DE10236666A1 - Method for producing contactless and / or mixed chip cards - Google Patents

Abstract

The invention relates to a method for producing a chip card without contacts and / or with a mixed function, which carries an electronic micro module component (2) or a simple metallic contact, depending on the card to be produced, which has an antenna (11) between its inner and outer Turns are connected. The invention provides for an insulating material (3) to be applied in the form of a film, which is trimmed and applied to the component film itself, instead of being applied to the film which carries the antennas. It is therefore the component itself which, after this treatment, also fulfills the function of the insulating bridge if it is applied to the antenna in such a way that it spans it. This increases the robustness of the insulation and makes it easier to implement because it is applied at the level of the component film.

Description

The invention relates to a method for producing an electronic arrangement, the is intended to be built into the body of a smart card that has at least one Electronic micromodule has on a carrier made of an insulating material is brought, which carries a coil, which serves as an antenna, with the micromodule is intended to be electrically connected to the ends of the antenna winding.

The invention is more particularly applicable to the field of making contactless Chip cards, that is chip cards that can ensure contactless operation, wherein the exchange of information to the outside takes place solely via the antenna.

The manufacturing method according to the invention also relates to chip cards, the one Provide operating mode with contact and an operating mode without contact. The exchange of Information to the outside occurs either via the antenna (thus without contact) or over the contacts that are applied to the surface of the card. In the following This card type is described as a mixed function or mixed card Chipkate called.

Such cards are designed to perform different operations, such as Example bank transactions, telephone communication, identification operations and all types of operations either by inserting the card into a reader or from the Distance by electromagnetic coupling (principally inductive coupling) between one Transceiver port and a card that is in the scope of this port brought, can expire.

The antenna is generally formed from a conductor element that is on a thin Layer is applied to a substrate plate made of plastic and so a coil in one forms a single plane, which comprises at least two turns, the windings extend essentially at the outer edge of the substrate plate. At the ends of the antenna connections are provided to the antenna with contacts of the electronic micromodule to be able to connect.

The antenna coils can be realized in different ways, by lamination, Embedding antenna wires in the substrate, using conductive ink, photo Etching or screen printing.

Each coil, which is realized in one and the same plane, makes the arrangement of one insulating bridge necessary to keep the outer turn towards the other active Guide components that are inside the turns. In the event that the antenna wire in the substrate is embedded, the wire is already insulated and the coil does not need a bridge. For the other embodiments of the coil, however, it is necessary to use an insulating one To build bridge.

The technical problem that arises here is accuracy and reliability the connection between the module and the antenna. Also the restrictions due to mechanical hold, reliability and manufacturing costs be taken into account.

A method for producing chip cards with an antenna is known, at the ends of which surfaces are provided for connection to an electronic micromodule, the manufacturing method making it possible to obtain a free space between the connection surfaces of the antenna in which the micromodule is positioned without the risk of short circuits or damaging the windings of the antenna. Such a method is shown schematically in FIG. 1.

In this case, an antenna 11 , which comprises at least two turns, is implemented on a substrate plate 10 . Connection fields 12 are provided at the ends of the wire of the antenna 11 . The windings of this antenna 11 lie outside the connection fields 12 , and an insulating bridge 13 is provided in order to connect each of the ends of the antenna to a connection field 12 without a short circuit.

This embodiment allows the space which lies between the connection fields 12 of the antenna to be left free, so that no turns pass through it. Since this space is free, there is no risk that the antenna traces will be damaged during a later step in which the electronic micromodule is attached to the connection fields of the antenna. However, this embodiment requires the provision of an insulating bridge 13 . This insulating bridge 13 is realized by covering the turns of the antenna in a zone z with an insulating layer, in which case a conductor element also includes the end of a turn and in particular the end of the last turn, which is the most outer on the substrate plate 10 can connect one of the connection fields of the antenna.

It is thus shown that the provision of such an insulating bridge is an expensive solution. The series of additional steps before the assembly of the micromodule on the antenna executed to realize the insulating bridge also prevents reaching a higher production rate.

Another method for producing contactless chip cards according to the prior art is shown in FIG. 2. In this method, the electronic micromodule 600 spans the turns of the antenna 200 , which is implemented on the substrate plate 100 . In this configuration the antenna is in the form of a spiral and comprises at least two turns. The turns of the antenna pass between the terminals 250 of this antenna. The electronic micromodule is thus applied in such a way that its metal grating, which carries contact fields, is aligned in the direction of the turns of the antenna. It is therefore necessary to provide an insulating bridge before the micromodule is applied in order to avoid the occurrence of short circuits between the antenna and the metallic connections of the micromodule when the micromodule is applied.

An insulating bridge 300 is therefore provided, which partially covers the turns of the antenna 200 , with the exception of a part of the connection terminals 250 . A small amount of fill material 500 is then applied to the insulating bridge before the micromodule comes to rest against the isolating bridge and fill material to form an electrical connection between the micromodule and the terminals of the antenna.

The insulating bridge 300 ensures electrical isolation of the traces of the antenna and the metal grating of the micromodule, and the filling material allows the space between the micromodule and the insulating bridge to be filled. The insulating bridge is preferably realized by screen printing a liquid resin and then polymerizing it with ultraviolet radiation. The realization of the insulating bridge, which covers part of the turns of the antenna before the micromodule is applied to the antenna, therefore requires the implementation of complex and expensive steps. Since the actual structure of the device of FIG. 2 spans the windings of the antenna with the micromodule and the connection fields of the metal grating of the micromodule are directly connected to the connections of the antenna, it is very difficult to isolate the tracks of the antenna on the one hand and between the Master antenna and the metallic connections of the micromodule on the other hand. The insulating bridge 300 thus does not appear to be sufficiently robust.

It is an object of the invention to provide a chipkate without contacts and / or with a mixed one Manufacture function that carries a component that an electronic module or a Metallic contact can be, depending on the type of card that is to be made the component is connected to an antenna between the inner and outer turns, avoiding the disadvantages associated with the prior art methods should be.

For this purpose, the invention provides in a first embodiment, an insulating material in the form of a film that is cut and laminated onto the component film itself instead of applying it to the plate that carries the antenna. In a second Embodiment, the insulating material is not applied to the component film, but it is provided to apply it in the form of insulating tablets to each component, after which the Components have been cut and before they are applied to an antenna substrate. It is therefore the component itself, which after this treatment is also the task of isolating bridge if it is applied to the antenna so that it spans it.

The insulation thus becomes more robust and the implementation is very simple because it is in Level of the micromodul film is executed.

• - Laminieren eines isolierenden Filmes auf einen Mikromodulfilm, auf dem eine Anordnung aus Mikromodulen angeordnet ist, wobei in dem isolierendem Film vorab Öffnungen ausgebildet sind, welche der Zone elektrischer Kontaktfelder entsprechen, die an den jeweiligen Außenseiten jedes Mikromoduls angeordnet sind;
• - Laminieren eines Films aus einem elektrisch leitenden, thermisch aktivierbaren Leitermaterial mit Klebeigenschaften auf den Mikromodulfilm, wobei in dem Leiterfilm vorab Öffnungen ausgebildet sind, die der zentralen Zone der Mikromodule entsprechen, welche zu beiden Seiten ihre Kontaktfelder liegt;
• - Beschneiden der Mikromodule;
• - Für jedes Mikromodul, Aufbringen des Mikromoduls auf die Antenne, wobei die Unterseite des Mikromoduls die isolierende Schicht und die Leiterschicht mit Klebeigenschaften trägt, welche zuvor zur Antenne gewandt aufgebracht wurden, um eine elektrische Verbindung mit den Anschlüssen der Antenne herzustellen.

The invention specifically relates to a method for producing a chip carrier without contact with an electronic arrangement which comprises an antenna which forms a spiral, at the ends of which connections are provided, and with at least one electronic micromodule which is connected to the antenna through the following process steps:

• Laminating an insulating film on a micromodule film on which an array of micromodules is arranged, openings being formed in the insulating film beforehand which correspond to the zone of electrical contact fields which are arranged on the respective outer sides of each micromodule;
• - Laminating a film of an electrically conductive, thermally activatable conductor material with adhesive properties on the micromodul film, openings being formed in the conductor film beforehand, which correspond to the central zone of the micromodules, which lies on both sides of their contact fields;
• - trimming the micromodules;
• - For each micromodule, application of the micromodule to the antenna, the underside of the micromodule carrying the insulating layer and the conductor layer with adhesive properties, which were previously applied facing the antenna, in order to establish an electrical connection with the connections of the antenna.

The invention relates to a method for producing a chip card without contacts and / or with mixed function, which is an electronic micro module component or a simple metallic contact, depending on the card to be manufactured, which carries an antenna are connected between their inner and outer turns. The invention provides to apply an insulating material in the form of a film, which is trimmed and applied to the Component film itself is applied instead of applying it to the film that the antennas wearing. It is the component itself that is the task after this treatment the insulating bridge if it is applied to the antenna so that it is this spans. This increases the robustness of the insulation and makes it easier to implement because it is applied at the level of the component film.

Further details and advantages of the invention will become clearer from reading the following description of an embodiment with reference to the drawings. In the Figures show:

Fig. 1, already described, shows a first method for applying an insulating bridge to an antenna coil for applying an electronic micromodule with good operating conditions according to the prior art;

Fig. 2, already described, shows a second method according to the prior art, in which an insulating bridge is applied to an antenna coil, wherein an electronic micromodule spans this antenna coil when it is applied,

Fig. 3A, 3B, 3C, and 4 show various steps of the method according to the invention, in which Fig. 4 is an exploded view.

The method according to the invention consists first of all in implementing a certain number of operations directly at the level of the micromodul film before cutting and electronic micromodules are applied to their associated antenna. These steps are shown in Figures 3A to 3C.

FIG. 3A shows a part of the film with micromodules or micromodul film 1 , on which an arrangement of electronic modules 2 is arranged. Each row of micromodules running across the film 1 comprises three micromodules in the example of FIG. 3A, without any intention that this should limit the scope of the invention.

This type of micromodule film is usually a 35 mm film that is on a spool is wound and can be used with facilities that are common in today's Processing of traditional chip cards can be used.

Figs. 3B and 3C thus show the two different operations are performed with the Mikromodufilm. 1 It is important to note that the two operations described below with reference to Figures 3B and 3C can be performed in any order.

Referring to FIG. 3B, a first operation is to apply (laminate) to the first micromodul film 1 a second film 3 made of an insulating film covered with an adhesive to locally electrically isolate each of the micromodules , The insulating film 3 is preferably formed from a polyester substrate of very small thickness, which is covered on at least one side with an adhesive made of a thermally activatable adhesive or another material. The application of this insulator by lamination to the micromodule film has the function of neutralizing the inner turns of the antenna when the micromodule is applied to the antenna.

When the micro module is inserted, the turns of the antenna go under the component through and thus touch the metallic contact part of the component, from which the This step of electrical insulation necessitates to avoid short circuits between the middle metallic zone of the component on both sides of its contact surfaces and Avoid coil turns of the antenna. The adhesive with thermally activated adhesive covers at least one side of the polyester substrate and forms an insulator that additionally can ensure good mechanical resistance if the electronic Micromodule is applied to the antenna.

However, the insulator must not cover the zone that the electrical contact surfaces corresponds to the micromodules and through which the electronic micromodule with the Connections of the antenna is electrically connected. Only the middle zone of the micro modules, which can come into contact with the turns of the antenna, so it can be isolated.

Before the insulating film 3 is laminated onto the micromodule film 1 , openings 4 , which correspond to the zone of the contact surfaces of the electronic micromodules, which are located on the respective outer sides of each micromodule, are therefore online on the insulating film 3 with the aid of a suitable tool, such as a matrix -Stamp, executed.

In the example of FIG. 3B, the insulating film 3 does not cover the entire micromodul film 1 , and four openings 4 are formed in the insulating film 3 for each row of micromodules running across the micromodul film.

In a modification, a larger insulating film (not shown in Fig. 3B) is used so that it completely covers the micromodul film 1 (except for the transport holes of the film). Six openings 4 are thus formed in the insulating film for each row of micromodules running transversely on the micromodul film 1 . In the example of FIG. 3B, each row comprises three micromodules.

The openings, which correspond to the zones of the contact fields of the micromodules, are used for electrical connection to the antenna.

After the insulating film 3 has been laminated with its openings 4 , the part of the insulator which remains on the micromodule allows the antenna to be insulated from the micromodule when the micromodule is applied to the antenna.

In a further modification, an arrangement of individual, continuous insulating tapes 7 , in the example of FIG. 3B there are three pieces, is applied to the micromodule film 1 in such a way that they only cover the central zone of the micromodule, which lies between their electrical contact fields.

The three continuous, insulating tapes 7 are preferably provided on three different coils, which are all applied to the micromodule film at a correct distance, the distance corresponding exactly to the coverage of the central zones of the micromodules. They can also be provided on a single spool which has been provided with a protective film offline, the protective film being removed after application to the micromodulim.

Referring to Fig. 3C, the subsequent step is to apply a film to the micromodul film 1 , which consists of a thermally activatable, electrically conductive adhesive 5 , which is called ACF, which is an abbreviation for the English term "anisotropic conductive film" ,

The ACF film 5 is formed from an adhesive with conventional thermally activatable adhesive, in which there are randomly distributed metallic balls with gold plating, which after pressing enable electrical conductivity to be realized along an axis perpendicular to the film.

The application of the ACF adhesive 5 has the function, on the one hand, of holding the electronic micromodule on the antenna when it is applied to it, and, on the other hand, of forming the electrical connections between the antenna and the micromodule.

Since this film 5 is an electrical conductor, the part which is complementary to the first step of lamination corresponding to the central metallic zone of the electronic micromodules is preferably withdrawn from the ACF film 5 by any electrical prior to lamination to the micromodul film 1 Avoid conduction between this zone of the micromodules and the turns of the coil when a micromodule is applied to an antenna.

Before this second lamination step, openings 6 are thus made online in the ACF film 5 by means of a suitable tool, such as a matrix punch, on both sides of their contact fields. These openings 6 do not allow the parts of the insulator which were previously applied to the micromodul film 1 to be covered by the ACF film when the film 5 is applied. After this lamination step, only the contact fields of the micromodules are covered by the ACF.

When the various steps of lamination at the level of the micromodule film are carried out as described above, a step for cutting the micromodule 2 is carried out in order to be able to apply it to a substrate of the antenna using a special placement machine. The micromodules are then cut online with the aid of a matrix punch together with the insulating layer 3 and the conductive adhesive layer 5 , which were previously laminated on.

The application of the micromodules 2 to the antenna is shown in FIG. 4.

The antenna 11 is, for. B. on a substrate made of a plastic material by etching a film of copper or aluminum. It can also be made by screen printing with a conductive ink, e.g. B. a gold ink that dries instantly. Alternatively, the antenna can be fabricated using other known techniques, such as embedding a conductive wire.

The antenna 11 has the shape of a spiral and comprises at least two turns. On the other hand, the antenna has two connections at its ends, which are intended to ensure the electrical connection to the electronic micromodule 2 . Furthermore, the antenna is manufactured in the form of a spiral in such a way that the turns of the antenna pass between the connections 12 .

The last step is to connect antenna 11 to electronic micromodule 2 . The micromodule 2 is applied with its previously laminated layers in such a way that it spans the turns of the antenna 11 . Its underside, which faces the antenna, carries the various laminated films, in particular the conductive adhesive film 5 , which covers the connection fields at the ends of the micromodule, and the insulating film 3 , which covers the center of the micromodule between its contact fields, the underside is applied facing the terminals 12 of the antenna 11 . The middle zone of the micromodule 2 , which lies between its connection fields and is covered with the previously applied insulating layer 3 , thus comes to lie against the turns of the antenna 11 . The micromodule is then applied by applying pressure to this predefined location.

The conductive ACF adhesive film, which is laminated to the ends of the electronic micromodule, ensures the mechanical resistance of the micromodule on the antenna and at the same time allows good electrical conduction between the antenna connections and the contacts of the micromodules. The insulating film 3 , which is laminated between the contact fields of the micromodule, can ensure good electrical insulation between the turns of the antenna and the center of the micromodule. Furthermore, the adhesive with the thermally activatable adhesive, which covers the underside of the insulating, laminated film, as described above, makes it possible to increase the mechanical resistance of the micromodule on the antenna.

The method according to the invention thus consists of the steps of laminating each an insulating adhesive film and an ACF film (in this or another Order) on the micromodule film before cutting the micromodules and applying them to realize the micromodules on the antenna carrier, creating a bridge or that Isolating the antenna will become unnecessary.

According to a second embodiment of the invention, however, the insulator can also be applied to each micromodule in a different way. More precisely, the insulator can be applied after the micromodules have been cut before they are applied to an antenna carrier. In this particular embodiment, the insulator is no longer applied in the form of a film, which is cut after being laminated to the micromodules itself, as previously described with reference to Figure 3B.

In a first step of this second embodiment of the invention, which is shown in FIG. 3C, only the ACF film 5 , in which the openings 6 which correspond to the central zone of the micromodules 2 were previously formed, is formed on both sides of their contact fields (zone, in which an insulator is to be applied) arranged and laminated onto the micromodul film 1 . Then the micro modules are cut in a straight line using a matrix stamp. Each micromodule thus simply comprises the conductive adhesive layer 5 , which was previously laminated on and only covers its electrical contact fields.

The isolator is then shaped into the central metallic zone of each micromodule insulating drop or a lozenge applied. The dimensions of the insulating Drops are dimensioned so that they precisely match those of the central zone of the micromodules correspond to which is on both sides of the contact fields in order to completely cover this zone and thus ensure good isolation when the micromodules are placed on an antenna carrier be applied. Each isolating drop is e.g. B. made of a polyester support, which is covered on at least one side with a thermally activatable adhesive.

Applying insulating drops after cutting the micromodules with a Matrix punches are preferably cut during transport Micro modules between the counter punch of the cutting tool and the holder of the Pick and place machine provided. As a result, the arrangement of the micromodules as on the Preserve micromodul film before cutting, thereby applying the insulating Drop on the central zone of each micromodule is simplified.

The application of the micromodules to an antenna carrier is thereby carried out in exactly the same way as already described above with reference to FIG. 4.

The proposed solution according to one or the other embodiment for application of an electronic micromodule on an antenna before it is placed on a card carrier is therefore easier, more economical and more robust than the solutions of the State of the art.

Finally, the method according to the invention can also be used on cards with mixed cards Function can be applied. For such an application it is necessary to build a bridge to bring the two connections of the antenna to the inside of the antenna windings. The bridge thus spans the antenna windings.

A simple metallic tongue can be applied to implement such a bridge which is a metallic contact, with the parts of the ACF film and the insulating Films are as they are for applying an electronic micromodule have been described.

Instead of applying the method according to the invention to a micromodul film, as described above with reference to FIG. 3A, a film is used at the beginning of the process which carries an arrangement of metallic contacts. This film then experiences either the steps according to the first embodiment of the invention or the steps according to the second embodiment of the invention.

By maintaining the same process for a component that functions as an electronic micromodule is referred to, or for metallic contact with the same surface and thickness like those of the micromodule, bridges can also be realized on the antennas which are intended for cards with mixed function.

Claims (10)

1. A method for producing a contactless chip carrier with an electronic device which carries an antenna ( 11 ) which forms a spiral, at the ends of which connections ( 12 ) are provided, and at least one electronic micromodule ( 2 ) which is connected to the antenna ( 11 ), characterized by the following process steps: - Laminating an insulating film ( 3 ) on a micromodul film ( 1 ), wherein an arrangement of micromodules ( 2 ) is arranged on the micromodul film ( 1 ) and openings ( 4 ) are formed in the insulating film ( 3 ), which have a zone with correspond to electrical contact surfaces which are present on the respective outer sides of each micromodule ( 2 ), - Laminating a film of an electrically conductive, thermally activatable adhesive on the micromodul film ( 1 ), wherein openings ( 6 ) are formed in the adhesive film, which correspond to the central zone of the micromodules ( 2 ), which lies on both sides of their contact surfaces; - trimming the micromodules ( 2 ); - For each micromodule, applying the micromodule ( 2 ) to the antenna ( 11 ), the underside of the micromodule ( 2 ) carrying the insulating layer ( 3 ) and the conductive adhesive layer ( 5 ), which were previously applied, and the antenna ( 11 ) is facing so that an electrical connection to the connections ( 12 ) of the antenna is established. 2. The method according to claim 1, characterized in that the openings ( 4 and 6 ), which are formed in the insulating film ( 3 ) or in the film of electrically conductive adhesive ( 5 ) before these films on the micromodul film ( 2nd ) can be laminated on with a matrix punch in one line. 3. The method according to claim 1, characterized in that the first step of laminating an insulating film ( 3 ), in which openings ( 4 ) have previously been formed, is replaced by a step which consists in the micromodul film ( 1 ) Arrangement of individual and continuous insulating tapes ( 7 ) to be applied so that only the central zone of the micromodules is covered, which lies on both sides of their electrical contact fields. 4. The method according to claim 1, 2 or 3, characterized in that the step of laminating the film of electrically conductive, thermally activatable material ( 5 ) on the micromodul film ( 1 ) is carried out before the insulating film ( 3 , 7 ) is applied the next steps remain unchanged. 5. A method for producing a contactless chip carrier with an electronic arrangement comprising an antenna ( 11 ) which forms a spiral, at the ends of which connections ( 12 ) are provided, and with at least one electronic micromodule ( 2 ) connected to the antenna ( 11 ) is connected, characterized by the following process steps: - Applying a film of an electrically conductive, thermally activatable adhesive ( 5 ), in which openings ( 6 ) are formed in advance, which correspond to the central zone of the micromodules ( 2 ), which is located on both sides of their contact fields, on a micromodul film ( 1 ) ; - cutting the micromodules ( 2 ); - Applying an insulating drop on the central zone of each micromodule ( 2 ), which is on both sides of their contact surfaces, in order to completely cover this zone; - For each micromodule, applying the micromodule ( 2 ) to the antenna ( 11 ), the underside of the micromodule ( 2 ) carrying the insulating layer ( 3 ) and the conductive adhesive layer ( 5 ), which were laminated in advance, and in the direction facing the antenna ( 11 ) to form an electrical connection with the connections ( 12 ) of the antenna. 6. The method according to any one of the preceding claims, characterized in that the electronic micromodule ( 2 ) is arranged on the antenna ( 11 ) such that the central zone of the micromodule, which lies between its contact fields and with the insulating layer ( 3 , 7th ) is covered, comes to rest against the turns of the antenna ( 11 ). 7. The method according to any one of the preceding claims, characterized in that the electronic micromodule ( 2 ) is applied to the antenna ( 11 ) by applying pressure to the micromodule at a predetermined position, so that an electrical connection to the connections ( 12 ) the antenna ( 11 ) is formed. 8. The method according to any one of the preceding claims, characterized in that the insulating layer ( 3 , 7 ) is formed from a polyester substrate with a very small thickness, which is covered on at least one side with a thermally activatable or other adhesive. 9. The method according to any one of the preceding claims, characterized in that the film of the electrically conductive, thermally activatable adhesive ( 5 ) is formed from a thermally activatable adhesive in which metal balls are randomly distributed, which are covered with gold, whereby after an electrical line is obtained after pressing along an axis perpendicular to the film. 10. The method according to any one of the preceding claims, characterized in that it is applied to the production of a chip carrier with a mixed function, ie with and without contact, the micromodul film ( 1 ) then being replaced at the beginning of the process by a film which carries an arrangement of metallic contacts, the metallic contacts having the same surface and thickness as the electronic micromodules ( 2 ).