JP3934286B2 - Substrate transfer apparatus and substrate processing apparatus - Google Patents

Substrate transfer apparatus and substrate processing apparatus Download PDF

Info

Publication number
JP3934286B2
JP3934286B2 JP25606299A JP25606299A JP3934286B2 JP 3934286 B2 JP3934286 B2 JP 3934286B2 JP 25606299 A JP25606299 A JP 25606299A JP 25606299 A JP25606299 A JP 25606299A JP 3934286 B2 JP3934286 B2 JP 3934286B2
Authority
JP
Japan
Prior art keywords
substrate
contact
roller mechanism
processing
processing liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP25606299A
Other languages
Japanese (ja)
Other versions
JP2001080738A (en
Inventor
暢生 柳沢
真一 石田
健司 碓井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Original Assignee
Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd, Dainippon Screen Manufacturing Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP25606299A priority Critical patent/JP3934286B2/en
Publication of JP2001080738A publication Critical patent/JP2001080738A/en
Application granted granted Critical
Publication of JP3934286B2 publication Critical patent/JP3934286B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PROBLEM TO BE SOLVED: To reduce a flowout of processing liquid for performing a treatment by forming the layer of the processing liquid on a substrate in a conveyance configuration using rollers. SOLUTION: This roller mechanism conveys a substrate 8 using a plurality of rotating members 111. Supporting rollers 113 are disposed so as to be not in contact with both end parts of the substrate 8 on the sides vertical relative to a transfer direction 11A. Also, the substrate is disposed so that both end parts of the substrate 8 on the transfer direction 11A side do not ride on any supporting roller 113 at a stop position of the substrate 8. Thus the processing liquid put on the substrate 8 can be suppressed from flowing out along the supporting rollers 113.

Description

【0001】
【発明の属する技術分野】
この発明は、液晶ディスプレイやプラズマディスプレイ用のガラス基板、半導体デバイス製造用の半導体基板、配線が形成されるプリント基板等の各種基板上に処理液の層を形成して処理を行う基板処理装置および基板処理装置に利用される基板搬送装置に関する。
【0002】
【従来の技術】
液晶ディスプレイの製造に用いられるガラス基板を搬送する際に、従来より、基板の端面を支持するローラを用いて基板を搬送するという手法が用いられている。図10は、回転軸91に2つの端面支持ローラ92および中央支持ローラ93が設けられた1つの回転部材9の例を示す図であり、このような回転部材9が基板8の搬送方向(図10では紙面に垂直な方向)に沿って多数並べられることにより基板8の搬送のためのローラ機構が構成される。
【0003】
図10に示す回転部材9の場合、基板8を搬送する際に2つの端面支持ローラ92が基板8の両端部81を下方から支持するとともに、端面支持ローラ92の鍔部921が基板8の端面の位置を規制する。すなわち、搬送方向に対して垂直な方向に位置する基板8の両端面が鍔部921と当接することにより、基板8の搬送方向に垂直な方向の位置決めが行われる。
【0004】
【発明が解決しようとする課題】
ところが、処理の種類によってはこのような基板の支持方法が基板処理に悪影響を与える場合がある。例えば、表面張力を利用して基板8上に現像液を盛って現像を行う場合、基板8の端部81から端面支持ローラ92を伝って矢印811にて示すように現像液がこぼれることがある。エッチング、レジスト剥離、洗浄等に用いられるその他の処理液を基板8上に盛る場合についても同様である。
【0005】
さらに、基板8を端面支持ローラ92にて支持する場合、重力とローラからの反力とを受けて基板8が撓むという問題が生じる。図10では、撓みを緩和するために基板8の中央下方に中央支持ローラ93を設けているが、このような構成であっても中央支持ローラ93と基板8との接触面積が小さいと端面支持ローラ92と中央支持ローラ93との間で基板8が下方へ撓む。
【0006】
したがって、基板8上に処理液の層を形成しつつ処理を行う場合には、処理液が基板8の撓みに応じて移動し、図10に示すように処理液82の層が部分的に厚くなる。その結果、処理液82が集まる領域では基板8の搬送方向側の端面から矢印812にて示すように処理液82がこぼれてしまうという問題が生じる。
【0007】
一方、基板8が搬送経路上にて停止した際に基板8と回転部材9との位置関係によっては、基板8上の処理液がローラを伝って流れ落ちる可能性もある。図11はこのような状態を例示する図であり、基板8の搬送方向83(紙面の左から右への方向)側の端部84がある回転部材9上に位置する状態で基板8の搬送が停止した様子を示している。図11に示す状態では、基板8上の処理液82が回転部材9の端面支持ローラ92のみならず中央支持ローラ93をも介して矢印813にて示すように搬送方向側の端部84(搬送方向の反対側の端部も同様である。)から流れ落ちてしまう。
【0008】
基板に処理液を盛る処理における処理液の流出原因となる要素はローラ以外にも存在する。図12は接触式センサ94により基板8上の処理液82がこぼれ落ちる様子を示す図である。なお、図12では回転部材9の図示を省略している。図12に示すように基板8が搬送方向83に向かって搬送される場合に、基板8の搬送方向側の端部84が接触式センサ94の振り子941に接触し、これにより基板8の搬送が停止すると基板8と振り子941とは接触したままの状態となる。その結果、端部84から処理液82が振り子941を伝って矢印814にて示すようにこぼれ落ちる。
【0009】
以上のように、従来より、基板上に処理液の層(いわゆる、パドル)を形成しつつ処理を行う場合においてローラにより基板を搬送としようとすると、様々な原因に基づいて処理液がこぼれてしまい処理液の層を維持することができないという問題があった。すなわち、このような処理を行う際にはローラを用いた搬送形態を利用することができなかった。
【0010】
しかしながら、ローラ搬送は基板を安定して搬送することができるとともに他の処理装置においても用いられており、基板上に処理液の層を形成して行われる処理は処理液の消費量を低減することができるという長所を有することから、基板上に処理液の層を形成する処理をローラ機構上にて実現したいという要望も高まっている。
【0011】
そこで、この発明は上記様々な課題に鑑みなされたものであり、ローラを用いる搬送形態において、基板上の処理液の流出を減少させることを目的としている。
【0012】
【課題を解決するための手段】
請求項1の発明は、上面に処理液の層が形成される水平姿勢の基板を搬送する基板搬送装置であって、搬送方向に並べられた複数の回転部材にそれぞれ設けられ、搬送方向に対して垂直方向側の前記基板の両端部に非接触であり、円筒形状の複数のローラにより、その上面に処理液の層が形成された前記基板を下方から線接触しつつ支持するローラ機構と、前記ローラ機構を駆動することにより前記基板を前記搬送方向へと搬送する駆動手段と、前記ローラ機構により前記基板を下方から支持しつつ前記搬送方向へと所定の距離だけ搬送させた後、前記搬送方向における前記基板の先端および後端の下方に前記いずれのローラも位置しない停止位置にて前記基板を所定の時間だけ停止させるように前記駆動手段を制御する制御手段と、を備え、前記停止位置は、前記基板の先端および後端が互いに隣接する前記回転部材の中心間の領域から所定のマージンを除いた領域に位置するような位置である
【0015】
請求項の発明は、請求項に記載の基板搬送装置であって、前記駆動手段によって搬送される前記基板の先端と接触することにより前記基板の位置を検出する接触式センサをさらに備え、前記停止位置が、前記接触式センサと前記基板の先端とが接触する位置を通り過ぎた位置である。
【0016】
請求項の発明は、水平姿勢の基板の上面に処理液の層を形成しつつ前記基板に処理を施す基板処理装置であって、前記基板の上面に処理液を供給して前記上面に処理液の層を形成する処理液供給手段と、搬送方向に並べられた複数の回転部材にそれぞれ設けられ、搬送方向に対して垂直方向側の前記基板の両端部に非接触であり、円筒形状の複数のローラにより前記処理液供給手段によりその上面に処理液の層が形成された前記基板を下方から線接触しつつ支持するローラ機構と、前記ローラ機構を駆動することにより前記基板を前記搬送方向へと搬送する駆動手段と、前記ローラ機構により前記基板を下方から支持しつつ前記搬送方向へと所定の距離だけ搬送させた後、前記搬送方向における前記基板の先端および後端の下方に前記いずれのローラも位置しない停止位置にて前記基板を所定の時間だけ停止させるように前記駆動手段を制御する制御手段と、を備え、前記停止位置は、前記基板の先端および後端が互いに隣接する前記回転部材の中心間の領域から所定のマージンを除いた領域に位置するような位置である
請求項4の発明は、請求項3に記載の基板処理装置であって、前記駆動手段によって搬送される前記基板の先端と接触することにより前記基板の位置を検出する接触式センサ、をさらに備え、前記停止位置が、前記接触式センサと前記基板の先端とが接触する位置を通り過ぎた位置である。
【0017】
【発明の実施の形態】
図1はこの発明の一の実施の形態である基板処理装置1の構成を簡略化して示す縦断面図である。基板処理装置1は液晶ディスプレイに用いられる矩形のガラス基板(以下、「基板」という。)8に現像処理を行う装置であり、基板8をローラを用いて矢印11Aの方向に搬送するローラ機構11、搬送される基板8の位置を検出する接触式センサ12、現像液である処理液82を吐出して基板8に供給するノズル21、使用済みの現像液を回収する回収容器22、基板8の処理空間を形成する処理室(チャンバ)23、および、装置1の動作を制御する制御部31を有する。なお、基板処理装置1は、ローラ機構11、接触式センサ12および制御部31を有する基板搬送装置と、ノズル21、回収容器22および制御部31を有する処理部とを組み合わせた構成と捉えることもできる。
【0018】
ローラ機構11は、ローラを有する複数の回転部材111を搬送方向に並べることにより基板8の搬送経路を形成する機構であり、複数の回転部材111の幾つかがモータ(後出の図7の符号13参照)により回転することで、回転部材111上の基板8が矢印11Aの方向に搬送される。
【0019】
図2はローラ機構11を構成する複数の回転部材111のうちのひとつを搬送方向側から見た様子を示す図であり、図3は複数の回転部材111上を水平姿勢にて矢印11Aの方向に移動する基板8(想像線にて示す。)を上方から見た様子を示す図である。図2に示すように回転部材111は回転軸112に3つの支持ローラ113を設けた構成となっており、各支持ローラ113は回転軸112を中心軸とする円筒形状となっている。したがって、各支持ローラ113は基板8の下面と線接触する。
【0020】
基板処理装置1では、支持ローラ113を円筒形状とすることにより、基板8の下面との接触面積を大きくし、基板8に生じる応力の低減を図っている。その結果、図10に示すように基板8が大きく撓むことが防止され、基板8上の処理液82が偏ることによる処理液82の流出を可能な限り防止するようになっている。
【0021】
また、これらの支持ローラ113は基板8の搬送方向に垂直な方向に対して、基板8の両端部81(図2参照)よりも内側に位置している。すなわち、支持ローラ113上に基板8の端面が位置しないようになっている。したがって、基板8上の処理液82が両端部81から支持ローラ113を伝わって流れ落ちることもない。
【0022】
図1に示す接触式センサ12は、搬送経路上に配置されて基板8の位置を検出するためのものであり、接触式センサ12の振り子121が搬送されてきた基板8の先端と接触することにより振り子121が傾き、基板8の存在位置が検出される。
【0023】
ノズル21は搬送方向に垂直な方向(すなわち、紙面に垂直な方向)に伸びるスリットを有するスリット型のノズルであり、基板8がノズル21の下方を矢印11Aにて示す方向に搬送されてくる際に処理液82をカーテン状に吐出し、基板8上に処理液の層(いわゆる、パドル)を形成する役割を果たす。このように、基板処理装置1ではローラ機構11を駆動するとともにノズル21から処理液82を吐出して基板8上に処理液82の層を形成し、これにより、基板8の上面に処理を施すようになっている。
【0024】
なお、処理液82の層が形成された基板8は接触式センサ12による位置検出に基づいてローラ機構11上にて一旦停止し(詳細については後述)、所定時間放置されることにより現像処理が行われる。
【0025】
回収容器22は使用済みの処理液を回収する容器であり、処理済みの基板8を回収容器22上にて進行方向を向く軸を中心に傾けることにより、基板8上の処理液82が回収容器22へと流れ落ちる。処理液82の大部分が除去された基板8は傾斜姿勢のままローラ機構11上を搬送されて次工程の処理装置へと送られる。
【0026】
処理室23は、ノズル21、回収容器22等を収容して基板処理装置1の外形を形成するものであり、処理中の基板8へのゴミの付着を防止するとともに基板処理装置1外部の汚染の防止の役割を果たす。
【0027】
制御部31は基板処理装置1の全体動作を制御する部位であり、接触式センサ12等からの信号が入力されるとともに、ローラ機構11の駆動制御、ノズル21からの処理液82の吐出制御、基板8を傾ける動作の制御等の基板処理に係る様々な制御を行う。
【0028】
次に、基板処理装置1の動作について説明する。図4は基板処理装置1の動作の流れを示す流れ図である。
【0029】
まず、制御部31がローラ機構11を制御することにより前工程からの基板8を処理室23の搬入口から処理室23内へと搬入する(ステップS11)。このとき、ノズル21から処理液82が連続的に吐出されており、基板8の先端がノズル21の下方に差し掛かると基板8の上面には搬送方向側の先端から順次処理液82が盛られていく(ステップS12)。図1はこのときの様子を示した図である。
【0030】
さらに基板8が搬送されると、図5に示すように搬送方向側の基板8の端部84が接触式センサ12の振り子121と接触し、接触式センサ12から制御部31へと信号が送られる(ステップS13)。また、接触式センサ12による基板8の検出に前後して、基板8の後端がノズル21の下方を通過する。これにより、基板8の上面全体に表面張力を利用して処理液82が盛られた状態となる。
【0031】
基板8はさらに搬送され、接触式センサ12から制御部31へと信号が送られてから所定の距離だけ基板8が移動した後、基板8の搬送が停止される(ステップS14)。すなわち、搬送経路上の基板8の停止位置は、接触式センサ12と基板8とが接触する位置(図5)を通り過ぎた位置となる。図6は搬送が一時的に停止したときの基板8の様子を示す図である。
【0032】
基板8が搬送経路上にて停止する際には、図6に示すように基板8の先端および後端の下方にローラ機構11のいずれの回転部材111も位置しないように(すなわち、先端および後端が支持ローラ113に乗り上げないように)基板8の停止位置が制御部31により制御される。既に示した図3は図6に示す状態における基板8と回転部材111との位置関係を示すものであり、図3に示すように基板8が停止した状態では基板8の外周部の全てがいずれの支持ローラ113とも接しない状態となる。したがって、基板8が停止した状態において、基板8上の処理液82が支持ローラ113を伝って流れ落ちることはない。
【0033】
また、図6に示すように基板8の停止位置は接触式センサ12と基板8とが接触する位置を通り過ぎた位置であることから、停止位置において接触式センサ12の振り子121と基板8の端部84とが接触する状態とはならず、振り子121を伝って基板8上の処理液82が流れ落ちるという問題も生じない。
【0034】
基板8の搬送の停止は所定の時間だけ行われ(ステップS15)、この間に基板8の上面の現像処理が進行する。その後、基板8が進行方向を向く軸を中心に傾けられ、基板8上の処理液82が除去されて回収容器22へと回収される(ステップS16)。
【0035】
処理液82の回収が完了すると基板8は傾斜姿勢のまま搬出口から処理室23外へと搬出される。搬出された基板8は次工程の洗浄装置へと導かれる(ステップS17)。
【0036】
図7は、基板8が停止した状態(図6)における回転部材111、接触式センサ12および基板8の位置関係を説明するための図である。なお、図7では基板8の進行方向側の端部84を拡大して示しており、図1にて省略したローラ機構11の駆動源であるモータ13も図示している。モータ13は幾つかの回転部材111と歯車やベルトにより接続され、回転部材111に回転力を与える駆動源となっている。
【0037】
上記説明では、基板8が停止した状態では基板8の進行方向側の端部84はいずれの回転部材111(支持ローラ113)にも接しないと説明したが、厳密には、図7における互いに隣接する2つの回転部材111a,111bの中心間の領域から僅かなマージンR1,R2を除いた領域R3に位置する。これは、処理液82がこぼれた際に回転部材111と基板8の端部84(端面)とが近接していると、回転部材111を伝って連続的に処理液82が流出する可能性があるからである。
【0038】
すなわち、マージンR1,R2は仮に処理液82が搬送時の振動によりこぼれたとしても、回転部材111との間で処理液82の連続的な流れが生じない距離として定められる。これにより、制御部31の制御による基板8の停止位置では、基板8の端部84と回転部材111とが実質的に接するという状態が回避される。なお、進行方向と反対側の端部も停止状態において互いに隣接する2つの回転部材111の間の領域から僅かなマージンを除いた領域に位置する。また、基板8の停止位置における接触式センサ12の振り子121と基板8の端部84との位置関係も実質的に接しない位置関係とされる。同様に、図2における基板8の両端部81と支持ローラ113との位置関係も実質的に接しない位置関係とされる。
【0039】
以上のように、基板処理装置1では支持ローラ113が搬送方向に垂直な方向側の基板8の両端部の下方に位置せず、これらの両端部がローラ機構11と非接触にて基板8が支持される。したがって、搬送方向に対して垂直方向側の両端部から処理液82がこぼれ落ちることを最小限に抑えることができる。
【0040】
また、基板処理装置1では処理液82が盛られた水平姿勢の基板8が搬送途上で停止する際に、搬送方向に対する両端部と回転部材111とが接しない状態とされる。これにより、停止位置において基板8の外周部が全ての支持ローラ113と非接触の状態とされ、基板8の外周部から支持ローラ113を介して処理液82が流出することが抑えられる。
【0041】
また、各支持ローラ113は円筒形状となっており基板8の下面と線接触し、ローラ機構11上の基板8の撓みが抑えられる。これにより、基板8の処理液82の分布の偏りが防止され、基板8上の処理液82が搬送方向に対応する両端部からこぼれ落ちる量を減少させることができる。また、基板8と支持ローラ113との接触面積が大きいことから基板8の搬送もより安定して行うことができる。
【0042】
さらに、基板8の停止位置は接触式センサ12と接触する位置を通り過ぎた位置であることから、基板8上の処理液82が接触式センサ12を伝って流出する量を最小限に抑えることができる。
【0043】
このように基板処理装置1では基板8上から流出する処理液82の量を減少させることができる。
【0044】
以上、この発明に係る基板処理装置1について説明してきたが、この発明は上記実施の形態に限定されるものではなく様々な変形が可能である。
【0045】
例えば、図2では回転軸112に3つの円筒形状の支持ローラ113を有する回転部材111を示したが、図8に示すように1つの円筒形の支持ローラ113aが回転軸112に設けられてもよい。これにより、基板8に生じる撓みをより減少させることができる。なお、基板8の下面は別途設けられた洗浄手段により適宜洗浄される。
【0046】
また、上記実施の形態では基板8に処理液82として現像液を盛ることで現像処理を行うようになっているが、行われる処理は現像処理に限定されるものではなく、エッチング、レジスト剥離、水洗、薬液洗浄等であってもよい。すなわち、処理液をエッチング液、レジスト剥離液、純水、洗浄薬液等に適宜変更することにより、これらの処理を行う基板処理装置とすることができる。
【0047】
また、上記実施の形態ではノズル21からカーテン状に処理液82と吐出するとともに基板8を搬送することにより、基板8の上面全体に処理液82の層が形成されるようになっているが、処理液82の層の形成方法はどのようなものであってもよい。例えば、基板8が所定の停止位置に位置した後、ノズル21が基板8の搬送方向に沿って移動するようになっていてもよいし、ノズル21をスプレー方式のノズルとして基板8を搬送しつつノズル21を搬送方向に垂直な方向に揺動させてもよい。すなわち、本発明は上面に処理液の層が形成される基板の搬送に関するものであり、処理液の層が形成されるタイミングは基板の搬送動作中であっても基板の搬送停止中であってもよい。
【0048】
また、上記実施の形態では液晶ディスプレイ用のガラス基板を処理する基板処理装置1を例に採り上げたが、処理される基板8はPDP等の他のFPDに用いられるガラス基板であってもよく、半導体基板やプリント基板等であってもよい。図9は搬送の停止位置における半導体基板8aと複数の回転部材111との位置関係の例を示す図である。図9に示すように基板の形状は矩形に限定されるものではなく、略円形やその他の複雑な形状であっても支持ローラ113の大きさおよび位置を適宜調整することによりこの発明を利用することができる。
【0049】
【発明の効果】
請求項1または3に記載の発明では、基板上の処理液の流出量の低減を図ることができる。
【0050】
また、請求項2または4に記載の発明では、基板上の処理液の流出をさらに抑えることができる。
【図面の簡単な説明】
【図1】この発明の一の実施の形態に係る基板処理装置の構成の概略を示す縦断面図である。
【図2】回転部材および基板を搬送方向側から見たときの様子を示す図である。
【図3】回転部材および基板を上側から見たときの様子を示す図である。
【図4】基板処理装置の動作の流れを示す流れ図である。
【図5】動作中の基板処理装置のある時点での様子を示す図である。
【図6】動作中の基板処理装置のある時点での様子を示す図である。
【図7】基板の搬送が停止した状態での基板の先端近傍を拡大して示す図である。
【図8】支持ローラの他の形態を示す図である。
【図9】搬送の停止位置において回転部材および半導体基板を上側から見たときの様子を示す図である。
【図10】従来の回転部材の形態を示す図である。
【図11】従来の基板処理装置における基板の停止位置と回転部材との位置関係を示す図である。
【図12】従来の基板処理装置における基板の停止位置と接触式センサとの位置関係を示す図である。
【符号の説明】
1 基板処理装置
8,8a 基板
11 ローラ機構
11A 矢印
12 接触式センサ
13 モータ
21 ノズル
31 制御部
81 端部
82 処理液
84 端部
113,113a 支持ローラ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for forming a processing liquid layer on various substrates such as a glass substrate for a liquid crystal display and a plasma display, a semiconductor substrate for manufacturing a semiconductor device, and a printed circuit board on which wiring is formed, and a substrate processing apparatus. The present invention relates to a substrate transfer device used in a substrate processing apparatus.
[0002]
[Prior art]
Conventionally, when a glass substrate used for manufacturing a liquid crystal display is transported, a method of transporting the substrate using a roller that supports an end surface of the substrate has been used. FIG. 10 is a diagram showing an example of one rotating member 9 in which two end surface support rollers 92 and a central support roller 93 are provided on the rotating shaft 91. Such a rotating member 9 is in the transport direction of the substrate 8 (FIG. 10). 10, a roller mechanism for transporting the substrate 8 is configured by being arranged in a large number along the direction perpendicular to the paper surface.
[0003]
In the case of the rotating member 9 shown in FIG. 10, when transporting the substrate 8, the two end surface support rollers 92 support the both end portions 81 of the substrate 8 from below, and the flange portions 921 of the end surface support roller 92 are the end surfaces of the substrate 8. Regulate the position of That is, both end surfaces of the substrate 8 positioned in a direction perpendicular to the transport direction are in contact with the flange portion 921, thereby positioning the substrate 8 in a direction perpendicular to the transport direction.
[0004]
[Problems to be solved by the invention]
However, depending on the type of processing, such a substrate support method may adversely affect the substrate processing. For example, when developing with the developer applied on the substrate 8 using surface tension, the developer may spill from the end portion 81 of the substrate 8 through the end surface support roller 92 as indicated by an arrow 811. . The same applies to the case where other processing liquids used for etching, resist peeling, cleaning, etc. are deposited on the substrate 8.
[0005]
Further, when the substrate 8 is supported by the end surface support roller 92, there arises a problem that the substrate 8 bends due to gravity and a reaction force from the roller. In FIG. 10, a central support roller 93 is provided below the center of the substrate 8 in order to alleviate the bending. However, even in such a configuration, if the contact area between the central support roller 93 and the substrate 8 is small, end surface support is provided. The substrate 8 bends downward between the roller 92 and the center support roller 93.
[0006]
Therefore, when processing is performed while forming a layer of the processing liquid on the substrate 8, the processing liquid moves according to the bending of the substrate 8, and the layer of the processing liquid 82 is partially thick as shown in FIG. Become. As a result, there arises a problem that in the region where the processing liquid 82 is collected, the processing liquid 82 spills from the end surface on the transport direction side of the substrate 8 as indicated by an arrow 812.
[0007]
On the other hand, depending on the positional relationship between the substrate 8 and the rotating member 9 when the substrate 8 stops on the transport path, the processing liquid on the substrate 8 may flow down along the roller. FIG. 11 is a diagram illustrating such a state, in which the substrate 8 is transported in a state where the end portion 84 on the side of the transport direction 83 (the direction from the left to the right of the paper surface) of the substrate 8 is located on the rotating member 9. Shows a state where has stopped. In the state shown in FIG. 11, the treatment liquid 82 on the substrate 8 is conveyed not only on the end surface support roller 92 of the rotating member 9 but also on the center support roller 93 as indicated by an arrow 813 on the end 84 (conveyance side). The same applies to the end opposite to the direction.)
[0008]
In addition to the rollers, there are other factors that cause the processing liquid to flow out in the processing of depositing the processing liquid on the substrate. FIG. 12 is a diagram illustrating a state in which the processing liquid 82 on the substrate 8 is spilled by the contact sensor 94. In addition, illustration of the rotation member 9 is abbreviate | omitted in FIG. As shown in FIG. 12, when the substrate 8 is transported in the transport direction 83, the end portion 84 on the transport direction side of the substrate 8 contacts the pendulum 941 of the contact sensor 94, thereby transporting the substrate 8. When stopped, the substrate 8 and the pendulum 941 remain in contact with each other. As a result, the treatment liquid 82 spills down from the end portion 84 along the pendulum 941 as indicated by an arrow 814.
[0009]
As described above, conventionally, when processing is performed while forming a layer of processing liquid (so-called paddle) on a substrate, the processing liquid spills due to various causes when the substrate is transferred by a roller. There was a problem that the layer of the treatment liquid could not be maintained. That is, when carrying out such processing, it has not been possible to use a conveyance form using rollers.
[0010]
However, the roller conveyance can stably convey the substrate and is also used in other processing apparatuses, and the processing performed by forming a layer of the processing liquid on the substrate reduces the consumption of the processing liquid. Since it has the advantage that it can be performed, there is an increasing demand for realizing a process for forming a layer of a processing solution on a substrate on a roller mechanism.
[0011]
Accordingly, the present invention has been made in view of the above-described various problems, and an object thereof is to reduce the outflow of the processing liquid on the substrate in a transport mode using a roller.
[0012]
[Means for Solving the Problems]
The invention according to claim 1 is a substrate transport apparatus for transporting a substrate in a horizontal posture in which a layer of a processing solution is formed on the upper surface, and is provided on each of a plurality of rotating members arranged in the transport direction , with respect to the transport direction. contactless der to both ends of the substrate in the vertical direction Te is, a plurality of cylindrical roller, a roller mechanism which supports while line contact with said substrate a layer of treatment liquid has been formed on the upper surface from the lower Driving the roller mechanism to drive the substrate in the transport direction; and supporting the substrate from below by the roller mechanism and transporting the substrate in the transport direction by a predetermined distance; and a control means for controlling said drive means so as to stop the substrate for a predetermined time at a stop position without the positioned either of the rollers below the leading end and the trailing end of the substrate in the conveying direction The stop position is a position such as to be located in a region other than a predetermined margin from the area between the centers of the rotating members leading and trailing ends of the substrate are adjacent to each other.
[0015]
Invention of Claim 2 is a board | substrate conveyance apparatus of Claim 1 , Comprising: The contact-type sensor which detects the position of the said board | substrate by contacting the front-end | tip of the said board | substrate conveyed by the said drive means is further provided, The stop position is a position that has passed a position where the contact sensor and the tip of the substrate are in contact with each other.
[0016]
The invention according to claim 3 is a substrate processing apparatus for performing processing on the substrate while forming a layer of processing liquid on the upper surface of the substrate in a horizontal position, and supplying the processing liquid to the upper surface of the substrate to process the upper surface. a treatment liquid supply means for forming a layer of liquid, provided on each of the plurality of rotary members which are arranged in the conveying direction, Ri contactless der to both ends of the substrate in the vertical direction relative to the conveying direction, a cylindrical shape conveying a plurality of rollers by the treatment liquid roller mechanism which supports while contacting line of the substrate a layer of treatment liquid has been formed on the upper surface thereof from below by a supply means, said substrate by driving the roller mechanism the Driving means for transporting in the direction, and transporting the substrate by a predetermined distance in the transport direction while supporting the substrate from below by the roller mechanism, and then below the front and rear ends of the substrate in the transport direction. Izu Control means for controlling the driving means so as to stop the substrate for a predetermined time at a stop position where no roller is located, and the stop position is such that the front end and the rear end of the substrate are adjacent to each other. The position is such that it is located in a region excluding a predetermined margin from the region between the centers of the rotating members .
According to a fourth aspect of the present invention, there is provided the substrate processing apparatus according to the third aspect, further comprising a contact-type sensor that detects a position of the substrate by contacting a tip of the substrate conveyed by the driving unit. The stop position is a position that has passed a position where the contact sensor and the tip of the substrate are in contact with each other.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a longitudinal sectional view showing a simplified configuration of a substrate processing apparatus 1 according to an embodiment of the present invention. The substrate processing apparatus 1 is an apparatus that performs development processing on a rectangular glass substrate (hereinafter referred to as “substrate”) 8 used in a liquid crystal display, and a roller mechanism 11 that conveys the substrate 8 in the direction of an arrow 11A using a roller. The contact type sensor 12 for detecting the position of the substrate 8 to be transported, the nozzle 21 for discharging the processing liquid 82 as a developing solution and supplying it to the substrate 8, the collection container 22 for collecting the used developing solution, A processing chamber (chamber) 23 that forms a processing space and a control unit 31 that controls the operation of the apparatus 1 are provided. The substrate processing apparatus 1 may be regarded as a configuration in which the substrate transport device having the roller mechanism 11, the contact sensor 12 and the control unit 31 and the processing unit having the nozzle 21, the recovery container 22 and the control unit 31 are combined. it can.
[0018]
The roller mechanism 11 is a mechanism that forms a transport path of the substrate 8 by arranging a plurality of rotating members 111 having rollers in the transport direction, and some of the plurality of rotating members 111 are motors (reference numerals in FIG. 7 described later). 13), the substrate 8 on the rotating member 111 is conveyed in the direction of the arrow 11A.
[0019]
FIG. 2 is a diagram showing a state in which one of the plurality of rotating members 111 constituting the roller mechanism 11 is viewed from the conveying direction side, and FIG. 3 is a direction of an arrow 11A in a horizontal posture on the plurality of rotating members 111. It is a figure which shows a mode that the board | substrate 8 (it shows with an imaginary line) which moves to (3) was seen from upper direction. As shown in FIG. 2, the rotating member 111 has a configuration in which three supporting rollers 113 are provided on a rotating shaft 112, and each supporting roller 113 has a cylindrical shape with the rotating shaft 112 as a central axis. Accordingly, each support roller 113 is in line contact with the lower surface of the substrate 8.
[0020]
In the substrate processing apparatus 1, the support roller 113 has a cylindrical shape, thereby increasing the contact area with the lower surface of the substrate 8 and reducing the stress generated in the substrate 8. As a result, as shown in FIG. 10, the substrate 8 is prevented from being greatly bent, and the outflow of the processing liquid 82 due to the biasing of the processing liquid 82 on the substrate 8 is prevented as much as possible.
[0021]
Further, these support rollers 113 are located on the inner side of both end portions 81 (see FIG. 2) of the substrate 8 with respect to the direction perpendicular to the conveyance direction of the substrate 8. That is, the end surface of the substrate 8 is not positioned on the support roller 113. Therefore, the processing liquid 82 on the substrate 8 does not flow down from the both ends 81 along the support roller 113.
[0022]
The contact sensor 12 shown in FIG. 1 is arranged on the transport path to detect the position of the substrate 8, and the pendulum 121 of the contact sensor 12 contacts the tip of the substrate 8 that has been transported. As a result, the pendulum 121 is tilted, and the position of the substrate 8 is detected.
[0023]
The nozzle 21 is a slit-type nozzle having a slit extending in a direction perpendicular to the transport direction (that is, a direction perpendicular to the paper surface), and the substrate 8 is transported below the nozzle 21 in the direction indicated by the arrow 11A. Then, the processing liquid 82 is ejected in the form of a curtain to form a processing liquid layer (so-called paddle) on the substrate 8. As described above, the substrate processing apparatus 1 drives the roller mechanism 11 and discharges the processing liquid 82 from the nozzle 21 to form a layer of the processing liquid 82 on the substrate 8, thereby processing the upper surface of the substrate 8. It is like that.
[0024]
The substrate 8 on which the layer of the processing liquid 82 is formed temporarily stops on the roller mechanism 11 based on position detection by the contact sensor 12 (details will be described later), and is left for a predetermined time to perform development processing. Done.
[0025]
The recovery container 22 is a container for recovering the used processing liquid, and the processing liquid 82 on the substrate 8 is recovered from the recovery container 22 by tilting the processed substrate 8 about the axis in the traveling direction on the recovery container 22. It flows down to 22. The substrate 8 from which most of the processing liquid 82 has been removed is conveyed on the roller mechanism 11 while being tilted, and is sent to the processing apparatus of the next process.
[0026]
The processing chamber 23 accommodates the nozzle 21, the recovery container 22, and the like to form the outer shape of the substrate processing apparatus 1, prevents dust from adhering to the substrate 8 during processing, and contaminates the outside of the substrate processing apparatus 1. Play a role in preventing.
[0027]
The control unit 31 is a part that controls the overall operation of the substrate processing apparatus 1. A signal from the contact sensor 12 or the like is input to the control unit 31, drive control of the roller mechanism 11, discharge control of the processing liquid 82 from the nozzle 21, Various controls related to substrate processing such as control of the operation of tilting the substrate 8 are performed.
[0028]
Next, the operation of the substrate processing apparatus 1 will be described. FIG. 4 is a flowchart showing an operation flow of the substrate processing apparatus 1.
[0029]
First, the control unit 31 controls the roller mechanism 11 to carry the substrate 8 from the previous process into the processing chamber 23 from the inlet of the processing chamber 23 (step S11). At this time, the processing liquid 82 is continuously discharged from the nozzle 21, and when the front end of the substrate 8 reaches below the nozzle 21, the processing liquid 82 is sequentially stacked on the upper surface of the substrate 8 from the front end in the transport direction. (Step S12). FIG. 1 is a diagram showing the situation at this time.
[0030]
When the substrate 8 is further transported, as shown in FIG. 5, the end portion 84 of the substrate 8 on the transport direction side contacts the pendulum 121 of the contact sensor 12, and a signal is transmitted from the contact sensor 12 to the control unit 31. (Step S13). Further, the rear end of the substrate 8 passes under the nozzle 21 before and after the detection of the substrate 8 by the contact sensor 12. As a result, the processing liquid 82 is deposited on the entire top surface of the substrate 8 using surface tension.
[0031]
The substrate 8 is further transported, and after the signal is sent from the contact sensor 12 to the control unit 31, the substrate 8 is moved by a predetermined distance, and then the transport of the substrate 8 is stopped (step S14). That is, the stop position of the substrate 8 on the transport path is a position that has passed the position where the contact sensor 12 and the substrate 8 are in contact (FIG. 5). FIG. 6 is a diagram illustrating a state of the substrate 8 when the conveyance is temporarily stopped.
[0032]
When the substrate 8 stops on the transport path, as shown in FIG. 6, the rotating member 111 of the roller mechanism 11 is not positioned below the front end and the rear end of the substrate 8 (that is, the front end and the rear end). The stop position of the substrate 8 is controlled by the control unit 31 (so that the end does not ride on the support roller 113). FIG. 3 already shown shows the positional relationship between the substrate 8 and the rotating member 111 in the state shown in FIG. 6, and when the substrate 8 is stopped as shown in FIG. It will be in the state which does not contact the support roller 113 of this. Therefore, when the substrate 8 is stopped, the processing liquid 82 on the substrate 8 does not flow down along the support roller 113.
[0033]
Further, as shown in FIG. 6, the stop position of the substrate 8 is a position past the position where the contact sensor 12 and the substrate 8 are in contact with each other. Therefore, the pendulum 121 of the contact sensor 12 and the end of the substrate 8 are stopped at the stop position. The portion 84 does not come into contact with the portion 84, and the problem that the processing liquid 82 on the substrate 8 flows down through the pendulum 121 does not occur.
[0034]
The conveyance of the substrate 8 is stopped for a predetermined time (step S15), and during this time, development processing of the upper surface of the substrate 8 proceeds. Thereafter, the substrate 8 is tilted about an axis that faces the traveling direction, and the processing liquid 82 on the substrate 8 is removed and recovered into the recovery container 22 (step S16).
[0035]
When the collection of the treatment liquid 82 is completed, the substrate 8 is carried out of the treatment chamber 23 from the carry-out port in an inclined posture. The board | substrate 8 carried out is guide | induced to the washing | cleaning apparatus of the next process (step S17).
[0036]
FIG. 7 is a view for explaining the positional relationship among the rotating member 111, the contact sensor 12 and the substrate 8 when the substrate 8 is stopped (FIG. 6). In FIG. 7, the end portion 84 on the traveling direction side of the substrate 8 is shown in an enlarged manner, and the motor 13 that is a drive source of the roller mechanism 11 omitted in FIG. 1 is also shown. The motor 13 is connected to several rotating members 111 through gears and belts, and serves as a drive source that applies a rotational force to the rotating member 111.
[0037]
In the above description, when the substrate 8 is stopped, the end portion 84 on the traveling direction side of the substrate 8 is not in contact with any rotating member 111 (supporting roller 113), but strictly speaking, adjacent to each other in FIG. It is located in a region R3 excluding slight margins R1, R2 from the region between the centers of the two rotating members 111a, 111b. This is because if the rotating member 111 and the end portion 84 (end surface) of the substrate 8 are close to each other when the processing liquid 82 is spilled, the processing liquid 82 may flow continuously through the rotating member 111. Because there is.
[0038]
That is, the margins R1 and R2 are determined as distances at which a continuous flow of the processing liquid 82 does not occur between the rotating member 111 even if the processing liquid 82 is spilled due to vibration during conveyance. Thereby, in the stop position of the board | substrate 8 by control of the control part 31, the state that the edge part 84 of the board | substrate 8 and the rotation member 111 contact | abut substantially is avoided. Note that the end opposite to the traveling direction is also located in a region where a slight margin is removed from the region between the two rotating members 111 adjacent to each other in the stopped state. Further, the positional relationship between the pendulum 121 of the contact sensor 12 and the end portion 84 of the substrate 8 at the stop position of the substrate 8 is also a positional relationship that does not substantially contact. Similarly, the positional relationship between the both end portions 81 of the substrate 8 and the support roller 113 in FIG.
[0039]
As described above, in the substrate processing apparatus 1, the support roller 113 is not positioned below both ends of the substrate 8 on the direction side perpendicular to the transport direction, and these both ends are not in contact with the roller mechanism 11 and the substrate 8 is not in contact with the roller mechanism 11. Supported. Therefore, it is possible to minimize the processing liquid 82 from spilling out from both end portions on the side perpendicular to the transport direction.
[0040]
Further, in the substrate processing apparatus 1, when the horizontal substrate 8 on which the processing liquid 82 is piled up stops in the course of transportation, both ends with respect to the transportation direction are not in contact with the rotating member 111. Accordingly, the outer peripheral portion of the substrate 8 is not in contact with all the support rollers 113 at the stop position, and the processing liquid 82 is prevented from flowing out from the outer peripheral portion of the substrate 8 through the support roller 113.
[0041]
In addition, each support roller 113 has a cylindrical shape and is in line contact with the lower surface of the substrate 8, so that bending of the substrate 8 on the roller mechanism 11 is suppressed. Thereby, the uneven distribution of the processing liquid 82 on the substrate 8 is prevented, and the amount of the processing liquid 82 on the substrate 8 spilling from both ends corresponding to the transport direction can be reduced. Further, since the contact area between the substrate 8 and the support roller 113 is large, the substrate 8 can be transported more stably.
[0042]
Further, since the stop position of the substrate 8 is a position that has passed the position where it contacts the contact sensor 12, the amount of the processing liquid 82 on the substrate 8 flowing out through the contact sensor 12 can be minimized. it can.
[0043]
As described above, the substrate processing apparatus 1 can reduce the amount of the processing liquid 82 flowing out from the substrate 8.
[0044]
The substrate processing apparatus 1 according to the present invention has been described above. However, the present invention is not limited to the above-described embodiment, and various modifications can be made.
[0045]
For example, FIG. 2 shows the rotating member 111 having three cylindrical supporting rollers 113 on the rotating shaft 112, but even if one cylindrical supporting roller 113a is provided on the rotating shaft 112 as shown in FIG. Good. Thereby, the bending which arises in the board | substrate 8 can be reduced more. The lower surface of the substrate 8 is appropriately cleaned by a separately provided cleaning means.
[0046]
Further, in the above embodiment, the developing process is performed by depositing the developing solution as the processing liquid 82 on the substrate 8, but the processing to be performed is not limited to the developing process, and etching, resist stripping, Water washing, chemical solution washing, etc. may be used. That is, by appropriately changing the processing liquid to an etching liquid, a resist stripping liquid, pure water, a cleaning chemical liquid, or the like, a substrate processing apparatus that performs these processes can be obtained.
[0047]
In the above embodiment, the treatment liquid 82 is discharged from the nozzle 21 in the form of a curtain and the substrate 8 is transported to form a layer of the treatment liquid 82 on the entire upper surface of the substrate 8. Any method may be used for forming the layer of the treatment liquid 82. For example, after the substrate 8 is positioned at a predetermined stop position, the nozzle 21 may be moved along the transport direction of the substrate 8, or while transporting the substrate 8 using the nozzle 21 as a spray-type nozzle. The nozzle 21 may be swung in a direction perpendicular to the transport direction. That is, the present invention relates to transport of a substrate on which a layer of processing liquid is formed on the upper surface, and the timing at which the layer of processing liquid is formed is when the transport of the substrate is stopped even during the transport of the substrate. Also good.
[0048]
Moreover, although the substrate processing apparatus 1 which processes the glass substrate for liquid crystal displays was taken as an example in the said embodiment, the board | substrate 8 processed may be a glass substrate used for other FPDs, such as PDP, A semiconductor substrate, a printed circuit board, etc. may be sufficient. FIG. 9 is a diagram showing an example of the positional relationship between the semiconductor substrate 8a and the plurality of rotating members 111 at the conveyance stop position. As shown in FIG. 9, the shape of the substrate is not limited to a rectangle, and the present invention can be used by appropriately adjusting the size and position of the support roller 113 even if it is a substantially circular shape or other complicated shapes. be able to.
[0049]
【The invention's effect】
In the invention according to claim 1 or 3 , the outflow amount of the processing liquid on the substrate can be reduced.
[0050]
In the invention according to claim 2 or 4 , the outflow of the processing liquid on the substrate can be further suppressed.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating a state when a rotating member and a substrate are viewed from a conveyance direction side.
FIG. 3 is a diagram showing a state when a rotating member and a substrate are viewed from above.
FIG. 4 is a flowchart showing an operation flow of the substrate processing apparatus.
FIG. 5 is a diagram showing a state of the substrate processing apparatus in operation at a certain point in time.
FIG. 6 is a diagram showing a state of the substrate processing apparatus in operation at a certain point in time.
FIG. 7 is an enlarged view showing the vicinity of the front end of the substrate in a state where the conveyance of the substrate is stopped.
FIG. 8 is a view showing another form of the support roller.
FIG. 9 is a diagram showing a state when the rotating member and the semiconductor substrate are viewed from the upper side at the conveyance stop position.
FIG. 10 is a diagram showing a form of a conventional rotating member.
FIG. 11 is a diagram showing a positional relationship between a stop position of a substrate and a rotating member in a conventional substrate processing apparatus.
FIG. 12 is a diagram showing a positional relationship between a substrate stop position and a contact sensor in a conventional substrate processing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate processing apparatus 8 and 8a Substrate 11 Roller mechanism 11A Arrow 12 Contact sensor 13 Motor 21 Nozzle 31 Control part 81 End part 82 Treatment liquid 84 End part 113, 113a Support roller

Claims (4)

上面に処理液の層が形成される水平姿勢の基板を搬送する基板搬送装置であって、
搬送方向に並べられた複数の回転部材にそれぞれ設けられ、搬送方向に対して垂直方向側の前記基板の両端部に非接触であり、円筒形状の複数のローラにより、その上面に処理液の層が形成された前記基板を下方から線接触しつつ支持するローラ機構と、
前記ローラ機構を駆動することにより前記基板を前記搬送方向へと搬送する駆動手段と、
前記ローラ機構により前記基板を下方から支持しつつ前記搬送方向へと所定の距離だけ搬送させた後、前記搬送方向における前記基板の先端および後端の下方に前記いずれのローラも位置しない停止位置にて前記基板を所定の時間だけ停止させるように前記駆動手段を制御する制御手段と、
を備え
前記停止位置は、前記基板の先端および後端が互いに隣接する前記回転部材の中心間の領域から所定のマージンを除いた領域に位置するような位置であることを特徴とする基板搬送装置。
A substrate transport apparatus for transporting a substrate in a horizontal posture in which a layer of processing liquid is formed on an upper surface,
Respectively provided on the plurality of rotary members which are arranged in the conveying direction, Ri contactless der to both ends of the substrate in the vertical direction relative to the conveying direction, by a plurality of cylindrical roller, the treatment liquid on its upper surface A roller mechanism for supporting the substrate on which the layer is formed while being in line contact from below;
Drive means for transporting the substrate in the transport direction by driving the roller mechanism;
After the substrate is transported by a predetermined distance in the transport direction while supporting the substrate from below by the roller mechanism, the roller mechanism is at a stop position where none of the rollers is positioned below the front end and the rear end of the substrate. Control means for controlling the drive means to stop the substrate for a predetermined time;
Equipped with a,
The substrate transport apparatus according to claim 1, wherein the stop position is a position where a front end and a rear end of the substrate are located in a region excluding a predetermined margin from a region between centers of the rotating members adjacent to each other .
請求項1に記載の基板搬送装置であって、The substrate transfer apparatus according to claim 1,
前記駆動手段によって搬送される前記基板の先端と接触することにより前記基板の位置を検出する接触式センサ、A contact-type sensor that detects the position of the substrate by contacting the tip of the substrate conveyed by the driving means;
をさらに備え、Further comprising
前記停止位置が、前記接触式センサと前記基板の先端とが接触する位置を通り過ぎた位置であることを特徴とする基板搬送装置。The substrate transfer apparatus, wherein the stop position is a position that passes a position where the contact sensor and the tip of the substrate are in contact with each other.
水平姿勢の基板の上面に処理液の層を形成しつつ前記基板に処理を施す基板処理装置であって、A substrate processing apparatus for processing a substrate while forming a layer of a processing solution on an upper surface of the substrate in a horizontal posture,
前記基板の上面に処理液を供給して前記上面に処理液の層を形成する処理液供給手段と、Treatment liquid supply means for supplying a treatment liquid to the upper surface of the substrate to form a layer of the treatment liquid on the upper surface;
搬送方向に並べられた複数の回転部材にそれぞれ設けられ、搬送方向に対して垂直方向側の前記基板の両端部に非接触であり、円筒形状の複数のローラにより、前記処理液供給手段によりその上面に処理液の層が形成された前記基板を下方から線接触しつつ支持するローラ機構と、Provided in each of a plurality of rotating members arranged in the transport direction, and not in contact with both ends of the substrate on the side perpendicular to the transport direction, and by the processing liquid supply means by a plurality of cylindrical rollers A roller mechanism for supporting the substrate having a processing liquid layer formed on the upper surface while making linear contact from below;
前記ローラ機構を駆動することにより前記基板を前記搬送方向へと搬送する駆動手段と、Drive means for transporting the substrate in the transport direction by driving the roller mechanism;
前記ローラ機構により前記基板を下方から支持しつつ前記搬送方向へと所定の距離だけ搬送させた後、前記搬送方向における前記基板の先端および後端の下方に前記いずれのローラも位置しない停止位置にて前記基板を所定の時間だけ停止させるように前記駆動手段を制御する制御手段と、After the substrate is transported by a predetermined distance in the transport direction while supporting the substrate from below by the roller mechanism, the roller mechanism is at a stop position where none of the rollers is positioned below the front end and the rear end of the substrate. Control means for controlling the drive means to stop the substrate for a predetermined time;
を備え、With
前記停止位置は、前記基板の先端および後端が互いに隣接する前記回転部材の中心間の領域から所定のマージンを除いた領域に位置するような位置であることを特徴とする基板処理装置。The substrate processing apparatus, wherein the stop position is a position where a front end and a rear end of the substrate are located in a region excluding a predetermined margin from a region between centers of the rotating members adjacent to each other.
請求項3に記載の基板処理装置であって、The substrate processing apparatus according to claim 3,
前記駆動手段によって搬送される前記基板の先端と接触することにより前記基板の位置を検出する接触式センサ、A contact-type sensor that detects the position of the substrate by contacting the tip of the substrate conveyed by the driving means;
をさらに備え、Further comprising
前記停止位置が、前記接触式センサと前記基板の先端とが接触する位置を通り過ぎた位置であることを特徴とする基板処理装置。The substrate processing apparatus, wherein the stop position is a position past a position where the contact sensor and the tip of the substrate are in contact with each other.
JP25606299A 1999-09-09 1999-09-09 Substrate transfer apparatus and substrate processing apparatus Expired - Fee Related JP3934286B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25606299A JP3934286B2 (en) 1999-09-09 1999-09-09 Substrate transfer apparatus and substrate processing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25606299A JP3934286B2 (en) 1999-09-09 1999-09-09 Substrate transfer apparatus and substrate processing apparatus

Publications (2)

Publication Number Publication Date
JP2001080738A JP2001080738A (en) 2001-03-27
JP3934286B2 true JP3934286B2 (en) 2007-06-20

Family

ID=17287380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25606299A Expired - Fee Related JP3934286B2 (en) 1999-09-09 1999-09-09 Substrate transfer apparatus and substrate processing apparatus

Country Status (1)

Country Link
JP (1) JP3934286B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI226077B (en) * 2001-07-05 2005-01-01 Tokyo Electron Ltd Liquid processing apparatus and liquid processing method
JP2016167475A (en) * 2015-03-09 2016-09-15 株式会社Screenホールディングス Substrate processing apparatus

Also Published As

Publication number Publication date
JP2001080738A (en) 2001-03-27

Similar Documents

Publication Publication Date Title
JP3919464B2 (en) Conveying device, cleaning device and developing device
JP3175908B2 (en) Substrate transfer device for liquid processing equipment
TW200950897A (en) Grinding equipment and grinding method
JP3934286B2 (en) Substrate transfer apparatus and substrate processing apparatus
JPH1187210A (en) Substrate treatment equipment and substrate treatment method
KR101269758B1 (en) Substrate processing apparatus, substrate processing method and computer readable storage medium
JPH07283185A (en) Substrate cleaner
JP4079579B2 (en) Wet processing equipment
JP3628919B2 (en) Substrate processing apparatus and substrate processing method
JP2006256768A (en) Substrate transporting device, substrate processing device, and plane indicating device
TWI225676B (en) Substrate treatment device
JP3550277B2 (en) Substrate processing equipment
JP2000254605A (en) Cleaning device for flexible substrate
US10520819B2 (en) Substrate treating apparatus and method of treating substrate
JP3535706B2 (en) Substrate processing equipment
JP2001102283A5 (en)
JP3865978B2 (en) Substrate processing equipment
JP4206359B2 (en) Treatment liquid supply device
CN211828692U (en) Substrate processing apparatus and discharge nozzle
KR20060076227A (en) Processing apparatus and processing method
CN114779592B (en) Substrate conveying device, developing device and developing method
TWI345260B (en) Resist elimination device
JPH1176908A (en) Device and method for coating film formation as well as substrate transporting device
KR102653152B1 (en) Developing apparatus
US7287919B2 (en) Developing process and apparatus

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060718

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060913

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070313

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070315

R150 Certificate of patent or registration of utility model

Ref document number: 3934286

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100330

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100330

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110330

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110330

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120330

Year of fee payment: 5

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120330

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130330

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130330

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130330

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140330

Year of fee payment: 7

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees