FR3013504B1 - Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports - Google Patents

Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports Download PDF

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Publication number
FR3013504B1
FR3013504B1 FR1361300A FR1361300A FR3013504B1 FR 3013504 B1 FR3013504 B1 FR 3013504B1 FR 1361300 A FR1361300 A FR 1361300A FR 1361300 A FR1361300 A FR 1361300A FR 3013504 B1 FR3013504 B1 FR 3013504B1
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FR
France
Prior art keywords
chip holder
holders
manufacturing
electronic
electronic chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1361300A
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English (en)
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FR3013504A1 (fr
Inventor
Eric Eymard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linxens Holding SAS
Original Assignee
Interplex Microtech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Interplex Microtech filed Critical Interplex Microtech
Priority to FR1361300A priority Critical patent/FR3013504B1/fr
Priority to DE112014005250.7T priority patent/DE112014005250B4/de
Priority to CN201480062932.7A priority patent/CN105793983B/zh
Priority to US15/036,927 priority patent/US9799598B2/en
Priority to PCT/FR2014/052955 priority patent/WO2015071619A1/fr
Publication of FR3013504A1 publication Critical patent/FR3013504A1/fr
Application granted granted Critical
Publication of FR3013504B1 publication Critical patent/FR3013504B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
FR1361300A 2013-11-18 2013-11-18 Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports Active FR3013504B1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR1361300A FR3013504B1 (fr) 2013-11-18 2013-11-18 Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports
DE112014005250.7T DE112014005250B4 (de) 2013-11-18 2014-11-18 Verfahren zum Herstellen eines elektronischen Chipträgers, Chipträger und Satz solcher Träger
CN201480062932.7A CN105793983B (zh) 2013-11-18 2014-11-18 电子芯片支承件的制造方法、芯片支承件以及这种支承件的组件
US15/036,927 US9799598B2 (en) 2013-11-18 2014-11-18 Method for producing an electronic chip support, chip support and set of such supports
PCT/FR2014/052955 WO2015071619A1 (fr) 2013-11-18 2014-11-18 Procede de fabrication d'un support d'une puce electronique,support de puce et ensemble de tels supports

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1361300A FR3013504B1 (fr) 2013-11-18 2013-11-18 Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports

Publications (2)

Publication Number Publication Date
FR3013504A1 FR3013504A1 (fr) 2015-05-22
FR3013504B1 true FR3013504B1 (fr) 2022-06-10

Family

ID=50179703

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1361300A Active FR3013504B1 (fr) 2013-11-18 2013-11-18 Procede de fabrication d'un support d'une puce electronique, support de puce et ensemble de tels supports

Country Status (5)

Country Link
US (1) US9799598B2 (fr)
CN (1) CN105793983B (fr)
DE (1) DE112014005250B4 (fr)
FR (1) FR3013504B1 (fr)
WO (1) WO2015071619A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107025481B (zh) * 2016-02-02 2021-08-20 上海伯乐电子有限公司 柔性印制电路板及应用其的智能卡模块和智能卡
FR3051063B1 (fr) 2016-05-06 2021-02-12 Linxens Holding Procede de fabrication de cartes a puce et carte a puce obtenue par ce procede
WO2023052804A1 (fr) 2021-09-29 2023-04-06 Linxens Holding Circuit imprimé destiné à être intégré dans une carte à puce, carte à puce dotée d'un tel circuit imprimé et bande de bobine à bobine destinée à être utilisée dans un procédé de fabrication d'une carte à puce
FR3127578B1 (fr) 2021-09-30 2023-09-15 Linxens Holding Capteur d’humidité
FR3127577B1 (fr) 2021-09-30 2023-10-06 Urgo Rech Innovation Et Developpement Coupon pour dispositif médical avec capteur d’humidité, dispositif médical, système, et procédé correspondants.

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19534480C2 (de) 1995-09-18 1999-11-11 David Finn IC-Kartenmodul zur Herstellung einer IC-Karte sowie IC-Karte mit einem IC-Kartenmodul
FR2810768B1 (fr) 2000-06-26 2003-11-28 Gemplus Card Int Procede de fabrication de cartes a puce hybrides et cartes a puce obtenues par ledit procede
CN1498417A (zh) * 2000-09-19 2004-05-19 纳诺皮尔斯技术公司 用于在无线频率识别装置中装配元件和天线的方法
US6522014B1 (en) * 2000-09-27 2003-02-18 International Business Machines Corporation Fabrication of a metalized blind via
FR2880160B1 (fr) 2004-12-28 2007-03-30 K Sa As Module electronique double face pour carte a puce hybride
JP2007188489A (ja) * 2005-12-21 2007-07-26 Infineon Technologies Ag スマートカードモジュール
DE102006019925B4 (de) * 2006-04-28 2010-09-16 Infineon Technologies Ag Chipmodul, Chipkarte und Verfahren zum Herstellen dieser
US8710645B2 (en) * 2009-10-19 2014-04-29 Jeng-Jye Shau Area reduction for surface mount package chips
US9489613B2 (en) * 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
ITMI20121134A1 (it) * 2012-06-27 2013-12-28 St Microelectronics Srl Dispositivo elettronico flip chip e relativo metodo di produzione
DE102013105575A1 (de) * 2013-05-30 2014-12-04 Infineon Technologies Ag Chipkartenmodul, Chipkarte, und Verfahren zum Herstellen eines Chipkartenmoduls

Also Published As

Publication number Publication date
US20160293536A1 (en) 2016-10-06
CN105793983B (zh) 2019-04-02
FR3013504A1 (fr) 2015-05-22
CN105793983A (zh) 2016-07-20
DE112014005250T5 (de) 2016-10-06
US9799598B2 (en) 2017-10-24
WO2015071619A1 (fr) 2015-05-21
DE112014005250B4 (de) 2020-04-02

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