FR3088515B1 - Module electronique pour carte a puce - Google Patents
Module electronique pour carte a puce Download PDFInfo
- Publication number
- FR3088515B1 FR3088515B1 FR1860297A FR1860297A FR3088515B1 FR 3088515 B1 FR3088515 B1 FR 3088515B1 FR 1860297 A FR1860297 A FR 1860297A FR 1860297 A FR1860297 A FR 1860297A FR 3088515 B1 FR3088515 B1 FR 3088515B1
- Authority
- FR
- France
- Prior art keywords
- electronic module
- sided film
- chip card
- substrate
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 1
- 230000009977 dual effect Effects 0.000 abstract 1
- 238000005304 joining Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000011241 protective layer Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
- G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Procédé de fabrication d'un module électronique destiné à être implémenté dans un objet portatif dual caractérisé en ce qu'il comporte au moins les étapes suivantes : • Utiliser un film simple face (4) constitué par une ou plusieurs zones de contacts (3) et un diélectrique comprenant un ou plusieurs orifices, • Utiliser un substrat (6) comprenant une ou plusieurs zones électriquement conductrices destinées à la communication sans contact de l'objet, • Solidariser ledit film simple face (4) et ledit substrat (6), • Positionner un circuit intégré (20) et le connecter aux zones de contacts (3) du film simple face et au moins à une borne d'au moins une zone électriquement conductrice, • Déposer une couche de protection (21) englobant au moins ledit circuit intégré. Module obtenu par le procédé.
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1860297A FR3088515B1 (fr) | 2018-11-08 | 2018-11-08 | Module electronique pour carte a puce |
US17/292,235 US20210406636A1 (en) | 2018-11-08 | 2019-10-09 | Electronic module for chip card |
EP19780270.5A EP3877909B1 (fr) | 2018-11-08 | 2019-10-09 | Module électronique pour carte à puce |
CN201980071664.8A CN112930540A (zh) | 2018-11-08 | 2019-10-09 | 芯片卡的电子模块 |
PCT/EP2019/077275 WO2020094320A1 (fr) | 2018-11-08 | 2019-10-09 | Module electronique pour carte a puce |
JP2021525330A JP7474251B2 (ja) | 2018-11-08 | 2019-10-09 | チップカード用電子モジュール |
SG11202103548XA SG11202103548XA (en) | 2018-11-08 | 2019-10-09 | Electronic module for chip card |
KR1020217013471A KR20210087944A (ko) | 2018-11-08 | 2019-10-09 | 칩 카드용 전자 모듈 |
BR112021005517-7A BR112021005517A2 (pt) | 2018-11-08 | 2019-10-09 | módulo eletrônico para cartão de chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1860297A FR3088515B1 (fr) | 2018-11-08 | 2018-11-08 | Module electronique pour carte a puce |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3088515A1 FR3088515A1 (fr) | 2020-05-15 |
FR3088515B1 true FR3088515B1 (fr) | 2022-01-28 |
Family
ID=66286386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1860297A Active FR3088515B1 (fr) | 2018-11-08 | 2018-11-08 | Module electronique pour carte a puce |
Country Status (9)
Country | Link |
---|---|
US (1) | US20210406636A1 (fr) |
EP (1) | EP3877909B1 (fr) |
JP (1) | JP7474251B2 (fr) |
KR (1) | KR20210087944A (fr) |
CN (1) | CN112930540A (fr) |
BR (1) | BR112021005517A2 (fr) |
FR (1) | FR3088515B1 (fr) |
SG (1) | SG11202103548XA (fr) |
WO (1) | WO2020094320A1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20220032774A (ko) * | 2020-09-08 | 2022-03-15 | 엘지이노텍 주식회사 | 스마트 ic 기판, 스마트 ic 모듈 및 이를 포함하는 ic 카드 |
FR3131412B1 (fr) * | 2021-12-24 | 2024-01-05 | Wisekey Semiconductors | Module sans contact ayant une bobine d'antenne configurable |
FR3131411B1 (fr) * | 2021-12-24 | 2024-01-05 | Wisekey Semiconductors | Procédé de fabrication d’un module sans contact ayant une bobine d'antenne à inductance finement ajustable |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2801707B1 (fr) * | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
JP4684433B2 (ja) | 2001-02-07 | 2011-05-18 | 大日本印刷株式会社 | 接触・非接触兼用型icモジュールとその製造方法 |
JP4734742B2 (ja) | 2001-03-29 | 2011-07-27 | 大日本印刷株式会社 | Icモジュールとその製造方法 |
JP4783997B2 (ja) | 2001-05-11 | 2011-09-28 | 大日本印刷株式会社 | 接触・非接触兼用型icモジュールとその製造方法 |
FR2829857B1 (fr) * | 2001-09-14 | 2004-09-17 | A S K | Carte a puce sans contact ou hybride contact-sans contact a tenue renforcee du module electronique |
KR20030024132A (ko) * | 2001-09-17 | 2003-03-26 | (주)제이티 | 점착성 기판을 이용한 비접촉 ic 카드 및 그 제조방법 |
JP4387887B2 (ja) | 2004-07-08 | 2009-12-24 | 株式会社ティーアイビーシー | 接触式icカード用テープキャリア |
SG185712A1 (en) * | 2010-06-18 | 2012-12-28 | Microconnections Sas | Multi-layered flexible printed circuit and method of manufacture |
EP2463809A1 (fr) | 2010-12-07 | 2012-06-13 | NagraID S.A. | Carte électronique à contact électrique comprenant une unité électronique et/ou une antenne |
US9622359B2 (en) * | 2011-08-08 | 2017-04-11 | Féinics Amatech Teoranta | RFID transponder chip modules |
US11341389B2 (en) * | 2013-01-18 | 2022-05-24 | Amatech Group Limited | Manufacturing metal inlays for dual interface metal cards |
FR3006551B1 (fr) * | 2013-05-30 | 2016-12-09 | Linxens Holding | Procede de fabrication d'un circuit imprime, circuit imprime obtenu par ce procede et module electronique comportant un tel circuit imprime |
US9424507B2 (en) * | 2014-04-01 | 2016-08-23 | Nxp B.V. | Dual interface IC card components and method for manufacturing the dual-interface IC card components |
DE102014106062B4 (de) * | 2014-04-30 | 2018-11-22 | Infineon Technologies Ag | Chipkartenmodul, Chipkartenkörper, Chipkarte und Chipkartenherstellungsverfahren |
JP2015219878A (ja) | 2014-05-21 | 2015-12-07 | 凸版印刷株式会社 | 複合icカード及びそれに用いる複合icカード用モジュール |
FR3026529B1 (fr) * | 2014-09-30 | 2017-12-29 | Linxens Holding | Procede de fabrication de carte a puce et carte a puce obtenue par ce procede. |
JP2016212778A (ja) | 2015-05-13 | 2016-12-15 | 凸版印刷株式会社 | デュアルインターフェース通信媒体 |
-
2018
- 2018-11-08 FR FR1860297A patent/FR3088515B1/fr active Active
-
2019
- 2019-10-09 WO PCT/EP2019/077275 patent/WO2020094320A1/fr unknown
- 2019-10-09 KR KR1020217013471A patent/KR20210087944A/ko not_active Application Discontinuation
- 2019-10-09 CN CN201980071664.8A patent/CN112930540A/zh active Pending
- 2019-10-09 JP JP2021525330A patent/JP7474251B2/ja active Active
- 2019-10-09 EP EP19780270.5A patent/EP3877909B1/fr active Active
- 2019-10-09 US US17/292,235 patent/US20210406636A1/en active Pending
- 2019-10-09 SG SG11202103548XA patent/SG11202103548XA/en unknown
- 2019-10-09 BR BR112021005517-7A patent/BR112021005517A2/pt unknown
Also Published As
Publication number | Publication date |
---|---|
EP3877909B1 (fr) | 2024-09-25 |
EP3877909A1 (fr) | 2021-09-15 |
FR3088515A1 (fr) | 2020-05-15 |
JP7474251B2 (ja) | 2024-04-24 |
CN112930540A (zh) | 2021-06-08 |
KR20210087944A (ko) | 2021-07-13 |
US20210406636A1 (en) | 2021-12-30 |
WO2020094320A1 (fr) | 2020-05-14 |
JP2022507119A (ja) | 2022-01-18 |
BR112021005517A2 (pt) | 2021-06-29 |
SG11202103548XA (en) | 2021-05-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
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PLSC | Publication of the preliminary search report |
Effective date: 20200515 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
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PLFP | Fee payment |
Year of fee payment: 5 |
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PLFP | Fee payment |
Year of fee payment: 6 |