JPH0529209A - Sheet-feed type developing device - Google Patents

Abstract

PURPOSE:To eliminate a defective product generating in a development process in a sheet-feed type development device, and to remove the primary factor of detective product generated already in the previous process utilizing the working of a development solution. CONSTITUTION:A function, with which the spray condition (discharge pressure, discharge quantity, discharge direction, etc.) for the spray nozzles 3, 4 and 5 arranged at a plurality of points in the development zone of a sheet-feed type development device can be changed independently for the points 3, 4 and 5 in the development zone, is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sheet feeding type developing apparatus, and more particularly to a sheet feeding type developing apparatus suitable for manufacturing a liquid crystal cell.

[0002]

2. Description of the Related Art Conventionally, in a single-wafer-feed type developing apparatus used in a liquid crystal manufacturing line, the developing solution is supplied from a liquid tank to several PVC pipes having the same number and the same number of nozzles set by one pump. Therefore, the state of the developer sprayed from each nozzle was uniform throughout the developing zone.

[0003]

However, in the above-mentioned conventional example, when the liquid pressure from the nozzle is large, a pinhole is generated in the neutral zone on the inlet side due to the scattering of the developing solution on the substrate. As a countermeasure, it is common to reduce the liquid pressure from the nozzle before use. As a result, it is more difficult to remove the foreign matter in the exposed portion resist that has been mixed in in the previous step or the like by utilizing the liquid condition in the developing step, which is a major factor in causing short circuit between electrodes. Further, when the liquid pressure and the liquid amount above a certain level necessary for replacing the developing solution on the substrate surface are set, it is impossible to completely eliminate the pinhole.

In view of the above-mentioned problems in the conventional example, the object of the present invention is to eliminate the defects that occur in the developing process in the single-wafer-feed type developing device and to utilize the force of the developing solution in the preceding process. The purpose is to make it possible to eliminate the cause of defects that occur in the.

[0005]

In order to achieve the above object, in the present invention, the spray conditions (discharge pressure, discharge amount, discharge direction, etc.) in the development zone are changed independently for each position in the development zone. It is characterized by the provision of a function to be performed.

In a preferred embodiment of the present invention, the spray nozzles are arranged at the inlet side, the central portion and the outlet side in the developing zone, and the inlet side spray nozzle is closer to the surface to be developed surface than the nozzles at other locations. Are placed.

[0007]

In the above construction, for example, when the liquid pressure of the inlet side spray is set low and the liquid pressures of the central part and the outlet side spray are set sufficiently high, the liquid pressure of the inlet side spray is low and the developer is scattered. It is possible to reduce the number of pinholes caused by, and because the liquid pressure of the spray at the center and at the outlet side is sufficiently high, it is possible to remove foreign matter on the surface to be developed and prevent defective development due to the presence of foreign matter.

[0008]

As described above, according to the present invention, the spray state in the developing zone is set to each position at an appropriate condition to reduce the occurrence of pinholes and remove foreign matter on the surface to be developed. It is possible to achieve both.
In particular, when forming electrodes etc. using positive type photoresist on the liquid crystal cell substrate, by removing the foreign matter mixed in the exposed portion of the positive type photoresist, the development failure due to the presence of the foreign matter is prevented. can do. That is, according to the present invention, it becomes possible to eliminate the defects generated in the developing process and to utilize the force of the developing solution to remove the factors of the defects already generated in the previous process.

[0009]

1 and 2 are a top view and a side view schematically showing the structure of a single-wafer-feed type developing apparatus for manufacturing a liquid crystal cell substrate according to an embodiment of the present invention. In the figure, 1 is a substrate as a work supplied on an inloader, 2 and 6 are neutral zones, 3 is an inlet side nozzle, 4 is a central nozzle, 5 is a rear nozzle, 7 is a rinsing zone, and 10 is an arrow image. It is a liquid tank. The white arrow (⇒) indicates the traveling direction of the work 1, and the arrow (→) indicates the circulation direction of the developer.

The inlet-side nozzle 3 is installed near the substrate passage surface, and the liquid pressure is lowered to reduce pinholes due to liquid scattering. The rear nozzle 5 makes the liquid amount and the liquid pressure larger than those of the inlet side nozzle 3 and the central nozzle 4, and further sprays the developing solution in parallel to the direction of the electrodes to be formed on the substrate to remove foreign matters between the electrodes. Make it easier.

In this case, pretreatment for increasing the adhesion strength of the photoresist before applying the photoresist makes it possible to lower the prebaking temperature, which is caused by the sneak of light around the foreign matter during exposure. The reaction is accelerated, development is facilitated, and foreign substances existing in the exposed portion are greatly removed.

FIG. 3 shows another embodiment.

Reference numeral 8 is a developing solution supply port, and 9 is a hydraulic tank for supplying and collecting the developing solution to the inlet side nozzle 3. The new liquid is supplied only to the tank 9 and the inlet side nozzle 3
It is dropped on the surface of the substrate (not shown). The developer that has flowed down from the substrate surface is collected in tanks 9 and 10. Further, the developer that overflows the tank 9 is also stored in the tank 10.
Is supplied to. In the configuration of FIG. 3, by stopping the nozzle 4, it is possible to always develop under a constant condition, and the pre-bake temperature can be lowered, and in addition to the development quality caused by the liquid pressure and the liquid amount of the nozzle 5. Variation can be reduced.

According to the developing device of the above-described embodiment, by increasing the liquid amount only in the latter half of the development, insufficient development due to insufficient liquid movement on the developing surface is eliminated, and by reducing the central spray, high quality is achieved. Excellent development results are obtained.

Further, the number of processed sheets for a fixed amount of liquid is large, and the amount of developing solution per sheet is small.

Further, when the pre-bake temperature is set lower, the exposure and development time can be shortened, and as a result, the line capacity can be improved. In addition, defects such as undeveloped residue and unpeeled residue are reduced.

[Brief description of drawings]

FIG. 1 is a schematic top view of a sheet-feeding type developing device according to an embodiment of the present invention.

FIG. 2 is an explanatory view showing a schematic side surface of the apparatus of FIG. 1 and a flow of a developing solution.

FIG. 3 is an explanatory diagram showing a schematic side surface of a sheet-feeding type developing device according to another embodiment of the present invention and a flow of a developing solution.

[Explanation of symbols]

1: Workpiece (substrate) on inloader, 2, 6: Developing device neutral zone, 3: Inlet side nozzle, 4: Central nozzle, 5: Rear nozzle, 7: Rinse zone, 8: Developer supply port, 9, 10: developer tank

Claims (3)

[Claims] 1. A single-wafer-feed type developing apparatus comprising means for independently setting spray conditions of spray nozzles arranged at a plurality of positions in a developing zone for each position. 2. The spray nozzles are provided at three positions at least on the inlet side, the central part and the outlet side in the developing zone, and the spray nozzles on the inlet side are more developed surface passing surfaces than those on the central part and the outlet side. The developing device according to claim 1, wherein the developing device is disposed in the vicinity of. 3. The developing device according to claim 2, wherein a discharge direction of the spray nozzle on the outlet side is set parallel to a longitudinal direction of a pattern to be formed on the surface to be developed.