WO2011020244A1 - 一种双界面智能卡的封装工艺 - Google Patents

一种双界面智能卡的封装工艺 Download PDF

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Publication number
WO2011020244A1
WO2011020244A1 PCT/CN2009/073379 CN2009073379W WO2011020244A1 WO 2011020244 A1 WO2011020244 A1 WO 2011020244A1 CN 2009073379 W CN2009073379 W CN 2009073379W WO 2011020244 A1 WO2011020244 A1 WO 2011020244A1
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WO
WIPO (PCT)
Prior art keywords
smart card
dual interface
interface smart
antenna
packaging process
Prior art date
Application number
PCT/CN2009/073379
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English (en)
French (fr)
Inventor
杨军良
钟卫
Original Assignee
上海赞润微电子科技有限公司
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Priority to PCT/CN2009/073379 priority Critical patent/WO2011020244A1/zh
Publication of WO2011020244A1 publication Critical patent/WO2011020244A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a packaging process for a dual interface smart card.
  • contact smart cards hereinafter referred to as contact cards
  • many drawbacks were gradually discovered: the wear caused by the frequent insertion and removal of the card on the reader caused poor contact, which caused data transmission errors, and the wear between the card and the reader was greatly shortened.
  • a contactless smart card (hereinafter referred to as a contactless card) has emerged.
  • the advantages of the contactless card are obvious: it communicates with the reading and writing device via radio waves, has no exposed contacts, has no mechanical contact with the reader, has high reliability and long service life; its communication speed is higher than the contact
  • the card can communicate with the reading and writing device from any direction within a certain distance, which makes the operation more convenient and quick.
  • non-contact cards also have communication failures due to environmental interference; encryption methods are simpler and less secure than contact cards.
  • Dual Interface Smartcard which provides two ways of communicating with the outside world on one card: contact and non-contact.
  • Contact type can be selected according to the characteristics and requirements of different application fields. For example, in the field of public transportation, because the bus has large passenger flow, fast transaction, and low security requirements, non-contact communication can be used. In the taxi application, the requirements for the length of the transaction are flexible, and the contact or non-contact communication method can be used.
  • the bank In the financial application, because the bank has a clear requirement for the communication mode of the card, it must be The contact method completes all transaction processes; in the social security application, there are a large number of operations for reading and writing card information, and the card reading and writing time is not high, so the contact communication method is also used.
  • the object of the present invention is to provide a packaging process for a dual-interface smart card with simple manufacturing process, low cost and high production yield.
  • the technical solution of the present invention is: a packaging process of a dual interface smart card, the dual interface smart card comprises a smart card module and a dual interface smart card card base, the smart card module comprises a chip and two antenna solder joints, the dual interface smart card
  • the base includes a blind hole for accommodating the chip and a soldering through hole for receiving the antenna solder joint.
  • the package process of the dual interface smart card includes the following steps: Step 1: Fix the dual interface smart card module in the dual interface Smart card base;
  • Step 2 soldering the start end of the antenna and one of the antenna solder joints
  • Step three embedding the antenna
  • Step four soldering the end of the antenna to another antenna solder joint
  • Step 5 injecting glue or a filler into the soldering through hole
  • Step six laminating the printed layer on the soldering surface.
  • the dual interface smart card module and the dual interface smart card base in step 1 are fixed by glue.
  • the initial end of the antenna and the antenna solder joint are welded using an automatic wire bonding machine.
  • step three an automatic wire bonding machine is used for embedding.
  • step four the end of the antenna and the antenna solder joint are welded using an automatic wire bonding machine.
  • the material of the dual interface smart card base is polyvinyl chloride or polyethylene terephthalate.
  • the dual interface smart card module comprises a double layer printed circuit board, and one of the double layer printed circuit boards is a contact layer on the front side of the dual interface smart card module, including a Vcc for contact type. RST, CLK, GND, Vp and I/O six contacts, the other layer is non-contact Antenna solder joints and dual interface smart card chips.
  • the dual interface smart card chip is turned on by the bonding process and the contacts on the front side of the module and the antenna pads.
  • the dual interface smart card base further includes a square flat slot for placing a double layer printed circuit board for receiving a circular blind hole of the dual interface smart card chip.
  • the packaging process of the dual interface smart card of the invention has many advantages such as simple manufacturing process, low cost and high production yield rate. BRIEF DESCRIPTION OF THE DRAWINGS The dual interface smart card packaging process of the present invention will be further described below with reference to the accompanying drawings and specific embodiments:
  • Figure 1 is a top view of a dual interface smart card module
  • Figure 2 is a bottom view of the dual interface smart card module
  • Figure 3 is a cross-sectional view of the dual interface smart card module of Figure 1 taken along line A - A;
  • Figure 4 is a top view of a dual interface smart card base
  • Figure 5 is a cross-sectional view of the dual interface smart card base shown in Figure 4 taken along line B - B;
  • FIG. 6 is a cross-sectional view of the dual interface smart card card shown in FIG. 5 after the dual interface smart card module is placed;
  • FIG. 7 is a schematic structural view of the double interface smart card shown in FIG. 6 after the buried wire is buried;
  • Figure 8 is a cross-sectional view of the dual interface smart card of Figure 7 taken along line C - C;
  • FIG. 9 is a schematic structural view of the dual-interface smart card soldering hole shown in FIG. 8 after the filler or glue is injected;
  • FIG. 10 is a schematic structural view of the dual-interface smart card shown in FIG. DETAILED DESCRIPTION OF THE INVENTION.
  • the dual interface smart card of the present invention comprises a smart card module 8 and a dual interface smart card base 7.
  • a dual interface smart card module 8 package according to a preferred embodiment of the present invention
  • the two-layer printed circuit board, the first layer 1 is the contact layer on the front of the dual-interface smart card module, including six contacts for contact Vcc, RST, CLK, GND, Vp and I/O, the second layer 2
  • the solder joint 3 and the dual interface smart card chip 4 are provided with a non-contact antenna, and the dual interface smart card chip 4 is electrically connected through the bonding process and the contacts on the front side of the module and the antenna solder joint 3.
  • the card base 7 of the dual interface smart card PVC (polyvinyl chloride) material according to the preferred embodiment of the present invention is milled out to form a square flat groove 6 of a double-layer printed circuit board according to the size of the dual interface smart card module.
  • the material of the card base 7 can also be used with PET (polyethylene terephthalate).
  • the dual interface smart card module 8 is fixed to the PVC card base 7 using glue.
  • the PVC card base 7 on which the dual interface module has been installed is reversed, and the initial end of the antenna 9 is first soldered to one of the antenna pads 3 using an automatic wire bonding machine, and then buried.
  • the antenna 9, the end of the buried antenna 9 and the other solder joint 3 are soldered.
  • glue or filler is injected into the soldering via 5 to make the solder joint 3 stronger and to ensure the flatness of the card surface.
  • the printing layer 11 is laminated on the soldering surface to complete the production of the entire dual interface smart card.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)

Description

一种双界面智能卡的封装工艺 技术领域 本发明涉及一种双界面智能卡的封装工艺。 背景技术 如今，接触式智能卡 (下简称接触卡)在人们的日常生活中得到了普遍的应 用。 在接触卡的普及过程中， 逐渐发现了许多的弊端： 卡在读写器上经常拔 插造成的磨损导致接触不良， 从而引起数据传输错误， 并且卡与读写器之间 的磨损也大大缩短了卡和读写器的使用寿命； 另外， 接触卡的通讯速率较低， 再加上插拔卡的动作延误， 造成每一笔交易需要较长时间的等待。
为了解决这些问题， 非接触式智能卡 (下简称非接触卡)应运而生。 非接触 卡的优点是显而易见的： 它通过无线电波与读写设备进行通讯， 无棵露触点， 与读写器间也无机械接触， 可靠性和使用寿命高； 它的通讯速率高于接触卡， 在一定距离范围内可以从任意方向与读写设备通讯， 从而使操作更为方便、 快捷。 然而， 非接触卡也存在通讯容易受环境干扰而失败； 加密方法较简单， 安全性低于接触卡等缺陷。
为了解决这些问题， 将射频传送能量的技术与接触式智能卡技术结合， 产生了双界面智能卡 (Dual Interface Smartcard) ,也就是在一张卡片上同时提供 两种与外界通讯的方式： 接触式和非接触式， 可以根据不同的应用领域的特 点和要求进行选择， 如在公共交通领域， 由于公交车具有客流量大， 交易快 捷， 对安全性要求不高的特点， 可以釆用了非接触的通讯方式消费； 在出租 车应用中， 对交易时间长短的要求则很灵活， 釆用接触或非接触的通讯方式 均可； 而在金融应用中由于银行对卡片的通讯方式有明确要求， 即必须以接 触方式完成所有的交易流程； 在社会保障应用中， 存在大量对卡片信息读写 的操作， 对卡片的读写时间要求不高， 所以也会使用接触的通讯方式。
但是由于双界面智能卡的生产工艺复杂， 导致产品合格率只有 65-70%左 右,致使最终产品价格居高不下。 发明内容
本发明的目的是提供一种制作工艺简单， 成本低， 生产合格率高的双界 面智能卡的封装工艺。
本发明的技术方案是： 一种双界面智能卡的封装工艺， 所述双界面智能 卡包括智能卡模块和双界面智能卡卡基， 所述智能卡模块包括芯片和两个天 线焊点， 所述双界面智能卡卡基包括收容所述芯片的盲孔和收容所述天线焊 点的焊接通孔， 其特征在于， 所述双界面智能卡的封装工艺包括下述步骤： 步骤一， 将双界面智能卡模块固定在双界面智能卡卡基中；
步骤二， 将天线的起始端和其中一个天线焊点进行焊接；
步骤三， 埋天线；
步骤四， 将天线的末端和另一个天线焊点焊接；
步骤五， 在所述焊接通孔内注入胶水或填充剂；
步骤六， 在焊接面上层压印刷层。
作为本发明的进一步改进， 步骤一中所述双界面智能卡模块与所述双界 面智能卡卡基是通过胶水固定。
作为本发明的进一步改进， 步骤二中使用自动埋线焊接机对天线的起始 端和天线焊点进行焊接。
作为本发明的进一步改进， 步骤三中使用自动埋线焊接机进行埋线。 作为本发明的进一步改进， 步骤四中使用自动埋线焊接机对天线的末端 和天线焊点进行焊接。
作为本发明的进一步改进， 所述双界面智能卡卡基的材料为聚氯乙稀或 者为聚对苯二曱酸乙二醇酯。
作为本发明的进一步改进， 所述双界面智能卡模块包括双层印刷电路板， 所述双层印刷电路板中的一层为双界面智能卡模块正面的触点层， 包括用作 接触式的 Vcc, RST, CLK, GND, Vp 和 I/O六个触点， 另一层设置有非接触式 天线的焊接点和双界面智能卡芯片。
作为本发明的进一步改进， 所述双界面智能卡芯片通过绑定工艺和模块 正面的触点及天线焊点导通。
作为本发明的进一步改进， 所述双界面智能卡卡基还包括放置双层印刷 电路板的方形平槽， 用来收容双界面智能卡芯片的圓形盲孔。
本发明的双界面智能卡的封装工艺具有制作工艺简单， 成本低， 生产合 格率高等诸多优点。 附图说明 下面结合附图和具体实施例对本发明的双界面智能卡封装工艺作进一步 的说明：
图 1是双界面智能卡模块俯视图；
图 2 是双界面智能卡模块仰视图；
图 3是图 1所示双界面智能卡模块沿 A - A线的剖面图；
图 4是双界面智能卡卡基俯视图；
图 5是图 4所示双界面智能卡卡基沿 B - B线的剖面图；
图 6是图 5所示的双界面智能卡卡基中放入双界面智能卡模块后的剖视 图；
图 7是图 6所示双界面智能卡反面焊接埋线后结构示意图；
图 8是图 7所示双界面智能卡沿 C - C线的剖视图；
图 9是图 8所示双界面智能卡焊接孔注入填充剂或胶水后的结构示意图； 图 10是图 9所示双界面智能卡背面层压印刷层后的结构示意图。 具体实施方式 下面结合附图与具体实施方式对本发明作进一步详细描述：
本发明所述双界面智能卡包括智能卡模块 8和双界面智能卡卡基 7。
参见图 1、 图 2和图 3所示， 本发明较佳实施例的双界面智能卡模块 8包 括双层印刷电路板， 第一层 1 为双界面智能卡模块正面的触点层， 包括用作 接触式的 Vcc, RST, CLK, GND, Vp 和 I/O六个触点， 第二层 2上设置有非接 触式天线的焊接点 3和双界面智能卡芯片 4,双界面智能卡芯片 4通过绑定工 艺和模块正面的触点及天线焊点 3导通。
如图 4和图 5所示， 本发明较佳实施例的双界面智能卡 PVC (聚氯乙稀） 材料的卡基 7按双界面智能卡模块尺寸铣出放置双层印刷电路板的方形平槽 6, 用来收容双界面智能卡芯片 4的位于方形平槽 6底部的圓形盲孔 12, 以及 用来收容天线焊点 3的焊接通孔 5。 此外， 卡基 7的材料还可以釆用 PET (聚 对苯二曱酸乙二醇酯）。
如图 6所示， 使用胶水将双界面智能卡模块 8固定在 PVC卡基 7上。 如图 7和图 8所示，将已安装好双界面模块的 PVC卡基 7反过来，使用自 动埋线焊接机将天线 9的起始端先和其中一个天线焊点 3进行焊接， 然后开 始埋天线 9, 所埋天线 9的末端和另一个焊接点 3焊接。
如图 9所示， 在焊接通孔 5内注入胶水或填充剂， 使焊点 3更坚固同时 保证成卡表面的平整度。
如图 10所示， 在焊接面上层压上印刷层 11 , 即可完成整个双界面智能卡 的生产。
以上实施例仅为本发明实施方式的一种， 其描述较为具体和详细， 但并 不能因此而理解为对本发明专利范围的限制。 应当指出的是， 对于本领域的 普通技术人员来说， 在不脱离本发明构思的前提下， 还可以做出若干变形和 改进， 这些都属于本发明的保护范围。 因此， 本发明专利的保护范围应以所 附权利要求为准。

Claims

权 利 要求 书
1. 一种双界面智能卡的封装工艺， 所述双界面智能卡包括智能卡模块和双 界面智能卡卡基， 所述智能卡模块包括芯片和两个天线焊点， 所述双界面智能 卡卡基包括收容所述天线焊点的焊接通孔， 其特征在于， 所述双界面智能卡的 封装工艺包括下述步骤：
步骤一， 将双界面智能卡模块固定在双界面智能卡卡基中；
步骤二， 将天线的起始端和其中一个天线焊点进行焊接；
步骤三， 埋天线；
步骤四， 将天线的末端和另一个天线焊点焊接；
步骤五， 在所述焊接通孔内注入胶水或填充剂；
步骤六， 在焊接面上层压印刷层。
2. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 步骤一 中所述双界面智能卡模块与所述双界面智能卡卡基是通过胶水固定。
3. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 步骤二 中使用自动埋线焊接机对天线的起始端和天线焊点进行焊接。
4. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 步骤三 中使用自动埋线焊接机进行埋线。
5. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 步骤四 中使用自动埋线焊接机对天线的末端和天线焊点进行焊接。
6. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 所述双 界面智能卡卡基的材料为聚氯乙稀或者为聚对苯二曱酸乙二醇酯。
7. 根据权利要求 1所述的双界面智能卡的封装工艺， 其特征在于： 所述双 界面智能卡模块包括双层印刷电路板， 所述双层印刷电路板中的一层为双界面 智能卡模块正面的触点层， 包括用作接触式的 Vcc, RST, CLK, GND, Vp 和 I/O 六个触点， 另一层设置有非接触式天线的焊接点和双界面智能卡芯片。
8. 根据权利要求 7所述的双界面智能卡的封装工艺， 其特征在于： 所述双 界面智能卡芯片通过绑定工艺和模块正面的触点及天线焊点导通。
9. 根据权利要求 7所述的双界面智能卡的封装工艺， 其特征在于： 所述双 界面智能卡卡基还包括放置双层印刷电路板的方形平槽， 用来收容双界面智能 卡芯片的圓形盲孔。
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CN2459713Y (zh) * 2001-01-18 2001-11-14 深圳市艾柯电子有限公司 双端口智能卡
CN2833904Y (zh) * 2005-07-29 2006-11-01 北京握奇数据系统有限公司 供插入式双界面智能卡使用的天线
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