Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
  • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07745—Mounting details of integrated circuit chips
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
  • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
  • H01L2224/45001—Core members of the connector
  • H01L2224/45099—Material
  • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
  • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
  • H01L2224/45144—Gold (Au) as principal constituent
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/4805—Shape
  • H01L2224/4809—Loop shape
  • H01L2224/48091—Arched
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
  • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
  • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
  • H01L2224/491—Disposition
  • H01L2224/49105—Connecting at different heights
  • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01057—Lanthanum [La]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01087—Francium [Fr]

Definitions

• the invention relates to a double-sided integrated circuit for a hybrid contact-contactless smart card and relates in particular to a double-sided electronic module for a hybrid smart card.
• the contactless smart cards are nowadays widely used in many sectors of activity such as the transport sector and the banking sector but also for the identification of people and objects.
• the contactless smart cards include an antenna embedded in the card connected to an electronic chip inserted in the card used to develop, store and process the information.
• Such cards allow the exchange of information with the outside by electromagnetic coupling at a distance and therefore without contact, between the antenna and a second antenna located in the associated reading device.
• the hybrid contactless contact smart cards comprise a contact area flush with the surface of the card so that information can be exchanged also by electrical transmission of data between the flush contacts of the electronic module of the card and the contacts of the card. a read head of a reading device in which the card is inserted.
• the chip of the hybrid smart cards must therefore be connected on the one hand to the range of flush contacts and on the other hand to the connection pads of the antenna.
• Several solutions are used to achieve this dual connection of chips of hybrid smart cards.
• a first solution shown in section in FIG. 1 consists in producing an electronic module consisting of an electrically non-conductive support 10 bearing on the first face the range of contacts. flush 12 adapted to connect to the contacts of the read head of the reading device, and on the other side, contacts 14 adapted to be connected to the antenna of the card.
• a chip 16 is then connected both to the range of flush contacts 12 by means of welded gold wires 18 passing through the support by holes 20 provided for this purpose and to the contacts 14 of the antenna also by wires. welded gold 22.
• the chip 16 and the wires 18 and 22 are then protected and sealed by a resin 24 cast on top.
• Such a module is called a double integrated circuit. face since it includes contacts on both sides unlike a single-sided integrated circuit composed only of the flush contact range used in the realization of smart cards contact.
• the module thus formed is housed in a milled cavity in the body of the card 30.
• the cavity comprises an inner portion 32 of thickness equal to 600 microns receiving the encapsulated chip and an outer portion 34 of thickness equal to 200 microns receiving the portion of the circuit constituting the flush contact pads.
• Two wells 36 are also milled in the outer portion of the cavity and allow to disengage the connection pads of the antenna.
• the next step is to insert the module using an adhesive to fix the module on the outer portion of the cavity and a conductive adhesive for connecting the module to the antenna connection pads released through the two wells 36.
• limited surface of the external cavity 34 due to the size of the chip encapsulated in the resin 24 does not allow to put glue on the entire periphery. Indeed, only two locations 40 and 42 in gray in the figure are covered with glue.
• the connections made conductive glue between the contacts 14 of the module and the antenna pads located at the bottom of the wells 36 undergo the maximum of mechanical bending stresses when in particular the card is folded in its width.
• the welding of the gold wires 22 connecting between the chip 16 and the antenna contacts 14 also undergo the mechanical bending stresses due to the folding of the card.
• the electronic module thus undergoes constraints that can alter the connection with the antenna and therefore the reliability of the card.
• the cavities milled in the card body weaken the card given its small thickness equal to 0.76 mm and imposed by the standard.
• the location of the contacts 14 located very close to the edges of the module because of the large size of the encapsulated chip also represents a problem when the module is placed in the cavity, conductive glue removals can occur and create short -circuits with flush contacts.
• connection of the electronic module with the antenna being one of the problems of the realization of such smart cards, another solution is not to use a double-sided circuit.
• This solution described in detail in patent application FR 2 810 768, consists in transferring and connecting the chip directly to the antenna before rolling together the various layers constituting the card. A thin cavity is then milled into the body of the card adapted to receive a single-sided circuit consisting of the range of flush contacts. The connections between the chip and the range of contacts are made through a set of wells connection and link tracks previously performed on the antenna support and connected to the chip.
• This solution makes it possible to use a single-sided circuit and to relocate the chip in the card body where the constraints are the weakest, that is to say at mid-thickness and preferentially in a corner.
• the main problem of such a solution comes from the cards intended for scrapping. Indeed, the chip is inserted from the beginning of the card manufacturing process and is discarded with the card if problems of lamination or printing occur after, which represents a significant cost in the cost price of the card .
• Another object of the invention is in particular to provide a method for manufacturing a hybrid contact-contactless smart card whose connection between the antenna and the electronic module supports the mechanical bending stresses undergone by the card.
• the object of the invention is therefore a double-sided electronic module of a hybrid smart contactless contact card made on a non-conductive support and adapted to stick in a cavity of the card and connect to the connection pads of the antenna embedded in the card, the cavity comprising an internal portion intended to house the chip and an outer portion of thickness less than the inner portion, the module comprising on the first face of the support a range of contacts, some of the contacts covering each a hole through the support, the range being adapted to form the contacts flush the surface of the card.
• connection pads are screen printed firstly the first connecting tracks connected by their first ends to the through holes and the other end to the connection pads of the chip and secondly the second connection tracks each connected respectively to one side to a screen-printed connection pad and the other to two of the connection pads of the chip, the connection pads being positioned in such a way that during the insertion of the module into the cavity they are opposite the pads of connection of the antenna and they allow the module to be glued all around its periphery in the external portion provided for this purpose.
• FIG. 1 represents a section of a double-sided electronic module according to the state of the art
• FIG. 2 represents the double-sided electronic module according to the state of the art seen from the side of the chip
• FIG. 3 represents a smart card and the location of the cavity able to receive the double-sided module according to the state of the art
• FIG. 4 represents a film on which single-sided printed circuits are made
• FIG. 5 represents the first face of a double-sided electronic module according to the invention
• FIG. 6 represents the second face of a double-sided electronic module according to the invention
• FIG. 7 represents the second face of a double-sided electronic module according to the invention with the chip
• FIG. 8 represents a smart card and the location of the cavity able to receive the double-sided electronic module according to the invention. Detailed description of the invention
• the electronic module which is the subject of the invention is made from a single-sided circuit as illustrated in FIG. 4.
• Each single-sided circuit comprises the range of flush contacts 52 adapted to connect to the contacts of the read head of the reading device.
• the ranges are generally made in a continuous process on the first face of an electrically non-conductive support 50 of width equal to 35 mm, 70 mm or 150 mm for 2, 4 and 8 modules.
• the support 50 is fiberglass epoxy type, polyester or paper thickness between 0.1 and 0.2 mm.
• the range of contacts is made of copper but can also be made by screen printing conductive ink type epoxy filled with silver or gold particles or by screen printing a conductive polymer.
• each electronic module is thus composed on its first face 51 of a set of flush contacts 52-1 to 52-10, some of which are placed opposite a hole passing through the support not shown in FIG. in order to cover it.
• the flush contacts each covering a through hole are generally 6: 52-2, 52-3, 52-4, 52-7, 52-8 and 52-9.
• the second face 53 of the module shown in FIG. 6 comprises a pattern made by serigraphy of conductive ink or screen printing of a conductive polymer continuously produced on the second face of the film 50.
• the conductive ink is of the epoxy ink type loaded with silver particles or gold particles.
• first connection tracks 54 each connecting 5 of the contacts 52 to a location adapted to receive a connection pad of the chip and of two second connection tracks 56 and 58 intended to connect two of the connection pads of the chip to the connection pads of the antenna of the card.
• the link between the first connection tracks 54 and the contact pads 52-2, 52-3, 52-4, 52-7 and 52-9 is made by through the through holes, the end 55 of each of the first tracks forming a surface greater than the surface of the hole to cover it.
• the ends 57 and 59 of the second connecting tracks 56 and 58 form two connection pads positioned so as to be distant from the edges of the module by about 1.5 mm and centered with respect to the other two edges of the module. According to the embodiment described in FIG.
• connection pads 57 and 59 are centered with respect to the small side of the module.
• the pads are aligned in a direction parallel to the short sides of the module.
• the studs are sufficiently distant from the edges (preferably at a distance greater than or equal to 1.5mm) to free a sufficient space around the entire periphery of the module to be able to put a thin stream of glue .
• the tight and centered positioning of the connection pads 57 and 59 and the pads forming the ends 55 of the connecting tracks 54 is possible partly thanks to the use of the screen printing and to the assembly of the chip on the module by connection of its face activates directly on the connection pads of the antenna according to an assembly called "flip-chip".
• connection pads preferably made of gold
• the integrated circuit chip 60 on which connection pads, preferably made of gold, are soldered is then transferred by bonding with a non-conductive glue to the second face 53 of the electronic module of FIG. so that the connection pads of the chip are positioned opposite the ends of the first five connecting tracks 54. Pressure is then applied to the chip so that the pads of the chip enter the intended location of the connecting tracks 54, 56 and 58.
• the double-sided module thus formed is then detached from its support and then stuck on the card and connected to the connection pads of the antenna embedded in the card.
• the standard size card card 61 in the 85.6 mm x 54 mm format illustrated in FIG. several layers laminated together around a support on which is screen printed an antenna whose two ends form the two connection pads.
• the antenna is preferably made of a silver-filled epoxy type conductive ink or a conductive polymer.
• a cavity is milled in the card body. It comprises an inner portion 62 of thickness equal to 400 microns receiving the chip 60 and an outer portion 64 of thickness equal to 180 microns receiving the portion of the circuit constituting the flush contact pads.
• Two wells 66 are also milled in the external cavity and allow to clear the connection pads of the antenna.
• the next step is to insert the module using an adhesive to fix it on the external cavity and a conductive adhesive for connecting the module to the connection pads of the antenna released through the two wells 66.
• Conductive glue is first sunk to the bottom of the two wells 66 to the antenna points of the map. Cyanoacrylate-type glue is then placed around the periphery of the external cavity 64 so as to form a continuous strip of glue which passes between the cavities 66 and the edge of the external cavity 64.
• the internal cavity 62 intended to house the chip is small in relation to a cavity made to house an encapsulated electronic module as illustrated in FIG. 3.
• the cavities formed to clear the antenna pads are more centered and are advantageously aligned in a transverse direction of the map that is to say a direction parallel to the short sides of the map.
• the glue is positioned according to the gray area 68 so as to form a thin and continuous net.
• the large surface area of the external cavity and the positioning of the module connection pads allow a 100% bonding of the module contour.
• the area of the bonding surface 68 of the module according to the invention is increased by 50% relative to the surface 40 and 42 of bonding of a module according to the state of the technical. The reliability of the connection between the module and the antenna is therefore significantly improved.
• the electronic module thus produced has the advantage of being thin, which has a number of advantages over a conventional module where the chip is encapsulated.
• the maximum thickness of the milled cavity in the card body is of the order of 400 ⁇ m instead of 600 ⁇ m in the case of an encapsulated electronic module.
• the electrical connection between the connection pads of the antenna and the module is achieved thanks to the silver particles contained on the one hand in the conductive material cast in the connection wells 66 of the card and in the silkscreen ink for making the second connecting tracks 55 and 56 and the connection pads 57 and 58 on the second face of the module and the antenna pads.
• a conductive adhesive composed of a product that has a flexible and semi-rigid consistency to make the electrical seal in the cavities 66 of the card such as silicone or polyurethane.
• the silicone or polyurethane is loaded with silver in gold or carbon to make it conductive.
• the silver particles represent between 40% and 65% by weight of the final product and have a size of 30 to 230 ⁇ m knowing that 80% of the particles have a size less than or equal to 55 microns.
• the conductive glue based on silicone or polyurethane is placed in the connection wells 66 of the card in order to form an electrical joint between the antenna and the module and polymerizes at room temperature without interacting with the glue of the type cyanoacrylate used to stick the module because the silicone and the polyurethane do not have any incompatibility with the cyanoacrylate type glue.
• the deformable character of the silicone and polyurethane after polymerization, makes the electrical seal more resistant to mechanical shear stresses. Mechanical tests such as rupture tests carried out on boards equipped with such an electrical connection between the module and the antenna revealed that the card is capable of 25% more rupture tests than cards equipped with epoxy type electric seals loaded with silver.

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• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Credit Cards Or The Like (AREA)

Applications Claiming Priority (2)

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• 2004
  • 2004-12-28 FR FR0413951A patent/FR2880160B1/fr not_active Expired - Fee Related
• 2005
  • 2005-12-23 US US11/315,273 patent/US20060139901A1/en not_active Abandoned
  • 2005-12-27 TW TW094146597A patent/TW200634652A/zh unknown
  • 2005-12-28 WO PCT/FR2005/003293 patent/WO2006070140A1/fr active Application Filing
  • 2005-12-28 CN CNB2005800452807A patent/CN100527161C/zh not_active Expired - Fee Related
  • 2005-12-28 EP EP05850625A patent/EP1834352A1/fr not_active Withdrawn
• 2008
  • 2008-06-18 HK HK08106738.6A patent/HK1116919A1/xx not_active IP Right Cessation

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