EP2351166B1 - Method for connecting two parts mechanically and electrically at the same time - Google Patents
Method for connecting two parts mechanically and electrically at the same time Download PDFInfo
- Publication number
- EP2351166B1 EP2351166B1 EP09778881.4A EP09778881A EP2351166B1 EP 2351166 B1 EP2351166 B1 EP 2351166B1 EP 09778881 A EP09778881 A EP 09778881A EP 2351166 B1 EP2351166 B1 EP 2351166B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- insulating material
- adhesive
- parts
- electrically
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0228—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections without preliminary removing of insulation before soldering or welding
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- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions
- the invention relates to a method according to the preamble of claim 1.
- Such a method according to the preamble of claim 1 is known from DE-A-197 23241 known.
- electrical conductors are usually provided with the exception of their contact points with an electrical insulation, which is to form a mechanical or chemical protection at the same time.
- the insulation can be made of different materials according to the respective requirement, in particular polymers are used.
- NCA adhesives non-conductive adhesive
- ACA adhesive anisotropically conductive adhesive
- the NCA adhesive is a non-conductive adhesive that permanently holds two conductive parts in direct electrical contact.
- the ACA adhesive also contains small conductive particles. These have a sufficiently large mutual distance, so that the adhesive does not conduct in the uncompressed state. On the other hand, if it is compressed, the distance between the particles decreases and conductive bridges are created. The adhesive can then be cured so that it permanently maintains these conductive bridges between the two contact surfaces. In the areas outside the contact surfaces of the adhesive is not compressed, so that it remains non-conductive and produces only a mechanical connection between the parts.
- an adhesive which is put into a tacky state between the electrical connection surfaces of the conductive parts between them and the surrounding area during connection, and subsequently converted into a non-tacky state the process of transferring the adhesive to the sticky state also results in that it is brought into a flowable state in which it is pressed out of the contact region or in the contact region by the pressing against one another can be compressed.
- this is pushed out of the contact area, and in the case of using an ACA adhesive or isotropically conductive adhesive (ICA), this is at least compressed, so that in each case an electrical connection between the conductive parts is obtained.
- the mechanical connection is only outside the contact surface, while in the case of an ACA adhesive or ICA adhesive it is also in the area of the contact surface.
- the electrical connection surface is at least one of the conductors with respect to the surrounding area, so that when the electrical connection surfaces abut each other, still leaves a sufficient insulation causing gap between the areas surrounding the electrical connection surfaces.
- the raised connection surface can be, for example, a metal contact designed as a Stud Bump.
- the displacement of the insulating material in the sticky and flowable state is preferably carried out by supplying heat. If a thermosetting adhesive is used, the transfer to the non-tacky state (hardening) takes place at elevated temperature. If a hot melt adhesive is used as the insulating material, this process is achieved by cooling.
- the electrically insulating material which is non-tacky and in a solid state prior to bonding can be easily brought into a tacky and flowable state by heating, and then easily returned to the non-tacky and solid state by cooling ,
- the heat supply can be done by increasing the temperature of the surrounding space, but also targeted by the action of infrared or light rays, ultrasound and magnetic or electric fields.
- the adhesive insulates and / or protects at least one of the conductive parts where it does not contribute to the mechanical or electrical connection of the parts. For outside the connection, it remains unchanged at least in its function and continues to fulfill the functions of an electrical insulator and / or a mechanical and / or chemical protection.
- a thermosetting adhesive it is also possible for the insulator / adhesive to cure altogether, if desirable. This curing reduces however, possibly a previously existing flexibility of one or both parts.
- the adhesive / insulator is initially not part of one of the conductors involved in the contacting. It is a separate part (e.g., a foil or paste) as in normal NCA gluing. In contrast to NCA bonding, after bonding, the adhesive also covers areas of one or both parts that do not contribute to the electrical or mechanical connection of the parts.
- the aim here is the electrical insulation and / or the mechanical and / or chemical protection of the part or parts.
- the bonding process is the same as with a coated conductor, but you will often also make the adhesive sticky everywhere (and possibly also apply pressure), where it should be connected to the conductor.
- the connection process is to be carried out so that an electrical contact arises only where it is also desired, and that the insulation of the other areas is ensured.
- the essential properties of the adhesive / insulator are thus that it is electrically isolated and / or mechanically and / or chemically protected, and that it can be changed by pressure and temperature so that it is the task of an NCA or ACA adhesive can take over for electrical contact.
- targeted specific compounds can be prepared and other compounds suppressed by using different adhesives, despite otherwise uniform large-scale treatment.
- the adhesives differ, e.g. in their reaction mode (e.g., thermosetting or thermoplastic) or in their response to physical influences (e.g., reaction by light or reaction by heat) or the parameters at which they react (e.g., different reaction temperatures).
- reaction mode e.g., thermosetting or thermoplastic
- physical influences e.g., reaction by light or reaction by heat
- the parameters at which they react e.g., different reaction temperatures
- a conductive thread with a first adhesive and a conductive thread with a second adhesive coated as an insulator For example, in a woven surface in each case in warp and weft, a conductive thread with a first adhesive and a conductive thread with a second adhesive coated as an insulator.
- the first adhesive is thermosetting at 100 ° C and the second adhesive is also thermosetting, but at 150 ° C. If the fabric is pressed between two plates and heated to 100 ° C, only the first adhesive liquefies and cures after some time, so that only the conductive threads are contacted with each other with the first adhesive. Subsequently, the temperature of the press plates is increased to 150 ° C.
- the first glue is already hardened and does not soften anymore.
- the second adhesive on the other hand, liquefies, hardens and thus only bonds the conductive threads that are coated with the second adhesive. The same can be achieved with a combination from photosensitive adhesives or adhesives that react to ultrasound.
- a tool with elevations or a special topography of the parts to be joined are not required, although of course they can still be used to increase the pressure at the contact points.
- conductive part is not limited to wires or cables, but means anything that can perform the function of electrical conduction, such as conductors on printed circuit boards, conductive tapes, cable ties, conductive threads of all kinds, textile conductive surfaces, textile surfaces with conductive structures and the like.
- Conductive filaments are filament, yarn or fiber electrical conductors, such as filaments. coated fibers or metallic fibers or yarns consisting of non-conductive and conductive fibers and / or wires.
- Textile surfaces can be fully conductive or have partially conductive structures that are completely or partially isolated. Textile surfaces can be produced, for example, from conductive textile threads by weaving, knitting or embroidering or else by conductive coatings on textile surfaces. It should be noted that nonwovens should be understood as textile surfaces, even if they are not strictly speaking referred to as textiles.
- a special application may be for display or lighting purposes.
- two completely or structured conductive textile or non-textile surfaces arranged on two sides contactable light-emitting components (eg LEDs), wherein the two surfaces and the light-emitting components with an insulating material (adhesive) are glued together.
- this adhesive holds the contacts of the light emitting device in electrical contact with each one of the two surfaces and at the same time isolated these surfaces from each other.
- the adhesive can be applied over the entire surface on one or both surfaces, but also as a separate part (eg as a film, powder, paste, spray, etc.) are brought between the surfaces.
- single-sided contactable LEDs can be arranged on only one structured conductive textile or non-textile surface.
- the adhesive may also be applied to individual textile or non-textile conductors which are located on or in the surface instead of the entire surface.
- the light emitting device has more than two terminals (e.g., RGB LEDs), thus also having multiple contacts with at least one of the two surfaces, it is preferable to use textile surfaces having patterned conductors to selectively supply the individual terminals.
- sensors of all types such as acceleration sensors, temperature sensors, thermocouples, humidity sensors, light sensors, etc.
- actuators of all kinds such as vibrators, heating elements, piezoelements, etc. electronic modules of all kinds or antennas of all kinds are contacted in the manner described.
- the electrically conductive part covered over a large area with the layer of electrically insulating material can also be a semiconductor substrate provided with conductor tracks covered by the layer of electrically insulating material, the mechanical and electrical connection between the latter and at least one flip chip and / or at least one passive component to be produced.
- the conductor tracks extend at least partially outside the coverage area of the parts to be joined.
- Fig. 1 are on the left side of a plurality of parallel, each coated with an insulating layer 1 conductors 2 existing ribbon cable 3 and provided with contact surfaces 4, flat Substrate 5 shown separately.
- the round conductors 2 have the same mutual distance as the contact surfaces 4 on the substrate. 5
- Fig. 2 shows an embedded between two layers of fabric LED 7.
- the upper fabric layer consists of a thread-like conductor 8a, which extends in the plane (eg Webschuss), and non-conductive textile threads 9, both in the plane and perpendicular to this (eg Web Chain).
- the fabric is embedded in a layer 10 of insulating material / adhesive.
- the lower fabric layer consists of a thread-shaped conductor 8b, which runs perpendicular to the plane of the drawing, and non-conductive textile threads 9b, which are embedded in a layer 10b of insulating material / adhesive.
- the mutually perpendicular course of the conductors 8a and 8b allows the selective activation of LEDs arranged between the tissue layers in matrix form.
- the layers 10a and 10b are translucent, so that a luminous LED is visible from the outside.
- each a terminal contact 11a and 11b On the upper and the lower surface of the LED 7 are each a terminal contact 11a and 11b. If the fabric layers are heated and compressed flat, the layers 10a and 10b stick together outside of the LEDs. The conductor 8a and the terminal contact 11a on the one hand and the conductor 8b and the terminal contact 11b on the other hand are pressed against each other, so that an electrical contact 12a or 12b is formed between them. Outside the contact surfaces, the LED 7 also bonds to the layers 10a and 10b. After hardening or hardening of the layers 10a and 10b, a stable matrix of LEDs is obtained, which are contacted in a desired manner with filamentary conductors so that they can be selectively activated.
- Fig. 3 (a) shows the top view of a substrate 13, for example a flex substrate or a FR4 substrate, which carries on the upper side conductor tracks 14. This side is covered over its entire area including the printed conductors 14 with a layer of electrically insulating material 1. This layer was after the formation of the tracks 14 on the substrate 13th applied to electrically isolate the substrate surface including the tracks 14 and protect against mechanical effects.
- the electrically insulating material 1 is first brought into a sticky and flowable state, for example, by heating.
- the flip chips 15 and 16 and the component 17 are then pressed with their contacts 18 bearing side in the correct position against the top of the substrate 13, so that the protruding contacts 18, the insulating material 1, if it is an NCA adhesive, push aside and come in direct contact with a track, or if it is an ACA adhesive, compress it so that it becomes electrically conductive between the contacts 18 and the tracks 14 and remains insulating in the remaining areas.
- the material 1 is brought, for example by cooling back into its previous, mechanically stable state, the substrate 13 on the one hand and the flip-chips 15 and 16 and the device 17 remain permanently mechanically connected, whereby the electrical connection 6 between the Contacts 18 and the tracks 14 remains permanently connected.
- the substrate 13 and the printed conductors 14 are over the entire surface, ie permanently outside the overlapping areas with the flip chips 15 and 16 and the component 17 by the material 1 electrically isolated and mechanically protected. Between the substrate 13 and the flip chips 15 and 16 extending portions of the tracks 14, where no contacts 18th are opposite, are also isolated and protected by the material 1.
- thermoplastic polyurethane has been found to be suitable as NCA adhesive and insulator.
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- Computer Hardware Design (AREA)
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Description
Die Erfindung betrifft ein Verfahren nach dem Oberbegriff des Anspruchs 1. Ein solches Verfahren nach dem Oberbegriff des Anspruchs 1 ist aus der
In elektronischen und elektrischen Systemen sind elektrische Leiter üblicherweise mit Ausnahme ihrer Kontaktstellen mit einer elektrischen Isolierung versehen, die gleichzeitig einen mechanischen oder chemischen Schutz bilden soll. Die Isolierungen können entsprechend der jeweiligen Anforderung aus unterschiedlichen Materialien bestehen, wobei insbesondere Polymere verwendet werden.In electronic and electrical systems electrical conductors are usually provided with the exception of their contact points with an electrical insulation, which is to form a mechanical or chemical protection at the same time. The insulation can be made of different materials according to the respective requirement, in particular polymers are used.
Die Herstellung elektrischer Kontakte zwischen zwei Leitern erfolgt häufig mit Hilfe von Klebstoffen. Dabei können sowohl NCA(non-conductive adhesive)-Klebstoffe als auch ACA(anisotropically conductive adhesive)-Klebstoffe verwendet werden. Der NCA-Klebstoff ist ein nicht leitender Klebstoff, der zwei leitende Teile dauerhaft in unmittelbarem elektrischem Kontakt hält. Zur Herstellung der Verbindung werden die Kontaktflächen der Teile zusammengepresst, bis der die Kontaktflächen umgebende Klebstoff bei erhöhter Temperatur aushärtet. Der ACA-Klebstoff enthält zusätzlich kleine leitende Partikel. Diese haben einen hinreichend großen gegenseitigen Abstand, so dass der Klebstoff im unkomprimierten Zustand nicht leitet. Wird er hingegen zusammengedrückt, verringert sich der Abstand der Partikel und es entstehen leitende Brücken. Der Klebstoff kann dann ausgehärtet werden, so dass er diese leitenden Brücken zwischen den beiden Kontaktflächen dauerhaft aufrechterhält. In den Bereichen außerhalb der Kontaktflächen wird der Klebstoff nicht verdichtet, so dass er dort nichtleitend bleibt und nur eine mechanische Verbindung zwischen den Teilen herstellt.The production of electrical contacts between two conductors is often done with the help of adhesives. Both NCA (non-conductive adhesive) adhesives and ACA (anisotropically conductive adhesive) adhesives can be used. The NCA adhesive is a non-conductive adhesive that permanently holds two conductive parts in direct electrical contact. To produce the compound, the contact surfaces of the parts are pressed together until the adhesive surrounding the contact surfaces cured at elevated temperature. The ACA adhesive also contains small conductive particles. These have a sufficiently large mutual distance, so that the adhesive does not conduct in the uncompressed state. On the other hand, if it is compressed, the distance between the particles decreases and conductive bridges are created. The adhesive can then be cured so that it permanently maintains these conductive bridges between the two contact surfaces. In the areas outside the contact surfaces of the adhesive is not compressed, so that it remains non-conductive and produces only a mechanical connection between the parts.
Die elektrische Leitung derartiger Kontakte ergibt sich durch ohmsche Leitung oder den Tunneleffekt. Sie kann auch durch eine Mischung dieser beiden Effekte zustande kommen.The electrical conduction of such contacts results from ohmic conduction or the tunneling effect. It can also come about through a mixture of these two effects.
Die elektrische Kontaktierung zweier leitender Teile, von denen mindestens eines elektrisch isoliert ist, weist jedoch den Nachteil auf, dass entweder die Isolation vorher an der Kontaktstelle entfernt werden muss oder die Isolation an der Kontaktstelle selbst erst gar nicht aufgebracht sein darf. Dieser Verfahrensschritt, der jeweils vor der eigentlichen Kontaktierung durchgeführt werden muss, ist mit zusätzlichem Arbeitsaufwand verbunden und kann sogar zur Folge haben, dass bestimmte Verbindungen nicht in gewünschter Weise hergestellt werden können.The electrical contacting of two conductive parts, of which at least one is electrically isolated, however, has the disadvantage that either the insulation must first be removed at the contact point or the insulation must not even be applied to the contact point itself. This process step, which must be carried out before the actual contacting, is associated with additional work and can even have the consequence that certain compounds can not be produced in the desired manner.
Es ist daher die Aufgabe der vorliegenden Erfindung, ein Verfahren zum gleichzeitigen mechanischen und elektrischen Verbinden von zwei einander nur teilweise überdeckenden, mit elektrisch leitenden Strukturen versehenen Teilen, von denen mindestens eines zur elektrischen Isolierung und/oder zum mechanischen und/oder chemischen Schutz über den Überdeckungsbereich hinaus großflächig unter Einschluss der Verbindungsfläche mit einer Schicht aus elektrisch isolierendem Material bedeckt ist, wobei die leitenden Teile im Bereich ihrer Verbindungsflächen gegeneinander gepresst werden, anzugeben, bei dem dieser zusätzliche Schritt des lokalen Entfernens der Isolation bzw. des selektiven Aufbringens der Isolation nicht erforderlich ist, so dass das Verfahren erheblich vereinfacht werden kann.It is therefore an object of the present invention to provide a method for the simultaneous mechanical and electrical connection of two only partially overlapping, provided with electrically conductive structures parts, of which at least one for electrical insulation and / or mechanical and / or chemical protection over the Cover area is covered over a large area, including the connection surface with a layer of electrically insulating material, wherein the conductive parts are pressed against each other in the region of their connection surfaces to specify, in which this additional step of locally removing the insulation or the selective application of the insulation is not required so that the process can be greatly simplified.
Diese Aufgabe wird erfindungsgemäß durch ein Verfahren mit den Merkmalen des Anspruchs 1 gelöst. Vorteilhafte Weiterbildungen dieses Verfahrens ergeben sich aus den Unteransprüchen.This object is achieved by a method having the features of
Dadurch, dass als elektrisch isolierendes Material ein Klebstoff verwendet wird, der während des Verbindens unter Ausbildung eines elektrischen Kontakts zwischen den elektrischen Verbindungsflächen der leitenden Teile zwischen diesen und im diese umgebenden Bereich in einen klebrigen Zustand versetzt und anschließend in einen nichtklebrigen Zustand übergeführt wird, hat der Vorgang des Versetzens des Klebstoffs in den klebrigen Zustand auch zur Folge, dass er in einen fließfähigen Zustand gebracht wird, in welchem er durch das Gegeneinanderpressen aus dem Kontaktbereich herausgedrückt oder im Kontaktbereich zusammengedrückt werden kann. Im Fall einer Verwendung eines NCA-Klebstoffs wird dieser aus dem Kontaktbereich herausgedrückt, und im Falle der Verwendung eines ACA-Klebstoffs oder ICA-Klebstoffs (isotropically conductive adhesive) wird dieser zumindest zusammengedrückt, so dass in jedem Falle eine elektrische Verbindung zwischen den leitenden Teilen erhalten wird. Bei einem NCA-Klebstoff besteht die mechanische Verbindung nur außerhalb der Kontaktfläche, während sie bei einem ACA-Klebstoff oder ICA-Klebstoff auch im Bereich der Kontaktfläche vorliegt.By using, as the electrically insulating material, an adhesive which is put into a tacky state between the electrical connection surfaces of the conductive parts between them and the surrounding area during connection, and subsequently converted into a non-tacky state the process of transferring the adhesive to the sticky state also results in that it is brought into a flowable state in which it is pressed out of the contact region or in the contact region by the pressing against one another can be compressed. In the case of using an NCA adhesive, this is pushed out of the contact area, and in the case of using an ACA adhesive or isotropically conductive adhesive (ICA), this is at least compressed, so that in each case an electrical connection between the conductive parts is obtained. In the case of an NCA adhesive, the mechanical connection is only outside the contact surface, while in the case of an ACA adhesive or ICA adhesive it is also in the area of the contact surface.
Da außerhalb der elektrischen Verbindungs- bzw. Kontaktfläche das Gegeneinanderpressen der leitenden Teile nicht dazu führen darf, dass das elektrisch isolierende Material in erheblichem Maße zur Seite gedrückt oder leitend wird, ist die elektrische Verbindungsfläche zumindest eines der Leiter gegenüber dem diese umgebenden Bereich erhaben, so dass, wenn die elektrischen Verbindungsflächen aneinander anliegen, noch ein eine ausreichende Isolierung bewirkender Spalt zwischen den die elektrischen Verbindungsflächen umgebenden Bereichen verbleibt. Die erhabene Verbindungsfläche kann beispielsweise ein als Stud Bump ausgebildeter Metallkontakt sein.Since pressing the conductive parts against each other outside of the electrical connection or contact surface must not cause the electrically insulating material to be pushed to a considerable extent sideways or conductive, the electrical connection surface is at least one of the conductors with respect to the surrounding area, so that when the electrical connection surfaces abut each other, still leaves a sufficient insulation causing gap between the areas surrounding the electrical connection surfaces. The raised connection surface can be, for example, a metal contact designed as a Stud Bump.
Das Versetzen des isolierenden Materials in den klebrigen sowie fließfähigen Zustand erfolgt vorzugsweise durch Wärmezufuhr. Wird ein wärmehärtender Klebstoff verwendet, so findet auch die Überführung in den nichtklebrigen Zustand (Aushärtung) bei erhöhter Temperatur statt. Wird ein Schmelzkleber als isolierendes Material eingesetzt, wird dieser Vorgang durch Abkühlung erreicht.The displacement of the insulating material in the sticky and flowable state is preferably carried out by supplying heat. If a thermosetting adhesive is used, the transfer to the non-tacky state (hardening) takes place at elevated temperature. If a hot melt adhesive is used as the insulating material, this process is achieved by cooling.
Insbesondere in diesem Fall kann das elektrisch isolierende Material, das vor dem Verbinden nichtklebrig und in einem festen Zustand ist, auf einfache Weise durch Erwärmen in einen klebrigen und fließfähigen Zustand gebracht und anschließend auf einfache Weise durch Abkühlen wieder in den nichtklebrigen und festen Zustand zurückgeführt werden.In particular, in this case, the electrically insulating material which is non-tacky and in a solid state prior to bonding can be easily brought into a tacky and flowable state by heating, and then easily returned to the non-tacky and solid state by cooling ,
Die Wärmezufuhr kann durch Temperaturerhöhung des umgebenden Raums, aber auch gezielt durch Einwirkung von Infrarot- oder Lichtstrahlen, Ultraschall sowie magnetische oder elektrische Felder erfolgen.The heat supply can be done by increasing the temperature of the surrounding space, but also targeted by the action of infrared or light rays, ultrasound and magnetic or electric fields.
Es ist jedoch auch möglich, die Klebrigkeit und Fließfähigkeit auf chemischem Wege herbeizuführen. So kann dem isolierenden Material ein flüchtiges Lösungsmittel hinzugefügt werden, das diesen Zustand bewirkt. Nachdem der elektrische Kontakt durch Druckaufbringung hergestellt ist, verdampft das Lösungsmittel unter Aufrechterhaltung des Drucks, bis das isolierende Material sich wieder verfestigt hat.However, it is also possible to cause the stickiness and flowability by chemical means. Thus, a volatile solvent can be added to the insulating material, causing this state. After the electrical contact is made by pressure application, the solvent evaporates while maintaining the pressure until the insulating material has re-solidified.
Im Gegensatz zum bekannten NCA- oder ACA-Kleben isoliert und/oder schützt der Klebstoff mindestens eines der leitenden Teile dort, wo er nicht zur mechanischen oder elektrischen Verbindung der Teile beiträgt. Denn außerhalb der Verbindung bleibt er zumindest in seiner Funktion unverändert und erfüllt weiterhin die Funktionen eines elektrischen Isolators und/oder eines mechanischen und/oder chemischen Schutzes. Bei einem thermisch aushärtenden Klebstoff ist es jedoch auch möglich, dass der Isolator/Klebstoff insgesamt ausgehärtet wird, falls dies wünschenswert ist. Diese Aushärtung reduziert jedoch möglicherweise eine zuvor vorhandene Flexibilität eines oder beider Teile.In contrast to the known NCA or ACA bonding, the adhesive insulates and / or protects at least one of the conductive parts where it does not contribute to the mechanical or electrical connection of the parts. For outside the connection, it remains unchanged at least in its function and continues to fulfill the functions of an electrical insulator and / or a mechanical and / or chemical protection. However, with a thermosetting adhesive, it is also possible for the insulator / adhesive to cure altogether, if desirable. This curing reduces however, possibly a previously existing flexibility of one or both parts.
In einer Variante ist der Klebstoff/Isolator zunächst nicht Bestandteil eines der an der Kontaktierung beteiligten Leiter. Er ist, wie beim normalen NCA-Kleben ein separates Teil (z.B. eine Folie oder eine Paste). Im Unterschied zum NCA-Kleben bedeckt der Klebstoff nach dem Verbinden auch Bereiche eines oder beider Teile, die nicht zur elektrischen oder mechanischen Verbindung der Teile beitragen. Ziel ist hier die elektrische Isolation und/oder der mechanische und/oder der chemische Schutz des Teils oder der Teile. Der Verbindungsvorgang erfolgt wie bei einem beschichteten Leiter, jedoch wird man häufig zusätzlich den Klebstoff auch überall dort klebrig machen (und möglicherweise auch mit Andruckkraft belegen), wo dieser mit dem Leiter verbunden werden soll. Der Verbindungsvorgang ist dabei so durchzuführen, dass ein elektrischer Kontakt nur dort entsteht, wo er auch erwünscht ist, und dass die Isolation der anderen Bereiche sichergestellt wird. Dies kann z.B. mit einem Presswerkzeug umgesetzt werden, das an der Stelle, wo der Kontakt entstehen soll, erhaben ist und so an dieser Stelle einen höheren Druck aufbringt. In anderen Fällen wird allein durch die Topografie der zu verbindenden Teile (z.B. durch eine erhabene Kontaktfläche) sichergestellt werden können, dass nur die Kontaktstellen der Teile elektrisch verbunden werden.In one variant, the adhesive / insulator is initially not part of one of the conductors involved in the contacting. It is a separate part (e.g., a foil or paste) as in normal NCA gluing. In contrast to NCA bonding, after bonding, the adhesive also covers areas of one or both parts that do not contribute to the electrical or mechanical connection of the parts. The aim here is the electrical insulation and / or the mechanical and / or chemical protection of the part or parts. The bonding process is the same as with a coated conductor, but you will often also make the adhesive sticky everywhere (and possibly also apply pressure), where it should be connected to the conductor. The connection process is to be carried out so that an electrical contact arises only where it is also desired, and that the insulation of the other areas is ensured. This can e.g. be implemented with a pressing tool, which is at the point where the contact is to be raised, and so at this point applies a higher pressure. In other cases, only the topography of the parts to be joined (e.g., by a raised contact surface) will ensure that only the contact points of the parts are electrically connected.
Die wesentlichen Eigenschaften des Klebstoffs/Isolators sind somit, dass er elektrisch isoliert und/oder mechanisch und/oder chemisch schützt, und dass er durch Druck und Temperatur so verändert werden kann, dass er die Aufgabe eines NCA- oder ACA-Klebstoffs zur elektrischen Kontaktierung übernehmen kann.The essential properties of the adhesive / insulator are thus that it is electrically isolated and / or mechanically and / or chemically protected, and that it can be changed by pressure and temperature so that it is the task of an NCA or ACA adhesive can take over for electrical contact.
In einer weiteren Variante können durch Verwendung von verschiedenen Klebstoffen gezielte bestimmte Verbindungen hergestellt und andere Verbindungen unterdrückt werden, trotz ansonsten einheitlicher großflächiger Behandlungsart. Dabei unterscheiden sich die Klebstoffe z.B. in ihrer Reaktionsart (z.B. wärmehärtend oder thermoplastisch) oder in ihrer Reaktion auf physikalische Einflüsse (z.B. Reaktion durch Licht oder Reaktion durch Wärme) oder hinsichtlich der Parameter, bei denen sie reagieren (z.B. verschiedene Reaktionstemperaturen). So können durch die Wahl der Reihenfolge der physikalischen Einflüsse oder der Parameter selektiv bestimmte Verbindungen aufeinander folgend erzeugt werden.In a further variant, targeted specific compounds can be prepared and other compounds suppressed by using different adhesives, despite otherwise uniform large-scale treatment. The adhesives differ, e.g. in their reaction mode (e.g., thermosetting or thermoplastic) or in their response to physical influences (e.g., reaction by light or reaction by heat) or the parameters at which they react (e.g., different reaction temperatures). Thus, by choosing the order of the physical influences or the parameters, certain compounds can be selectively generated sequentially.
Beispielsweise sind in einer gewebten Fläche jeweils in Kette und Schuss ein leitender Faden mit einem ersten Klebstoff und ein leitender Faden mit einem zweiten Klebstoff als Isolator beschichtet. Der erste Klebstoff ist wärmehärtend bei 100°C und der zweite Klebstoff ist ebenfalls wärmehärtend, jedoch bei 150°C. Wird das Gewebe zwischen zwei Platten gepresst und auf 100°C erhitzt, verflüssigt sich nur der erste Klebstoff und härtet nach einiger Zeit aus, so dass nur die leitenden Fäden mit dem ersten Klebstoff miteinander kontaktiert werden. Anschließend wird die Temperatur der Pressplatten auf 150°C erhöht. Der erste Klebstoff ist bereits ausgehärtet und erweicht nicht mehr. Der zweite Klebstoff hingegen verflüssigt sich, härtet aus und verbindet so nur die leitenden Fäden, die mit dem zweiten Klebstoff beschichtet sind. Ähnliches ist erzielbar mit einer Kombination aus lichtempfindlichen Klebstoffen oder Klebstoffen, die auf Ultraschall reagieren.For example, in a woven surface in each case in warp and weft, a conductive thread with a first adhesive and a conductive thread with a second adhesive coated as an insulator. The first adhesive is thermosetting at 100 ° C and the second adhesive is also thermosetting, but at 150 ° C. If the fabric is pressed between two plates and heated to 100 ° C, only the first adhesive liquefies and cures after some time, so that only the conductive threads are contacted with each other with the first adhesive. Subsequently, the temperature of the press plates is increased to 150 ° C. The first glue is already hardened and does not soften anymore. The second adhesive, on the other hand, liquefies, hardens and thus only bonds the conductive threads that are coated with the second adhesive. The same can be achieved with a combination from photosensitive adhesives or adhesives that react to ultrasound.
Bei dieser Variante sind ein Werkzeug mit Erhebungen oder eine spezielle Topografie der zu verbindenden Teile nicht erforderlich, obwohl diese natürlich dennoch eingesetzt werden können, um den Druck an den Kontaktstellen zu erhöhen.In this variant, a tool with elevations or a special topography of the parts to be joined are not required, although of course they can still be used to increase the pressure at the contact points.
Der Begriff "leitendes Teil" ist nicht auf Drähte oder Kabel beschränkt, sondern gemeint ist alles, was die Funktion des elektrischen Leitens übernehmen kann, wie beispielsweise Leiter auf Leiterplatten, leitfähige Bänder, Kabelbänder, leitfähige Fäden aller Art, textile leitfähige Flächen, textile Flächen mit leitfähigen Strukturen und dergleichen.The term "conductive part" is not limited to wires or cables, but means anything that can perform the function of electrical conduction, such as conductors on printed circuit boards, conductive tapes, cable ties, conductive threads of all kinds, textile conductive surfaces, textile surfaces with conductive structures and the like.
Leitfähige Fäden sind elektrische Leiter mit Faden-, Garn- oder Fasercharakter, wie z.B. beschichtete Fasern oder metallische Fasern oder Garne bestehend aus nichtleitfähigen und leitfähigen Fasern und/oder Drähten.Conductive filaments are filament, yarn or fiber electrical conductors, such as filaments. coated fibers or metallic fibers or yarns consisting of non-conductive and conductive fibers and / or wires.
Textile Flächen können vollständig leitend sein oder teilweise leitende Strukturen aufweisen, die vollständig oder teilweise isoliert sind. Textile Flächen können beispielsweise aus leitenden textilen Fäden durch Weben, Stricken oder Besticken oder auch durch leitfähige Beschichtungen auf textilen Flächen hergestellt sein. Es sei erwähnt, dass auch Vliese als textile Flächen verstanden werden sollen, auch wenn diese streng genommen nicht als Textilien bezeichnet werden.Textile surfaces can be fully conductive or have partially conductive structures that are completely or partially isolated. Textile surfaces can be produced, for example, from conductive textile threads by weaving, knitting or embroidering or else by conductive coatings on textile surfaces. It should be noted that nonwovens should be understood as textile surfaces, even if they are not strictly speaking referred to as textiles.
Eine spezielle Anwendung kann für Anzeige- oder Beleuchtungszwecke erfolgen. Hierbei sind zwischen zwei vollständig oder strukturiert leitfähigen textilen oder nicht textilen Flächen zweiseitig kontaktierbare lichtemittierende Bauelemente (z.B. LEDs) angeordnet, wobei die beiden Flächen und die lichtemittierenden Bauelemente mit einem isolierenden Material (Klebstoff) zusammenklebt werden. Dabei hält dieser Klebstoff die Kontakte des lichtemittierenden Bauelements in elektrischem Kontakt mit jeweils einer der beiden Flächen und isoliert gleichzeitig diese Flächen voneinander. Der Klebstoff kann dabei vollflächig auf eine oder auf beide Flächen aufgebracht sein, aber auch als separates Teil (z.B. als Film, Pulver, Paste, Spray usw.) zwischen die Flächen gebracht werden.A special application may be for display or lighting purposes. Here are between two completely or structured conductive textile or non-textile surfaces arranged on two sides contactable light-emitting components (eg LEDs), wherein the two surfaces and the light-emitting components with an insulating material (adhesive) are glued together. In this case, this adhesive holds the contacts of the light emitting device in electrical contact with each one of the two surfaces and at the same time isolated these surfaces from each other. The adhesive can be applied over the entire surface on one or both surfaces, but also as a separate part (eg as a film, powder, paste, spray, etc.) are brought between the surfaces.
Jedoch können auch einseitig kontaktierbare LEDs auf nur einer strukturiert leitfähigen textilen oder nicht textilen Fläche angeordnet werden.However, single-sided contactable LEDs can be arranged on only one structured conductive textile or non-textile surface.
Der Klebstoff kann aber auch anstatt auf die gesamte Fläche auf einzelne textile oder nichttextile Leiter aufgebracht sein, die sich auf oder in der Fläche befinden.However, the adhesive may also be applied to individual textile or non-textile conductors which are located on or in the surface instead of the entire surface.
Hat das lichtemittierende Bauelement mehr als zwei Anschlüsse (z.B. RGB-LEDs), die somit auch mehrere Kontakte mit mindestens einer der beiden Flächen aufweisen, werden vorzugsweise textile Flächen verwendet, die strukturierte Leiter aufweisen, um die einzelnen Anschlüsse selektiv zu versorgen.If the light emitting device has more than two terminals (e.g., RGB LEDs), thus also having multiple contacts with at least one of the two surfaces, it is preferable to use textile surfaces having patterned conductors to selectively supply the individual terminals.
Anstelle der lichtemittierenden Bauelemente können auch Sensoren aller Art wie Beschleunigungssensoren, Temperatursensoren, Thermoelemente, Feuchtesensoren, Lichtsensoren usw., Aktuatoren aller Art wie Vibratoren, Heizelemente, Piezoelemente usw., elektronische Module aller Art oder Antennen aller Art in der beschriebenen Weise kontaktiert werden.Instead of the light-emitting components, it is also possible to use sensors of all types, such as acceleration sensors, temperature sensors, thermocouples, humidity sensors, light sensors, etc., actuators of all kinds, such as vibrators, heating elements, piezoelements, etc. electronic modules of all kinds or antennas of all kinds are contacted in the manner described.
Das großflächig mit der Schicht aus elektrisch isolierendem Material bedeckte, elektrisch leitende Teil kann auch ein mit von der Schicht aus elektrisch isolierendem Material bedeckten Leiterbahnen versehenes Halbleitersubstrat sein, wobei die mechanische und elektrische Verbindung zwischen diesem und mindestens einem Flip-Chip und/oder mindestens einem passiven Bauteil hergestellt werden soll. Dabei verlaufen die Leiterbahnen zumindest teilweise außerhalb des Überdeckungsbereichs der zu verbindenden Teile.The electrically conductive part covered over a large area with the layer of electrically insulating material can also be a semiconductor substrate provided with conductor tracks covered by the layer of electrically insulating material, the mechanical and electrical connection between the latter and at least one flip chip and / or at least one passive component to be produced. In this case, the conductor tracks extend at least partially outside the coverage area of the parts to be joined.
Die Erfindung wird im Folgenden anhand von in den Figuren dargestellten Ausführungsbeispielen näher erläutert. Es zeigen:
- Fig. 1
- ein Flachbandkabel bzw. Leiterband und ein flaches Substrat mit Kontaktflächen einerseits vor und andererseits nach ihrer gegenseitigen Verbindung,
- Fig. 2
- eine zwischen zwei textilen Flächen eingebettete Leuchtdiode (LED), und
- Fig. 3
- die Draufsicht auf ein mit Leiterbahnen versehenes Substrat und einen senkrechten Querschnitt durch dieses entlang der Linie A-A.
- Fig. 1
- a ribbon cable or conductor strip and a flat substrate with contact surfaces on the one hand before and on the other hand after their mutual connection,
- Fig. 2
- an embedded between two textile surfaces light emitting diode (LED), and
- Fig. 3
- the top view of a substrate provided with tracks and a vertical cross section therethrough along the line AA.
In
Um die auf der rechten Seite von
Auf der oberen und der unteren Fläche der LED 7 befindet sich jeweils ein Anschlusskontakt 11a bzw. 11b. Werden die Gewebeschichten flächig erwärmt und zusammengedrückt, verkleben die Schichten 10a und 10b außerhalb der LEDs miteinander. Der Leiter 8a und der Anschlusskontakt 11a einerseits und der Leiter 8b und der Anschlusskontakt 11b andererseits werden gegeneinander gedrückt, so dass sich ein elektrischer Kontakt 12a bzw. 12b zwischen ihnen ausbildet. Außerhalb der Kontaktflächen verklebt auch die LED 7 mit den Schichten 10a und 10b. Nach dem Aushärten bzw. Erstarren der Schichten 10a und 10b erhält man eine stabile Matrix aus LEDs, die in gewünschter Weise mit fadenförmigen Leitern so kontaktiert sind, dass sie selektiv angesteuert werden können.On the upper and the lower surface of the
Um das Substrat 13 mit Flip-Chips 15 und 16 sowie einem passiven Bauteil 17 mechanisch und elektrisch zu verbinden, wird das elektrisch isolierende Material 1 zunächst beispielsweise durch Erwärmen in einem klebrigen und fließfähigen Zustand gebracht. Die Flip-Chips 15 und 16 sowie das Bauteil 17 werden dann mit ihrer Kontakte 18 tragenden Seite lagerichtig gegen die Oberseite des Substrats 13 gedrückt, so dass die vorstehenden Kontakte 18 das isolierende Material 1, wenn es ein NCA-Klebstoff ist, beiseite drängen und in unmittelbaren Kontakt mit einer Leiterbahn gelangen, oder, wenn es ein ACA-Klebstoff ist, so zusammendrücken, dass es zwischen den Kontakten 18 und den Leiterbahnen 14 elektrisch leitend wird und in den übrigen Bereichen isolierend bleibt.To mechanically and electrically connect the
In diesem Zustand wird das Material 1 beispielsweise durch Abkühlen wieder in seinen vorherigen, mechanisch stabilen Zustand gebracht, wobei das Substrat 13 einerseits und die Flip-Chips 15 und 16 sowie das Bauelement 17 mechanisch dauerhaft verbunden bleiben, wodurch auch die elektrische Verbindung 6 zwischen den Kontakten 18 und den Leiterbahnen 14 dauerhaft verbunden bleibt. Das Substrat 13 und die Leiterbahnen 14 sind vollflächig, d.h. auch außerhalb der Überdeckungsbereiche mit den Flip-Chips 15 und 16 sowie dem Bauelement 17 durch das Material 1 dauerhaft elektrisch isoliert und mechanisch geschützt. Zwischen dem Substrat 13 und den Flip-Chips 15 bzw. 16 verlaufende Bereiche der Leiterbahnen 14, denen keine Kontakte 18 gegenüberliegen, sind ebenfalls durch das Material 1 isoliert und geschützt.In this state, the
Neben dem in dieser Erfindung ganz allgemein definierten Isolator/Klebstoff Material hat sich im Speziellen thermoplastisches Polyurethan als NCA Kleber und Isolator als geeignet herausgestellt.In addition to the insulator / adhesive material generally defined in this invention, in particular, thermoplastic polyurethane has been found to be suitable as NCA adhesive and insulator.
Claims (15)
- Method for the simultaneous mechanical and electrical connection of two parts (2, 4; 8, 11; 13, 15, 16, 17), which cover each other only partially and are provided with electrically conducting structures, at least one of which parts, for electrical insulation and/or for mechanical and/or chemical protection, is covered beyond the overlapping region over a large area including the connection surface with a layer made of electrically insulating material (1; 10), the conducting parts (2, 4; 8, 11; 13, 15, 16, 17) being pressed together in the region of their connection surfaces,
characterised in that
an adhesive is used as electrically insulating material (1; 10) which is changed into a tacky and flowable state during the connection, whilst forming an electrical contact (6; 12) between the electrical connection surfaces of the electrically conducting parts (2, 4; 8, 11; 13, 15, 16, 17), between these and in the region surrounding these, and subsequently is converted into a permanently adhesive state in order to maintain the electrical contact of the connection. - Method according to claim 1, characterised in that the layer made of electrically insulating material (1; 10) is in a mechanically stable state before the connection and is converted into a tacky and flowable state for the connection.
- Method according to claim 1 or 2, characterised in that changing the insulating material (1; 10) into the tacky and flowable state is effected by supplying energy to the insulating material (1; 10) or by chemical treatment, and / or that converting the insulating material (1; 10) from the tacky and flowable state into the permanently adhesive state is effected by cooling or by evaporating of a volatile solvent added to the insulating material (1; 10).
- Method according to one of the claims 1 to 3, characterised in that the insulating material (1; 10) is a hot-melt adhesive or a heat-hardening adhesive.
- Method according to claim 4, characterised in that the insulating material (1; 10) consists of polyurethane.
- Method according to one of the claims 1 to 5, characterised in that the insulating material (1; 10) is applied as separate part and / or as film or paste on at least one of the electrically conducting parts (2; 8).
- Method according to one of the claims 1 to 6, characterised in that the insulating material (1; 10) is compressed in the tacky and flowable state by the pressing-together of the electrical connection surfaces of the two parts (2, 4; 8, 11) as an adhesive which is mixed with conductive particles or is pressed out of the electrical connection surface as a non-conducting adhesive, and then the insulating material (1; 10) is converted into the permanently adhesive state.
- Method according to one of the claims 1 to 5, characterised in that the electrical connection surface at least of one of the conductors (2, 4; 8, 11) is raised relative to the region surrounding it, and / or is a metal contact configured as a stud bump.
- Method according to one of the claims 1 to 8, characterised in that different adhesives (1; 10) are used for different connections to be produced selectively between at least two parts.
- Method according to one of the claims 1 to 9, characterised in that at least one of the conducting parts is a cable or cable strip (3) insulated with the adhesive, a conductive thread (8), wire or flex insulated with the adhesive, or a thread (8), wire or flex which is disposed on a textile layer or nonwoven layer or embedded in this.
- Method according to claim 10, characterised in that the thread (8) is formed from electrically conducting fibres or from a yarn consisting of electrically conducting and non-conducting fibres.
- Method according to one of the claims 1 to 11, characterised in that one of the conducting parts is a terminal contact (11) of a lightemitting component (7) which is provided on at least one side over the entire surface or partially with a conductive layer, a terminal contact of a sensor or actuator, or a terminal contact of an antenna arrangement.
- Method according to one of the claims 1 to 9, characterised in that the electrically conducting part which is covered over a large area with the layer made of electrically insulating material (1) is a substrate (13) which is provided with strip conductors (14) covered by the layer made of electrically insulating material (1), and that the mechanical and electrical connection is produced between the substrate (13) and at least one flip-chip (15, 16) to be applied on this and / or at least one passive component (17) to be applied on this, wherein the strip conductors (14) extend at least partially outside the overlapping region between the substrate (13) and the flip-chips (15, 16) or passive components (17).
- Method according to one of the claims 1 to 9, characterised in that the electrically conducting parts are intersecting conductors.
- Connection between two electrically conducting parts which cover each other only partially and at least the one of which, for electrical insulation and/or for mechanical and/or chemical protection, is covered beyond the overlapping region over a large area with a layer made of electrically insulating material, characterised in that the insulating material is an adhesive which holds the electrically conducting parts together mechanically in the overlapping region.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008050000A DE102008050000A1 (en) | 2008-09-30 | 2008-09-30 | Method for the simultaneous mechanical and electrical connection of two parts |
PCT/EP2009/007273 WO2010037565A1 (en) | 2008-09-30 | 2009-09-30 | Method for connecting two parts mechanically and electrically at the same time |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2351166A1 EP2351166A1 (en) | 2011-08-03 |
EP2351166B1 true EP2351166B1 (en) | 2014-04-16 |
Family
ID=41416102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP09778881.4A Active EP2351166B1 (en) | 2008-09-30 | 2009-09-30 | Method for connecting two parts mechanically and electrically at the same time |
Country Status (6)
Country | Link |
---|---|
US (1) | US20110217877A1 (en) |
EP (1) | EP2351166B1 (en) |
KR (1) | KR101670733B1 (en) |
DE (1) | DE102008050000A1 (en) |
ES (1) | ES2478250T3 (en) |
WO (1) | WO2010037565A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012013473B4 (en) * | 2012-07-09 | 2018-02-22 | Fresenius Medical Care Deutschland Gmbh | Device for detecting moisture for a device for monitoring access to a patient |
DE102012013474A1 (en) * | 2012-07-09 | 2014-01-09 | Fresenius Medical Care Deutschland Gmbh | Device for detecting moisture for a device for monitoring access to a patient |
DE102014104230A1 (en) * | 2014-03-26 | 2015-10-01 | Osram Opto Semiconductors Gmbh | Radiation-emitting component and method for producing a radiation-emitting component |
CN108235793B (en) | 2015-01-27 | 2020-01-07 | 荷兰应用自然科学研究组织Tno | Flexible equipment module for fabric layer assembly and production method |
DE102015007157A1 (en) | 2015-06-03 | 2016-12-08 | imbut GmbH | Flat electrical contacting and method for its production |
CN211126230U (en) * | 2020-01-21 | 2020-07-28 | 东莞讯滔电子有限公司 | Electrical connector |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4642421A (en) * | 1984-10-04 | 1987-02-10 | Amp Incorporated | Adhesive electrical interconnecting means |
US4588456A (en) * | 1984-10-04 | 1986-05-13 | Amp Incorporated | Method of making adhesive electrical interconnecting means |
US4729809A (en) * | 1985-03-14 | 1988-03-08 | Amp Incorporated | Anisotropically conductive adhesive composition |
US4659872A (en) * | 1985-04-30 | 1987-04-21 | Amp Incorporated | Flexible flat multiconductor cable |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
US5584122A (en) * | 1994-04-01 | 1996-12-17 | Yazaki Corporation | Waterproof connection method for covered wire with resin encapsulation |
DE19618104A1 (en) * | 1996-05-06 | 1997-11-13 | Siemens Ag | Method for producing an electrically conductive connection between a coated copper wire and an electrical conductor |
JP3131383B2 (en) * | 1996-05-23 | 2001-01-31 | 矢崎総業株式会社 | Insulated wire joint structure |
JP3231242B2 (en) * | 1996-06-04 | 2001-11-19 | 矢崎総業株式会社 | Insulated wire joint structure |
JP3311604B2 (en) * | 1996-06-04 | 2002-08-05 | 矢崎総業株式会社 | Insulated wire joint structure |
JP3522974B2 (en) * | 1996-06-04 | 2004-04-26 | 矢崎総業株式会社 | Insulated wire joint structure |
EP0834956B1 (en) * | 1996-10-01 | 2001-12-19 | Yazaki Corporation | Covered wire connection method and structure |
US6093894A (en) * | 1997-05-06 | 2000-07-25 | International Business Machines Corporation | Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer |
DE19719455C2 (en) * | 1997-05-07 | 1999-03-18 | Siemens Ag | Sensor circuit, especially for motor vehicles |
DE19847088A1 (en) * | 1998-10-13 | 2000-05-18 | Ksw Microtec Ges Fuer Angewand | Flat carrier for semiconductor chips and method for its production |
EP1061606A3 (en) * | 1999-06-16 | 2004-05-19 | Sumitomo Wiring Systems, Ltd. | Structure and method for connecting a flat cable to bus bars |
JP3683746B2 (en) * | 1999-06-23 | 2005-08-17 | 矢崎総業株式会社 | Covered wire bonding method, resin chip with recess |
FR2807168B1 (en) * | 2000-03-29 | 2002-11-29 | Commissariat Energie Atomique | METHOD AND DEVICE FOR THE PASSIVE ALIGNMENT OF OPTICAL FIBERS AND OPTOELECTRONIC COMPONENTS |
JP3901426B2 (en) * | 2000-05-01 | 2007-04-04 | 矢崎総業株式会社 | Covered wire connection structure |
US6528731B2 (en) * | 2000-11-24 | 2003-03-04 | Yazaki Corporation | Flat shield harness and method for manufacturing the same |
JP4907763B2 (en) | 2000-11-24 | 2012-04-04 | 矢崎総業株式会社 | Flat shield harness and method for manufacturing flat shield harness |
DE10161527A1 (en) * | 2001-12-14 | 2003-07-03 | Infineon Technologies Ag | Construction and connection technology in textile structures |
DE10222555A1 (en) * | 2002-05-17 | 2003-12-04 | Hirschmann Electronics Gmbh | Contacting cables |
KR100746330B1 (en) * | 2005-11-24 | 2007-08-03 | 한국과학기술원 | Method for bonding between electrical devices using ultrasonication |
-
2008
- 2008-09-30 DE DE102008050000A patent/DE102008050000A1/en not_active Ceased
-
2009
- 2009-09-30 ES ES09778881.4T patent/ES2478250T3/en active Active
- 2009-09-30 WO PCT/EP2009/007273 patent/WO2010037565A1/en active Application Filing
- 2009-09-30 US US13/121,909 patent/US20110217877A1/en not_active Abandoned
- 2009-09-30 EP EP09778881.4A patent/EP2351166B1/en active Active
- 2009-09-30 KR KR1020117007405A patent/KR101670733B1/en active IP Right Grant
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ES2478250T3 (en) | 2014-07-21 |
KR20110082514A (en) | 2011-07-19 |
EP2351166A1 (en) | 2011-08-03 |
WO2010037565A1 (en) | 2010-04-08 |
US20110217877A1 (en) | 2011-09-08 |
DE102008050000A1 (en) | 2010-04-01 |
KR101670733B1 (en) | 2016-11-01 |
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