CN101095220A - 用于混合式智能卡的双面电子模块 - Google Patents
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Abstract
本发明涉及一种混合式接触-非接触型智能卡的双面电子模块,其被设计为安置于卡的空孔中并被连接到嵌入卡中的天线的焊盘,所述模块在支撑物的第一面上包括一组接触端(52),某些接触端各自覆盖支撑物中的过孔。根据本发明的主要特征,在模块的第二面上是丝网印刷的第一布线线路和第二布线线路,所述第一布线线路的第一端(55)连接到所述过孔,另一端连接到芯片的焊盘,每个第二布线线路在一侧分别连接到丝网印刷的焊盘(57和59),在另一侧连接到芯片的焊盘中的两个焊盘,将所述焊盘定位,从而当将模块插入空孔中时,它们面对天线的焊盘,并且允许模块沿着它的整个周界来粘合。
Description
技术领域
本发明涉及一种为混合式接触-非接触型智能卡设计的双面集成电路,具体说来,涉及一种用于混合式智能卡的双面电子模块。
背景技术
非接触型智能卡目前广泛用于诸如运输部分和银行业部分的许多领域,并用于识别人员和物品。非接触型智能卡的特征在于将天线嵌入卡中,并将其连接到插入该卡中的电子芯片,该芯片用于开发、存储和处理信息。
这种卡允许通过所述天线与位于相关阅读器中的另一天线之间的、远程的并因此非接触的电磁耦合与外部交换信息。混合式接触-非接触型智能卡具有一组与卡表面齐平的接触端,从而可通过数据在卡的电子模块的齐平接触端与阅读器的阅读头的接触端之间的电子传输来实现信息的交换,其中,卡被插入所述阅读头。
因此,混合式智能卡的芯片必须一端连接到所述齐平接触端组,另一端连接到天线的焊盘。存在几种用于在混合式智能卡中实现芯片的这种双连接的解决方案。
在图1的截面图中示出第一种解决方案,其包括:创建由非导电支撑物10组成的电子模块,所述支撑物在第一面上装有适于连接阅读器的阅读头的接触端的齐平接触端组12,在另一面上装有适于连接卡的天线的接触端14。然后,使用经由专门设计的孔20穿过支撑物的焊金线18将芯片16连接到齐平接触端组12,同样通过焊金线22将芯片16连接到天线的接触端14。随后,通过浇铸在上面的树脂24来保护和密封芯片16以及线18和22。在树脂硬化之后,如图2所示,芯片和线被包住,表面上只可以看出接触端14的一部分,其被设计用来连接天线的焊盘。由于这种模块的特征在于两面均有接触端,其不同于用于制造接触型智能卡并且仅包括齐平接触端组的单面集成电路,所以将这种模块称为双面集成电路。
如图3所示,所述模块由此在卡体30中所轧出的空孔中形成空仓。所述空孔包括:厚度为600μm的内侧部分32,其容纳被包住的芯片;以及厚度为200μm的外侧部分34,其容纳表征为齐平接触端组的电路部分。在空孔的外侧部分中还轧出两个凹孔36,其允许焊盘与天线分开。
下一步骤包括:使用使得模块固定在空孔的外部的粘合剂和使得模块连接到借助所述两个凹孔36分开的天线的焊盘的导电粘合剂来插入模块。外部空孔34的较小表面由于被包在树脂24中的芯片的大小而不允许粘合剂遍布整个周界。结果,只有在如图中用阴影表示的两个位置40和42覆盖有粘合剂。为此,当卡特别沿着它的宽边折叠时,利用在模块的接触端14与位于凹孔36底部的天线焊盘之间的导电粘合剂制成的连接承受最大的机械弯曲应力。当卡折叠时,芯片16与天线接触端14之间的焊金连接线22也承受机械弯曲应力。因此,电子模块承受应力,这可改变与天线的连接,并由此改变卡的可靠性。此外,鉴于标准要求的0.76mm的其小的厚度,在卡体中轧出的空孔削弱了卡的坚固性。由于被包住的芯片的较大尺寸而将接触端14的位置置于非常靠近模块边缘的处理也意味着:由于导电粘合剂会移动为淤积状态并产生与齐平接触端的短路,所以当将模块安装在空孔中时会出现问题。
除了这些机械强度和可靠性的技术问题之外,还必须考虑这种模块的生产成本。双面电路的费用大约是单面电路的三倍,而利用金线进行连接进一步增加了卡的成本价格。
电子模块与天线的连接是生产这种智能卡的问题之一,另一解决方案在于不使用双面电路。该解决方案在第FR 2 810 768号专利申请中进行了详细的描述,其包括:在将组成卡的各个层压合在一起之前,直接将芯片移动并连接到天线。随后,在卡体中轧出非常小的空孔,其适于容纳由齐平接触端组组成的单面电路。通过一组连接凹孔以及布线线路来制成芯片与接触端组之间的连接,其中,在天线支撑物上预先产生所述布线线路并将其连接到芯片。这一解决方案使得能够使用单面电路,并且有助于将芯片在卡体中重新定位于下述位置,其中,在所述位置,应力最小(即,中间厚度处),并且该位置优选地为角落位置。这种解决方案的主要问题来自于将要废弃的卡。实际中,在卡的制作过程的开始阶段就插入了芯片,如果随后出现了分层或印刷问题,则所述芯片就随着卡一起被丢弃,这意味着卡的成本价格中一项重要的花费。
发明内容
这就是是研究本发明的原因,本发明的目的在于:在不增加混合式接触-非接触型智能卡的成本价格的情况下,解决作用于所述卡的天线与电子模块之间的连接上的机械应力的问题。
本发明的另一目的在于具体提出一种混合式接触-非接触型智能卡的制作过程,其中,天线与电子模块之间的连接能够经受住施加在卡上的机械弯曲应力。
因此,本发明的目的为一种混合式接触-非接触型智能卡的双面电子模块,其形成于非导体的支撑物上,并且被设计为安置于卡的空孔中并被连接到嵌入卡中的天线的焊盘。所述空孔包括用于安置芯片的内侧部分以及厚度小于内侧部分的外侧部分,所述模块在一面上包括一组接触端,某些接触端各自覆盖支撑物中的过孔,调整所述接触端组,从而接触端与卡表面齐平。根据本发明的主要特征,在模块的第二面上是丝网印刷的第一布线线路和第二布线线路,所述第一布线线路的第一端连接到过孔,另一端连接到芯片的焊盘,第二布线线路在一侧各自分别连接到丝网印刷的焊盘,在另一侧连接到芯片的焊盘中的两个焊盘,将所述焊盘定位,从而当将模块插入空孔中时,其面对天线的焊盘,并且允许模块在设置到这一端的外侧部分中沿着它的整个周界来粘合。
附图说明
通过下面结合附图进行的描述,本发明的目标、目的和优点将会变得更加清楚,其中:
图1示出根据现有技术的双面电子模块的截面,
图2示出从芯片侧查看的根据现有技术的双面电子模块,
图3示出根据现有技术的智能卡以及能够容纳双面模块的空孔的位置,
图4示出在其上生成单面印刷电路的膜,
图5示出根据本发明的双面电子模块的第一面,
图6示出根据本发明的双面电子模块的第二面,
图7示出根据本发明的双面电子模块的第二面以及芯片;
图8示出根据本发明的智能卡以及能够容纳双面模块的空孔的位置。
具体实施方式
通过如图4所示的单面电路来制造实现本发明主题的电子模块。每个单面电路的特征在于一组齐平接触端52,其适于连接到阅读器的读取头的接触端。作为实际中的标准,所述齐平接触端组通常按照连续方式形成于电子非导体支撑物50的第一面上,在2、4和8个模块的情况下的宽度分别为35mm、70mm或150mm。所述支撑物50由厚度在0.1到0.2mm之间的环氧型玻璃纤维、聚酯或纸制成。所述接触端组由铜制成,而且还可利用充入银粒子或金粒子的导电环氧基的墨对其进行丝网印刷,或者利用导电聚合物来进行丝网印刷。
参照图5,每个电子模块由此在它的第一面51上由一组齐平接触端52-1到52-10组成,某些齐平接触端被置于支撑物中的过孔(附图中未示出)上,以便覆盖所述过孔。通常52-2、52-3、52-4、52-7、52-8和52-9这六个齐平接触端均穿过过孔。图6所示的模块的第二面53的特征在于:在膜50的第二面上,通过利用导电墨进行丝网印刷或通过导电聚合物连续进行丝网印刷而形成的图案。所述导电墨是充入银粒子或金粒子的环氧类型的墨。在图6中加黑表示的设计由5条第一布线线路54和2条第二布线线路56和58组成,其中,所述第一布线线路54将5个接触端52中的每一个连接到被设计用来容纳芯片的焊盘的位置,所述第二布线线路56和58被设计用来将芯片的两个焊盘连接到卡的天线的焊盘。通过过孔来实现第一布线线路54与一组接触端52-2、52-3、52-4、52-7和52-9之间的链接,其中,每个布线线路的端点55形成大于过孔表面的表面,从而过孔的表面被覆盖。第二布线线路56和58的端点57和59形成两个焊盘,其定位于距离模块边缘约1.5mm处并且处在相对于模块的另两个边缘的中心的位置。根据图6所示的实施例,焊盘57和59处在相对于模块的短边的中心的位置。此外,沿着平行于模块的短边的方向排列所述盘。当考虑到模块的长边时,所述焊盘距离边缘足够远(优选地为1.5mm或更远的距离),以便空出足够的沿模块的整个周界的区域,从而可将粘合剂的细珠附在上面。借助于丝网印刷的使用,以及通过根据称为“倒装法(flip-chip)”的装配处理将模块的有源侧直接连接到天线的焊盘上将芯片装配到模块上,将焊盘57和59以及形成布线线路54的端点55的焊盘紧密排列。
参照图7,随后通过使用非导电粘合剂进行粘合将集成电路60的芯片按照以下方式置于电子模块的第二面53上:将芯片的焊盘设置为相对于5条第一布线线路54,其中,在所述集成电路60上,焊接优选为金焊盘的焊盘。随后对芯片加压,从而芯片的接触端进入为布线线路54、56和58设置的位置。如此构成的双面模块随后从它的支撑物分离,并且被粘合到卡和连接到嵌入卡中的天线的焊盘。
图8所示的具有标准规格85.6mm×54mm的智能卡体61包括围绕支撑物压合在一起的若干层,其中,在所述支撑物上丝网印刷有天线,该电线的两个端点形成两个焊盘。优选地,所述天线包括充入银或导电聚合物的环氧类型的导电墨。在卡体中轧出空孔。所述空孔包括:厚度为400μm的内侧部分62,其容纳芯片60;以及厚度为180μm的外侧部分64,其容纳表征为齐平接触端组的电路部分。在外部空孔中还轧出两个凹孔66,其允许焊盘与天线分开。以下步骤包括:使用使得模块固定在外部空孔上的粘合剂和使得模块连接到借助所述两个凹孔36分开的天线的焊盘的导电粘合剂来插入模块。导电粘合剂是首先从两个凹孔66的底部上至卡的天线接触端进行浇注的。随后将氰基丙烯酸盐粘合剂置于外部空孔64的周界,从而形成连续的粘合剂带,其经过空孔66与外部空孔64的边缘之间。
被设计用来装入芯片的内部空孔62相对于用来装入被包住的电子模块的空孔要小,如图3所示。通过这种方式,用来分开天线焊盘的空孔也位于中心,并且方便地相对于卡的横切方向排列,横切方向也就是指平行于卡的短边的方向。将粘合剂附在灰色区域98,以便形成细小连续的珠。外部空孔的较大区域以及焊盘的排列允许沿着模块的整个周界来焊接。通过这种方式,根据本发明的模块的粘合剂表面68相对于根据现有技术的模块的粘合剂表面40和42增加了50%。因此,显著改进了模块与天线之间连接的可靠性。
通过这种方式制成的电子模块的优点在于比较薄,这产生了若干相对于将芯片包住的传统模块的优势。在卡体中轧出的空孔的最大厚度是400μm的级别上的,而不是电子模块被包住情况下的600μm的级别。
优点在于,借助于包含在被浇注进入卡的连接凹孔66中的导电材料里以及丝网印刷的墨里的银粒子制成天线的焊盘与模块之间的电连接,从而生成布线线路55和56、模块第二面上的焊盘57和58以及天线焊盘。
由于通过根据本发明的电子模块及其用于连接天线的手段提供的优点,施加在天线与芯片之间的连接上的机械应力被减小。
然而,可通过使用诸如硅有机树脂或聚氨酯的导电粘合剂以便在卡的空孔66中产生电接合,使得所述连接更加能够抗住机械应力,其中,所述导电粘合剂包括具有柔韧性和半刚性结合的产物。对于环氧类型的墨,将银和碳充入硅有机树脂或聚氨酯以使其导电。假设80%的银粒子具有55μm或更小的大小,银粒子占了最终产物重量的40%到65%,并具有30-230μm的大小。基于硅有机树脂或聚氨酯的导电粘合剂被置于卡的连接凹孔66中,以便形成天线与模块之间的电接合,由于硅有机树脂或聚氨酯不会产生任何与氰基丙烯酸盐粘合剂的不相容,所以不需要与用于附上模块的氰基丙烯酸盐粘合剂相互作用,所述粘合剂在环境温度下就会聚合。此外,由于硅有机树脂和聚氨酯一旦被聚合就会保留某种程度的柔软性,所以电接合更加能够抗住机械切断应力。对配备有所述类型的模块与天线之间电连接的卡执行断裂测试类型的机械测试显示:与配备有充入银的环氧类型的电接合的卡相比,所述卡能够承受多出25%的断裂测试。
Claims (9)
1、一种混合式接触-非接触型智能卡的双面电子模块,其形成于非导体的支撑物上,并且被设计为安置于卡的空孔中并被连接到嵌入卡中的天线的焊盘,所述空孔包括用于安置芯片的内侧部分(62)以及厚度小于所述内侧部分的外侧部分(64),所述模块在支撑物的一面上包括一组接触端(52-1到52-10),所述接触端中的一些各自覆盖支撑物中的过孔,所述接触端组被配置为形成与卡表面齐平的接触端,
其特征在于:在模块的第二面上是丝网印刷的第一布线线路(54)和第二布线线路(56和58),所述第一布线线路的第一端(55)连接到所述过孔,另一端连接到芯片的焊盘,每个第二布线线路(56和58)在一侧分别连接到丝网印刷的焊盘(57和59),在另一侧连接到芯片的焊盘中的两个焊盘,将所述焊盘定位,从而当将模块插入空孔中时,它们面对天线的焊盘,并且允许模块在设置到这一端的外侧部分(64)中沿着其整个周界来粘合。
2、如权利要求1所述的电子模块,其中,通过形成电接合的导电材料将所述焊盘(57和59)连接到所述天线的焊盘。
3、如权利要求1或2所述的电子模块,其中,通过利用充入银粒子的导电墨进行的丝网印刷来制成天线和焊盘。
4、如权利要求3所述的电子模块,其中,通过使用充入银粒子的导电墨来实现第一布线线路(54)和(56和58)以及焊盘(57和59)的丝网印刷。
5、如权利要求2所述的电子模块,其中,使用充入银粒子的环氧类型的粘合剂来制成将天线的焊盘连接到模块的电接合。
6、如权利要求2所述的电子模块,其中,使用充入银粒子的硅有机树脂来制成将天线的焊盘连接到模块的电接合。
7、如权利要求2所述的电子模块,其中,使用充入银粒子的聚氨酯来制成将天线的焊盘连接到模块的电接合。
8、根据任何上述权利要求的电子模块,其中,将进行连接的盘(57和59)定位在距离模块的边缘超出1.5mm的距离处。
9、一种混合式接触-非接触型智能卡,其被配置有根据任何上述权利要求的电子模块。
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CN100527161C (zh) | 2009-08-12 |
HK1116919A1 (en) | 2009-01-02 |
FR2880160A1 (fr) | 2006-06-30 |
TW200634652A (en) | 2006-10-01 |
FR2880160B1 (fr) | 2007-03-30 |
WO2006070140A1 (fr) | 2006-07-06 |
EP1834352A1 (fr) | 2007-09-19 |
US20060139901A1 (en) | 2006-06-29 |
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