inlay substrate remain unsecured and are prepositioned in the vicinity of a predetermined area for receiving the transponder chip on the substrate. After the transponder chip is installed on the substrate, the end portions of the antenna wire are repositioned to overlie respective terminals of the transponder chip for subsequent connection thereto.

It is therefore an object of the invention to provide a method for producing a chip card with durable durable electrical contacts.

The object is achieved by a method having the features of claim 1.

Advantageous developments of the invention are the subject of the dependent claims.

The inventive method is used for producing a chip card, comprising a chip module having at least one contacting surface, wherein the chip module can be arranged in a receiving position of a substrate. In the method, a contacting lug is formed from a wire conductor at least for one of the contacting surfaces, which is supplied by a wire guide unit. The contact lug is formed by adhering a first portion of the wire conductor out of the pickup position on a surface of the substrate. A second section of the wire conductor adjacent to the first section is guided in such a way that it forms the contacting lug together with the surface and out of it, in particular approximately at right angles. A subsequent third section of the wire conductor is adhered to the surface outside the receiving position, so that the Kontaktierungsöse is closed. The chip module is inserted into the receiving position, the second section is bent around and electrically connected to the contacting surface. As a result of the shape of the Kontaktierungsöse the wire conductor is bent in the vicinity of the contacting surface instead of straight, so that there is a strain relief and as a result bending and twisting of the chip card or on the smart card temperature changes the contacts mechanically load less than a straight wire conductor. Another advantage is that the chip module does not necessarily have to be inserted before the wiring. In conventional methods for contacting RFID chips in smart cards, the chip module must be used before the wire conductor is attached and contacted to form an antenna coil, because it is guided straight over the contacting areas. In the method according to the invention, the chip module can be used after the preparation of the contacting eyelets and before they are bent, since the receiving position at this time due to the fact that the first and the second portion of the Wire ladder are tacked outside the pickup position, is free and accessible. The main advantage here is that the wire conductors, especially if they are used as an antenna coil, can be visually and electrically tested before inserting the chip module. If the wire conductors fail the test, the substrate may be discarded with the wire conductors without the chip inserted. In contrast, the wire conductors or antenna coils of a smart card, which was produced by a conventional method, can only be tested when the chip module is already inserted and contacted. In the case of failure in the test, the entire chip card must be discarded with the inserted chip module, which causes higher costs than in the inventive method. Chip modules for use in passports according to the ICAO 9303 contain particularly large integrated circuits with EEPROM capacities of at least 64 kbit and are much more expensive than the substrates and antenna coils. Also in the method according to the invention, the chip module can be used before the wiring.

The term chip module can also refer to a so-called interposer, which is a chip arranged on a thin film with two contacting surfaces, the chip being fastened by flip-chip contacting, wire bonding technology or another contacting technique. The chip module may be an RFID module. In particular, in this case, the chip module has two contacting surfaces for contacting a wire conductor in the form of an antenna coil. The chip card can be used as a passport, identity card or other identity document. Further process steps may be required to complete the smart card.

The antenna coil may be arranged around the receiving position. In this case, the wire conductor has a crossover. In a further embodiment, the antenna coil is arranged such that a part thereof traverses the receiving positions. In this case, the chip module is inserted over this part. The advantage of this embodiment is that a crossover of the wire conductors can be avoided, so that the required height is reduced. In addition, in this case, the wire conductor does not necessarily have to be insulated. However, a slightly greater height results in the area of the chip module as a result of the underlying wire conductor.

According to the invention, the protruding shape of the second section is achieved by appropriately raising and lowering the wire guide unit and by varying a feed rate of the wire conductor. For this purpose, the wire guide unit must be designed to be movable in the direction of a normal to the surface.

According to the invention, the shape of the second section is determined by being guided around an auxiliary tool with the aid of the wire guide unit, which determines the shape of the contacting lug. The auxiliary tool, z. B. in the manner of a pin, must be placeable in a position between the surface and the second portion and removably formed from this position. In this way, the Kontaktierungsöse is designed omega-shaped, resulting in a particularly good strain relief.

The wire guide unit can be integrated in an ultrasonic sonotrode. The ultrasonic sonotrode can provide energy for attaching the first and third sections to the surface. Other parts of the wire conductor can also be attached using the ultrasonic sonotrode. When laying an antenna coil, it is usually at least partially embedded in the surface by softening the substrate by means of ultrasonic energy. For this purpose, a thermoplastic film can be used as a substrate.

Preferably, the second portion is guided so that there is a Kontaktierungsöse which protrudes a maximum of 2 mm from the surface. However, the supernatant may also be limited to a few tenths of a millimeter.

The term pick-up position may refer to that location on the substrate where the chip module is to be installed without any structural difference from the rest of the substrate. The chip module may in this case be mounted on the substrate before or after the wiring. This embodiment is preferably applied to chip modules which are not thicker than 150 μm, preferably less than 100 μm, particularly preferably less than 80 μm. In another embodiment, the receiving position may be formed as a recess in the substrate, both in the form of a recess and a breakthrough.

The wire conductor may be a lacquer-insulated copper wire. Depending on the technique used for electrically contacting the contacting lug with the contacting surface, it may be necessary for the lacquer to be removed from the corresponding part of the wire conductor prior to contacting. In some other techniques can be dispensed with the removal of the paint. The contacting technique can be one of the techniques from the group of thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing or crimping. Bending and contacting can also be carried out by means of the ultrasonic sonotrode.

In a further embodiment of the invention, a further film can be arranged on at least one of the two surfaces of the substrate, in particular a further thermoplastic film. Particularly when the receiving position is formed as a breakthrough, an additional film may be arranged below the substrate for supporting the chip module. Another additional foil may be placed on the chip module after wiring and contacting, even in the case where the receiving position is not a recess. The additional film, which is arranged above the chip module, may have a recess for enclosing the chip module. Also, it may have a softening temperature lower than a softening temperature of the substrate. The substrate and the additional foils may be aligned with each other and tacked together by heat pressure or energy from the ultrasound sonotrode at at least two locations to facilitate handling of the smartcard without adversely affecting the contact pads.

The substrate may be processed alone or as one of a plurality of multiple-use segments. The segments can be processed one after the other by an arrangement according to the invention. In a further embodiment of the invention, at least two of the segments can be processed simultaneously by a respective device.

Embodiments of the invention are explained in more detail below with reference to drawings.

Show:

1 a top view of a chip card in the form of one of a plurality of segments of a multiple use, wherein the chip card comprises a chip module and an antenna coil disposed around the chip module and is produced by a method according to the prior art,

2 a detailed view of a section of the smart card 1 wherein the smart card is produced by a method according to the prior art,

3 a sectional view of the smart card 2 in the sectional plane AB, wherein the chip card is produced by a method according to the prior art,

4 a detailed view of a chip card similar to the one in 2 wherein the chip card is produced by a method not according to the invention and an antenna coil is attached to the substrate but is not yet electrically connected to the chip module,

5 a sectional view of the smart card 4 in the section plane CD,

6 a view of the chip card 4 wherein the Kontaktierungsösen the antenna coil are bent to the contacting surfaces of the chip module and the Kontaktierungsösen resemble a bell curve,

7 a view of the chip card 4 wherein the Kontaktierungsösen the antenna coil are bent to the contacting surfaces of the chip module and the Kontaktierungsösen according to the invention in the form of an omega,

8th a sectional view of the smart card 4 in the sectional plane EF, wherein the Kontaktierungsöse has the shape of a bell curve,

9 a sectional view of the smart card 4 in the sectional plane EF with an auxiliary tool for forming the contacting lug, wherein the contacting lug has the shape of a bell curve,

10 a plan view of a chip card, wherein the chip card comprises a chip module and an antenna coil, which is at least partially disposed below the chip module, and

11 a sectional view of the smart card 10 in the sectional plane GH.

Corresponding parts are provided in all figures with the same reference numerals.

1 is a plan view of a substrate 1 a smart card, which is one of a plurality of segments of multiple uses 2 is. The chip card comprises a chip module 3 with two contact surfaces 4.1 . 4.2 and a wire conductor 5 in the form of an antenna coil surrounding the chip module 3 is arranged around. The wire conductor 5 is laid, fixed and contacted by a method according to the prior art. The chip module 3 will be on the substrate 1 in a recording position 6 arranged as a recess in the substrate 1 can be trained. For the production of the chip card is the substrate 1 , which can also be in the single-use format, placed on a workbench. The chip module 3 will be in the shooting position 6 with the contact surfaces 4.1 . 4.2 arranged upwards. When the shooting position 6 is a recess in the form of a breakthrough, the chip module 3 from below through vacuum or through Attach to one below the substrate 1 arranged additional film (not shown) are fixed.

The wire conductor 5 is detected by means of an ultrasonic sonotrode (not shown) on a surface of the substrate 1 attached or at least partially embedded there. The substrate 1 is usually a thermoplastic film. The wire conductor 5 may be a lacquer-insulated copper wire. The ultrasonic sonotrode comprises a wire guide unit for feeding and guiding the wire conductor 5 ,

2 is a more detailed view of a section of the smart card 1 with the chip module 3 and the contacting surfaces 4.1 . 4.2 , wherein the chip module 3 from an integrated circuit 10 formed in a chip embedding compound 11 is included.

To the wire conductor 5 on the substrate 1 to lay and him with the contact surface 4.1 to connect, becomes a first section 7 of the wire conductor 5 outside the shooting position 6 , ie shifted in the x-direction, attached to the surface. A the first section 7 adjacent second section 8th is over the contact surface 4.1 led and a subsequent third section 9 in turn will be on the surface behind the bonding pad 4.1 attached to. The wire conductor 5 can then be in the substrate 1 embedded to form an antenna coil. The end of the wire conductor 5 The windings of the antenna coil is guided crossing to make it in the same way with the other contacting surface 4.2 connect to. Finally, the wire conductor 5 behind the contact surface 4.2 cut off or notched and torn off. The second sections 8th become electrically with the respective contact surfaces 4.1 and 4.2 connected. The process described is usually followed by lamination steps.

3 is a sectional view of the smart card 2 in the cutting plane AB. The recording position 6 is a recess in the substrate 1 in the form of a breakthrough. The chip module 3 is through an additional slide 12.1 which is attached to its back and at least loosely attached to the substrate 1 is fixed, held. Both 2 and 3 show a smart card, which is produced by a method according to the prior art.

4 is a detailed view of a smart card similar to the one in 2 shown. In contrast, it shows an intermediate step of an embodiment of a method not according to the invention, with which the chip card is produced in this figure. Unlike the prior art method, laying the wire conductor 5 on the substrate 1 and for contacting the contacting surface 4.1 the first paragraph 7 of the wire conductor 5 on the surface of the substrate 1 outside the shooting position 6 additionally pinned in the y-direction. The first section 7 adjacent second section 8th is guided in such a way that together with the surface and in the z-direction it forms a contact-making eyelet outstandingly. This is going out 5 clearly, which is a sectional view of the smart card 4 in the sectional plane CD shows. The third section 9 will turn to the surface outside the shooting position 6 and additionally pinned in the y-direction to close the Kontaktierungsöse. In this way, the shooting position 6 so kept that the chip module 3 also after the creation of Kontaktierungsöse as well as before can be used. The wire conductor 5 can then be embedded in the substrate to form the antenna coil. The end of the wire conductor 5 the windings of the antenna coil is crossed over to finally with a similarly formed Kontaktierungsöse for the contacting surface 4.2 to be provided. Finally, the wire conductor 5 behind the contact surface 4.2 cut off or notched and torn off. After inserting the chip module 3 become the second sections 8th to the contact surfaces 4.1 . 4.2 bent around and electrically connected to it. The process described is usually followed by lamination steps. In the example shown, the recording position 6 a recess in the substrate 1 in the way of a breakthrough. The chip module 3 comes with an additional slide 12.1 which is attached to its back and at least loosely attached to the substrate 1 connected, held. The recording position 6 may also have the shape of a depression. The term recording position 6 can also affect the location in the substrate 1 refer where the chip module 3 should be arranged without a structural difference to the rest of the substrate 1 consists. In these cases, not necessarily an additional slide 12.1 be arranged. The embedding of the wire conductor 5 in the region of the antenna coil can also be performed deeper or shallower than shown in the figure.

6 is a view of the smart card 4 in a subsequent step of the method not according to the invention. The Kontaktierungsösen or the second sections 8th are to the contact surfaces 4.1 . 4.2 of the chip module 3 bent around and electrically connected to it. The second sections 8th each have the shape of a bell curve. This shape can be achieved by appropriately raising and lowering the wire guide unit and by varying a feed rate of the wire conductor 5 can be achieved while the Kontaktierungsöse in the in 4 shown earlier step of the process is created.

7 is an inventive view of the chip card, wherein the Kontaktierungsösen or the second sections 8th to the contact surfaces 4.1 . 4.2 of the chip module 3 bent around. In this case, the second sections 8th an omega shape, so that there is an even better strain relief. This shape is achieved by appropriately raising and lowering the wire guide unit, by varying a feed rate of the wire conductor 5 and by guiding the wire conductor 5 around a pin-shaped auxiliary tool that in 9 shown achieved.

The shape of the Kontaktierungsösen in the form of bell curves, as in 6 can also be assisted by an auxiliary tool.

8th is a sectional view of the smart card from the 4 . 5 and 6 in the section plane EF, the in 4 is shown. The Kontaktierungsöse or the second section 8th have the shape of a bell curve.

9 shows another sectional view of the smart card from the 4 and 5 in the section plane EF. The Kontaktierungsöse or the second section 8th is by appropriately raising and lowering the wire guide unit by varying a feed rate of the wire conductor 5 and by guiding the wire conductor 5 around the pen-shaped auxiliary tool 13 shaped around, with the auxiliary tool 13 as shown in the figure, in a position between the surface of the substrate 1 and the second section 2 placed and removed from this position as soon as the Kontaktierungsöse is formed.

The in the 6 . 7 . 8th and 9 shown forms of the second section 8th are exemplary of a variety of possible forms, the second section 8th as a result of the method according to the invention can be selected. The shape of the second section 8th can by the shape of the auxiliary tool 13 be influenced by the feed rate or by the manner of guiding the wire guide unit.

10 is a plan view of another embodiment of the smart card. The Kontaktierungsösen be essentially created in a similar manner as in the previous figures. In contrast, however, the wire conductor 5 for forming the antenna coil partially below the chip module 3 about the shooting position 6 instead of around it, and that before the chip module 3 is used. This type of embodiment can only be achieved with the method according to the invention or the subsequently published method, since the methods according to the prior art require that the chip module 3 is inserted before the wiring. The arrangement of the chip module shown 3 allows the avoidance of crossovers when laying the wire conductor 5 ,

11 is a sectional view of the smart card 10 in the sectional plane GH. The chip module 3 can be attached by means of an adhesion promoter or by ultrasonic energy and pressure. An additional slide 12.2 will be on with the chip module 3 provided side of the substrate 1 arranged. This additional slide 12.2 has a recess 14 to the sheath of the chip module 3 on.

The additional foil 12.2 on the with the chip module 3 provided side of the substrate 1 can be arranged in all embodiments shown. Instead of the recess 14 it may have a softening temperature lower than a softening temperature of the substrate 1 , so a good embedding of the chip module 3 during a subsequent lamination step and otherwise required accurate alignment of the additional film 12.2 and the substrate 1 is avoided.

The inventive method can also for chip modules 3 be applied, the less or more than two contact surfaces 4.1 . 4.1 exhibit. Not all of these contact surfaces 4.1 . 4.2 must be connected to an antenna coil.

The antenna coil or other wire conductors 5 can before inserting the chip module 3 be tested. The smart card can be discarded if the antenna coil or other wire conductors 5 fail in the test.

The wire guide unit can be integrated in an ultrasonic sonotrode.

The substrate 1 and the additional forums 12.1 . 12.2 may be thermoplastic films.

The Kontaktierungsöse can be laid out at right angles or at any other angle from the surface outstanding.

The Kontaktierungsöse can be at most 2 mm protruding from the surface.

The wire conductor 5 may be a lacquer-insulated copper wire. Especially in the in the 10 and 11 the embodiment shown, the wire conductor 5 not necessarily be isolated.

The second section 8th can with the respective contact surface 4.1 . 4.2 electrically connected by one of the techniques of the following group: thermal bonding, ultrasonic welding, brazing, laser welding, laser brazing, gluing, crimping.

The substrate 1 may be a single use or one of a plurality of segments of multiple uses 2 be. The segments can be processed one after the other by means of a device according to the invention. In a further embodiment of the invention, at least two of the segments may be processed simultaneously by a respective device. Multiple uses may take the form of sheets or rolls.

The chip module 3 can be an RFID module.

LIST OF REFERENCE NUMBERS

1

substratum

2

Multiple benefits

3

chip module

4

contacting surface

5

wire conductor

6

pickup position

7

first section

8th

second part

9

Third section

10

Integrated circuit

11

Chip embedding mass

12

Additional foil

13

auxiliary tool

14

recess

Claims (18)

Method for producing a chip card, comprising a chip module ( 3 ) with at least one contacting surface ( 4.1 . 4.2 ), wherein the chip module ( 3 ) into a receiving position ( 6 ) of a substrate ( 1 ) can be used, wherein for at least one of the contacting surfaces ( 4.1 . 4.2 ) from a supplied by a wire guide unit wire conductor ( 5 ) a contact hole is formed by a first section ( 7 ) of the wire conductor ( 5 ) on a surface of the substrate ( 1 ) outside the shooting position ( 6 ), one of the first sections ( 7 ) adjacent second section ( 8th ) of the wire conductor ( 5 ) is guided in such a way that, together with the surface and out of it, it forms the contacting eye in an outstanding manner, with a subsequent third section ( 9 ) of the wire conductor ( 5 ) on the surface outside the pickup position ( 6 ), the chip module ( 3 ) in the receiving position ( 6 ) and the second section ( 8th ) to the contacting surface ( 4.1 . 4.2 bent and electrically connected thereto, the second section ( 8th ) by corresponding raising and lowering of the wire guide unit and by varying a feed rate of the wire conductor ( 5 ) is characterized in that the second section ( 8th ) around a the shape of the Kontaktierungsöse determining auxiliary tool ( 13 ) and the Kontaktierungsöse is formed in Omegaform. Method according to Claim 1, characterized in that the chip module ( 3 ) at least two contacting surfaces ( 4.1 . 4.2 ), wherein at least two of the contacting surfaces ( 4.1 . 4.2 ) are connected to a respective Kontaktierungsöse, both Kontaktierungsösen part of the same wire conductor ( 5 ) are in the form of an antenna coil. Method according to one of claims 1 or 2, characterized in that the chip module ( 3 ) is used prior to the creation of Kontaktierungsöse. Method according to one of claims 1 or 2, characterized in that the chip module is used after the creation of Kontaktierungsöse. Method according to one of claims 2 to 4, characterized in that the antenna coil is tested and the chip module ( 3 ) is only used and contacted when the antenna coil passes the test. Method according to one of claims 2 to 5, characterized in that the antenna coil to the receiving position ( 6 ) is arranged around. Method according to one of claims 2 to 5, characterized in that the antenna coil is arranged so that a part of the antenna coil, the receiving position ( 6 ), wherein the chip module ( 3 ) is placed on this part. Method according to one of the preceding claims, characterized in that the wire guide unit is integrated in an ultrasonic sonotrode and that the first section ( 7 ) and the third section ( 9 ) are attached to the surface by means of ultrasound sonotrode energy, the substrate ( 1 ) is a thermoplastic film. Method according to one of the preceding claims, characterized in that the second section ( 8th ) is guided so that there is an approximately perpendicular from the surface projecting Kontaktierungsöse. Method according to one of the preceding claims, characterized in that the second section ( 8th ) is guided so that there is a Kontaktierungsöse that protrudes a maximum of 2 mm from the surface. Method according to one of the preceding claims, characterized in that the receiving position ( 6 ) in the manner of a recess in the substrate ( 1 ) is formed. Method according to one of the preceding claims, characterized in that a lacquer-insulated copper wire as a wire conductor ( 5 ) is used. Method according to one of claims 8 to 12, characterized in that at least one additional film ( 12.1 . 12.2 ) on at least one of the two surfaces of the substrate ( 1 ) is arranged. A method according to claim 13, characterized in that the additional film ( 12.1 . 12.2 ) a recess for the sheath of the chip module ( 3 ) having. Method according to one of claims 13 or 14, characterized in that the additional film ( 12.1 . 12.2 ) has a softening temperature which is lower than a softening temperature of the substrate ( 1 ). Method according to one of the preceding claims, characterized in that the second section ( 8th ) by means of one of the techniques from the group of thermal bonding, ultrasonic welding, soldering, laser soldering, laser welding, gluing, crimping electrically with the contacting surface ( 4.1 . 4.2 ) is connected. Method according to one of the preceding claims, characterized in that the substrate ( 1 ) is one of a plurality of multiple-use segments, the segments being processed sequentially. Method according to one of claims 1 to 16, characterized in that the substrate ( 1 ) is one of a plurality of multiple-use segments, wherein at least two of the segments are simultaneously processed by respective wire-guiding units.

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