CN112703510A - 便携式物体的电子模块的制造方法 - Google Patents
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Abstract
本发明涉及一种用于制造一个或多个电子模块的方法,该方法包括至少以下步骤:使用基板(6)和导电载体(1),该基板(6)包括多个连接通孔、至少一个导电区域、一个或多个连接焊盘和第二面,该导电载体(1)在第一面上包括一个或多个连接区域;将所述基板(6)的第二面组装至所述载体(1)的第二面(1b);将集成电路(12)定位在所述基板(6)的一个面上或该面处;经由连接孔(11)将所述集成电路(12)的一个或多个触点连接至一个或多个连接区域,并且连接至连接焊盘;在集成电路处沉积保护层(13)。在卡中使用电子模块。
Description
本发明涉及一种制造用于包括接触功能和/或非接触功能的便携式物体的电子模块的方法。
该方法特别用于制造旨在用于具有接触和/或非接触功能的卡的电子模块,这些卡可能是双接口卡或混合卡。所获得的卡可以用于识别、健康、运输等领域。
电子模块通常被理解为是借助于粘合剂附接至连接封装的隐藏面(与模块的与读取器接触的面相对的面)的集成电路芯片。
电子模块通常在具有一个或两个蚀刻且金属化的铜层的柔性印刷电路板上制造。集成电路芯片的焊盘借助于导电线电连接至连接封装的接触板。为了能够将电子模块电连接至嵌入卡体中的另一电路,电子模块还包括芯片内部的天线或一对接触板,该天线或一对接触板布置在连接封装的隐藏面上。天线经由焊盘并借助于导电线(称为“引线键合”技术)或使用采用导电球或“凸块”的直接连接技术(称为“倒装芯片”技术)电连接至芯片。
这种用于制造微模块的技术的缺点是昂贵。
文献EP2825001公开了一种制造电子模块的技术,以便确保在显示出低机械强度的模块的所有位置处具有足够的刚性。
本发明的目的特别是在确保给定用途的接触和/或非接触功能的同时降低制造电子模块的成本。为此,使用了低成本的柔性基板,该柔性基板将被固定至导电载体以便形成用于电子模块的连接封装,该电子模块用于包括接触功能和/或非接触功能的卡。
本发明涉及一种用于制造一个或多个电子模块的方法,其特征在于,该方法包括至少以下步骤:
使用以下元件:
柔性基板,该柔性基板包括多个通孔,并且在第一面上包括至少一个导电区域,在该至少一个导电区域的端部具有一个或多个连接焊盘,并且包括第二面,以及
导电载体,该导电载体在第一面上包括一个或多个连接区域,并且包括第二面,
借助于粘合剂层将所述柔性基板的第二面结合至所述导电载体的所述第二面,
将集成电路定位在所述基板的面上或该面的水平上,
经由所述连接孔将所述集成电路的一个或多个触点连接至一个或多个连接区域,并且连接至连接焊盘,
在集成电路的水平上沉积保护层。
在对由基板和粘合剂层形成的组件进行穿孔之前,将柔性基板结合至导电载体。
根据一个实施例,导电区域由形成天线的多个匝组成。匝可以由铝制成、由铜制成或由印刷导电材料制成。
导电区域由例如围绕集成电路布置的至少两个导电材料区域形成。
所使用的载体是例如由聚对苯二甲酸乙二酯(PET)或聚氯乙烯(PVC)制成的基板。
本发明还涉及一种电子模块,其特征在于,该电子模块包括至少以下元件:
·柔性基板,该柔性基板包括至少一个导电区域、多个连接孔、连接焊盘,
·导电载体,该导电载体在一个面上包括一个或多个连接区域,
·所述柔性基板借助于粘合剂层经由一个面附接至所述导电载体的第二面,
·集成电路,该集成电路布置在基板的第一面上或该第一面的水平上,所述集成电路通过所述连接孔经由一个或多个焊盘连接至至少一个导电区域,
·保护层,该保护层在至少集成电路的水平上。
基板由例如聚对苯二甲酸乙二酯PET或聚氯乙烯PVC制成。
根据一个实施例,导电区域是由沉积在基板的至少一个面上的至少一个匝形成的天线。
导电区域可以由围绕集成电路布置的至少两个导电材料区域形成。
本发明还涉及便携式物体,诸如卡,该卡包括根据本发明的电子模块,该模块被布置在卡的腔中,并且包括沉积在卡的主体中的天线。
通过阅读经由连同附图的完全非限制性说明所提供的示例性实施例的描述,本发明的其他特征和优点将变得更加显而易见,在附图中:
·图1示出了框架的俯视图,该框架与外部读卡器保持“物理”接触;
·图2A和图2B示出了在每个面上包括电路的柔性基板的俯视图和仰视图;
·图3示出了用多个孔刺穿从而允许连接的基板的俯视图;
·图4以S35类型的连续格式示出了在如图3所描述那样刺穿的柔性膜的转移之前载体上的框架的多个位置的集合图;
·图5A示出了在按图4所描述的格式分离并且连接集成电路之后形成的模块的俯视图,图5B示出了相对于卡中的腔就位的模块的截面图;并且
·图6示出了包括两个金属板的模块的一个变体实施例。
为了清楚地理解本发明的主题,通过非限制性示例的方式提供了以下描述,以制造旨在用于包括至少一个接触式和/或非接触式交易(支付或其他)功能的卡中的电子模块。
图1示出了导电载体或框架1的俯视图,该导电载体或框架1被设计为将接触焊盘保持在第一面1a上,诸如ISO触点2,从而允许芯片与外部读取器(为简单起见未示出)之间的对话,ISO触点经由连接井3连接至芯片。导电载体可以是刚性载体类型,诸如引线框架。
框架的金属是例如铜基合金。框架1也可以由铝制成,显示出更好的耐腐蚀性并且与用于将连接焊盘电连接至ISO触点的引线键合工艺具有良好的兼容性。框架的与读卡器的触点接触的接触面1a(外部面)可以使用“无电镀”型的基本化学金属化方法容易地金属化。
图2A示出了低成本柔性塑料载体类型的基板6,该基板在第一面6a上包括天线5(导电区域)。低成本载体可以由聚对苯二甲酸乙二酯或PET或者由聚氯乙烯或PVC制成。在该示例中,天线5具有由导电材料制成的多个匝,该导电材料是通过蚀刻或借助于增材工艺生产的(在该增材工艺中,将期望图案的表面活化,以允许导体在第二步骤中生长,或例如通过丝网印刷或转印来直接转印导体)。包括天线5的第一面6a包括两个连接焊盘7,该两个连接焊盘7将用于芯片12的连接,以便确保非接触功能。在这种情况下,电子模块与掩埋在卡中的天线之间的耦合将通过感应耦合来执行(图5B)。
图2B示出了沉积在与基板6的第一面6a相对的面6b上的第二天线8。在该示例中,第二天线8本身由多个匝组成。取决于所设想的应用,两个天线5、8(双面天线)可以具有相同或不同的技术特性。基板的两个面通过使用力和超声波在钳口之间压接9进行电连接。
制造天线的技术可以是对具有在PET电介质上的两层铝的复合物进行宽幅蚀刻(几十厘米到几米)。然后,两个导电层将通过压接互连。
能够使用铜或银墨作为导电材料。天线将例如通过导电材料的根据所选模型(图案)的增材生长或任何其他可用技术来制造。
将一层粘合剂10沉积在低成本基板上,以便允许其附接至框架。
然后,由“粘合的”载体形成的组件用多个孔11或焊料井穿孔,该多个孔或焊料井将用于将芯片连接至框架的ISO焊盘,从而确保接触功能。穿孔步骤可以在粘合剂层的沉积之前或之后进行。当在基板的穿孔之后沉积粘合剂层时,将对粘合剂层进行预穿孔。孔的位置是根据布置在框架的外部面上的触点的位置进行选择。
在给出的示例中(图3),用于接触功能的孔11的数量为五个,并且用于非接触功能的(非接触)连接焊盘7的数量为两个。连接焊盘的数量是根据应用进行选择。
然后将“粘合的”和穿孔的载体胶合至框架的隐藏面1b,该面不包括用于ISO连接的饰面。可能是多层的具有耐蚀芯(resistant core)的粘合剂层10特别能够在双面天线的情况下使天线的金属(ISO层)电绝缘。为了确保其电绝缘,可以至少对于该面保留蚀刻清漆。孔11暴露出布线区域,以便形成用于芯片12的电连接的焊料井。
图4以本领域的技术人员已知的S35类型的连续格式(Super 35mm格式)示出了载体上的框架的多个位置的示例,柔性膜及其导体将被转移到该载体上,根据上文描述的方法,该柔性膜被刺穿且价格低廉。
下一步骤(图5A)在于根据本领域的技术人员已知的原理将集成电路或芯片12接合至柔性基板或在柔性基板的水平上。例如,芯片12可以定位在塑料载体中的开口15(在图5B中以虚线示出)的水平上,以便获得厚度方面的增益。然后,芯片12连接至与天线的端部相对应的连接焊盘7以便确保非接触功能,并且经由焊料井11与芯片的接触焊盘12p连接以便确保接触功能。沉积包封和保护树脂13,以便覆盖芯片和连接部。
执行上述步骤使得能够获得具有与镶嵌工艺兼容的天线的双接口电子模块。
图5B以截面图示出了使用本发明的方法制造的电子模块在卡21中的腔上方的定位,该卡21包括布置在载体23上以便确保非接触功能的天线22(电路)。腔24的几何形状和尺寸是例如根据电子模块的大小来选择。
根据图6的一个变体实施例,电子模块的载体具有一定厚度,例如350-400μm,从而允许存在两个导电区域31(金属材料),其以电子模块的匝的螺旋形式替换天线5。然后,通过电容耦合来执行电子模块与掩埋在卡中的天线之间的耦合。
在给出的示例中,触点满足ISO标准,但也可以是适合于其他应用的其他触点。
根据一个变体实施例,天线被两个连接焊盘替换,该两个连接焊盘适合于连接至位于卡体中的天线。可以使用各种技术,例如,在金属表面31与卡体中的核心天线的端子之间使用各向异性导电镶嵌胶膜或ACF或使用导电凸块或者使用导电胶或焊料的常规技术。
执行所描述的步骤是为了制造用于双接口卡或混合卡的模块,该卡包括芯片并且用于银行交易。根据本发明的方法和所获得的模块还可以用于识别领域(例如用于护照)或使用此类便携式物体的任何其他领域。
凭借本发明获得的电子模块具有较低的生产成本。
该产品的灵活性允许其与用于制造双接口卡的所有已知技术兼容。
Claims (13)
1.一种制造一个或多个电子模块(20)的方法,其特征在于,所述方法包括至少以下步骤:
使用以下元件:
柔性基板(6),所述柔性基板(6)包括多个连接通孔(11),并且在第一面(6a)上包括至少一个导电区域(5),在所述至少一个导电区域(5)的端部具有一个或多个连接焊盘(7),并且包括第二面(6b),以及
导电载体(1),所述导电载体(1)在第一面(1a)上包括一个或多个连接区域(3),并且包括第二面(1b),
借助于粘合剂层将所述柔性基板(6)的第二面(6b)结合至所述导电载体(1)的第二面(1b),
将集成电路(12)定位在所述基板(6)的所述面(6a)上或所述面(6a)的水平上,经由所述连接孔(11)将所述集成电路(12)的一个或多个触点(12p)连接至所述一个或多个连接区域(3),并且连接至所述连接焊盘(7),
在所述集成电路的水平上沉积保护层(13)。
2.根据权利要求1所述的方法,其特征在于,在对由所述基板和所述粘合剂层形成的组件进行穿孔之前,将所述柔性基板结合至所述导电载体。
3.根据权利要求1和2中任一项所述的方法,其特征在于,所述导电区域(5)由形成天线的多个匝组成。
4.根据权利要求3所述的方法,其特征在于,所述匝由铝制成。
5.根据权利要求3所述的方法,其特征在于,所述匝由铜制成。
6.根据权利要求3所述的方法,其特征在于,所述匝由印刷导电材料制成。
7.根据权利要求1和2中任一项所述的方法,其特征在于,所述导电区域(5)由围绕所述集成电路布置的至少两个导电材料区域(31)形成。
8.根据前述权利要求中任一项所述的方法,其特征在于,使用了由聚对苯二甲酸乙二酯(PET)或聚氯乙烯(PVC)制成的基板。
9.一种电子模块,其特征在于,所述电子模块包括至少以下元件:
柔性基板(6),所述柔性基板(6)包括至少一个导电区域(5)、多个连接孔(11)、连接焊盘(7),
导电载体(1),所述导电载体(1)在一个面(1a)上包括一个或多个连接区域(3),
所述柔性基板(6)借助于粘合剂层经由一个面(6b)附接至所述导电载体(1)的面(1b),
集成电路(12),所述集成电路(12)布置在所述基板(6)的一个面(6a)上或所述面(6a)的水平上,所述集成电路(12)通过所述连接孔(11)经由一个或多个焊盘(12p)连接至所述至少一个导电区域(5),
保护层(13),所述保护层(13)在至少所述集成电路的水平上。
10.根据权利要求9所述的电子模块,其特征在于,所述基板由聚对苯二甲酸乙二酯(PET)或由聚氯乙烯(PVC)制成。
11.根据权利要求9和10中任一项所述的电子模块,其特征在于,所述导电区域(5)是由沉积在所述基板的至少一个面上的至少一个匝形成的天线。
12.根据权利要求9和10中任一项所述的电子模块,其特征在于,所述导电区域(5)由围绕所述集成电路布置的至少两个导电材料区域(31)形成。
13.一种卡,所述卡包括根据权利要求9至12中任一项所述的电子模块以及沉积在所述卡的主体中的天线,所述电子模块布置在所述卡的腔(13)中。
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WO2020058036A1 (fr) | 2020-03-26 |
EP3853773B1 (fr) | 2023-07-26 |
KR20210060476A (ko) | 2021-05-26 |
FR3086098B1 (fr) | 2020-12-04 |
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