CN1344425A - 模制的塑料电子组件用的导线框架的防湿层 - Google Patents
模制的塑料电子组件用的导线框架的防湿层 Download PDFInfo
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Abstract
由晶片组成的密封在中空塑料外壳内的用导电的导线穿透外壁以连接晶片电路的电子组件这样制造:仅在导线表面会与外壳材料交接的部位向导线施涂可热固化粘合剂,在导线周围模制组件,并在模制过程或后固化期间固化粘合剂。所述粘合剂配制成可在导线周围形成气密性密封,并在制造组件和与其他电路电连接时所包括的一般工序中,在部件要经受的热循环期间,也在使用时完成和装配制品要经受的一般的环境变化期间,保持密封性。尤其要选择粘合剂,使之容许导线与外壳材料之间的热膨胀系数差,同时仍保持气密性密封。
Description
本发明属于电子封装领域。本发明包括将集成电路晶片放入保护集成电路晶片免受环境影响的中空外壳内，并由外壳外的导线形成与晶片电路的连接。本发明具体涉及总的来说作为阻止潮气和污染气体渗入的屏障的外壳。
发明的背景
电子组件用作晶片的保护性外壳，同时使晶片电路与载体或基材上的电路例如印制的接线板连接。本发明所涉及的组件是完全包住晶片而且起始用导电性导线或嵌入壁的“痕线”形成为开放的插座的中空体。一旦用嵌入壁的导线形成插座，就将晶片放入插座内，与导线连接。接着闭合插座并密封以进行进一步加工，包括进一步的电连接和应用。
为了用目前用于晶片的极其细的电路线和高电流密度获得一致和可靠的性能，一旦密封后避免水汽和其他外界气体进入电子组件内就很重要。通过密封晶片并防止其与这些气体接触，电子组件就可提高晶片在潮湿和其他可能有害的环境中的性能。电连接晶片与电子组件外的部件的导线是经过组件壁的薄金属条，条的内端与晶片电路连接，外端与基材的电路连接。由于条与电子组件壁用不同的材料制成，所以它们之间难以形成起阻挡气体作用的牢固的结合。当材料的膨胀和收缩率差异大时，该困难尤其大。所述膨胀和收缩随着加工步骤例如晶片连接、电线连接和焊接中组件受到热循环时产生的温度变化而发生。温度变化也发生于使用组件的一般环境中，也会由于晶片自身使用的高电流密度而产生。结果，导线穿透壁的部位尤其容易形成气体能够进入组件并污染晶片的孔隙。
密封金属导线与组件壁之间的界面的一般方法是在导线上直接模制壁以形成组件。一般使用注塑或压铸，起始用在模制过程中或此后不久在后固化中固化的熔融态可热固化树脂。这些模制技术可在金属与塑料之间形成机械结合，由于上述原因，它对于要经受高电流密度的组件不完全有效。此外，在这些加工中，一般将模具的温度控制于100-175℃范围内，同时导线金属表面的温度相当低。该温度差可抑制熔融态树脂的固化，而且进一步削弱结合的强度。其他的漏气源来自于这样的事实，即用作模塑料的一般树脂自身具有粘合性能，因此需要脱模剂，以防止与模具粘合。一般的脱模剂是加入模塑料配制物中的微晶蜡。不幸的是，脱模剂也会削弱模塑料与金属导线之间的结合。
就本发明人所知，一种以前没有使用或揭示的方法是在导线上模制组件体之前，用粘合物简单地涂布整个导线框架，使得模塑料固化时，粘合物在导线与模塑料之间形成化学粘合。该方法的难度是必须在导线与晶片之间形成电连接的苛刻性质。粘合部位导线表面的任何污染都会妨碍形成可靠电连接的线连接过程。在模制操作完成后，只能通过昂贵和困难的清理过程来避免该现象。在镀有导电材料例如银或金以提高与晶片的电接触的导线内，该问题更严重。
发明的概述
根据本发明，通过向会与组件壁接触的导线表面的区域上选择性地施涂可热固化粘合剂，接着在导线周围模制组件，就可解决上述问题。由此，粘合剂通过其自身的模制工艺固化或在组件体的后固化期间固化。所述粘合剂是这样的材料，它一旦固化就会在导线与组件体之间的界面处形成基本不透气的密封。如果导线金属与组件体热膨胀系数存在差值，对最优粘合剂或粘合剂组合物的选择要反映出该差值大小。所述粘合剂可以包括存在热膨胀度差异时，需要为密封提供回弹性的热塑性组分。在金属上的会形成界面的区域局部施涂粘合剂，可保持在导线与晶片电路之间形成牢固电接触的能力。
从下述描述中会更加明白本发明的这些和其他目的、特征和优点。
发明的详细说明和优选实施方式
如上所述，粘合剂或粘合剂组合物的最优选择决定于导电导线和组件体所用的材料。能够使用多种材料，许多这样的材料在有关电子材料的公开文献中都有揭示，而且在它们的应用行业内是已知的。
能用于导线的金属的例子(和它们的符号表示可见Electronic MaterialsHandbook Vol.1，Minges，M.L.等编辑，ASM International，Materials Park，Ohio，1989)是：
铜
铜-铁合金：C19400，C19500，C19700，C19210
铜-铬合金：CCZ，EFTEC647
铜-镍-硅合金：C7025，KLF125，C19010
铜-锡合金：C50715，C50710
铜-锆合金：C15100
铜-镁合金：C15500
铁-镍合金：ASTM F30(Alloy 42)
铁-镍-钴合金：ASTM F15(Kovar)
低碳钢
铝
其中优选铜、铜占至少95％(重量)的含铜合金、铁约占50-75％(重量)的铁-镍合金、铁约占50-75％(重量)的铁-镍-钴合金。铁-镍合金Alloy42(58％Fe，42％Ni)和铁-镍-钴合金Kovar(54％Fe，29％Ni，17％Co)和各种铜合金尤其好。
能够用作组件体的材料的类型或外壳材料，包括热固性和热塑性材料两种。热塑性材料的例子是环氧树脂和改性的环氧树脂、聚氨酯、聚酰亚胺、改性的聚酰亚胺、聚酯和聚硅氧烷。热塑性材料的例子是聚苯硫醚、液晶聚合物、聚砜和聚醚酮。虽然对于每种材料能够使用不同的模制方法，但是热固性材料一般由压铸模制，而热塑性材料一般由模塑模制。
这些材料的影响所用粘合剂的选择的一个重要参数是热膨胀系数(“CTE”)，单位是ppm(重量)/℃。CTE可随着所用的材料变化很大，导线的CTE范围可以与组件体(模制的塑料外壳)材料的CTE范围重叠。但是，在本发明的一些实施方式中，这些范围没有重叠。例如，导线框架(包括导线)可以具有约5-15ppm/℃的CTE范围，而固化时的组件体材料可以具有约16-50ppm/℃的CTE范围。另外，导线框架材料与组件体的CTE可以相差至少约10ppm/℃，或相差最大约100ppm/℃，或相差约20-50ppm/℃。当CTE相差这些数值时，粘合剂组合物优选含有热塑性组分，或者作为单一的粘合剂配料或作为与热固性粘合剂配料的混合物。
尤其适用作粘合剂的树脂，或单独使用或组合使用，其例子如下所述：
热固性树脂：
D.E.R.332：含有双酚A的环氧树脂(Dow Chemical Company，Midland，Michigan，USA)；
ARALDITEECN1273：环氧甲酚酚醛清漆树脂(Ciba-GeigyCorporation，Ardsley，New York，USA)
ARALDITEMY721：多官能液态环氧树脂(Ciba-Geigy Corporation)
QUARTEX1410：含有双酚A的环氧树脂(Dow Chemical Company)
EPON828，1001F，58005：改性的双酚A环氧树脂(Shell ChemicalCompany，Houston，Texas，USA)
热塑性树脂：
Phenoxy PKHJ：苯氧基树脂(Phenoxy Associate)
聚砜
粘合剂组合物任选包含一种或多种配料，为组合物提供多种较好的性能中的任何一种。例如固化剂、消泡剂、湿润剂(干燥剂)和填料可加入本体中。固化剂的例子是多元胺、多酰胺、多酚、聚硫醇、多羧酸、酐、双氰胺、氰基胍、咪唑和路易斯酸例如三氟化硼与胺或醚的配合物。消泡剂的例子是憎水性二氧化硅例如聚硅氧烷树脂和硅烷、氟烃例如聚四氟乙烯、脂肪酸的酰胺例如亚乙基二胺、硬脂酰胺、磺酰胺、烃蜡和固态脂肪酸和酯。湿润剂的例子是活性氧化铝和活性碳。用作湿润剂的具体产品是供应商(美国NewJersey的Jersey City的Alpha Metals)标为GA2000-2、SD1000和SD800的产品。填料的例子是氧化铝、二氧化钛、碳黑、碳酸钙、高岭土、云母、二氧化硅、滑石粉和木粉。
制成组件的模制方法是众所周知和广泛使用的方法，因此本文不详细讨论。但是，总的来说，模制在导线框架组装物的上实施，所述组装物包括一系列由连接网络连接并以分散的组的方式排置的金属导线，每个组件为一组，相邻组由模制结束时最终要除去的进一步连接网络连接。所述组装物也包含在沿导线的一些部位处机械阻挡模塑料的坝，以帮助限制模塑料，这些在多个模制组件前面同样要除去的坝是分离的。根据所用的物料，采用常规的模制技术例如注塑、压铸、镶嵌模塑和反应注塑。
在具体的对应于模制的塑料组件外壳与导线接触的部位的部位，将粘合剂施涂到导线框架上。根据体系的具体需要，粘合剂可以施涂到框架的一面或两面。施加的实施要局限于所要求的区域，以基本避免将粘合剂施涂到不嵌入组件壁的区域上。根据1998年10月6日颁发的发明人Richard J.Ross的美国专利№5816158“Inverted Stamping Process”所揭示的步骤和设备，该类的局部施涂能够用常规印制或打印方法，优选由反打印进行，所述专利的内容结合于此以供参考。
提供下述实施例仅为了说明。
实施例
下面是表示热固性配制物、热塑性配制物和两者的不同组合的的粘合剂配制物的实施例。
1.环氧热固性粘合剂：
组分 份数(重量)
EPON828 25
EPON1001F 50
Dicy CG1400(氰基胍) 5
滑石粉 5
二氧化钛 5
Cab-O-SilM5(煅制二氧化硅) 10
2.苯氧基热塑性粘合剂
组分 份数(重量)
苯氧基PKHJ 95
滑石粉 3
Cab-O-SilM5 2
3.聚砜热塑性粘合剂
组分 份数(重量)
聚砜(分子量＝20,000) 95
二氧化钛 5
4.组合的环氧/苯氧基粘合剂(热固性和热塑性的组合)
组分 份数(重量)
EPON828 45
苯氧基PKHJ 45
Dicy CG1400 3
滑石粉 5
碳黑 2
5.组合的环氧/聚砜粘合剂(热固性和热塑性的组合)
组分 份数(重量)
D.E.R.332 30
聚砜(分子量＝20,000) 60
Dicy CG1400 2
滑石粉 4
Cab-O-SilM5 4
提供上述描述主要是为了说明。本行业内的普通技术人员会容易明白，不脱离本发明的精神和范围，可以进一步改变本文所述的方法的物料、步骤、条件和其他参数，或以不同的方式进行替换。
Claims (10)
1.一种形成模制的塑料外壳的方法，所述外壳用导电的金属导线穿透，以连接通过模制所述导线周围的所述外壳壁密封在所述外壳内的晶片，所述方法的改进之处包括：
(a)将可热固化粘合剂选择地施涂到模制时与所述外壳壁接触的所述导线表面的区域，
(b)在上面带有所述可热固化粘合剂的所述导线周围模制所述外壳壁，
(c)在模制所述外壳壁期间或随后，固化所述的可热固化粘合剂；
选择所述的可热固化粘合剂，使固化时它会在所述导线周围以基本不透气的方式密封所述外壳壁。
2.如权利要求1所述的方法，其中所述的可热固化粘合剂选自热固性树脂、热塑性树脂和热固性与热塑性树脂的混合物。
3.如权利要求1所述的方法，其中所述的可热固化粘合剂是环氧树脂与热塑性树脂的混合物。
4.如权利要求1所述的方法，其中所述的金属导线或是铜、铜-铁合金、铜-铬合金、铜-镍-硅合金、铜-锡合金、铜-锆合金、铜-镁-磷合金、铁-镍合金、铁-镍-钴合金、低碳钢或铝。
5.如权利要求1所述的方法，其中所述的塑料外壳由热固性塑料形成，而且(b)包括由压铸模制所述的外壳壁。
6.如权利要求1所述的方法，其中所述的塑料外壳由热塑性塑料形成，而且(b)包括由注塑模制所述的外壳壁。
7.如权利要求6所述的方法，其中所述的热塑性材料或是聚苯硫醚、液晶聚合物、聚砜或是聚醚酮。
8.如权利要求1所述的方法，其中所述的导线和所述的模制塑料外壳材料固化时彼此的热膨胀系数相差至少约为10ppm/℃。
9.如权利要求1所述的方法，其中所述的导线镀有银或金。
10.如权利要求1所述的方法，其中所述的可热固化粘合剂含有其中分散有干燥剂的树脂。
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| US09/273,608 | 1999-03-22 | ||
| US09/273,608 US6214152B1 (en) | 1999-03-22 | 1999-03-22 | Lead frame moisture barrier for molded plastic electronic packages |
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| JP2003139593A (ja) * | 2001-11-07 | 2003-05-14 | Hitachi Ltd | 車載電子機器および熱式流量計 |
| SG157957A1 (en) * | 2003-01-29 | 2010-01-29 | Interplex Qlp Inc | Package for integrated circuit die |
| US6900525B2 (en) * | 2003-05-21 | 2005-05-31 | Kyocera America, Inc. | Semiconductor package having filler metal of gold/silver/copper alloy |
| US20050048349A1 (en) * | 2003-08-28 | 2005-03-03 | Fannon Megan A. | Method of manufacturing a fuel cell array and a related array |
| US6913493B2 (en) * | 2003-11-05 | 2005-07-05 | Molex Incorporated | Sealed electrical connector assembly and method of fabricating same |
| US7821129B2 (en) * | 2004-12-08 | 2010-10-26 | Agilent Technologies, Inc. | Low cost hermetic ceramic microcircuit package |
| JP5046366B2 (ja) * | 2005-10-20 | 2012-10-10 | 信越化学工業株式会社 | 接着剤組成物及び該接着剤からなる接着層を備えたシート |
| US8283769B2 (en) * | 2009-10-14 | 2012-10-09 | Stmicroelectronics, Inc. | Modular low stress package technology |
| JP6210922B2 (ja) * | 2014-04-04 | 2017-10-11 | アルプス電気株式会社 | 電子部品 |
| WO2015152364A1 (ja) * | 2014-04-04 | 2015-10-08 | アルプス電気株式会社 | 電子部品の製造方法 |
| US10115605B2 (en) | 2016-07-06 | 2018-10-30 | Rjr Technologies, Inc. | Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates |
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| US3911475A (en) * | 1972-04-19 | 1975-10-07 | Westinghouse Electric Corp | Encapsulated solid state electronic devices having a sealed lead-encapsulant interface |
| JPS63184357A (ja) * | 1987-01-26 | 1988-07-29 | Japan Aviation Electronics Ind Ltd | インサート成形部品の端子保持方法 |
| US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
| JPH02133932A (ja) * | 1988-11-14 | 1990-05-23 | Polyplastics Co | プレモールドパッケージとその製造方法 |
| JPH088320B2 (ja) * | 1988-12-23 | 1996-01-29 | ポリプラスチックス株式会社 | プレモールドパッケージとその製造方法 |
| ATE186795T1 (de) * | 1990-07-21 | 1999-12-15 | Mitsui Chemicals Inc | Halbleiteranordnung mit einer packung |
| US5122858A (en) * | 1990-09-10 | 1992-06-16 | Olin Corporation | Lead frame having polymer coated surface portions |
| US5244707A (en) * | 1992-01-10 | 1993-09-14 | Shores A Andrew | Enclosure for electronic devices |
| US5458716A (en) * | 1994-05-25 | 1995-10-17 | Texas Instruments Incorporated | Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid |
| US5817544A (en) * | 1996-01-16 | 1998-10-06 | Olin Corporation | Enhanced wire-bondable leadframe |
| JPH1041423A (ja) * | 1996-07-22 | 1998-02-13 | Sony Corp | 半導体パッケージの製造方法 |
| AU4749997A (en) * | 1996-10-10 | 1998-05-05 | Rjr Polymers, Inc. | Inverted stamping process |
| US5785791A (en) * | 1997-05-05 | 1998-07-28 | Motorola, Inc. | Method of manufacturing semiconductor component |
| DE19731424C1 (de) * | 1997-07-22 | 1998-08-13 | Daimler Benz Ag | Verfahren zum Einbetten von metallischen Leitern mikroelektronischer Bauelemente in eine Kunststoffmasse |
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| Publication number | Publication date |
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| JP2002540600A (ja) | 2002-11-26 |
| AU3912500A (en) | 2000-10-09 |
| AP1317A (en) | 2004-10-19 |
| MXPA01009488A (es) | 2003-08-19 |
| FI20011860A (fi) | 2001-09-21 |
| NO20082268L (no) | 2001-09-18 |
| WO2000057466A1 (en) | 2000-09-28 |
| NO20014533D0 (no) | 2001-09-18 |
| HK1044224B (zh) | 2004-12-31 |
| IL145050A (en) | 2006-12-10 |
| KR20020010895A (ko) | 2002-02-06 |
| NO20014533L (no) | 2001-09-18 |
| TW446742B (en) | 2001-07-21 |
| HK1044224A1 (en) | 2002-10-11 |
| NO326807B1 (no) | 2009-02-16 |
| CA2372172C (en) | 2009-10-27 |
| IL145050A0 (en) | 2002-06-30 |
| EP1171911A1 (en) | 2002-01-16 |
| JP4351809B2 (ja) | 2009-10-28 |
| CN1146975C (zh) | 2004-04-21 |
| KR100605328B1 (ko) | 2006-07-28 |
| CA2372172A1 (en) | 2000-09-28 |
| AP2001002271A0 (en) | 2001-09-30 |
| US6214152B1 (en) | 2001-04-10 |
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