CN1365084A - 一种制造双接口ic卡的方法以及用这种方法制造的ic卡 - Google Patents
一种制造双接口ic卡的方法以及用这种方法制造的ic卡 Download PDFInfo
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Abstract
本发明涉及一种制造嵌有至少一个集成电路(IC)和一个天线线圈的卡的方法,这种方法包括如下步骤:(a)在芯板上嵌入天线线圈;(b)将上述芯板和多个外板层压成一个层压板;(c)在上述层压板中形成第一凹槽以容纳上述部分天线线圈;(d)从上述芯板中拉出上述天线线圈的两端;(e)通过例如采用焊接或热压粘合的方法将上述集成电路和上述天线线圈固定在一起。
Description
技术领域
本发明涉及一种制造嵌有至少一块集成电路的磁卡,即通常所说的“IC卡”或“智能卡”的方法。更确切地说,本发明涉及一种制造嵌有天线线圈的IC卡的方法,以及用这种方法制造出的IC卡。
背景技术
卡一直以来被用作数据载体。普通的卡可以直观地传递数据,例如,在卡的一面或者两面上印刷或写入信息或者类似的数据。卡也可以磁卡的形式来作为磁性数据的载体。在磁卡中,磁条被压制在卡的一个特殊位置上。磁条携带的数据可通过磁性数据阅读器读取。磁卡可被用作车票,银行卡等等。然而,这种磁卡存在的缺点是,通过磁条携带或存储的数据量很少。另外,这种磁卡可被重写的次数相对很少,且很容易被损坏。磁卡很容易受环境中磁场的影响,甚至因此丢失所存储的数据。
作为对上述常规的数据携带卡改进,有人提出了“智能卡”或“IC”卡,这种卡嵌入了一块集成电路(IC)来存储数据。按照现有技术,一块IC可存储超过30K字节的数据,并且可重写和读取超过100,000次。IC既包括数据又包括程序,因而这种智能卡可被用作电脑终端的遥控。IC卡可被用作电话卡和信用卡,这种卡有时也包括一个磁条,这样可形成两个接口。
IC卡通常可分为接触式和非接触式。对于接触式IC卡而言,至少带有读/写接口的IC主表面暴露在外部的环境中。使用时,IC卡的读/写接口直接与电脑终端或处理器的读/写头接触,由此,可从卡中的IC读取数据和/或将数据写入IC。另一方面,非接触式IC卡设有多匝的铜线圈,它的两端固定在或紧贴在IC上,并完全嵌入IC卡。铜线圈作为天线来传送和/或接收无线电频率信号。这样,IC可通过无线电频率(RF)传输,与外部系统例如电脑系统耦合。在这种情况下,IC不必与任何外部电脑系统的读/写头直接接触。
如果接触式IC卡被频繁使用,比如说一天一次或两次或者更多,卡上的IC则极易被损坏。在特定的情况下,使用接触式卡也会很费时。例如,对于高速路的付费,使用接触式卡将意味着每一辆经过收费口的汽车将不得不停下来等待支付过程。因此,在交易相对频繁但交易金额较少的情况下适合使用非接触式IC卡。
非接触式IC卡可进一步分为高频非接触式IC卡和低频非接触式IC卡。高频非接触式IC卡(也叫高频卡)的工作频率是13.56MHz,低频非接触式IC卡(也叫低频卡)的工作频率是125KHz。一张高频卡有4-5匝铜线圈,工作距离大约在10cm以内。高频卡偶尔影响附近其它正在使用的高频卡或者受其影响的可能性很小,因此使用高频卡很可靠。对于低频卡,它有250-300匝铜线圈,尽管低频卡的制造过程相当复杂,并且极不容易实现自动化操作,但它的主要优点是工作距离可以达到3米。
高频卡通常适于个人使用,例如对于乘坐火车或汽车出行。至于低频卡,由于无线电频率信号可长距离传输,而且相对容易地辨别不同汽车,因此可被用作高速公路的付费。
对于高频卡,主要有三种可在卡中安放线圈的方法,即通过印刷、蚀刻和嵌入的方法。在印刷方法中,导电油墨被印刷在芯板上以形成有若干匝的线圈。这种方法快捷,且只需相对便宜的设备。然而,这种方法的缺点是,印刷成的“导线”易被折断。另外,因为导电性取决于导电金属粉末和油墨的混合情况,因此电阻的性能不均匀。这样印刷制成的电路也非常薄,通不过相应的国际标准下的弯曲试验。而且,在这种印刷方法中,邻近的线圈匝之间不能靠得太近,这将明显降低无线电频率传递的有效性。由于上述的各种问题,这种方法目前很少使用。
再看一下蚀刻方法,这种方法类似于制造电路板所使用的方法。然而,由于相邻的线圈互相不能靠得太近,所以,无线电频率传递的有效性将受到影响。另外,在制造中会引起环境污染的问题。这种方法生产出的磁卡也通不过弯曲试验,目前也很少采用。
至于嵌入方法,是很通用的方法,并且,两个邻近的线圈实际上可以互相接触,无线电频率传输的有效性大大地提高。这种方法易于实现自动控制,且对环境没有不利的影响。这种方法制出的卡可以通过弯曲试验。
最近,除了接触式和非接触式IC卡,又有人提出了一种将接触式和非接触式IC卡的功能结合在一起的卡。这种卡叫作“组合卡”或者“双接口IC卡”。考虑到使用方便,下面将使用术语“组合卡”。组合卡中嵌入集成电路(IC),当作为接触卡使用时,IC卡的主表面上暴露,以使得外部系统的读/写头与IC直接接触,以便从IC中读取数据或将数据写入IC。另一方面,当作为非接触式IC卡使用时,组合卡的IC和嵌入卡中的天线线圈也是电接触的,以使得IC可以通过无线电频率的传输而与外部的系统耦合起来,从而可以从IC中读取数据或将数据写入IC。这些使得这种组合卡可用于更多不同的环境下。
在制造组合卡的现有方法中,IC通过导电的粘合剂与天线线圈固定在一起。这种方法的缺点是天线线圈和IC之间的直接连接不够牢固,因而不能通过ISO-7816-1和ISO10536-1的标准。
发明内容
本发明的目的是提供一种制造IC卡的方法,它可以减轻上述缺点或者至少提供一种有用的替代现有方法的方法。
本发明的一方面是提供一种制造嵌有至少一个集成电路和一个天线线圈卡的方法,这种方法包括如下步骤:(a)芯板上嵌入天线线圈;(b)将上述芯板和至少两个外板层叠成一个层压板;(c)在上述层压板中形成至少一个第一凹槽以容纳上述部分天线线圈;(d)从上述芯板中拉出上述天线线圈的至少一端;和(e)将上述集成电路和上述天线线圈固定在一起。
本发明的另一方面是提供一种嵌有至少一个集成电路和一个天线线圈的卡,其中,上述集成电路的至少一个主表面暴露在外部环境中,上述天线线圈完全嵌入在上述卡中,上述天线线圈和集成电路电性连接,且通过焊接或者热压粘合而互相固定在一起。
附图说明
下面仅以举例的形式,结合附图,来说明本发明的实施例:
图1示出了现有技术中组合卡的芯板上天线线圈的图案;
图1A是图1中划圈部分的放大图;
图2是本发明中芯板上天线线圈的图案;
图3是图2中所示图案的顶视图;
图3A是图3中划圈部分的放大图;
图4示出了本发明中与不同的底片堆叠和排列在一起,以层压成型的芯板;
图5示出了层压图4中的外板和芯板后而形成的层压板;
图6示出了图5中的层压板被冲压之后而形成的磁卡;
图7示出了本发明中形成第一凹槽和第二凹槽后的磁卡;
图8示出了本发明中从磁卡中抽出的天线线圈的两端及第三凹槽的形成;
图9示出了集成电路与在图8中示出的天线线圈的两端固定在一起;和
图10示出了本发明中将集成电路嵌入磁卡而形成的组合卡。
具体实施方式
图1和图1A示出了常规方法中,嵌入多匝铜线圈12以形成一个天线线圈的固定芯板10。在现有技术的方法中,集成电路是通过导电粘合剂和天线线圈固定在一起的,这样制成的卡通常通不过ISO的相关测试。
本发明中,如图2至3A中所示,铜线圈100是嵌在芯板102上的。芯板102通常是由热塑性材料(例如树脂玻璃,聚氯乙烯,聚丙烯和丙烯腈丁二烯苯乙烯)制成的,或者是涂有一层薄的(例如大约线圈100直径的一半)部分硫化的热固性粘合剂的耐热材料(例如环氧树脂玻璃纤维)。线圈100从一个配线机上传送到芯板102上。配线机包括一个可激励驱动线圈的超声波发生器。驱动线圈转而驱动一个在端部带有触针的超声传感器。触针上有一凹槽与线圈100的形状相匹配。在配线机上有两片片簧悬挂装置可支撑超声传感器。
通过这样的装配,触针可在超声波频率下作上下振动。这种振动产生了热量,可使线圈100下面的芯板102的材料熔化。作用在触针上的向下的力将线圈100推入芯板102内。当触针向上移动时,软化的热塑性材料将很快的硬化,这样,就把线圈100固定在芯板102内的位置上。在线圈分支的末端,线圈100在触针尖端的附近被一小剪机剪断。线圈100就这样被嵌入从而形成可接收和传送无线电频率信号的天线线圈,借此,可从IC中读取数据和/或将数据写入IC。
超声波焊接的优点是,振动的机械应力生成的热量只产生在基片(也就是芯板102)上。这样,在准确的位置上,也就是在线圈100下面很小的范围内,能很快地产生所需要的热量。因为这些热量只产生在基片上的局部范围内,所以触针一移走材料就会固化。超声波加热如此之快以至于线圈100下面的基片在热量向四周传导之前就被熔化。邻近的基片,即使是仅仅相隔和线圈直径一样近的距离,也完全不受影响。这样,能够使焊接以每秒几英尺的直线速度继续下去,而不会影响已经焊接过的线圈100。
线圈100通常是实心铜,外表有韧性弹性绝缘层,例如,聚酰亚胺,聚酯和聚亚胺酯。聚酰亚胺极适合于复杂的图案,因为它可抵抗在交叠处机械性折断。在线圈100上涂一层薄的(例如,0.0005到0.01英寸)粘合材料,可使多层的线圈100相粘合。根据实际需要,可将线圈100以每分钟5至15英尺的速度嵌入芯板上。
之后,如图4所示,将芯板102放于不同外板104,106之间,并将各板对齐以层压成型。虽然图中仅示出了两块外板104和106,但是很显然可以使用多个外板。根据所制的卡的用途,这种外板(104,106)可以包括垫板、保护板、图形印刷板、及外部的透明板。
当外板104,106和芯板102之间正确的排放并互相之间对准,即可对它们进行点焊以保证层压成型过程中各板之间相对正确的位置。在层压过程中,堆放和排序好的芯板及外层板104、106将在层压机的压力和高温作用下固定在一起,形成如图5所示的层压板108。如图6所示,通过冲压可将卡110可从层压板108上切下,以进行进一步的加工。
如图7所示,通过磨铣使卡110上形成一个上部的凹槽112。这一凹槽112的大小适合放入集成电路115的较宽部分113(见图9)。另外,上部的凹槽112可达到的深度可以刚好超过形成线圈100的天线线圈的末端。中间的凹槽117,位于凹槽112的下方,其深度和线圈100的厚度一样,是通过例如磨铣制成的。如图8所示,随着中间凹槽117的成型,可将天线线圈的末端114从卡110中拉出。。一个直接位于中间凹槽117的下方的下部的凹槽116,也是通过例如磨铣制成的。下部凹槽116比上部凹槽112狭窄,大小适于放入集成电路115的窄部118。下部凹槽116和上部凹槽112通过中间孔凹槽117连接在一起。
然后将粘合材料涂敷于上部凹槽112中。粘合材料可以是受热熔化的粘性剂,也可以是液体粘合剂,这取决于特定的环境。覆盖于天线线圈末端114上的绝缘材料,通过加热而被除去。如图9所示,天线线圈的末端114与集成电路115,通过焊接和热压粘合,固定在一起且形成电连接。集成电路115通过内植机被嵌入卡110中,内植机的一个部件120如图10所示。在嵌入过程中,涂敷于上部凹槽112中的热熔化粘合剂受热熔化,从而有助于将集成电路115固定于卡110上。这样,就制成了一个组合卡的最终产品。
上面仅根据本发明的实施例进行了描述,但是可以看出,在不超出本发明构思的情况下,可以对本发明做出改进和/或改型。
应当认识到,为简单起见,在一个实施例中描述的本发明的不同特征,可以单独地或以任何恰当的部分组合的形式给出。
Claims (11)
1.一种制造嵌有至少一个集成电路和一个天线线圈的卡的方法,这种方法包括如下步骤:(a)在芯板上嵌入天线线圈;(b)将上述芯板和至少两个外板层压成一个层压板;(c)在上述层压板中形成至少一个第一个凹槽以容纳上述天线线圈的一部分;(d)从上述芯板中拉出上述天线线圈的至少一端;(e)将上述集成电路和上述天线线圈固定到一起。
2.如权利要求1所示的方法,其特征在于,在上述步骤(d)中,上述天线线圈的两个端部从上述芯板中拉出。
3.如权利要求1或2所述的方法,其特征在于,上述天线线圈与上述集成电路通过焊接或热压粘合的方法固定在一起。
4.如前所述的任意一项权利要求所述的方法,其特征在于,还包括如下步骤(f):将上述集成电路中的第一部分放于上述的第一凹槽内。
5.如权利要求4所述的方法,其特征在于,还包括如下步骤(g):在上述层压板上制造第二凹槽,以容纳上述集成电路的第二部分。
6.如权利要求5所述的方法,其特征在于,上述第一凹槽和第二凹槽互相连通。
7.如权利要求5或6所述的方法,其特征在于,第二凹槽比第一凹槽窄。
8.如前所述任意一项权利要求所述的方法,还包括如下步骤(h):将粘合材料涂敷于上述第一凹槽内中的至少一部分中。
9.如前所述的任意一项权利要求所述的方法,还包括如下步骤(i):从上述天线线圈的末端去除绝缘涂层。
10.一种嵌有至少一个集成电路和一个天线线圈的卡,其特征在于,至少上述集成电路的主表面暴露在外部环境中,上述天线线圈完全地嵌入在上述卡中,上述天线线圈和上述集成电路电性连接,且所述集成电路和所述天线线圈通过焊接或者热压粘合而互相固定在一起。
11.一种在此详细描述并参见附图的卡。
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GB0101318.4 | 2001-01-18 | ||
GB0101318A GB2371264A (en) | 2001-01-18 | 2001-01-18 | Smart card with embedded antenna |
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KR (1) | KR20020062198A (zh) |
CN (1) | CN1365084A (zh) |
DE (1) | DE10201112A1 (zh) |
FR (1) | FR2821691A1 (zh) |
GB (1) | GB2371264A (zh) |
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- 2001-10-19 CN CN01141569A patent/CN1365084A/zh active Pending
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2002
- 2002-01-15 US US10/044,958 patent/US6881605B2/en not_active Expired - Fee Related
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- 2002-01-16 FR FR0200503A patent/FR2821691A1/fr active Pending
- 2002-01-17 KR KR1020020002732A patent/KR20020062198A/ko not_active Application Discontinuation
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CN110163327B (zh) * | 2013-03-15 | 2023-03-10 | X卡控股有限公司 | 用于制作信息携带卡的芯层的方法以及结果产品 |
CN106611212A (zh) * | 2015-10-21 | 2017-05-03 | 恩智浦有限公司 | 双接口ic卡 |
CN106611212B (zh) * | 2015-10-21 | 2021-03-12 | 恩智浦有限公司 | 双接口ic卡 |
Also Published As
Publication number | Publication date |
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GB2371264A (en) | 2002-07-24 |
TW523718B (en) | 2003-03-11 |
GB0101318D0 (en) | 2001-02-28 |
FR2821691A1 (fr) | 2002-09-06 |
KR20020062198A (ko) | 2002-07-25 |
HK1049722A1 (zh) | 2003-05-23 |
MXPA02000699A (es) | 2004-11-01 |
DE10201112A1 (de) | 2002-10-24 |
US20030000070A1 (en) | 2003-01-02 |
US6881605B2 (en) | 2005-04-19 |
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