NO20014533D0 - Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stöpt plast - Google Patents

Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stöpt plast

Info

Publication number
NO20014533D0
NO20014533D0 NO20014533A NO20014533A NO20014533D0 NO 20014533 D0 NO20014533 D0 NO 20014533D0 NO 20014533 A NO20014533 A NO 20014533A NO 20014533 A NO20014533 A NO 20014533A NO 20014533 D0 NO20014533 D0 NO 20014533D0
Authority
NO
Norway
Prior art keywords
molded plastic
conductor frame
humidity barrier
electronics enclosures
enclosures
Prior art date
Application number
NO20014533A
Other languages
English (en)
Other versions
NO326807B1 (no
NO20014533L (no
Inventor
Richard J Ross
Cynthia L Ross
Tony B Shaffer
John Qiang Ni
Original Assignee
Rjr Polymers Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr Polymers Inc filed Critical Rjr Polymers Inc
Publication of NO20014533L publication Critical patent/NO20014533L/no
Publication of NO20014533D0 publication Critical patent/NO20014533D0/no
Publication of NO326807B1 publication Critical patent/NO326807B1/no

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142Sealing arrangements between parts, e.g. adhesion promotors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56Encapsulations, e.g. encapsulation layers, coatings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/06Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/10Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
  • Casings For Electric Apparatus (AREA)
NO20014533A 1999-03-22 2001-09-18 Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast NO326807B1 (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/273,608 US6214152B1 (en) 1999-03-22 1999-03-22 Lead frame moisture barrier for molded plastic electronic packages
PCT/US2000/007710 WO2000057466A1 (en) 1999-03-22 2000-03-22 Lead frame moisture barrier for molded plastic electronic packages

Publications (3)

Publication Number Publication Date
NO20014533L NO20014533L (no) 2001-09-18
NO20014533D0 true NO20014533D0 (no) 2001-09-18
NO326807B1 NO326807B1 (no) 2009-02-16

Family

ID=23044680

Family Applications (2)

Application Number Title Priority Date Filing Date
NO20014533A NO326807B1 (no) 1999-03-22 2001-09-18 Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av stopt plast
NO20082268A NO20082268L (no) 1999-03-22 2008-05-20 Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av støpt plast

Family Applications After (1)

Application Number Title Priority Date Filing Date
NO20082268A NO20082268L (no) 1999-03-22 2008-05-20 Fuktighetsbarriere for lederramme for elektronikkinnkapslinger av støpt plast

Country Status (15)

Country Link
US (1) US6214152B1 (no)
EP (1) EP1171911A1 (no)
JP (1) JP4351809B2 (no)
KR (1) KR100605328B1 (no)
CN (1) CN1146975C (no)
AP (1) AP1317A (no)
AU (1) AU3912500A (no)
CA (1) CA2372172C (no)
FI (1) FI20011860A (no)
HK (1) HK1044224B (no)
IL (2) IL145050A0 (no)
MX (1) MXPA01009488A (no)
NO (2) NO326807B1 (no)
TW (1) TW446742B (no)
WO (1) WO2000057466A1 (no)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003139593A (ja) * 2001-11-07 2003-05-14 Hitachi Ltd 車載電子機器および熱式流量計
SG157957A1 (en) 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US6900525B2 (en) * 2003-05-21 2005-05-31 Kyocera America, Inc. Semiconductor package having filler metal of gold/silver/copper alloy
US20050048349A1 (en) * 2003-08-28 2005-03-03 Fannon Megan A. Method of manufacturing a fuel cell array and a related array
US6913493B2 (en) * 2003-11-05 2005-07-05 Molex Incorporated Sealed electrical connector assembly and method of fabricating same
US7821129B2 (en) * 2004-12-08 2010-10-26 Agilent Technologies, Inc. Low cost hermetic ceramic microcircuit package
JP5046366B2 (ja) * 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート
US8759965B2 (en) * 2009-10-14 2014-06-24 Stmicroelectronics, Inc. Modular low stress package technology
CN106132660A (zh) * 2014-04-04 2016-11-16 阿尔卑斯电气株式会社 电子部件的制造方法
JP6210922B2 (ja) * 2014-04-04 2017-10-11 アルプス電気株式会社 電子部品
US10115605B2 (en) 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911475A (en) * 1972-04-19 1975-10-07 Westinghouse Electric Corp Encapsulated solid state electronic devices having a sealed lead-encapsulant interface
JPS63184357A (ja) * 1987-01-26 1988-07-29 Japan Aviation Electronics Ind Ltd インサート成形部品の端子保持方法
US5205036A (en) * 1988-10-17 1993-04-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device with selective coating on lead frame
JPH02133932A (ja) * 1988-11-14 1990-05-23 Polyplastics Co プレモールドパッケージとその製造方法
JPH088320B2 (ja) * 1988-12-23 1996-01-29 ポリプラスチックス株式会社 プレモールドパッケージとその製造方法
EP0468379B1 (en) * 1990-07-21 1999-11-17 Mitsui Chemicals, Inc. Semiconductor device having a package
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
US5244707A (en) * 1992-01-10 1993-09-14 Shores A Andrew Enclosure for electronic devices
US5458716A (en) * 1994-05-25 1995-10-17 Texas Instruments Incorporated Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US5817544A (en) * 1996-01-16 1998-10-06 Olin Corporation Enhanced wire-bondable leadframe
JPH1041423A (ja) * 1996-07-22 1998-02-13 Sony Corp 半導体パッケージの製造方法
AU4749997A (en) * 1996-10-10 1998-05-05 Rjr Polymers, Inc. Inverted stamping process
US5785791A (en) * 1997-05-05 1998-07-28 Motorola, Inc. Method of manufacturing semiconductor component
DE19731424C1 (de) * 1997-07-22 1998-08-13 Daimler Benz Ag Verfahren zum Einbetten von metallischen Leitern mikroelektronischer Bauelemente in eine Kunststoffmasse

Also Published As

Publication number Publication date
AP1317A (en) 2004-10-19
CA2372172C (en) 2009-10-27
NO326807B1 (no) 2009-02-16
MXPA01009488A (es) 2003-08-19
CN1344425A (zh) 2002-04-10
TW446742B (en) 2001-07-21
CA2372172A1 (en) 2000-09-28
NO20014533L (no) 2001-09-18
IL145050A0 (en) 2002-06-30
WO2000057466A1 (en) 2000-09-28
AP2001002271A0 (en) 2001-09-30
NO20082268L (no) 2001-09-18
EP1171911A1 (en) 2002-01-16
CN1146975C (zh) 2004-04-21
KR100605328B1 (ko) 2006-07-28
IL145050A (en) 2006-12-10
HK1044224B (zh) 2004-12-31
US6214152B1 (en) 2001-04-10
FI20011860A (fi) 2001-09-21
JP2002540600A (ja) 2002-11-26
HK1044224A1 (en) 2002-10-11
JP4351809B2 (ja) 2009-10-28
KR20020010895A (ko) 2002-02-06
AU3912500A (en) 2000-10-09

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