CN1407378A - Liquid treating device and method - Google Patents
Liquid treating device and method Download PDFInfo
- Publication number
- CN1407378A CN1407378A CN02142802A CN02142802A CN1407378A CN 1407378 A CN1407378 A CN 1407378A CN 02142802 A CN02142802 A CN 02142802A CN 02142802 A CN02142802 A CN 02142802A CN 1407378 A CN1407378 A CN 1407378A
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- China
- Prior art keywords
- substrate
- treating fluid
- nozzle
- developer solution
- lcd substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
The present invention provides a solution processing apparatus and a processing method with which a substrate, even when it is large in size, can be processed uniformly at the entire part thereof without increase of its foot print. The developing process unit (DEV) 24 comprises a roller transferring mechanism 14 for transferring an LCD substrate G in a single direction almost in the horizontal attitude, a main developer discharge nozzle 51a and a sub developer discharge nozzle 51b for discharging the developer to the LCD substrate G, and a nozzle moving mechanism 60a for scanning the main and sub developer discharge nozzles 51a, 51b over the LCD substrate G. While the main and sub developer discharge nozzles 51a, 51b are scanned over the LCD substrate G by driving the nozzle moving mechanism 60a, these developer discharge nozzles 51a, 51b discharge the developer to the LCD substrate G. Accordingly, uniform developing process can be performed at the entire part of the LCD substrate G by shortening the supply period of the developer.
Description
Technical field that the present invention belongs to
The present invention relates to the substrate that for example is used in glass substrate in the liquid crystal indicator (LCD) etc. is carried out the liquid handling device and the method for treating liquids of the liquid handling of development treatment etc.
Prior art
In the manufacturing of LCD, use LCD glass substrate (below be called the LCD substrate) go up form resist film after, to this resist film exposure, to its so-called photoetching technique of carrying out development treatment, on the LCD substrate, form circuit pattern with specified circuit pattern again.Here, for example for development treatment, open in the flat 11-87210 communique the spy, disclose at the substrate surface coating developer solution that transports by horizontality and on substrate, formed puddle (puddle), according to keeping the stipulated time to carry out the method and apparatus of developing reaction.
The problem that invention will solve
But nearly strong request in period LCD substrate maximizes, so that the huge LCD substrate that the length of side arrives 1m occurs.On one side this large LCD substrate is transported when being coated with developer solution on one side on the surface of LCD substrate by horizontality, increase with the contacted mistiming of developer solution in the developer solution part of the part of initial coating developer solution and last coating, produce inequality in the middle of developing reaction is carried out thus, on whole LCD substrate, be difficult to obtain uniform developing pattern.
But by quickening the travelling speed short time coating developer solution of LCD substrate, but when quickening the travelling speed of LCD substrate, for transporting the LCD substrate with identical speed in the time that needs in developing reaction, the distance that needs lengthening to transport the LCD substrate, thereby the new problem that the printing table top of generation device (Off Star ト プ リ Application ト) is widened.Be to shorten the distance of transporting of LCD substrate, must stop to form the LCD substrate in the puddle of developer solution rapidly, at this moment, the developer solution on the LCD substrate overflows because of acceleration, can not fully carry out developing reaction.And, on the LCD substrate, apply big load owing to stop the LCD substrate rapidly, thereby the LCD substrate can produce damage.
In view of described situation, the purpose of this invention is to provide and a kind ofly do not increase the printing table top, even if large-sized substrate also can be carried out the liquid handling device of uniform liquid handling on entire substrate.
The scheme of dealing with problems
According to first scheme of the present invention, a kind of liquid handling device is provided, it is characterized in that having the conveyer that transports substrate by the approximate horizontal state in one direction; With treating fluid nozzle to the substrate surface ejection treating fluid that transports by described conveyer; The nozzle moving mechanism that described treating fluid nozzle is moved on substrate with fixing speed; Move described treating fluid nozzle on one side from described treating fluid nozzle ejection treating fluid, to substrate coating treating fluid by described nozzle moving mechanism on one side.
According to alternative plan of the present invention, a kind of method for treating liquids is provided, it is characterized in that having: the operation that substrate is transported to the liquid handling zone of carrying out liquid handling by the approximate horizontal state; In described liquid handling zone, stop to transport or the travelling speed of described substrate being reduced to than the slow operation of substrate travelling speed to described liquid handling zone of described substrate; The limit makes the treating fluid nozzle to described substrate coating treating fluid move horizontally the operation that the limit comes described substrate is coated with described treating fluid from described treating fluid nozzle to the described treating fluid of described substrate ejection on described substrate.
According to third party's case of the present invention, a kind of liquid handling device is provided, the substrate of having implemented exposure-processed is implemented development treatment, it is characterized in that having the conveyer that transports substrate by the approximate horizontal state in one direction; With developer solution nozzle to the substrate surface ejection developer solution that transports by described conveyer; Make described developer solution nozzle with fixing speed in the nozzle moving mechanism that on the direction opposite, moves on the substrate with the carriage direction of described substrate; Move described developer solution nozzle by described nozzle moving mechanism on one side and spray described developer solution from described developer solution nozzle on one side, be coated with described developer solution to described substrate.
According to cubic case of the present invention, a kind of method for treating liquids is provided, the substrate of having implemented exposure-processed is carried out development treatment, it is characterized in that having: the operation that substrate is transported to the developer solution dispensing area that carries out the developer solution coating by the approximate horizontal state; At described developer solution dispensing area, stop to transport or the travelling speed of described substrate being reduced to than to the slow operation of the substrate travelling speed of described developer solution dispensing area of described substrate; While being moved horizontally from described developer solution nozzle, developer solution nozzle to described substrate coating developer solution sprays described developer solution, the operation that liquid is managed in the described development of splendid attire on described substrate on described substrate; With splendid attire the substrate of described developer solution be transported to the operation that the liquid of removing described developer solution is removed processing region.
According to described of the present invention first liquid handling device and the method for treating liquids, can move the treating fluid nozzle short time by speed in accordance with regulations and on substrate, be coated with treating fluid to cubic case.Thus, can on entire substrate, carry out uniform liquid handling.Owing to do not need to transport at a high speed the substrate that has been coated with treating fluid, do not need to stop rapidly substrate yet, therefore can not produce treating fluid falls from the substrate overflow, developing reaction can not be carried out, because the stress that stops rapidly producing produces distortion on substrate, substrate too turns round (overrun) and problems such as breakage.In addition, substrate transports the interval that needs can be with identical originally, but therefore the printing table top of restraining device increases.
Brief description of drawings
Fig. 1 is the schematic plan view of resist-coating developing system of development treatment unit with embodiment of a liquid handling device of the present invention;
Fig. 2 is the outboard profile of first thermal treatment unit part of expression resist-coating developing system shown in Figure 1;
Fig. 3 is the outboard profile of second thermal treatment unit part of expression resist-coating developing system shown in Figure 1;
Fig. 4 is the outboard profile of the 3rd thermal treatment unit part of expression resist-coating developing system shown in Figure 1;
Fig. 5 is the concise and to the point outboard profile of development treatment of the present invention unit;
Fig. 6 is the schematic plan view of development treatment unit shown in Figure 5;
Fig. 7 is a front elevation of observing the structure of the first developer solution drainage area with development treatment unit shown in Figure 5 from the upstream side of the carriage direction of LCD substrate;
Fig. 8 is the oblique view of the main developer solution structure of nozzle that disposes in the first developer solution drainage area of expression development treatment unit shown in Figure 5;
Fig. 9 A is the outboard profile of the configuration of expression main developer solution nozzle shown in Figure 5 and secondary developer solution nozzle;
Fig. 9 B is the outboard profile of the developer solution coating form of expression main developer solution nozzle shown in Figure 5 and secondary developer solution nozzle;
Figure 10 is the process flow diagram of the summary of expression development treatment operation;
Fig. 1 is the key diagram of the scanning form of main developer solution nozzle of expression and secondary developer solution nozzle;
Figure 12 A is the key diagram of sweep velocity with the inhomogeneity relation of live width of the developing pattern that obtains of main developer solution nozzle of expression and secondary developer solution nozzle;
Figure 12 B is the carrying liquid number of times of main developer solution nozzle of expression and secondary developer solution nozzle and the key diagram of the relation of the live width of the developing pattern that obtains;
Figure 12 C is the carrying liquid number of times of main developer solution nozzle of expression and secondary developer solution nozzle and the key diagram of the inhomogeneity relation of live width of the developing pattern that obtains.
Inventive embodiment
Describe embodiments of the invention in detail below with reference to accompanying drawing.Here, in the present embodiment, be that example describes with the situation that applies the present invention to the LCD substrate of having implemented exposure-processed is carried out the development treatment unit (DEV) of development treatment.Fig. 1 is that expression has as the development treatment unit (DEV) of one embodiment of the present of invention and the planimetric map of brief configuration of resist-coating developing system 100 that carries out being formed into from resist film the processing of development continuously.
This resist-coating developing system 100 has the case station (transporting the portion of transporting) 1 that mounting is held the casing C of a plurality of LCD substrate G; Has the treating stations (handling part) 2 of a plurality of processing units that is used for LCD substrate G is implemented to comprise a series of processing of resist-coating and development; Be used for and exposure device 4 between carry out the handing-over platform of sending (junction) 3 of LCD substrate G, dispose case station 1 and handing-over platform 3 respectively at treating stations 2 two ends.Among Fig. 1, the vertical of resist-coating developing system 100 is directions X, and the direction with the directions X quadrature is the Y direction in the plane.
Treating stations 2 has the 2 parallel row that the LCD substrate G that substantially extends transports usefulness and transports circuit AB on directions X, handing-over platform 3 from case station 1 one side direction and set scrub process unit (SCR) 21, the first thermal treatment unit part 26, resist processing unit 23 and the second thermal treatment unit part 27 along transporting circuit A.
21 limits, scrub process unit (SCR) are transported substrate G limit with the approximate horizontal state therein and are carried out cleaning treatment and dried.Development treatment unit (DEV) 24 also as the back describes in detail, on one side LCD limit approximate horizontal the developer solution after transporting LCD substrate G and carry out the developer solution coating, developing clean and dried.Among these scrub process unit (SCR) 21 and development treatment unit (DEV) 24, the transporting of LCD substrate G for example transported by rolling or is with to transport and carries out, and transporting mouthful and transporting mouth of LCD substrate G is arranged on the relative minor face.LCD substrate G transports by carrying out continuously with the conveyer identical mechanism of development treatment unit (DEV) 24 to i line UV illumination unit (i-UV) 25.
Be provided with in order on the resist processing unit 23 the resist drop is dropped on the LCD substrate G of approximate horizontal maintenance, by rotation number rotation LCD substrate G resist liquid is expanded on the whole LCD substrate G, form resist-coating treating apparatus (CT) 23a of resist film with regulation; Drying under reduced pressure LCD substrate G goes up decompression dry device (VD) 23b of the resist film that forms; The solvent shower nozzle on four limits by can scanning LCD substrate G is removed peripheral resist stripper (ER) 23c more than resist that adheres on the periphery of LCD substrate G.Be provided with the arm that transports that between these resist-coating treating apparatus (CT) 23a, decompression dry device (VD) 23b and peripheral resist stripper (ER) 23c, transports LCD substrate G in the resist processing unit 23.
The first thermal treatment unit part 26 has stacked 2 thermal treatment unit pieces (TB) 31 of LCD substrate G being implemented heat treated thermal treatment unit formation, 32, thermal treatment unit piece (TB) 31 is arranged on scrub process unit (SCR) 21 sides, and thermal treatment unit piece (TB) 32 is arranged on resist processing unit 23 sides.Between these 2 thermal treatment unit pieces (TB) 31,32 first conveyer 33 is set.
Shown in the outboard profile of the first thermal treatment unit part 26 of Fig. 2, thermal treatment unit piece (TB) 31 has from the handing-over of following 4 folded layer by layer LCD substrate G in order with path unit (PASS) 61, LCD substrate G is carried out 2 dewatered drying unit (DHP) 62 that dewatered drying is handled, 63 couples of LCD substrate G implement the structure of adhering to processing unit (AD) 64 of hydrophobic treatments, thermal treatment unit piece (TB) 32 has from the handing-over of following 4 folded layer by layer LCD substrate G in order with path unit (PASS) 65,2 cooling units (COL) 66,67 that LCD substrate G is cooled off, LCD substrate G is implemented the structure of adhering to processing unit (AD) 68 of hydrophobic treatments.
The second thermal treatment unit part 27 has stacked 2 thermal treatment unit pieces (TB) 34 of LCD substrate G being implemented heat treated thermal treatment unit formation, 35, thermal treatment unit piece (TB) 34 is arranged on resist processing unit 23 sides, and thermal treatment unit piece (TB) 35 is arranged on development treatment unit (DEV) 24 sides.And between these 2 thermal treatment unit pieces (TB) 34,35 second conveyer 36 is set.
Shown in the outboard profile of the second thermal treatment unit part 27 of Fig. 3, thermal treatment unit piece (TB) 34 has from the handing-over of following 4 folded layer by layer LCD substrate G in order with path unit (PASS) 69, LCD substrate G is carried out 3 prebake unit (PREBAKE) 70 that prebake is handled, 71,72 structure, thermal treatment unit piece (TB) 35 has from the handing-over of following 4 folded layer by layer LCD substrate G in order with path unit (PASS) 73, the cooling unit (COL) 74 that LCD substrate G is cooled off, LCD substrate G is implemented the structure of 2 prebake unit (PREBAKE) 75,76 of prebake processing.
The 3rd thermal treatment unit part 28 has stacked 2 thermal treatment unit pieces (TB) 37 of LCD substrate G being implemented heat treated thermal treatment unit formation, 38, thermal treatment unit piece (TB) 37 is arranged on development treatment unit (DEV) 24 sides, and thermal treatment unit piece (TB) 38 is arranged on case station 1 side.And between these 2 thermal treatment unit pieces (TB) 37,38 the 3rd conveyer 39 is set.
Shown in the outboard profile of the 3rd thermal treatment unit part 28 of Fig. 4, thermal treatment unit piece (TB) 37 has from the handing-over of following 4 folded layer by layer LCD substrate G in order with path unit (PASS) 77, to drying unit (POBAKE) 78 behind the LCD substrate G carry out that back oven dry handles 3,79,80 structure, thermal treatment unit piece (TB) 38 has from single (POBAKE) 81 of following 4 poststack oven dry layer by layer in order, carry out the path cooling unit (PASSCOL) 82 of handing-over and the cooling of LCD substrate G, LCD substrate G is carried out the structure that drying unit (POBAKE) 83,84 after 2 that handle is dried in the back.
The 3rd conveyer 39 carries out LCD substrate G and transports the handing-over through 82 pairs of case stations 1 of path cooling unit (PAASSCOL) with LCD substrate G through path unit (PASS) 77 from the handing-over of i line UV illumination unit (i-UV) 25, transporting of LCD substrate G between described thermal treatment unit.The 3rd conveyer 39 also has the structure identical with first conveyer 33, can be near any one unit of thermal treatment unit piece (TB) 37,38.
In the treating stations 2, what as above constitute 2 row like that transports circuit A, B, and transport circuit A at these substantially by arranged in order each processing unit and the conveyer handled, space 40 is set between the B.And setting can be at the shuttle (shuttle) (substrate mounting parts) 41 of 40 back and forth movements along the space.This shuttle 41 can keep LCD substrate G to constitute, and is transporting circuit A through shuttle 41, carries out the handing-over of LCD substrate G between the B.LCD substrate G is undertaken by described first to the 3rd conveyer 33,36,39 handing-over of shuttle 41.
Handing-over platform 3 has and carries out conveyer 42 that transporting of LCD substrate G transport and as the extension cooling bench (EXTCOL) 44 with substrate junction of refrigerating function between treating stations 2 and exposure device 4, the external device (ED) piece 45 and the conveyer 42 adjacent settings of stacked on top of one another letter row's record device (TITLER) and peripheral exposure device (EE).Conveyer 42 has the arm of transporting 42a, transports arm 42a by this and carries out transporting of LCD substrate G transport between treating stations 2 and exposure device 4.
Like this in the resist-coating developing system 100 of Gou Chenging, at first, the LCD substrate G on the mounting table 9 at case station 1 in the casing C of configuration directly transport treating stations 2 be excited clean pre-treatment in the UV2 illumination unit (e-UV) 2.Then, LCD substrate G is transported scrub process unit (SCR) 21, clean by conveyer 11.After the scrub process, LCD substrate G for example transports the path unit (PASS) 61 that transports the thermal treatment unit piece (TB) 31 that belongs to the first thermal treatment unit part 26 by rolling.
The LCD substrate G of configuration transports the dewatered drying unit (DHP) 62 of thermal treatment unit piece (TB) 31 at first on the path unit (PASS) 61, one in 63 is carried out heat treated, then be transported to the cooling unit (COL) 66 of thermal treatment unit piece (TB) 32, after cooling off in one of 67, for improving the stationarity of resist, be transported to adhering to the adhering in one of processing unit (AD) 68 of processing unit (AD) 64 and thermal treatment unit piece (TB) 32 of thermal treatment unit piece (TB) 31, adhere to processing (hydrophobic treatments) by HMDS there.Afterwards, LCD substrate G is transported in one of cooling unit (COL) 66,67 and cools off, and is transported in the path unit (PASS) 65 of thermal treatment unit piece (TB) 32 again.The processing of transporting of LCD substrate G when carrying out this a series of processing is all undertaken by first conveyer 33.
The LCD substrate G that is configured on the path unit (PASS) 65 transports in the resist processing unit 23 by the arm that transports of resist processing unit 23.LCD substrate G is transported among decompression dry device (VD) 23b behind the spin-coating erosion resistant agent liquid in resist-coating treating apparatus (CT) 23a and carries out drying under reduced pressure, in being transported to peripheral resist stripper (ER) 23c, remove around the LCD substrate G more than resist.And after peripheral resist was removed and finished, LCD substrate G was delivered to the path unit (PASS) 69 of the thermal treatment unit piece (TB) 34 that belongs to the second thermal treatment unit part 27 from resist processing unit 23 by transporting arm.
Be configured in LCD substrate G on the path unit (PASS) 69 and be transported to the prebake unit (PREBAKE) 70 of thermal treatment unit piece (TB) 34 by second conveyer 36,71,72 and the prebake unit (PREBAKE) 75 of thermal treatment unit piece (TB) 35, carry out prebake in one of 76 and handle, be transported to afterwards in the cooling unit (COL) 74 of thermal treatment unit piece (TB) 35 and be cooled to set point of temperature.And, be transported to by second conveyer 36 in the path unit (PASS) 73 of thermal treatment unit piece (TB) 35.
Subsequently, LCD substrate G is transported to the extension cooling bench (EXTCOL) 44 of handing-over platform 3 by second conveyer 36, conveyer 42 by handing-over platform 3 is transported to the exposure that the peripheral exposure device (EE) of external device (ED) piece 45 is removed peripheral resist, then be transported to exposure device 4 by conveyer 42, the resist film on the LCD substrate G that exposes there forms the pattern of regulation.Be transported to exposure device 4 again after according to circumstances holding LCD substrate G in the baffle-box on buffer table (BUF) 43.
Behind the end exposure, LCD substrate G is transported by the conveyer 42 of handing-over platform 3 in the letter row record device (TITLER) of epimere of external device (ED) piece 45 after the LCD substrate G recording prescribed information, is positioned in and extends on the cooling bench (EXTCOL) 44.LCD substrate G is transported to the path unit (PASS) 73 of the thermal treatment unit piece (TB) 35 that belongs to the second thermal treatment unit part 27 from extension cooling bench (EXTCOL) 44 by second conveyer 36.
By making the 24 for example rolling conveyer effects of extending from path unit (PASS) 73 to development treatment unit (DEV), LCD substrate G can be transported the development treatment unit (DEV) 24 from path unit (PASS) 73, carry out development treatment there.Describe in detail in the back about this development treatment operation.
After development treatment finished, LCD substrate G was by continuous conveyer, and for example rolling to transport from development treatment unit (DEV) 24 is transported to the i line UV illumination unit (i-UV) 25, to the LCD substrate G processing of decolouring.Afterwards, LCD substrate G transports the path unit (PASS) 77 of the thermal treatment unit piece (TB) 37 that belongs to the 3rd thermal treatment unit part 28 by the rolling conveyer in the i line UV illumination unit (i-UV) 25.
Be configured in LCD substrate G on the path unit (PASS) 77 and be transported to the back drying unit (POBAKE) 78 of thermal treatment unit piece (TB) 37 by the 3rd conveyer 39,79,80 and the back drying unit (POBAKE) 81 of thermal treatment unit piece (TB) 38,83, any one unit of 84 carries out the back oven dry to be handled, after the path cooling unit (PASSCOL) 82 that is transported to thermal treatment unit piece (TB) 38 subsequently is cooled to set point of temperature, be contained among the regulation casing C of configuration on the case station 1 by the conveyer 11 at case station 1.
Then, describe the structure of development treatment unit (DEV) 24 in detail.Fig. 5 is the outboard profile of the brief configuration of expression development treatment unit (DEV) 24.Fig. 6 is a planimetric map.Development treatment unit (DEV) 24 is by Lead-In Area 24a, and the first developer solution drainage area 24b, the second developer solution drainage area 24c, developer solution remove and distinguish 24d, and rinsing district 24e and dry section 24f constitute.Path unit (PASS) 73 of Lead-In Area 24a and thermal treatment unit piece (TB) 35 is adjacent, and dry section 24f is adjacent with i line UV illumination unit (i-UV) 25.
Be provided with between path unit (PASS) 73 and the i line UV illumination unit (i-UV) 25 by the driven in rotation roller 17 of motor etc. and, LCD substrate G transported to i line UV illumination unit (i-UV) 25 by development treatment unit (DEV) 24 from path unit (PASS) 73 by making these rolling conveyer 14 actions with the rolling conveyer 14 that the LCD substrate G on the roller 17 is transported to prescribed direction.Roller 17 is provided with defined amount on the carriage direction of LCD substrate G and the direction vertical with this carriage direction, make to be difficult to produce warpage etc. on the LCD substrate G.Not shown this rolling conveyer 14 among Fig. 6.
In the development treatment unit (DEV) 24, as shown in Figure 5, rolling conveyer 14 is divided into 3 zones, and each zone independently is driven.Path unit (PASS) 73 and Lead-In Area 24a are driven by the first motor 15a and transport LCD substrate G.The first developer solution drainage area 24b and the second developer solution drainage area 24c and developer solution removal district 24d are driven by the second motor 15b and transport LCD substrate G.Rinsing district 24e and dry section 24f are driven by the 3rd motor 15c and transport LCD substrate G in addition.For example separately driving of this rolling conveyer 14 can be undertaken by each district that constitutes development treatment unit (DEV) 24.
Path unit (PASS) but 73 have the lifting pivot (pin) 16 of free lifting.When the substrate keeping arm 94 of second conveyer 36 of maintenance LCD substrate G made lifting pivot 16 rise under the state of inlet passage unit (PASS) 73, LCD substrate G was handed off to lifting pivot 16 from substrate keeping arm 94.Then, when path list (PASS) 73 withdrawed from the back and reduces lifting pivot 16, LCD substrate G was positioned on the roller 17 in the path unit (PASS) 73 substrate keeping arm 94.By driving the first motor 15a LCD substrate G is transported Lead-In Area 24a from path unit (PASS) 73.
Lead-In Area 24a is set to the buffer area between the path unit (PASS) 73 and the first developer solution drainage area 24b, this Lead-In Area 24a prevents that developer solution is splashed to path unit (PASS) 73 etc. from the first developer solution drainage area 24b, prevents that path unit (PASS) 73 is contaminated.
The first developer solution drainage area 24b is to transporting the district that next LCD substrate G carries out initial developer solution splendid attire (puddle formation) from Lead-In Area 24a, the developer solution feed mechanism 60 to LCD substrate G coating developer solution being set.
Fig. 7 is a front elevation of seeing the structure of the first developer solution drainage area 24b from the upstream side of the carriage direction of LCD substrate G.Developer solution feed mechanism 60 have to the main developer solution nozzle 51a of LCD substrate G ejection developer solution and secondary developer solution nozzle 51b (below be called developer solution nozzle 51a, 2 nozzles 51b); Fix the nozzle fixed part 55 of these 2 nozzles; The nozzle holding member 56 that keeps nozzle fixed part 55; The jacking gear 57 of lifting nozzle holding member 56 and make developer solution nozzle 51a, 51b is at the nozzle moving mechanism 60a of directions X scanning.
Also put down in writing the structure of rolling conveyer 14 among Fig. 7.That is, rolling conveyer 14 has: extend through the pivot 19 of the second motor 15b (Fig. 7 is not shown, with reference to figure 5) around the rotation of X turning axle on the carriage direction (directions X) of LCD substrate G; Be fixed on the first gear 19a of pivot 19 around the X-axis rotation; Grow and install at interval in accordance with regulations the pivot 18 of roller 17 at the Width (Y direction) of LCD substrate G; Be mounted in pivot 18 1 ends and first gear 19a engagement and will be around the X-axis rotational transform of the first gear 19a the second gear 18a for the rotation that centers on Y-axis; The other end that is installed in pivot 18 passes through the three gear 18b of the rotation of the second gear 18a through pivot 18 rotations; The pivot 19 ' that rotates freely around X-axis and the 3rd gear 18b be installed in engagement that pivot 19 ' is gone up and the 3rd gear 18b around the rotational transform of Y turning axle for centering on the 4th gear 19b that X-axis is rotated.
In rolling conveyer 14, the drive division of rotating hinge 18 is made of pivot 19, the first gear 19a, the second gear 18a, the second motor 15b.The 3rd gear 18b, pivot 19 ', the 4th gear 19b bear the rotation of carrying out pivot 18 smoothly, support the function of pivot 18.
Fig. 8 is the oblique view of the structure of the main developer solution nozzle 51a of expression.Main developer solution nozzle 51a has the long structure of Width (Y direction) at LCD substrate G.The center upper portion of main developer solution nozzle 51a is provided for transporting to main developer solution nozzle 51a the developer solution supply pipe 49a of developer solution, is from the ejiction opening 49b that forms along the longitudinal in its lower end to spray developer solution roughly bandedly.Secondary developer solution nozzle 51b has the identical structure with main developer solution nozzle 51a.
In the developer solution feed mechanism 60, from developer solution nozzle 51a, on one side 51b makes developer solution nozzle 51a to the roughly banded developer solution of LCD substrate G ejection, 51b scans (promptly on directions X by on one side, arch arm 58 is slided on directions X), can be to the surperficial splendid attire developer solution of LCD substrate G.
For on whole LCD substrate G, evenly carrying out development treatment, need be at the developer solution that in short time as much as possible, is coated with the amount that developing reaction needs on the LCD substrate G equably.By using 2 developer solution nozzle 51a, 51b can be in the short time and is stably sprayed the developer solution of ormal weight.Developer solution nozzle 51a, the sweep velocity of 51b is preferably in below the above 500mm/s of 100mm/s.
Splendid attire number of times to LCD substrate G is not limited to 1 time, and the splendid attire that can carry out is repeatedly handled.For example, behind the splendid attire of LCD substrate G 1 time, rising developer solution nozzle 51a, 51b is returning the original position, carries out the splendid attire action once more.
Fig. 9 A is more detailed expression developer solution nozzle 51a shown in Figure 5, and the outboard profile of the configuration of 51b, Fig. 9 B are to represent the limit from developer solution nozzle 51a, and 51b ejection developer solution limit makes developer solution nozzle 51a, the key diagram of the state of 51b scanning.
In the developer solution feed mechanism 60, to the surperficial splendid attire developer solution of LCD substrate G the time, arch arm 58 is scanned on the direction opposite with the carriage direction of LCD substrate G.For at first being coated with developer solution from main developer solution nozzle 51a to LCD substrate G, main developer solution nozzle 51a is configured in the upstream side of substrate carriage direction, and secondary developer solution nozzle 51b is configured in the downstream of substrate carriage direction.By the developer solution that is contained on the LCD substrate G from main developer solution nozzle 51a ejection being replenished developer solution from secondary developer solution nozzle 51b ejection developer solution, can supply with to LCD substrate G and carry out the sufficient developer solution that developing reaction needs, thereby the shortening development time improves the development precision.
Make developer solution nozzle 51a, during 51b scanning, in order the lower end of secondary developer solution nozzle 51b the developer solution that is ejected into LCD substrate G by main developer solution nozzle 51a not to be given as security to developer solution nozzle 51a, the direction of scanning of 51b (with reference to figure 9B), the gap width D (gap) of secondary developer solution nozzle 51b and LCD substrate G preferably sets the gap width d of ground greater than main developer solution nozzle 51a and LCD substrate G.
For example, establishing gap width d is 1.5mm～2.5mm, and gap width D is 3mm～5mm.Gap width d is during less than 1.5mm, and the position of main developer solution nozzle 51a cooperates some difficulty.Gap width d is involved in bubble in the developer solution during developer solution ejection during greater than 2.5mm, on the surface of this bubble attached to LCD substrate G, makes this part poor visualization occur.Gap width D is during greater than 5mm, and the developer solution that has been coated with on the LCD substrate G is stirred in large quantities, thereby the problem that the line width homogeneity reduces occurs.Do not exceed 1mm by the distance of leaving from the surface that is contained in the developer solution on the LCD substrate G by main developer solution nozzle 51a, can prevent being involved in of bubble etc.
For example, from main developer solution nozzle 51a to the developer solution of LCD substrate G ejection during easily to the place ahead of the direction of scanning of main developer solution nozzle 51a expansion, owing at first above the developer solution that is coated with at LCD substrate G, apply to the impact (developer solution rushes at the impetus of LCD substrate G) of the relative LCD substrate of the developer solution G of LCD substrate G ejection, therefore compare and weaken with the situation that directly developer solution is ejected into LCD substrate G from main developer solution nozzle 51a.Therefore, produce the problem that the development precision reduces.
Main developer solution nozzle 51a inclination predetermined angular θ, the developer solution that sprays from main developer solution nozzle 51a is difficult to developer solution nozzle 51a by only, the place ahead of the direction of scanning of 51b expansion.Thereby, be applied directly on the LCD substrate G from the impact of the developer solution of main developer solution nozzle 51a ejection, therefore can improve the development precision.
Owing to from the developer solution of main developer solution nozzle 51a ejection, also newly spraying developer solution from secondary developer solution nozzle 51b, originally compare with the condition of main developer solution nozzle 51a from secondary developer solution nozzle 51b ejection developer solution, G does not produce big impact to the LCD substrate.The preferably secondary developer solution nozzle 51b predetermined angular θ that also tilts is not so that can produce a large amount of the stirring to the developer solution that before had been coated with at LCD substrate G from the developer solution of secondary developer solution nozzle 51b ejection.
Like this, in the first developer solution drainage area 24b, because scan edge developer solution nozzle 51a, the 51b limit does not need to transport at a high speed LCD substrate G to LCD substrate G ejection developer solution.Thereby, prevent when LCD substrate G from transporting because stopping rapidly of too moving and transport and on LCD substrate G, produce warpage and damage accident.Developer solution does not need to stop rapidly LCD substrate G after supplying with, and can prevent that therefore the development hydrorrhea of the last splendid attire of LCD substrate G from falling, and can effectively utilize developer solution.
In the first developer solution drainage area 24b, on one side low speed transports LCD substrate G and stops L CD substrate G on one side and carry out the developer solution splendid attire, but under use stops the situation of splendid attire that LCD substrate G carries out developer solution, can especially carry out under the stable status, therefore can improve the homogeneity of line width.
In the first developer solution drainage area 24b, during the LCD substrate G with the splendid attire developer solution was transported to developer solution removal district 24d, developer solution overflow from LCD substrate G sometimes.In the second developer solution drainage area 24c,, can newly replenish developer solution to LCD substrate G for preventing to fall to not carrying out developing reaction owing to developer solution overflows from LCD substrate G transporting in the way of LCD substrate.
In the second developer solution drainage area 24c, vertically be fixed on the motionless arm (not shown) that has with arch arm 58 same structures by it for the Y direction with the developer solution postinjector 51c of main developer solution nozzle 51a same structure.Go up by the long roughly banded developer solution that sprays ormal weight of Y direction to the LCD substrate G that transports by rolling conveyer 14 from developer solution postinjector 51c, when transporting, replenish the developer solution that overflows and from LCD substrate G like this.
Developer solution is removed among the district 24d, is provided with LCD substrate G to be transformed to the unshowned state transformation mechanism of heeling condition for example and to the rinsing liquid nozzle 52 of the rinsing liquid (for example pure water) of LCD substrate G surface ejection wash-out developer.The developing reaction of LCD substrate G is going 24b to carry out during developer solution is removed transporting of district 24d from the supply of first developer solution.Developer solution is removed among the district 24d, LCD substrate G is transformed to the heeling condition developer solution that drips on LCD substrate G, LCD substrate G is being kept under the state of heeling condition, LCD substrate G surface by the edge and scan rinsing liquid nozzle 52 limits from LCD substrate G top downwards and wash developer solution on the LCD substrate G to LCD substrate G surface ejection pure water.
Rinsing liquid nozzle 52 is a wash-out developer in the short time, by for example velocity sweeping of 500mm/s.In fact, the sweep velocity of rinsing liquid nozzle 52 better between 200mm/s～300mm/s, can improve the line width homogeneity of developing pattern between 100mm/s～300mm/s.As rinsing liquid nozzle 52 and developer solution nozzle 51a, 51b is the same, preferably uses the structure of membranaceous ejection rinsing liquid, thereby prevents the generation of uneven development.
Among the rinsing district 24e, the rinse nozzle 53 to the rinsing liquid of LCD substrate G ejection pure water etc. is installed.In rinsing district 24e, and meanwhile in accordance with regulations speed transport LCD substrate G and spray rinsing liquid on LCD substrate G surface and the inside, carry out the removal and the cleaning of the developer solution that adheres on the LCD substrate G.Rinse nozzle 53 has the shape longer than the width of LCD substrate G, can spray rinsing liquid on the whole Width of LCD substrate G.
Transport the air nozzle (air knife) 54 that blast in accordance with regulations sprays dry gas such as nitrogen is set among the dry section 24f of the LCD substrate G by rinsing district 24e.Among the dry section 24f limit in accordance with regulations speed transport LCD substrate G limit at LCD substrate G surface and the inside jet drying gas, the rinsing liquid that adheres on the LCD substrate G that blows off is dry LCD substrate G also.Air nozzle 54 has the shape longer than the width of LCD substrate G, can spray dry gas on the whole Width of LCD substrate G.The LCD substrate G that finishes dried is transported to i line UV illumination unit (i-UV) 25 by rolling conveyer 14.
The development treatment operation of development treatment unit (DEV) 24 then, is described.Figure 10 is the key diagram (process flow diagram) of the summary of expression development treatment operation.The LCD substrate G that transports path unit (PASS) 73 transports (step 1) among the first developer solution drainage area 24b by rolling conveyer 14 by Lead-In Area 24a.LCD substrate G for example is 65mm/s from this path unit (PASS) 73 to the travelling speed of the first developer solution drainage area 24b.
Among the first developer solution drainage area 24b, as the state (step 2) that LCD substrate G is stopped at assigned position, the limit makes developer solution nozzle 51a with the high speed of for example 240mm/s, and the splendid attire (step 3) of developer solution is carried out to LCD substrate G surface ejection developer solution in 51b scanning limit.Drive developer solution nozzle 51a, 51b easily by being made as the state that stops LCD substrate G.Can be stably to LCD substrate splendid attire developer solution.
Figure 11 is expression developer solution nozzle 51a, the key diagram of the scanning form of 51b.Make developer solution nozzle 51a, 51b scans to the left side from the right side of Figure 11, is the splendid attire starting end with the right-hand member of LCD substrate G shown in Figure 11, and left end is finished end as splendid attire.Adjust developer solution nozzle 51a by elevating mechanism 57, behind the height and position of 51b, make driving mechanism 46 actions, beginning developer solution nozzle 51a, the scanning of 51b.Main developer solution nozzle 51a arrives than splendid attire starting end assigned position on the right side, for example when the position of splendid attire starting end right side 1cm (below be called the ejection starting position), begins from main developer solution nozzle 51a ejection developer solution (step 3a).Really begin the splendid attire developer solution from the splendid attire starting end thus.Equally, when secondary developer solution nozzle 51b arrives the ejection starting position, begin from secondary developer solution nozzle 51b ejection developer solution (step 3b).
Afterwards, make developer solution nozzle 51a, 51b scans on LCD substrate G, splendid attire developer solution (step 3c) on whole LCD substrate G.At this moment, with reference to figure 9 (a), (b) explanation is such as previous, and when developer solution nozzle 51a, 51b scanned on LCD substrate G, developer solution was to developer solution nozzle 51a, and the oblique below of 51b sprays.Secondary developer solution nozzle 51b is not coated on developer solution on the LCD substrate G to main developer solution nozzle 51a to developer solution nozzle 51a, and the direction of scanning of 51b is swept and gone up the coating developer solution to LCD substrate G.
Though as long as secondary developer solution nozzle 51b reach finish to support by splendid attire continuous to LCD substrate G ejection developer solution, but be more preferably if main developer solution nozzle 51a arrives splendid attire and finish end, just end from main developer solution nozzle 51a ejection developer solution (step 3d), secondary developer solution nozzle 51b arrives splendid attire and finishes end, just end from secondary developer solution nozzle 51b ejection developer solution (step 3e), mobile developer solution nozzle 51a, 51b make secondary developer solution nozzle 51b the lower end near or finish end join (step 3f) with the splendid attire of LCD substrate G.By secondary developer solution nozzle 51b is moved to this position, prevent that developer solution from coating to LCD substrate G that go up from overflowing from splendid attire end end.When secondary developer solution nozzle 51b and LCD substrate G join, join by this and can carry out finer control, make LCD substrate G not damage.
After 1 splendid attire end of job shown in Figure 11, developer solution nozzle 51a, 51b returns the splendid attire starting end, preferably once more to LCD substrate G coating developer solution (step 3g).By repeatedly carrying out splendid attire, not only can keep high development precision but also can shorten development time to LCD substrate G.
Figure 12 A, 12B, 12C represents the key diagram to splendid attire condition with the relation of the developing pattern characteristic that obtains of LCD substrate G respectively, Figure 12 A is expression developer solution nozzle 51a, the inhomogeneity relation of the sweep velocity of 51b and line width, Figure 12 B is the relation of expression splendid attire number of times and line width, and Figure 12 C is expression splendid attire number of times and the inhomogeneity relation of line width.
Result shown in Figure 12 A～C is the mask exposure-processed LCD substrate G under rated condition by the predetermined pattern that uses 8 microns or 10 microns, then under various conditions the LCD substrate G of exposure is developed, SEM observes the pattern of the resist film that obtains like this and measures that line width (width of the projection of developing pattern) obtains.During this SEM observes, for whole LCD substrate G is observed, be on 8 directions that equal angles cuts apart in the approximate centre of LCD substrate G a plurality of observation point are set radially.
Result shown in Figure 12 A is to use the mask of the pattern that forms 10 microns of line widths, make from developer solution nozzle 51a, the flow and the developer solution nozzle 51a of the developer solution of 51b ejection, the sweep velocity of 51b has nothing to do and keeps certain, by changing developer solution nozzle 51a, the sweep velocity of 51b is carried out splendid attire 1 time, and makes development time (from the time of taking out developer solution from LCD substrate G that is applied to of beginning developer solution) for what necessarily obtain.The corresponding 1 LCD substrate G of 1 column curve among Figure 12 A.
Shown in Figure 12 A, at developer solution nozzle 51a, when the splendid attire number of times of 51b is 1 time, developer solution nozzle 51a, the sweep velocity of 51b can improve the line width homogeneity soon.Consider that this is because the developer solution hold-up of developer solution splendid attire starting end reduces, the surplus reaction of the development part that this starting end causes be suppressed and since for time of shortening splendid attire on whole LCD substrate G on whole LCD substrate G, to carry out developing reaction equably.
The surplus reaction meaning of the development part that so-called starting end causes is as follows.That is, developer solution is along with developer solution nozzle 51a, and the scanning of 51b offers the direction of scanning, but this moment, the part developer solution flowed to the direction opposite with the direction of scanning.This developer solution that returns no longer flows and is trapped in the there at developer solution splendid attire starting end.Therefore, for the state of developer solution is provided superfluously, developing reaction is carried out soon than other positions at developer solution splendid attire starting end, carries out the surplus reaction.The superfluous reaction result of this development part is the inequality that has increased the line width in the face.
By accelerating developer solution nozzle 51a, the sweep velocity of 51b can reduce the amount of returning developer solution, therefore can suppress the surplus reaction of developer solution splendid attire starting end part.
Owing to make from developer solution nozzle 51a, the flow and the development time of the developer solution of 51b ejection all are constant, are under the situation of 100mm/s in sweep velocity, and the average line width is 9.94 microns, near mask pattern, but the inequality of line width increases in whole LCD substrate G.On the other hand, be under the situation of 210mm/s in sweep velocity, the average line width is 9.78 microns, and is narrower slightly than mask pattern, but the inequality of line width reduces in whole LCD substrate G.Developer solution nozzle 51a consequently under the fast situation of the sweep velocity of 51b, increases the impact of developer solution to resist, and developing reaction is faster, is under the situation of 210mm/s in sweep velocity therefore, think developing reaction too fast be one of reason wherein.Thereby, make developer solution nozzle 51a, during the 51b high-velocity scanning, can make the average line width near mask pattern by shortening development time, and can improve the line width homogeneity.
Result shown in Figure 12 B expresses and uses the formation line width is the mask of 8 microns pattern, at developer solution nozzle 51a, the sweep velocity of 51b is 80mm/s, the spray volume of developer solution is 5.6L (liter)/timesharing and developer solution nozzle 51a, the sweep velocity of 51b is 160mm/s, the spray volume of developer solution is 9.4L (liter)/timesharing, and development time is certain, the average line width when changing the splendid attire number of times.Shown in Figure 12 B, when the splendid attire number of times increases, the average line narrowed width.Think that this is because splendid attire number of times when increasing, developing reaction is carried out fast, by increasing the splendid attire coefficient, can shorten development time.
It is the mask of 8 microns pattern that result shown in Figure 12 C represents to use the formation line width, at developer solution nozzle 51a, the sweep velocity of 51b is 80mm/s, the spray volume of developer solution is 5.6L (liter)/timesharing and developer solution nozzle 51a, the sweep velocity of 51b is 160mm/s, the spray volume of developer solution is 9.4L (liter)/timesharing, and development time is certain, the line width homogeneity when changing the splendid attire number of times.The corresponding 1 LCD substrate G of 1 column curve among Figure 12 C.
Shown in Figure 12 C, when the splendid attire number of times is identical, developer solution nozzle 51a, the sweep velocity of 51b is big more, tends to improve the line width homogeneity more.Developer solution nozzle 51a when the sweep velocity of 51b is fast (160mm/s), during the splendid attire increased frequency, improves the line width homogeneity.From this result as can be known, though developer solution nozzle 51a, the sweep velocity of 51b is accelerated and the splendid attire increased frequency, and it is also effective to improve the line width homogeneity.
Make rolling conveyer 14 actions the splendid attire among the first developer solution drainage area 24b be handled the LCD substrate G that is through with and be transported to the second developer solution drainage area 24c (step 4) with the travelling speed of for example 46mm/s.When LCD substrate G passes through the second developer solution drainage area 24c, replenish developer solution (step 5) to LCD substrate G from developer solution postinjector 51c.
The LCD substrate G that is transported to the second developer solution drainage area 24c is transported to developer solution again and removes district 24d (in the step 6), there LCD substrate G is transformed to the developer solution (step 7) on the heeling condition drippage LCD substrate G, to spray rinsing liquid from rinsing liquid nozzle 52 to the surface of LCD substrate G under the state of LCD substrate G maintenance heeling condition again, as pure water, the developer solution (step 8) on the flushing LCD substrate G.
Then, LCD substrate G is transported among the rinsing district 24e (step 9), there the limit in accordance with regulations speed transport surface and the inside ejection rinsing liquid of LCD substrate G limit to LCD substrate G, carry out the removal and the cleaning (step 10) of the developer solution that adheres on the LCD substrate G.The limit is carried out this rinsing processing limit the LCD substrate G by rinsing district 24e is transported to (step 11) among the dry section 24f.Among the dry section 24f, limit speed is in accordance with regulations transported LCD substrate G limit and is carried out dried (step 12) by air nozzle 54.The LCD substrate G that finishes dried is transported to i line UV illumination unit (i-UV) 25 (step 13), the ultraviolet treatment with irradiation of stipulating there by rolling conveyer 14.
Embodiments of the invention more than have been described, but have the invention is not restricted to described embodiment.For example, the developer solution nozzle that is configured in the first developer solution drainage area 24b can be 1, can be more than 3.Use under the situation of 1 developer solution nozzle, must increase from the flow of the developer solution of developer solution nozzle ejection, therefore the developer solution ejection impetus strengthens, for making the developer solution that is ejected on the LCD substrate G not overflow from LCD substrate G, control the ejection state of developer solution, for example the emission direction of developer solution and the ejection impetus from the developer solution nozzle.
In the first developer solution drainage area 24b, can be on one side by do not stop LCD substrate G and be coated on developer solution on the LCD substrate G do not overflow that the speed that falls transports also can be on one side to LCD substrate G coating developer solution.In addition, developer solution nozzle 51a, the direction of scanning of 51b and the carriage direction of LCD substrate G opposite oppositely but stop under the situation of LCD substrate G, can make developer solution nozzle 51a, and 51b scans on the direction vertical with the carriage direction of LCD substrate G.
The invention effect
As above explanation is such, according to liquid handling device of the present invention and method for treating liquids, because by pressing Fixing speed makes the treatment fluid nozzle scan can be coated with treatment fluid in the short time, carries out on the whole substrate that therefore coexists Uniform liquid handling. Like this, produce and improve the substrate quality, reduce the effect of the bad incidence of product. No Need to transport at a high speed the substrate that has been coated with treatment fluid, therefore also not need to stop rapidly substrate, thereby can locate The liquid handling that reason liquid does not fall from the substrate overflow does not need to replenish the treatment fluid a great deal of that overflows and yet. In addition, by In the warpage that has prevented from because of the stress that stops rapidly producing substrate being caused, the damage that the substrate over-running produces etc. The generation of problem, so fabrication yield raising being kept load and alleviating. In addition, the space of substrate transfer needs With originally identical, but therefore the printing table of restraining device increases.
Claims (20)
1. a liquid handling device is characterized in that, has the conveyer that transports substrate by the approximate horizontal state in one direction; With treating fluid nozzle to the substrate surface ejection treating fluid that transports by described conveyer; The nozzle moving mechanism that described treating fluid nozzle is moved on substrate with fixing speed; Move described treating fluid nozzle on one side from described treating fluid nozzle ejection treating fluid, to substrate coating treating fluid by described nozzle moving mechanism on one side.
2. according to the device of claim 1, it is characterized in that also having to being coated with described treating fluid by described treating fluid nozzle and being coated with the fixing treating fluid postinjector of described treating fluid by the substrate surface that described conveyer transports.
3. according to the device of claim 2, it is characterized in that, described treating fluid postinjector with the direction of the carriage direction quadrature of described substrate on have microscler shape, to the substrate by described treating fluid postinjector below with the whole direction of described carriage direction quadrature on be and replenish described treating fluid roughly bandedly.
4. according to the device of claim 1 or 2 or 3, it is characterized in that described nozzle moving mechanism moves described treating fluid nozzle on the direction opposite with the carriage direction of described substrate.
5. according to the device of claim 1 or 2 or 3, it is characterized in that, described treating fluid nozzle by with the direction of the direction quadrature that moves by described nozzle moving mechanism on long main treating fluid nozzle and 2 nozzles of vice processing nozzle for liquid constitute,
Described main treating fluid nozzle and described vice processing nozzle for liquid and row arrangement, so that described main treating fluid nozzle is placed on the place ahead of the moving direction of described nozzle moving mechanism, described vice processing nozzle for liquid is placed on the rear of the moving direction of described nozzle moving mechanism
With the whole direction of described moving direction quadrature on be the described treating fluid of roughly banded ejection from described main treating fluid nozzle and described vice processing nozzle for liquid to described substrate.
6. according to the device of claim 5, it is characterized in that the gap of described vice processing nozzle for liquid and described substrate is than the relief width of described main treating fluid nozzle and described substrate.
7. according to the device of claim 5, it is characterized in that, described main treating fluid nozzle and described vice processing nozzle for liquid remain on the following heeling conditions of above 15 degree of 5 degree by relative vertical, so as when described nozzle moving mechanism to move to moving direction tiltedly below the described treating fluid of ejection.
8. according to the device of claim 5, it is characterized in that also having the elevating mechanism of described main treating fluid nozzle of lifting and described vice processing nozzle for liquid,
During near described vice processing nozzle for liquid arrives the end face of the described substrate that finishes the described treating fluid of ejection assigned position, described elevating mechanism makes the bottom surface of described vice processing nozzle for liquid near near the described end face, makes the treating fluid that is coated on described substrate not overflow from described end face.
9. according to the device of claim 1 or 2 or 3, it is characterized in that when described substrate is coated with described treating fluid, described conveyer stops action, and stops described substrate.
10. according to the liquid handling device of one of claim 1 to 9, it is characterized in that in the device of claim 1 or 2 or 3, described nozzle moving mechanism moves described treating fluid nozzle with the speed below the above 500mm/s of 100mm/s on general horizontal direction.
11. a method for treating liquids is characterized in that having:
Substrate is transported to the operation in the liquid handling zone of carrying out liquid handling by the approximate horizontal state;
In described liquid handling zone, stop to transport or the travelling speed of described substrate being reduced to than the slow operation of substrate travelling speed to described liquid handling zone of described substrate;
While making treating fluid nozzle on described substrate, move horizontally the operation of coming described substrate is coated with described treating fluid to the described treating fluid of described substrate ejection from described treating fluid nozzle to described substrate coating treating fluid.
12. method for treating liquids according to claim 11, it is characterized in that, limit speed is in accordance with regulations transported the substrate edge that has been coated with described treating fluid and is sprayed described treating fluid from the fixing treating fluid postinjector to described substrate coating treating fluid, is coated with described treating fluid to described substrate again.
13. method for treating liquids according to claim 11 or 12, it is characterized in that, in the operation of described substrate coating treating fluid, when described treating fluid nozzle arrives near the end face of described substrate of the ejection that will finish described treating fluid, by ending to spray described treating fluid from described treating fluid nozzle, make described treating fluid nozzle near near the described end face simultaneously, the treating fluid that is coated with on described substrate does not overflow from described end face.
14. method for treating liquids according to one of claim 11 to 13, it is characterized in that, in the method for treating liquids of claim 11 or 12, in the operation of described substrate coating treating fluid, spray described treating fluid from described treating fluid nozzle on one side and make described treating fluid nozzle on described substrate, do in the horizontal direction repeatedly to move on one side, described treating fluid is applied on the described substrate.
15. method for treating liquids according to one of claim 11 to 14, it is characterized in that, in the method for treating liquids of claim 11 or 12, in the operation of described substrate coating treating fluid, when moving described treating fluid nozzle by general horizontal direction, spray described treating fluid to the oblique below of the moving direction of described treating fluid nozzle to described treating fluid nozzle.
16. method for treating liquids according to one of claim 11 to 15, it is characterized in that, in the method for treating liquids of claim 11 or 12,, use 2 nozzles to be coated with described treating fluid to described substrate as described treating fluid nozzle in the operation of described substrate coating treating fluid.
17. the device according to claim 1 is characterized in that, also has the conveyer that transports the substrate that resist with exposure-processed films by the approximate horizontal state in one direction,
Spray developer solution while on the direction opposite, moving described treating fluid nozzle with fixing speed from described treating fluid nozzle, make the described resist contact developer solution of filming with the carriage direction of substrate by described nozzle moving mechanism.
18. the device according to claim 1 is characterized in that, also has the fixing developer solution postinjector to the substrate surface coating developer solution that transports by described treating fluid nozzle coating developer solution and by described conveyer.
19. the method according to claim 11 is characterized in that, has:
To have the operation that substrate that the resist of exposure-processed films is transported to the developer solution dispensing area by the approximate horizontal state;
At described developer solution dispensing area, stop to transport or the travelling speed of described substrate being reduced to than to the slow operation of the substrate travelling speed of described developer solution dispensing area of described substrate;
While making developer solution nozzle move horizontally the operation that sprays described developer solution described developer solution of splendid attire on described substrate from described developer solution nozzle on the described substrate to described substrate coating developer solution;
Splendid attire the substrate of described developer solution be transported to the operation that the liquid of removing described developer solution is removed processing region.
20. method according to claim 19, it is characterized in that, after described carrying liquid operation, and before the operation that substrate is transported to described liquid removal processing region, on one side with fixing speed transported splendid attire the substrate of developer solution on one side from fixing developer solution nozzle ejection development liquid, again to described substrate splendid attire developer solution.
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| JP2001204169 | 2001-07-05 | ||
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| CNB021428026A Expired - Fee Related CN100402163C (en) | 2001-07-05 | 2002-07-05 | Liquid treating device and method |
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| JP (1) | JP4643684B2 (en) |
| KR (1) | KR100848928B1 (en) |
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- 2002-06-07 TW TW091112429A patent/TWI226077B/en not_active IP Right Cessation
- 2002-07-04 KR KR1020020038676A patent/KR100848928B1/en not_active IP Right Cessation
- 2002-07-05 CN CNB021428026A patent/CN100402163C/en not_active Expired - Fee Related
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2008
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| CN100405544C (en) * | 2003-06-26 | 2008-07-23 | 东京応化工业株式会社 | Single-line arrangement development processing apparatus and method |
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| CN105651501B (en) * | 2015-12-25 | 2018-04-20 | 广州兴森快捷电路科技有限公司 | The detection method of condition of nozzles under a kind of horizontal line |
| CN107552254A (en) * | 2017-08-08 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | A kind of developing apparatus and developing method |
| CN107976874A (en) * | 2017-11-10 | 2018-05-01 | 江门崇达电路技术有限公司 | A kind of DES lines developing nozzle device and developing method |
| CN110389501A (en) * | 2018-04-20 | 2019-10-29 | 细美事有限公司 | Substrate board treatment |
| CN110389501B (en) * | 2018-04-20 | 2023-02-21 | 细美事有限公司 | Substrate processing apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008219043A (en) | 2008-09-18 |
| TWI226077B (en) | 2005-01-01 |
| KR100848928B1 (en) | 2008-07-29 |
| KR20030005029A (en) | 2003-01-15 |
| CN100402163C (en) | 2008-07-16 |
| JP4643684B2 (en) | 2011-03-02 |
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