JP5188926B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for performing development processing to form a predetermined circuit pattern on a target substrate such as an LCD glass substrate.

In the manufacture of LCDs, after forming a resist film on a glass substrate, the resist film is exposed in accordance with a circuit pattern, and further developed, so-called photolithography technology is used. A circuit pattern is formed.
Here, for example, with regard to development processing, Patent Document 1 discloses a substrate processing method and apparatus capable of reducing the amount of rinse liquid used when removing developed photoresist (and developer). Yes.

  In the substrate processing method disclosed in Patent Document 1, first, a developing solution is applied to the surface of a substrate conveyed in one direction in a horizontal posture to form a liquid layer on the substrate, and development is performed by holding the substrate for a predetermined time. The reaction is allowed to proceed (hereinafter referred to as a paddle development method). After that, one of the end faces in the direction orthogonal to the substrate transport direction is lifted to convert the substrate into an inclined posture, the developer is poured off, and the rinse liquid is supplied to the substrate while the substrate is transported in the inclined posture. is there.

  However, in recent years, there is a strong demand for increasing the size of the LCD substrate. In the substrate processing method disclosed in Patent Document 1, when a large substrate is transported at a high speed in an inclined posture, the mechanical load on the substrate There is a possibility that the load on the transfer device is increased and the substrate and the device are damaged.

  In response to such a problem, the applicant of the present application applied the developer to perform the paddle development method, and then removed the developer from the substrate on which the developer was applied. Patent Document 2 proposes a liquid processing apparatus and method for supplying a rinsing liquid to a substrate while moving a rinsing liquid supply nozzle at a predetermined speed along the surface of the substrate held in an inclined posture after the developer is poured off. ing.

According to this liquid processing apparatus and method, since the substrate is not transported at a high speed in an inclined posture, the processing safety is improved, and breakage and damage of the substrate and the apparatus can be suppressed.
Even for a large substrate, the processing liquid is in contact with the substrate by setting the direction in which the developer is applied to the substrate and the direction in which the developer flows down from the substrate when the developer is drained. Time is equalized over the entire substrate, and uniform liquid processing can be performed over the entire substrate.
JP-A-11-87210 JP 2003-17401 A

According to the liquid processing apparatus and method disclosed in Patent Document 2, it is possible to deal with a wide range of positive resists that are generally used in development processing for large substrates.
However, for example, R, G, B pigment-containing resists (hereinafter referred to as color resists) used for forming a color filter coloring pattern have poor penetrability of the developer into the color resist. The paddle type development method employed in the liquid processing apparatus disclosed in the above document has a slow development speed and is not practical.
Further, in the case of a color resist containing a pigment, an unnecessary color resist cannot be sufficiently dissolved in a developing solution and removed, and a resist residue may be generated after rinsing.

  The present invention has been made under the circumstances as described above, and in a substrate processing apparatus that performs a predetermined liquid processing on a predetermined film formed on a substrate to be processed, the liquid processing of the predetermined film is progressed. It is an object of the present invention to provide a substrate processing apparatus and a substrate processing method that can be promoted and can efficiently complete liquid processing.

In order to solve the above-described problems, a substrate processing apparatus according to the present invention is a substrate processing apparatus that performs a predetermined liquid processing on a predetermined film formed on a processing surface of a substrate to be processed. the developer is supplied along the processed surface of the substrate to be processed, the process of the developing solution is applied to the first liquid processing unit for applying a developer, by the first liquid processing section into the treatment surface of the substrate And a second liquid processing unit that supplies the developer along the processing surface of the substrate in the inclined posture, and the second liquid processing unit has the substrate to be processed in a horizontal posture. A substrate tilting means for converting the substrate into an inclined posture, a developer supply nozzle for supplying a developer, and a nozzle moving means for moving the developer supply nozzle, wherein the substrate tilting means includes the first liquid treatment. The front side of the substrate in which the developer is applied by the The developer supply nozzle is raised along the processing surface of the substrate in the inclined posture by the nozzle moving means when supplying the developer to the substrate to be processed. It is characterized by being moved .

By configuring such a two-stage liquid treatment, the second liquid processing section can perform the process up to that time even if the resist (predetermined film) is difficult to penetrate a developer (processing liquid) such as a color resist. The resist dissolved in the developing solution (processing solution) can be washed away by the newly supplied developing solution (processing solution), and the developing process can be advanced rapidly by the new developing solution (processing solution).
Therefore, the liquid processing (development processing) can be sufficiently accelerated, and the liquid processing can be completed efficiently without leaving a resist residue on the substrate by the rinsing processing (cleaning processing) after the development processing. .

In order to solve the above problems, a substrate processing method according to the present invention is in a horizontal posture in a substrate processing method for performing a predetermined liquid processing on a predetermined film formed on a processing surface of a substrate to be processed. Supplying a developing solution along the processing surface of the substrate to be processed, applying the developing solution to the processing surface of the substrate , and lifting the front in the transport direction of the processing substrate to which the developing solution has been applied And a step of newly supplying the developer along the processing surface of the substrate in the inclined posture.
Further, it is preferable to execute a step of setting the substrate to be processed in the inclined posture to a horizontal posture and a step of supplying a rinse liquid to the substrate to be processed in the horizontal posture and removing the developer .

By performing such a two-step liquid treatment, even in the case of a resist (predetermined film) in which a developing solution (processing solution) such as a color resist is difficult to penetrate, The resist dissolved in the developing solution (processing solution) is pushed away by the newly supplied developing solution (processing solution), and the developing process can be advanced rapidly by the new developing solution (processing solution).
Therefore, the liquid processing (development processing) can be sufficiently accelerated, and the liquid processing can be completed efficiently without leaving a resist residue on the substrate by the rinsing processing (cleaning processing) after the development processing. .

  According to the present invention, in a substrate processing apparatus that performs predetermined liquid processing on a predetermined film formed on a substrate to be processed, the progress of the liquid processing on the predetermined film is promoted and the liquid processing is efficiently completed. A substrate processing apparatus and a substrate processing method that can be performed can be obtained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, in the present embodiment, the substrate processing apparatus of the present invention performs development processing on a glass substrate (substrate to be processed) subjected to exposure processing after color resist film formation, for example, in color filter pattern formation. A case where the present invention is applied to a processing unit (DEV) will be described as an example.
FIG. 1 is a plan view showing a schematic configuration of a resist coating / development processing system that includes a development processing unit (DEV) that is an embodiment of the present invention and that continuously performs processing from formation of a resist film to development. is there.

First, the operation flow of the resist coating / developing system 100 will be briefly described.
First, the glass substrate G in the cassette C placed on the mounting table 9 in the cassette station 1 is directly carried into the excimer UV irradiation unit (e-UV) 22 in the processing station 2 by the transfer device 11 to perform scrub pretreatment. Is called. Next, the glass substrate G is carried into the scrub cleaning unit (SCR) 21 by the transfer device 41 and scrubbed. After the scrub cleaning process, the glass substrate G is carried out to a pass unit (not shown) of the thermal processing unit block (TB) 31 belonging to the first thermal processing unit section 26 by, for example, roller conveyance.

The glass substrate G arranged in the pass unit is first transported to a dehydration bake unit (not shown) of the thermal processing unit block (TB) 31 and subjected to heat treatment.
Next, after being transferred to a cooling unit (not shown) of the thermal processing unit block (TB) 32 and cooled, the thermal processing unit block (TB) 31 or the thermal processing unit block is used in order to improve the fixability of the resist. (TB) It is transported to an adhesion processing unit (not shown) 32, where it is subjected to an adhesion treatment (hydrophobization treatment) by HMDS.

Thereafter, the glass substrate G is transferred to the cooling unit of the thermal processing unit block (TB) 32 to be cooled, and further transferred to a pass unit (not shown) of the thermal processing unit block (TB) 32.
All the transfer processing of the glass substrate G when performing such a series of processing is performed by the first transfer device 33.

The glass substrate G arranged in the pass unit of the thermal processing unit block (TB) 32 is carried into the resist processing unit 23 by the transfer arm of the resist processing unit 23.
The glass substrate G is spin-coated with a predetermined color resist solution in a resist coating processing apparatus (CT) 23a, then transported to a reduced pressure drying apparatus (VD) 23b and dried under reduced pressure, and further to a peripheral resist removing apparatus (ER) 23c. The excess resist around the periphery of the glass substrate G is removed. After the peripheral resist removal is completed, the glass substrate G is transferred from the resist processing unit 23 to the pass unit (not shown) of the thermal processing unit block (TB) 34 belonging to the second thermal processing unit section 27 by the transfer arm. Delivered.

The glass substrate G arranged in the pass unit of the thermal processing unit block (TB) 34 is pre-baked by the second transfer device 36 for the thermal processing unit block (TB) 34 or the thermal processing unit block (TB) 35. It is transferred to one of the units (not shown) and pre-baked, and then transferred to a cooling unit (not shown) of the thermal processing unit block (TB) 35 and cooled to a predetermined temperature.
And it is further conveyed by the 2nd conveying apparatus 36 to the pass unit (not shown) of the thermal processing unit block (TB) 35.

Thereafter, the glass substrate G is transferred to the extension / cooling stage (EXT / COL) 44 of the interface station 3 by the second transfer device 36, and the peripheral exposure device (EE) of the external device block 45 is transferred by the transfer device 42 of the interface station 3. Then, exposure for removing the peripheral resist is performed.
Subsequently, it is conveyed by the conveying apparatus 42 to the exposure apparatus 4, where the resist film on the glass substrate G is exposed to form a predetermined pattern. In some cases, the glass substrate G is accommodated in a buffer cassette on the buffer stage (BUF) 43 and then transferred to the exposure apparatus 4.

  After the exposure is completed, the glass substrate G is carried into the upper titler (TITLER) of the external device block 45 by the transfer device 42 of the interface station 3 and predetermined information is written on the glass substrate G, and then the extension cooling stage (EXT) • COL) 44. The glass substrate G is transferred from the extension / cooling stage (EXT / COL) 44 to the pass unit of the thermal processing unit block (TB) 35 belonging to the second thermal processing unit section 27 by the second transfer device 36. The

  Next, the glass substrate G is moved from the pass unit to the development processing unit (DEV) by applying, for example, a roller transport mechanism extending from the pass unit of the thermal processing unit block (TB) 35 to the development processing unit (DEV) 24. It is carried into 24, where development processing is performed. This development processing step will be described in detail later.

  After completion of the development processing, the glass substrate G is transported from the development processing unit (DEV) 24 to the i-line UV irradiation unit (i-UV) 25 by a continuous transport mechanism, for example, roller transport, and the glass substrate G is subjected to decoloring processing. Applied. Thereafter, the glass substrate G is passed through a thermal processing unit block (TB) 37 belonging to the third thermal processing unit section 28 by a roller transport mechanism in the i-line UV irradiation unit (i-UV) 25 (not shown). ).

The glass substrate G arranged in the pass unit of the thermal processing unit block (TB) 37 is post-baked by the third transfer device 39 of the thermal processing unit block (TB) 37 or the thermal processing unit block (TB) 38. It is conveyed to a unit (not shown) and post-baked.
Thereafter, the glass substrate G is transferred to a pass / cooling unit (not shown) of the thermal processing unit block (TB) 38 and cooled to a predetermined temperature, and then is transferred to the cassette station 1 by the transfer device 11 of the cassette station 1. Are stored in a predetermined cassette C.

Next, the structure of the development processing unit (DEV) 24 to which the substrate processing apparatus of the present invention is applied will be described in detail. FIG. 2 is a side view showing a schematic structure of the development processing unit (DEV) 24, and FIG. 3 is a schematic plan view.
The development processing unit (DEV) 24 includes an introduction zone 24a, a first developer supply zone 24b (first liquid processing section), a second developer supply zone 24c (second liquid processing section), and a rinse zone 24d. , The drying zone 24e.
2 and 3, the introduction zone 24a is adjacent to the pass unit (PASS) 73 of the thermal processing unit block (TB) 35, and the drying zone 24e is connected to the i-line UV irradiation unit (i-UV) 25. Adjacent.

  As shown in FIG. 2, between the pass unit (PASS) 73 and the i-line UV irradiation unit (i-UV) 25, the roller 17 is rotated by driving a motor or the like, so that the glass substrate G on the roller 17 is predetermined. A roller transport mechanism 14 for transporting in the direction is provided. By operating the roller transport mechanism 14, the glass substrate G can be transported from the pass unit (PASS) 73 through the development processing unit (DEV) 24 toward the i-line UV irradiation unit (i-UV) 25. It can be done. Further, a predetermined number of rollers 17 are provided in the transport direction and the width direction (Y direction) of the glass substrate G so that the glass substrate G is not easily bent.

  In the development processing unit (DEV) 24, it is preferable to divide the roller transport mechanism 14 into, for example, regions where the transport speed of the glass substrate G is different, and to drive each region independently. For example, the glass substrate G is conveyed by the drive of a first motor (not shown) in the pass unit (PASS) 73 and the introduction zone 24a, and the first developer supply zone 24b is in the second motor (not shown). The second developer supply zone 24c is transported by driving a third motor (not shown), and the rinse zone 24d and the drying zone 24e are transported by driving a fourth motor (not shown). It is made like.

  A detailed configuration of the roller transport mechanism 14 is shown in FIG. 4A to 4C are a plan view and a side view showing the configuration of the substrate tilting mechanism 110 provided in the second developer supply zone 24c. 4A to 4C, the roller transport mechanism 14 includes a pivot 18a that extends in the transport direction (X direction) of the glass substrate G and rotates around the X axis by the motor 15, and a pivot. And a first gear 18b which is fixed to 18a and rotates around the X axis.

Further, a pivot shaft 19a is disposed in the width direction (Y direction) of the glass substrate G, and the rollers 17 are mounted at predetermined intervals. The pivot gear 19b is attached to one end of the pivot shaft 19a so as to mesh with the first gear 18b. Has a second gear 19b for converting rotation about the X axis into rotation about the Y axis.
A third gear 19b 'is attached to the other end of the pivot 19a, and the third gear 19b' is rotated via the pivot 19a by the rotation of the second gear 19b.
Furthermore, it has a pivot 18a 'that opposes the pivot 18a in the width direction of the glass substrate G and is rotatable about the X axis. The pivot 18a 'is provided with a fourth gear 18b' so as to mesh with the third gear 19b '. The fourth gear 18b' rotates the third gear 19b 'around the Y axis around the X axis. Convert to rotation.

In the roller transport mechanism 14, a drive unit for rotating the pivot shaft 19 a includes a pivot shaft 18 a, a first gear 18 b, a second gear 19 b, and a motor 15.
The third gear 19b 'and the fourth gear 18b' have a role of supporting the pivot 19a so that the pivot 19a rotates smoothly.

In addition, as shown in FIG. 2, the pass unit (PASS) 73 includes a lift pin 16 that can be lifted and lowered.
When the lift pins 16 are lifted in a state where the substrate holding arm of the second transfer device 36 holding the glass substrate G enters the pass unit (PASS) 73, the glass substrate G holds the substrate of the pass unit (PASS) 73. It is transferred from the arm to the lift pin 16.
When the lift pins 16 are lowered after the substrate holding arm is retracted from the pass unit (PASS) 73, the glass substrate G is placed on the roller 17 in the pass unit (PASS) 73. Then, by driving the roller transport mechanism 14, the glass substrate G is carried out from the pass unit (PASS) 73 to the introduction zone 24a.

  The introduction zone 24a is provided as a buffer area between the pass unit (PASS) 73 and the first developer supply zone 24b. The introduction zone 24a prevents the pass unit (PASS) 73 from being contaminated by, for example, the developer splashing from the first developer supply zone 24b to the pass unit (PASS) 73.

The first developer supply zone 24b is a zone in which the first developer is deposited (paddle formation) on the glass substrate G transported from the introduction zone 24a. In this zone, a main developer discharge nozzle 51a and a sub-developer discharge nozzle 51b (hereinafter referred to as “development nozzles 51a and 51b”) that apply a developing solution (first processing solution) as a processing solution to the glass substrate G are used. Two nozzles are provided.
As shown in FIG. 3, guide rails 59 are arranged on both sides of the substrate transport path in the first developer supply zone 24b.
A slide arm 58 is installed on the guide rails 59 arranged in a pair along the substrate width direction. The slide arm 58 is movable in the X direction.
The developing nozzles 51a and 51b are attached to the slide arm 58 so as to be movable up and down.

A developing solution is supplied to the developing nozzles 51a and 51b from a developing solution supply source (not shown).
When the developer paddle is formed on the glass substrate G, for example, after adjusting the distance between the developing nozzles 51a and 51b and the glass substrate G by the lifting mechanism, the developing nozzle is moved in the direction opposite to the conveying direction of the glass substrate G. A developer film is formed on the substrate surface by discharging the developer from the discharge port to the substrate surface while moving 51a and 51b.

  The developing nozzles 51a and 51b are long in the width direction (Y direction) of the glass substrate G (see FIG. 3), and a slit-shaped discharge port is formed at the lower end along the longitudinal direction. The one having a structure capable of discharging the developer in a substantially strip shape is preferably used. As the developing nozzles 51a and 51b, a nozzle having a plurality of circular discharge ports formed at predetermined intervals may be used instead of the slit-shaped discharge ports.

  Here, when the photoresist film (predetermined film) formed on the processing surface of the substrate G is a color resist containing a pigment as in the present embodiment, the developer does not easily permeate the resist. The development process cannot be carried out sufficiently in a short time. For this reason, in the second developer supply zone 24c, the glass substrate G is converted into an inclined posture, and the developer supplied in the first developer supply zone 24b and the resist dissolved in the developer are poured off, and the substrate In the state where G is held in an inclined posture, scan development is performed in which a developer is discharged from the developing nozzle 52 along the substrate surface (processing surface).

The second developer supply zone 24c includes a substrate tilting mechanism 110 (substrate tilting means) that converts the glass substrate G into a tilted posture, and a new developer on the surface of the glass substrate held in the tilted posture by the substrate tilting mechanism 110. And a developer supply mechanism 60 for supplying the developer.
Further, a developer recovery container 47 for recovering the developer flowing down from the glass substrate G held in an inclined posture by the substrate tilting mechanism 110 is provided.

  As shown in FIG. 4, the substrate tilting mechanism 110 includes a roller 101 that contacts a predetermined position on the back surface of the glass substrate G, a shaft member 102 a that connects the rollers 101, a frame member 103 that holds the shaft member 102 a, and a frame member And an elevating mechanism 106 that elevates and lowers one end of 103. Furthermore, it has the guide pin 104 which supports the end surface used as the lower end of the glass substrate G so that the glass substrate G supported diagonally by the roller 101 may not slide down when one end of the frame member 103 is raised. . The shaft member 102a and the frame member 103 are connected by a connecting jig 102b attached to both ends of the shaft member 102a.

A plurality of rollers 101 are attached to the shaft member 102a at predetermined intervals in the Y direction, and the shaft member 102a to which the rollers 101 are attached is attached to the frame member 103 at predetermined intervals in the X direction. Thus, when the roller 101 is in contact with the back surface of the glass substrate G to support the glass substrate G, the glass substrate G is not greatly bent.
The roller 101 is rotatable around the shaft member 102a, and when the glass substrate G is changed in posture, the roller 101 rotates according to the movement of the glass substrate G by the frictional force between the glass substrate G and the roller 101. . In this way, it is possible to prevent the rear surface of the glass substrate G from being scratched.

  The glass substrate G is carried into the second developer supply zone 24 c by the roller transport mechanism 14 with the back surface of the glass substrate G being in contact with the upper end of the roller 17. Further, in the second developer supply zone 24 c, the upper end of the roller 101 is at the same position as the upper end of the roller 17 or a position lower than the upper end of the roller 17 so that the roller 101 does not hinder the conveyance of the glass substrate G. Retained.

  The end of the frame member 103 on the side where the lifting mechanism 106 is not attached is supported by the shaft member 105. That is, the frame member 103 is rotatable around the shaft member 105, and when the one end of the frame member 103 is lifted by the elevating mechanism 106, the frame member 103 rotates and rotates at a predetermined angle (for example, 5 °). ) In an inclined state. When the frame member 103 is tilted, the glass substrate G supported by the rollers 17 is supported by the rollers 101 and converted into an inclined posture.

  When the glass substrate G is transported in the second developer supply zone 24c, the guide pins 104 are arranged from the back surface of the glass substrate G on which the upper ends of the guide pins 104 are transported so as not to hinder the transport of the glass substrate G. Are also arranged so as to be positioned below. Further, the guide pin 104 protrudes upward when the frame member 103 is inclined by the elevating mechanism 106 and supports the lower end surface of the glass substrate G, and prevents the glass substrate G from slipping down.

The elevating mechanism 106 rotates the frame member 103 so as to lift the front side (rinse zone 24d side) of the glass substrate G in the transport direction.
Usually, in the first developer supply zone 24b, the developer is applied to the glass substrate G from the front side in the transport direction of the glass substrate G.
Therefore, the developer applied in the first developer supply zone 24b is applied to the glass substrate G by lifting the end surface of the glass substrate G where the application of the developer is started and pouring the developer from the glass substrate G. It is necessary to make the contact time uniform over the entire glass substrate G.
As described above, by rotating the frame member 103 so as to lift the front side of the glass substrate G in the transport direction (rinse zone 24d side), the occurrence of uneven development can be suppressed and the line width uniformity can be improved. .

  When the glass substrate G is tilted by the substrate tilting mechanism 110, the developer that flows down from the glass substrate G is recovered in the developer recovery container 47. The high-concentration developer collected in the developer collection container 47 is sent to the collection line and recycled.

As shown in FIG. 3, the developer supply mechanism 60 pushes away the developer residue remaining on the glass substrate G held in the inclined posture, and further develops a new developer (first processing solution) for further development processing. And a developing nozzle moving mechanism 85 (nozzle moving means) that moves the developing nozzle 52 obliquely at a predetermined speed along the surface of the glass substrate G held in an inclined posture.
The developing nozzle moving mechanism 85 includes a guide rail 86 disposed at the same angle as the inclination angle θ of the glass substrate G, and a nozzle holding arm 87 provided so as to be movable along the guide rail 86 and holding the developing nozzle 52. And a drive mechanism 88 for moving the nozzle holding arm 87 along the guide rail 86.

In this configuration, while the developing nozzle 52 is moved along the processing surface of the glass substrate G held in an inclined posture by the substrate tilting mechanism 110, the developing solution as the processing liquid is transferred from the developing nozzle 52 to the processing surface of the glass substrate G. Supplied. Here, the developing solution may be supplied while moving the developing nozzle 52 from the upper end to the lower end of the substrate processing surface, or the developing nozzle 52 is developed while moving from the lower end to the upper end of the substrate processing surface. A liquid may be supplied. In addition to moving the developing nozzle 52 in one direction with respect to the substrate processing surface, the developing solution may be supplied while the developing nozzle 52 is reciprocated (one or more times) along the substrate processing surface. Good.
Thereby, the resist dissolved in the developing solution on the substrate can be effectively washed away and the developing speed can be improved by the newly supplied developing solution.

  Further, a rinse liquid (second treatment liquid) such as pure water is discharged onto the surface of the glass substrate G carried in at a high speed (for example, 160 to 180 mm / sec) to the rinse zone 24d to develop on the substrate. A rinse nozzle 48 that quickly replaces the liquid with the rinse liquid, and a plurality of rinse nozzles 53 that further discharge the rinse liquid onto the front and back surfaces of the glass substrate G that is decelerated and conveyed (for example, 30 mm / sec) after the replacement with the rinse liquid. Attached in order along the transport path.

  That is, in the rinsing zone 24d, a rinsing liquid is supplied to the front and back surfaces of the glass substrate G while the glass substrate G is being transported, and the developer attached to the glass substrate G is thoroughly removed and the glass substrate G is washed. Done. The rinse nozzles 48 and 53 have a shape longer than the width of the glass substrate G, so that the rinse liquid can be discharged over the entire width direction of the glass substrate G.

An air nozzle (air knife) 54 that injects a dry gas such as nitrogen gas at a predetermined wind pressure is provided in the dry zone 24e in which the glass substrate G that has passed through the rinse zone 24d is transported. In the drying zone 24e, while conveying the glass substrate G at a predetermined speed, a drying gas is sprayed onto the front and back surfaces of the glass substrate G, and the rinse liquid attached to the glass substrate G is blown off to dry the glass substrate G. The air nozzle 54 has a shape longer than the width of the glass substrate G, and can discharge the dry gas over the entire width direction of the glass substrate G.
The glass substrate G that has been dried is subjected to an i-ray UV irradiation unit (i-UV) 25 by the roller transport mechanism 14.

  Next, the development processing steps in the development processing unit (DEV) 24 will be described. FIG. 5 is a flowchart showing an outline of the developing process. The glass substrate G carried into the pass unit (PASS) 73 is carried by the roller transport mechanism 14 through the introduction zone 24a and into the first developer supply zone 24b at a predetermined speed (for example, 200 mm / second) ( Step ST1 in FIG. Note that a resist film after exposure (predetermined film) made of a color resist is formed on the processing surface of the glass substrate G.

In the first developer supply zone 24b, the glass substrate G is stopped at a predetermined position (step ST2 in FIG. 5), and the developing nozzles 51a and 51b are moved at a high speed of 180 mm / second, for example, in the substrate transport direction. The developer is applied to the surface of the substrate G while being moved from the front to the rear (step ST3 in FIG. 5).
In addition, by setting the glass substrate G to the stopped state in this way, the drive control of the developing nozzles 51a and 51b becomes easy. In addition, the developer can be stably deposited on the glass substrate G.

Next, the roller G is moved to the second developer at a conveyance speed of 46 mm / second, for example, by operating the roller conveyance mechanism 14 on the substrate G on which the liquid buildup (developing of the developer paddle) in the first developer supply zone 24b is completed. It is transported to the supply zone 24c (step ST4 in FIG. 5).
When the glass substrate G is transported to the second developer supply zone 24c, the glass substrate G is converted into an inclined posture by the substrate tilt mechanism 110, and the developer on the substrate G is poured off (step ST5 in FIG. 5). ). The developer thus poured off from the substrate G is recovered in the developer recovery container 47 and sent to the recovery line. Here, the substrate tilting mechanism 110 lifts the front side in the transport direction of the glass substrate G so that the substrate G is tilted. As a result, the time during which the developer applied in the first developer supply zone 24b is in contact with the glass substrate G is made uniform over the entire glass substrate G.

Almost at the same time when the glass substrate G reaches a predetermined inclination angle θ (for example, 5 °), the developer nozzle 52 is discharged along the substrate surface while discharging the developer from the developing nozzle 52 toward the processing surface of the substrate G. And move at a high speed of 200 mm / sec (step ST6 in FIG. 5).
By the processing of step ST6, the resist dissolved in the developing solution is effectively washed away by the new developing solution discharged from the developing nozzle 52 on the substrate processing surface, and the developing processing is further advanced by the new developing solution. As a result, the development speed is accelerated.

The glass substrate G in the inclined posture is returned (converted) to the horizontal posture at a high speed (for example, in 2 seconds) by the substrate tilting mechanism 110, and is transported to the rinse zone 24d at a higher speed (for example, 160 to 180 mm / sec) ( Step ST7 in FIG. 5).
In the rinse zone 24d, a rinse liquid such as pure water is supplied from the rinse nozzle 48 to the surface of the glass substrate G carried in at high speed, and the developer remaining on the substrate is quickly replaced with the rinse liquid.

Further, the substrate G is switched to low speed conveyance (for example, 30 mm / sec), and the rinse liquid is supplied from the rinse nozzle 53 to the front and back surfaces.
That is, in the rinsing zone 24d, a rinsing liquid is supplied to the front and back surfaces of the glass substrate G while the glass substrate G is being transported, and the developer attached to the glass substrate G is thoroughly removed and the glass substrate G is washed. This is performed (step ST8 in FIG. 5).

  The glass substrate G that has passed through the rinsing zone 24d while being subjected to such rinsing is transported to the drying zone 24e (step ST9 in FIG. 5). In the drying zone 24e, the drying process by the air nozzle 54 is performed while conveying the glass substrate G at a predetermined speed (step ST10 in FIG. 5). The glass substrate G that has been dried is transported to the i-ray UV irradiation unit (i-UV) 25 by the roller transport mechanism 14 and subjected to predetermined ultraviolet irradiation processing there.

As described above, according to the embodiment of the present invention, in the first developer supply zone 24b, the paddle-type development process in which the developer is deposited on the horizontal substrate G is performed, and the second In the developer supply zone 24c, the developer is newly supplied along the substrate processing surface to the substrate G in the inclined posture.
By such a two-step development process, even if a resist such as a color resist is difficult to penetrate, a resist that has been dissolved in the developer so far is newly added in the second developer supply zone 24c. The developer can be pushed away by the supplied developer, and further the development processing can be promoted by a new developer.
Therefore, the development process can be promoted sufficiently, and the development process can be completed efficiently without leaving a resist residue on the substrate by the rinsing process after the development process.

FIG. 1 is a plan view showing a schematic configuration of a resist coating / development processing system including a development processing unit according to an embodiment of the present invention. FIG. 2 is a side view showing a schematic structure of the development processing unit. FIG. 3 is a schematic plan view of the development processing unit. FIG. 4 is a plan view and a side view showing the configuration of the substrate tilting mechanism provided in the second developer supply zone. FIG. 5 is a flowchart showing an outline of the development processing step.

Explanation of symbols

14 Roller transport mechanism 17 Roller 24 Development processing unit (substrate processing apparatus)
24a Introduction zone 24b First developer supply zone (first liquid processing section)
24c 2nd developing solution supply zone (2nd liquid processing part)
24d Rinse zone 24e Drying zone 47 Developer recovery container 48 Rinse nozzle 51a Main developer discharge nozzle 51b Sub developer discharge nozzle 52 Developer nozzle 53 Rinse nozzle 54 Air nozzle 60 Developer supply mechanism 85 Developer nozzle moving mechanism 86 Guide rail 87 Development Holding arm 88 Drive mechanism 100 Resist coating / development processing system 101 Roller 102a Shaft member 103 Frame member 104 Guide pin 106 Elevating mechanism 110 Substrate tilt mechanism (substrate tilt means)
G Glass substrate (substrate to be processed)

Claims (5)

In a substrate processing apparatus for performing predetermined liquid processing on a predetermined film formed on a processing surface of a substrate to be processed,
A first liquid processing unit that supplies a developer along the processing surface of the substrate to be processed in a horizontal posture and applies the developer to the processing surface of the substrate;
A substrate to which a developing solution is applied by the first liquid processing unit, and a second liquid processing unit that supplies the developing solution along the processing surface of the substrate in the inclined posture ,
The second liquid processing unit includes a substrate tilting unit that converts the substrate to be processed in a horizontal posture into a tilted posture, a developer supply nozzle that supplies a developer, and a nozzle moving unit that moves the developer supply nozzle. Have
The substrate tilting means lifts the front in the transport direction of the substrate on which the developer is applied by the first liquid processing unit to tilt the substrate.
The substrate processing apparatus, wherein the developing solution supply nozzle is moved along the processing surface of the inclined substrate by the nozzle moving means when supplying the developing solution to the substrate to be processed. The substrate processing apparatus according to claim 1, wherein the predetermined film is a pigment-containing resist. In a substrate processing method for performing predetermined liquid processing on a predetermined film formed on a processing surface of a substrate to be processed,
Supplying a developing solution along the processing surface of the substrate to be processed in a horizontal posture, and applying the developing solution to the processing surface of the substrate;
The step of lifting the front in the transport direction of the substrate to which the developing solution is applied to bring the substrate into an inclined posture and supplying a new developing solution along the processing surface of the substrate in the inclined posture is executed. And a substrate processing method. Furthermore, the step of setting the substrate to be processed in the inclined posture to a horizontal posture;
The substrate processing method according to claim 3 , further comprising: supplying a rinsing liquid to the substrate to be processed in the horizontal posture and removing the developer . 5. The substrate processing method according to claim 3, wherein the predetermined film is a pigment-containing resist.

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