JP2012124309A - Development method, development apparatus, and coating and developing treatment system including the apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resist development apparatus that controls substrate transfer speed when supplying developer and substrate transfer speed when removing developer to uniformize resist patterns.SOLUTION: A development unit 30 includes: a first transfer mechanism that transfers a substrate S having an exposed resist film; a developer supply section 30B having a supply nozzle 50 which supplies developer onto the surface of the substrate S transferred by the first transfer mechanism; a development section 30C having a second transfer mechanism which transfers the substrate S whose surface is covered by developer; a blow section 30D having a blow nozzle 51 that ejects gas to completely blows away the developer covering the surface of the substrate S and a third transfer mechanism which transfers the substrate S to the nozzle, a rinse section 30E having a rinse liquid supply nozzle 53 that supplies rinse liquid onto the surface of the substrate S from which the developer is completely blown away; and a control section 60 that controls the first and third transfer mechanisms such that the transfer speed of the substrate S to be transferred to the first transfer mechanism is made different from the transfer speed of the substrate S to be transferred to the third transfer mechanism.

Description

  The present invention relates to a developing method for developing a photoresist film formed on a glass substrate for a flat panel display (FPD), a developing device, and a coating and developing processing system including the developing device.

  One of the processes for manufacturing the FPD is a photolithography process. In this process, each step of forming a photoresist film on a glass substrate for FPD, exposing the photoresist film using a predetermined photomask, and developing the exposed photoresist film is performed.

  Along with the increase in size of a glass substrate for FPD, a photoresist film forming step and a developing step are generally performed while a glass substrate is being transported by a transport mechanism including rollers, rollers, and the like (for example, Patent Documents 1 and 2). .

  In the development step of the photoresist film, the supply of the developer to the glass substrate, the development for a predetermined time, the washing of the developer with the rinse solution, and the drying of the rinse solution are performed while conveying the glass substrate. In order to make the line width and via diameter of the photoresist pattern formed in this way uniform within the surface of the glass substrate, a substantial development time (after the developer is supplied and development starts, It is desirable to equalize the time until the development is stopped after the developer is washed away in the plane of the glass substrate. For this reason, it is preferable to make equal the board | substrate conveyance speed when supplying a developing solution to a glass substrate, and the board | substrate conveyance speed when washing away a developing solution with a rinse solution (refer patent document 3).

JP 2007-5695 A JP 2008-159663 A Japanese Patent No. 3552187

  By the way, in order to reuse the developing solution, for example, the developing solution may be collected by flowing the developing solution off the glass substrate by tilting the glass substrate. In this case, since the developer flows on the glass substrate, the photoresist film is exposed to a large amount of developer or the developer is substantially stirred on the downstream side of the flow. As a result, development of the photoresist film is promoted on the downstream side of the flow of the developer (for example, the line width becomes narrow), and the photoresist pattern may become nonuniform in the plane of the glass substrate. That is, in such a situation, even if the conveyance speed of the substrate when supplying the developer to the glass substrate is equal to the conveyance speed of the substrate when washing away the developer with the rinse solution, the photoresist pattern is made uniform. I can't plan.

  Further, when the developer is supplied near the front end in the transport direction of the glass substrate being transported (that is, when the supply of the developer is started), the developer supply amount (or supply speed) and the substrate transport Depending on the speed, turbulent flow may occur in the developer on the glass substrate, or development may be promoted by circulating the developer. In this case, for example, the line width becomes narrower on the front end side than on the rear end side of the glass substrate. That is, even in such a situation, even if the substrate transport speed when supplying the developer to the glass substrate is equal to the substrate transport speed when the developer is washed away with the rinse solution, the photoresist pattern is made uniform. I can't plan.

  The present invention has been made in view of the above circumstances, and controls the substrate transport speed when supplying the developer to the substrate and the substrate transport speed when removing the developer, so that the in-plane of the substrate is controlled. A photoresist developing method, a developing apparatus, and a coating and developing processing system including the same can be provided.

  According to the first aspect of the present invention, the step of supplying a developing solution to the surface of the substrate having the exposed photoresist film on the surface while conveying the substrate at the first conveying speed; A process of transporting the covered substrate at a second transport speed and a developer covering the surface of the substrate with a gas while transporting the substrate at a third transport speed different from the first transport speed. There is provided a method for developing a photoresist film, including a step of cutting and a step of supplying a rinsing liquid to the surface while transporting the substrate at the third transport speed following the step of blowing off.

  According to the second aspect of the present invention, the first transport mechanism transports the substrate having the exposed photoresist film on the surface, and the developer is applied to the surface of the substrate transported by the first transport mechanism. A developer supply unit having a supply nozzle to supply; a developing unit having a second transport mechanism for transporting the substrate whose surface is covered with the developer supplied from the supply nozzle; and A blow nozzle that blows off the developer covering the surface of the substrate, a blow unit having a third transport mechanism that transports the substrate toward the blow nozzle, and a surface of the substrate where the developer is blown off A rinse part having a rinse liquid supply nozzle for supplying a rinse liquid, a first transport speed of the substrate transported by the first transport mechanism, and a third of the substrate transported by the third transport mechanism Transport speed The developing device of a photoresist film and a control unit for controlling the first conveying mechanism and the third conveying mechanism such that different is provided.

  According to a third aspect of the present invention, a photoresist film forming apparatus that forms a photoresist film on a substrate, and a photoresist film developing apparatus according to the second aspect that develops the exposed photoresist film. A coating and developing treatment system is provided.

  According to an embodiment of the present invention, the photoresist pattern is controlled within the surface of the substrate by controlling the substrate conveyance speed when supplying the developer to the substrate and the substrate conveyance speed when removing the developer. A photoresist developing method, a developing apparatus, and a coating and developing processing system including the same are provided.

1 is a top view schematically showing a coating and developing treatment system according to an embodiment of the present invention. It is a figure which shows the image development apparatus by embodiment of this invention provided in the application | coating development processing system of FIG. It is a figure explaining operation | movement of the image development apparatus of FIG. FIG. 4 is another view for explaining the operation of the developing device of FIG. 2 following FIG. 3. FIG. 5 is another diagram for explaining the operation of the developing device of FIG. 2 following FIG. 4. FIG. 6 is another diagram for explaining the operation of the developing device of FIG. 2 following FIG. 5.

  Hereinafter, a developing device according to an embodiment of the present invention and a coating and developing treatment system including the same will be described with reference to the accompanying drawings. In the following description, the same or corresponding parts or members are denoted by the same or corresponding reference numerals, and redundant description is omitted.

First, a photoresist coating and developing system according to an embodiment of the present invention will be described with reference to FIG.
As shown in the figure, the coating and developing treatment system 100 includes a cassette station 1 on which a cassette C that accommodates a plurality of glass substrates S (hereinafter simply referred to as “substrates S”) is placed, and coating and developing photoresist on the substrates S. A processing station 2 that performs a series of processes including the interface station 4 that transfers the substrate S to and from an exposure apparatus 9 that exposes a photoresist film formed on the surface of the substrate S in the processing station 2. . The cassette station 1, the processing station 2, and the interface station 4 are arranged along the X direction in the figure.

  The cassette station 1 is connected to a mounting table 12 in which the cassette C can be juxtaposed in the Y direction in the figure, and a transfer device 11 that carries the substrate S into and out of the processing station 2 from the mounting table 12. With. The transport device 11 includes a transport arm 11a, and the transport arm 11a can move along a guide 10 extending in the Y direction, and can move up and down, move back and forth, and rotate horizontally.

The processing station 2 includes an excimer UV irradiation unit (e-UV) 21, a scrub cleaning unit (SCR) 22, a preheat unit (PH) 23, an adhesion unit (AD) in the direction from the cassette station 1 to the interface station 4. ) 24, a cooling unit (COL) 25, a photoresist coating unit (CT) 26, a vacuum drying unit (DP) 27, a heat treatment unit (HT) 28, and a cooling unit (COL) 29 are arranged in this order.
The processing station 2 includes a developing unit (DEV) 30, a heating processing unit (HT) 31, a cooling unit (COL) 32, and an inspection device (IP) 35 in the direction from the interface station 4 to the cassette station 1. They are arranged in this order.

  In these units (and between the units), a roller transport mechanism similar to the roller transport mechanism including the roller 170 (described later) in the developing unit 30 is provided. Thereby, the board | substrate S is conveyed in order to said unit along the conveyance line A shown by the arrow A and the conveyance line B shown by the arrow B in a figure.

In the photoresist coating and developing processing system 100 configured as described above, the substrate S is processed as follows.
First, the substrate S is taken out from the cassette C mounted on the mounting table 12 of the cassette station 1 by the transfer arm 11 a of the transfer device 11, and is transferred along the transfer line A to the excimer UV irradiation unit 21 of the processing station 2. Be transported. Here, the ultraviolet light is emitted to the substrate S from the ultraviolet light lamp that emits ultraviolet light, and the organic matter adsorbed on the substrate S is removed. Next, the substrate S is transported to the scrub cleaning unit 22, and the surface of the substrate S is cleaned by a cleaning member such as a brush while a cleaning liquid (for example, deionized water (DIW)) is supplied to the substrate S, and dried by a blower or the like. . The washed and dried substrate S is conveyed to the preheat unit 23, heated, and further dried. Next, the substrate S is transported to the adhesion unit 24, and the substrate S is subjected to a hydrophobic treatment by spraying hexamethyldisilane (HMDS) on the heated substrate S. After the hydrophobization treatment, the substrate S is transported to the cooling unit 25, and the substrate S is cooled by blowing cold air against the substrate S, and is maintained at a predetermined temperature.

  Subsequently, the substrate S is transported to the photoresist coating unit 26. In the photoresist coating unit 26, the photoresist liquid is supplied onto the substrate S while the substrate S moves along the transport line A, and a photoresist film is formed on the substrate S.

  The substrate S on which the photoresist film is formed is transported on the transport line A and transported to the vacuum drying unit 27 configured to be able to decompress the internal space, and the photoresist film is dried in a decompressed atmosphere. Next, the substrate S is transported to the heat treatment unit 28. Here, the substrate S is heated, and the solvent and the like contained in the photoresist film are removed. After the heat treatment, the substrate S is transported to the cooling unit 29, and the substrate S is cooled by blowing cold air onto the substrate S.

  After the substrate S cooled by the cooling unit 29 is transported to the downstream end on the transport line A, the substrate S is transferred by the transport arm 43 that can move up and down, move back and forth, and rotate horizontally. It is conveyed to a certain rotary stage (RS) 44. Next, the substrate S is transported to the peripheral exposure device (EE) of the external device block 90 by the transport arm 43. In the peripheral exposure apparatus (EE), an exposure process is performed on the substrate S in order to remove the photoresist film on the outer peripheral portion of the substrate S. Subsequently, the substrate S is transported to the exposure apparatus 9 by the transport arm 43, and the photoresist film is exposed through a photomask having a pattern corresponding to the circuit pattern. The substrate S may be transported to the exposure apparatus 9 after being temporarily stored in a buffer cassette on the rotary stage 44. The substrate S for which the exposure processing has been completed is transported to a titler (TITLER) of the external device block 90 by the transport arm 43, where predetermined information is written on the substrate S.

  Thereafter, the substrate S is transported on the transport line B and reaches the developing unit 30. In the developing unit 30, as will be described later, the exposed photoresist film is developed with a developer, the developer is washed away with a rinse, and the rinse is dried.

  Next, the substrate S is transported on the transport line B and reaches the heat treatment unit 31, where it is heated to remove the solvent and rinse liquid (water) remaining in the photoresist film. In the heat treatment unit 31 as well, the substrate S is heated while being transported on the transport line B by the roller transport mechanism. Between the developing unit 30 and the heat treatment unit 31, an i-line UV irradiation unit that performs a decoloring process of the developer may be provided. The substrate S that has been subjected to the heat treatment in the heat treatment unit 31 is transported to the cooling unit 32 and cooled here.

  The cooled substrate S is transported to the inspection unit 35 where inspection such as measurement of a critical dimension (CD) of the photoresist pattern (line) is performed. Thereafter, the substrate S is accommodated in a predetermined cassette C mounted on the mounting table 12 by the transfer arm 11a of the transfer device 11 provided in the cassette station 1, and a series of processes is completed.

Next, the developing unit 30 according to the present embodiment will be described with reference to FIG. FIG. 2A is a schematic top view of the developing unit 30, and FIG. 2B is a schematic side view of the developing unit 30. In these drawings, in order to show the positional relationship between the substrate S and each part of the developing unit 30, a state in which the substrate S is arranged in each part is illustrated.
As illustrated, the developing unit 30 includes an introduction unit 30A, a developing solution supply unit 30B, a developing unit 30C, a blowing unit 30D, which are sequentially arranged in a direction from the external device block 90 toward the heat treatment unit 31 (see FIG. 1). A rinse portion 30E is provided.

  The introduction unit 30A is connected to the external device block 90, receives the substrate S having a photoresist film formed on the surface thereof from the external device block 90, and transports the substrate S to the developer supply unit 30B. Specifically, a plurality of (eight in the illustrated example) rollers 170 are arranged in parallel at a predetermined interval in the introduction portion 30A. These rollers 170 are longer than the width of the substrate S and are arranged at the same height. For this reason, the substrate S is stably supported on the rollers 170. Each of the rollers 170 can be rotated about the central axis as a center of rotation, and can be driven by the driving device M1 to rotate in the same direction at the same speed. Thereby, the substrate S on the roller 170 is transported at a predetermined transport speed. The driving device M1 may be an electric motor, for example. In the following description, it is referred to as a motor M1. The motor M1 is controlled by the control unit 60, and thereby the rotational speed of the roller 170, that is, the transport speed of the substrate S is controlled.

  The roller 170, the motor M1 (driving device), and the control unit 60 have the same configuration in the developing solution supply unit 30B and the developing unit 30C and function in the same manner. The description of the portion 30B and the developing portion 30C is omitted.

  Further, the developing unit 30 may have a carry-in unit disposed between the introduction unit 30 </ b> A and the external device block 90. The carry-in unit can have the same configuration as the introduction unit 30 </ b> A, and can function as a buffer that adjusts the conveyance interval of the substrate S between the external device block 90 and the development unit 30.

  The developer supply unit 30B is disposed so as to be continuous with the introduction unit 30A. Specifically, the distance between the rollers 170 at the boundary between the introduction part 30A and the developer supply part 30B is substantially equal to the distance between the rollers 170 in the introduction part 30A and the developer supply part 30B, and the arrangement of the rollers 170 The height is equal between the introduction unit 30A and the developer supply unit 30B. As a result, the substrate S is smoothly carried into the developer supply unit 30B from the introduction unit 30A. The developer supply unit 30B is provided with a developer supply nozzle 50 that supplies the developer to the surface of the substrate S. The developer supply nozzle 50 extends in a direction orthogonal to the transport direction of the substrate S (a direction parallel to the longitudinal direction of the rollers 170), and is slightly longer than the width of the substrate S as shown in FIG. The developer supply nozzle 50 has a plurality of holes (or slits extending in the longitudinal direction of the developer supply nozzle 50) that open downward at a predetermined interval, and develops the entire width of the surface of the substrate S. A developer is supplied from a liquid supply source (not shown). Further, as shown in FIG. 2B, the developer supply nozzle 50 is disposed near the boundary between the introduction section 30A and the developer supply section 30B. For this reason, the supply of the developing solution to the substrate S is started almost simultaneously with the carry-in from the introduction unit 30 to the developing solution supply unit 30B.

The developing unit 30C is disposed so as to be continuous with the developer supply unit 30B. The substrate S is carried into the developing unit 30C from the developing solution supply unit 30B in a state where the surface is covered with the developing solution supplied in the developing solution supply unit 30B, and is transported in the developing unit 30C in the same state.
The blow unit 30D is disposed so as to be continuous with the developing unit 30C. In the blow unit 30 </ b> D, a difference is provided in the arrangement height of the rollers 170 on the downstream side along the transport direction of the substrate S. Specifically, among the eight rollers 170, the seventh roller 170 from the upstream side in the transport direction of the substrate S is disposed at a position higher than the sixth roller 170 by, for example, 3 mm to 5 mm, and eight more. The eye roller 170 is disposed at a position 6 mm to 10 mm higher than the sixth roller 170, for example. For this reason, the board | substrate S conveyed by the roller 170 in the blow part 30D will be warped concavely so that it may become low toward the back end from the front end of a conveyance direction. By warping in this way, the developer covering the surface of the substrate S flows in a direction opposite to the transport direction of the substrate S and flows down from the rear end of the substrate S. A tray (or pan) (not shown) is provided below the roller 170. The developer flowing down is collected in a tray and collected through a predetermined pipe provided in the tray. As a result, the developer can be reused, and the developer can be saved.

  Further, a blow nozzle 51 is disposed in the blow part 30D near the boundary with the subsequent rinse part 30E. The blow nozzle 51 extends in a direction orthogonal to the transport direction of the substrate S and is longer than the width of the substrate S, as shown in FIG. A plurality of holes (or slits extending in the longitudinal direction of the blow nozzle 51) are formed at a predetermined interval below the blow nozzle 51, and clean air from a clean air supply source (not shown) is discharged downward. An air curtain is formed. When the substrate S crosses the air curtain, the developer on the substrate S is blown out in a line shape over the entire width by the air curtain. Thereby, the development of the photoresist film on the substrate S is substantially stopped.

  The rinse part 30E is arrange | positioned so that the blow part 30D may be followed. Specifically, the roller 170 on the most upstream side along the substrate conveyance direction in the rinsing unit 30E is arranged so as not to have an extreme step with respect to the roller 170 on the most downstream side along the substrate conveyance direction in the blow unit 30D. The rollers 170 following the most upstream roller 170 are arranged so that their heights are sequentially reduced. Thereby, the substrate S warped (substantially concave) in the blow part 30D is warped in the reverse direction in the rinse part 30E and becomes gradually flat. The longitudinal direction, the interval, and the like of the rollers 170 are the same in the rinse portion 30E as in the blow portion 30D.

In addition, a pre-rinse nozzle 52 is provided in the rinse portion 30E. As shown in FIG. 2A, the pre-rinse nozzle 52 extends in a direction perpendicular to the transport direction of the substrate S, is longer than the width of the substrate S, and has a plurality of holes formed at predetermined intervals in the lower portion. Has been. The pre-rinse nozzle 52 is connected to a supply source (not shown) of a rinse liquid (for example, DIW), and discharges the rinse liquid over the entire width of the substrate S. The pre-rinse nozzle 52 is provided adjacent to the blow nozzle 51 of the blow unit 30D (for example, at an interval of 30 mm). After the developer is blown off, the pre-rinse nozzle 52 is formed before the photoresist film is completely dried. The resist film can be wetted with a rinse solution. For this reason, the developer remaining on the surface or the side surface of the photoresist pattern formed by development can be dissolved in the rinse solution. A rinse nozzle 53 is provided on the downstream side of the pre-rinse nozzle 52 with respect to the substrate transport direction. The rinsing nozzle 53 can discharge the rinsing liquid over all the sub-sides of the substrate S in the same manner as the pre-rinsing nozzle 52, and thereby the developer dissolved in the rinsing liquid can be washed away together with the rinsing liquid. Further, the rinse nozzle 53 is disposed to be inclined, and the rinse liquid can be supplied in a direction along the inclination of the substrate S formed by the rollers 170. Therefore, the developer can be washed away efficiently.
The substrate S from which the developing solution has been washed away by the rinsing liquid is conveyed to a drying section (not shown) arranged so as to be continuous with the rinsing section 30E. The drying unit includes a roller transport mechanism similar to the introduction unit 30A and the like, and an air knife (not shown) that discharges clean air to the substrate S transported by the roller transport mechanism to dry the substrate S. Can do. The substrate S dried by the drying unit is transported to the heat treatment unit 31 (see FIG. 1) by roller transport.
In addition, you may provide the other rinse part which has a 1 or several rinse nozzle between the rinse part 30E and the drying part. According to this, the developer can be washed away more reliably.

  Further, the developing unit 30 is appropriately provided with a plurality of sensors (not shown) for detecting the position of the substrate S transported in the developing unit 30. In accordance with the position detected by these sensors, the control unit 60 controls the motors M1 to M5 and the roller 170 to change the substrate conveyance speed, and the nozzles 50 to 53 are controlled.

Next, the operation (developing method) of the developing unit according to the present embodiment will be described with reference to FIGS. In these drawings, the control unit 60 is omitted for convenience.
Referring to FIG. 3A, the substrate S carried in from the external device unit 90 (FIG. 1) is transported in the introduction unit 30A. Although not shown, a photoresist film is formed on the surface of the substrate S, and this photoresist film is exposed by the exposure apparatus 9 (FIG. 1) to form a latent image. In the introduction part 30A, the substrate S is transported at the transport speed V11. Further, in the developer supply unit 30B following the introduction unit 30A, the motor M2 and the roller 170 are controlled by the control unit 60 (FIG. 2), and the conveyance speed V21 is set in advance higher than the conveyance speed V11 in the introduction unit 30A. ing.

  When it is detected by a sensor (not shown) that the front end of the substrate S has been carried into the developer supply unit 30B, the motor M1 and the roller 170 of the introduction unit 30 are controlled by the control unit 60, and are conveyed in the introduction unit 30. The speed V11 is changed to the transport speed V21 (the transport speed in the developer supply unit 30B). Accordingly, the substrate S is transported from the introduction unit 30A to the developer supply unit 30B at the transport speed V21. On the other hand, the developer DL is supplied from the developer supply nozzle 50 to the surface of the substrate S at the same time as the front end of the substrate S reaches just below the developer supply nozzle 50. The developer DL supplied to the surface of the substrate S remains on the surface of the substrate S due to surface tension, as shown in FIG. The supply of the developer DL is continued until the rear end of the substrate S passes just below the developer supply nozzle 50 as shown in FIG. As a result, the entire surface of the substrate S is covered with the developer DL.

  When the substrate S is being transported in the developer supply unit 30B (when the developer is being supplied), in the developing unit 30C subsequent to the developer supply unit 30B, the substrate S is transported by the developing unit 30C. The motor M3 and the roller 170 are controlled by the control unit 60 so that the speed becomes V31. The conveyance speed V31 is determined based on the time required for development (development time) and the distance between the developer supply nozzle 50 and the blow nozzle 51. More specifically, the time to reach the blow nozzle 51 after the front end of the substrate S reaches just below the developer supply nozzle 50 is equal to the desired development time (the transport speed V21 in the developer supply unit 30B is set to be equal to the desired speed). Is also determined). In the present embodiment, the transport speed V31 in the developing unit 30C is set slower than the transport speed V21 in the developer supply unit 30B.

  When the rear end of the substrate S passes the developer supply nozzle 50 and the front end of the substrate S is carried into the developing unit 30C, the motor M2 and the roller 170 of the developer supply unit 30B are controlled by the control unit 60, and the developer is supplied. The conveyance speed V21 in the supply unit 30B becomes equal to the conveyance speed V31 in the subsequent development unit 30C (FIG. 4B). As a result, as shown in FIG. 5A, the substrate S is transported from the developer supply unit 30B to the developing unit 30C at the transport speed V31. Even in this case, the surface of the substrate S is covered with the developer DL. Thereafter, as shown in FIG. 5B, the substrate S is further transported from the developing section 30C to the blow section 30D at the transport speed V31 while the surface is covered with the developer DL.

  As shown in FIG. 6A, when a sensor (not shown) detects that the front end of the substrate S has reached just below the blow nozzle 51 of the blow unit 30D, the motor M4 and the roller 170 of the blow unit 30D control. Controlled by the unit 60, the substrate S is transported at the transport speed V41. The transport speed V41 is equal to the transport speed set in the subsequent rinsing section 30E, and the transport speed V21 of the substrate S when transported in the developer supply section 30B (FIGS. 3B and 4A). )) Faster than. Further, when the substrate S reaches just below the blow nozzle 51, the substrate S is warped so that the front end becomes higher due to the arrangement of the rollers 170 of the blow unit 30D. Therefore, as shown in FIG. The liquid DL flows toward the rear end, flows down from the rear end, and is collected via a tray (not shown).

  Further, as shown in FIG. 6B, the developer on the substrate S is blown off by the air curtain formed by the clean air discharged from the blow nozzle 51, whereby the development is substantially stopped. . In a relatively short time after the developer is blown off, a rinse liquid (DIW) is supplied from the pre-rinse nozzle 52 to the surface of the substrate S, and the surface of the substrate S is wetted with the rinse liquid to the surface. The remaining developer dissolves in the rinse solution. Further, the rinse solution in which the developer is dissolved is washed away by the rinse solution supplied from the rinse nozzle 53, and the developer is more reliably removed.

  Note that the rinsing liquid discharged from the pre-rinsing nozzle 52 is blocked by the air curtain formed by the blow nozzle 51 and therefore does not flow to the blow unit 30D side. If the rinse liquid from the pre-rinsing nozzle 52 flows on the surface of the substrate S and flows downward together with the developer from the rear end of the substrate S, development spots corresponding to the pattern in which the rinse liquid flows are generated. However, according to the developing unit 30 of the present embodiment, the rinsing liquid does not flow toward the upstream side of the substrate S by the blow nozzle 51, so that such spots do not occur.

The substrate S from which the developing solution has been washed away by the rinsing liquid in the rinsing section 30E is conveyed to a drying section (not shown) arranged so as to be continuous with the rinsing section 30E, and an air knife (not shown) provided in the drying section. The substrate S is dried by the clean air discharged from the substrate) and conveyed to the heat treatment unit 31 (see FIG. 1) by rollers.
In the case where another rinsing part (not shown) is provided between the rinsing part 30E and the drying part, the substrate S from which the developing solution has been washed away by the rinsing liquid in the rinsing part 30E is given to another rinsing part. Then, it is further cleaned and transported to the drying section.

  As an example of the transport speed of the substrate S, the transport speed V21 (FIG. 3) when the developer is supplied from the developer supply nozzle 50 to the substrate S in the developer supply unit 30B is, for example, from 60 mm / sec to 100 mm / sec. The conveyance speed V41 (FIG. 6) when the substrate S passes through the air curtain by the blow nozzle 51 in the blow unit 30D may be in a range from 120 mm / sec to 180 mm / sec, for example. Of course, after performing the above-described development method using at least one substrate S, the transport speeds V21, V31, V31, V31, and V31 are based on the in-plane uniformity of the formed photoresist pattern (dimensions such as line width and via diameter). It is preferable to determine V41 or the like. Further, the in-plane uniformity of the photoresist pattern may be measured, for example, in the inspection unit 35 located after the developing unit 30. Further, during the processing of one lot of substrates, the conveyance speeds V21, V31, V41, etc. are changed based on the measurement data acquired in time series in the inspection unit 35 (or other inspection apparatus) ( Or adjustment).

  As described above, in the developing unit 30 and the developing method according to the present embodiment, in the blow unit 30D, the substrate S is warped so that the front end becomes higher in order to collect the developer, so that the developer flows toward the rear end. . For this reason, the rear end side of the substrate S is exposed to a large amount of developer, and the developer is agitated by the flow of the developer, so that development on the rear end side is promoted. However, since the conveyance speed V41 in the blow unit 30D is faster than the conveyance speed V21 in the developer supply unit 30B, the development time (the developer is supplied by the developer supply nozzle 50 and then developed by the air curtain from the blow nozzle 51). The time until the liquid is blown off can be shortened on the rear end side of the substrate S, and the development can be offset. Therefore, according to the embodiment of the present invention, the effect and advantage that the in-plane uniformity of the photoresist pattern on the substrate S is not impaired is provided.

  Further, according to the developing unit 30 of the present embodiment, the substrate transport speed when supplying the developer DL onto the substrate S and the substrate transport speed when transporting the substrate S covered with the supplied developer DL. And the substrate transport speed when the developer DL is removed from the substrate S can be controlled independently, so that the substrate transport speed can be changed variously according to the photoresist or developer used. The photoresist pattern can be made uniform in the plane of the substrate.

  If the substrate transport speed cannot be controlled and the substrate transport speed is determined only by the development time, the substrate transport speed when supplying the developer cannot be adjusted. Conversely, if the substrate transport speed when supplying the developer is to be adjusted, it is necessary to secure the development time by changing the length of the developing unit 30C (substrate transport distance) in accordance with the substrate transport speed. Occurs. However, it is practically impossible to change the device configuration for each lot.

  That is, according to the developing unit 30 of the present embodiment, the process window (margin) can be enlarged. This contributes to the performance improvement of the PFD and the price reduction of the PFD accompanying the improvement of the yield. In addition, there is a high possibility that new photoresists and developing solutions that will be developed in the future can be used, and the retrofitting of the apparatus accompanying these can be omitted.

The present invention has been described above with reference to the embodiments of the present invention. However, the present invention is not limited to the above-described embodiments, and various changes or modifications can be made in light of the appended claims.
For example, after the front end of the substrate S reaches just below the blow nozzle 51 (FIG. 2), the conveyance speed in the blow unit 30D may be gradually increased. Specifically, after the front end of the substrate S reaches just below the blow nozzle 51, the control unit 60 may control the motors M4 and M5 and the rollers 170 so that the transport speed of the substrate S gradually increases. In this way, the development time on the rear end side of the substrate S can be made gradually shorter than the development time on the front end side. Therefore, it is possible to more reliably cancel the development on the rear end side of the substrate S.

  In the above embodiment, the developer DL is supplied from the developer supply nozzle 50 to the substrate S by detecting with a predetermined sensor that the front end of the substrate S has reached directly below the developer supply nozzle 50. However, it is not limited to this. For example, a sensor for detecting the front end of the substrate S is provided at a predetermined position in the introduction unit 30A (for example, approximately in the middle of the length along the transport direction of the substrate S), and when the front end of the substrate S is detected by this sensor; Based on the transport speed of the substrate S, the timing for discharging the developer DL from the developer supply nozzle 50 when the front end of the substrate S reaches just below the developer supply nozzle 50 may be determined. The timing for discharging the clean air from the blow nozzle 51 can be determined in the same manner by providing a sensor for detecting the front end of the substrate S at a predetermined position of the blow unit 30D, for example.

  Further, in the developing unit 30 of the present embodiment, the developing solution is collected by inclining the substrate S by disposing the rollers 170 in the blow unit 30D. However, after the substrate S is stopped in the blowing unit 30D, for example, lifting pins or the like are used. Thus, the developer on the substrate S may be poured off from the rear end side.

  The present invention can also be applied when the substrate is not tilted (the developer is not collected). For example, in this case, when the substrate transport speed when supplying the developing solution to the substrate is slow, the developing solution circulates or is stirred on the front end side of the substrate, so that development may be accelerated on the front end side. . In this case, the substantial development time on the rear end side of the substrate is reduced by lowering the substrate conveyance speed when blowing off the developer with the blow nozzle than the substrate conveyance speed when supplying the developer. Longer is preferable. As a result, the development on the rear end side can be promoted through a longer development time, and the in-plane uniformity of the photoresist pattern can be maintained. Also in this case, the substrate conveyance speed when the developer is blown off by the blow nozzle may be gradually decreased.

  In the above-described embodiment, the case where the glass substrate for FPD is used has been described. However, the present invention is applicable not only when the glass substrate is used but also when using a resin substrate or a semiconductor substrate.

  DESCRIPTION OF SYMBOLS 100 ... Coating development processing system, 1 ... Cassette station, 2 ... Processing station, 4 ... Interface station, 9 ... Exposure apparatus, 30 ... Development unit, 30A ... Introduction part, 30B ... Developer supply part, 30C ... Development part, 30D ... Blow unit, 30E ... Rinse unit, 50 ... Developer supply nozzle, 51 ... Blow nozzle, 52 ... Pre rinse nozzle, 53 ... Rinse nozzle, 90 ... Control unit, 170 ... Colo, M1 to M5 ... Drive device (motor) , S: substrate.

Claims (11)

Supplying a developing solution to the surface while transporting the substrate having the exposed photoresist film on the surface at a first transport speed;
Transporting the substrate whose surface is covered with the developer at a second transport speed;
Blowing off the developer covering the surface of the substrate with a gas while transporting the substrate at a third transport speed different from the first transport speed;
And a step of supplying a rinsing liquid to the surface while transporting the substrate at the third transport speed following the blow-off step.   The method for developing a photoresist film according to claim 1, wherein the third transport speed is faster than the first transport speed.   The method for developing a photoresist film according to claim 1, wherein the third transport speed is slower than the first transport speed.   The method for developing a photoresist film according to any one of claims 1 to 3, wherein the step of blowing off includes a step of pouring off the developer covering the surface of the substrate from a rear end in a transport direction of the substrate. . A step of measuring a dimension of a resist pattern obtained by performing from the step of supplying the developer to the step of supplying the rinse solution to at least one of the substrates;
The method for developing a photoresist film according to claim 1, further comprising: determining the third conveyance speed based on a result of the measuring step.   The method for developing a photoresist film according to claim 1, further comprising a step of further supplying a rinse liquid to the surface of the substrate after the step of supplying the rinse liquid. A first transport mechanism for transporting a substrate having an exposed photoresist film on the surface thereof, and a developer supply section having a supply nozzle for supplying a developer to the surface of the substrate transported by the first transport mechanism; ,
A developing section having a second transport mechanism for transporting the substrate whose surface is covered with the developer supplied from the supply nozzle;
A blow nozzle that discharges gas to blow off the developer covering the surface of the substrate, and a blow unit having a third transport mechanism that transports the substrate toward the blow nozzle;
A rinse part having a rinse liquid supply nozzle for supplying a rinse liquid to the surface of the substrate from which the developer has been blown;
The first transport mechanism and the first transport mechanism so that the first transport speed of the substrate transported by the first transport mechanism and the third transport speed of the substrate transported by the third transport mechanism are different. A photoresist film developing apparatus, comprising: a control unit that controls the third transport mechanism.   The photoresist film according to claim 7, wherein the control unit controls the first transport mechanism and the third transport mechanism such that the third transport speed is faster than the first transport speed. Development device.   The photoresist film according to claim 7, wherein the control unit controls the first transport mechanism and the third transport mechanism so that the third transport speed is slower than the first transport speed. Development device.   Another rinse having a fourth transport mechanism for transporting the substrate and another rinse liquid supply nozzle for supplying a rinse liquid to the surface of the substrate, which is disposed downstream of the rinse portion in the transport direction of the substrate. The photoresist film developing device according to claim 7, further comprising a liquid. A photoresist film forming apparatus for forming a photoresist film on a substrate;
A coating and developing treatment system comprising: the photoresist film developing device according to claim 7, which develops the exposed photoresist film.

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