HK1044224B - 形成模製的中空塑料外殼的方法 - Google Patents

形成模製的中空塑料外殼的方法

Info

Publication number
HK1044224B
HK1044224B HK02105774.9A HK02105774A HK1044224B HK 1044224 B HK1044224 B HK 1044224B HK 02105774 A HK02105774 A HK 02105774A HK 1044224 B HK1044224 B HK 1044224B
Authority
HK
Hong Kong
Prior art keywords
forming
molded plastic
hollow molded
plastic enclosure
enclosure
Prior art date
Application number
HK02105774.9A
Other languages
English (en)
Other versions
HK1044224A1 (en
Inventor
R‧J‧羅斯
C‧L‧羅斯
T‧B‧謝弗
J‧Q‧倪
Original Assignee
Rjr聚合物股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rjr聚合物股份有限公司 filed Critical Rjr聚合物股份有限公司
Publication of HK1044224A1 publication Critical patent/HK1044224A1/xx
Publication of HK1044224B publication Critical patent/HK1044224B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3142—Sealing arrangements between parts, e.g. adhesion promotors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Specific Sealing Or Ventilating Devices For Doors And Windows (AREA)
  • Casings For Electric Apparatus (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
HK02105774.9A 1999-03-22 2002-08-07 形成模製的中空塑料外殼的方法 HK1044224B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/273,608 US6214152B1 (en) 1999-03-22 1999-03-22 Lead frame moisture barrier for molded plastic electronic packages
PCT/US2000/007710 WO2000057466A1 (en) 1999-03-22 2000-03-22 Lead frame moisture barrier for molded plastic electronic packages

Publications (2)

Publication Number Publication Date
HK1044224A1 HK1044224A1 (en) 2002-10-11
HK1044224B true HK1044224B (zh) 2004-12-31

Family

ID=23044680

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02105774.9A HK1044224B (zh) 1999-03-22 2002-08-07 形成模製的中空塑料外殼的方法

Country Status (15)

Country Link
US (1) US6214152B1 (zh)
EP (1) EP1171911A1 (zh)
JP (1) JP4351809B2 (zh)
KR (1) KR100605328B1 (zh)
CN (1) CN1146975C (zh)
AP (1) AP1317A (zh)
AU (1) AU3912500A (zh)
CA (1) CA2372172C (zh)
FI (1) FI20011860A (zh)
HK (1) HK1044224B (zh)
IL (2) IL145050A0 (zh)
MX (1) MXPA01009488A (zh)
NO (2) NO326807B1 (zh)
TW (1) TW446742B (zh)
WO (1) WO2000057466A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003139593A (ja) * 2001-11-07 2003-05-14 Hitachi Ltd 車載電子機器および熱式流量計
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US6900525B2 (en) * 2003-05-21 2005-05-31 Kyocera America, Inc. Semiconductor package having filler metal of gold/silver/copper alloy
US20050048349A1 (en) * 2003-08-28 2005-03-03 Fannon Megan A. Method of manufacturing a fuel cell array and a related array
US6913493B2 (en) * 2003-11-05 2005-07-05 Molex Incorporated Sealed electrical connector assembly and method of fabricating same
US7821129B2 (en) * 2004-12-08 2010-10-26 Agilent Technologies, Inc. Low cost hermetic ceramic microcircuit package
JP5046366B2 (ja) * 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート
US8283769B2 (en) * 2009-10-14 2012-10-09 Stmicroelectronics, Inc. Modular low stress package technology
JP6210922B2 (ja) * 2014-04-04 2017-10-11 アルプス電気株式会社 電子部品
WO2015152364A1 (ja) * 2014-04-04 2015-10-08 アルプス電気株式会社 電子部品の製造方法
US10115605B2 (en) 2016-07-06 2018-10-30 Rjr Technologies, Inc. Vacuum assisted sealing processes and systems for increasing air cavity package manufacturing rates

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911475A (en) * 1972-04-19 1975-10-07 Westinghouse Electric Corp Encapsulated solid state electronic devices having a sealed lead-encapsulant interface
JPS63184357A (ja) * 1987-01-26 1988-07-29 Japan Aviation Electronics Ind Ltd インサート成形部品の端子保持方法
US5205036A (en) * 1988-10-17 1993-04-27 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device with selective coating on lead frame
JPH02133932A (ja) * 1988-11-14 1990-05-23 Polyplastics Co プレモールドパッケージとその製造方法
JPH088320B2 (ja) * 1988-12-23 1996-01-29 ポリプラスチックス株式会社 プレモールドパッケージとその製造方法
ATE186795T1 (de) * 1990-07-21 1999-12-15 Mitsui Chemicals Inc Halbleiteranordnung mit einer packung
US5122858A (en) * 1990-09-10 1992-06-16 Olin Corporation Lead frame having polymer coated surface portions
US5244707A (en) * 1992-01-10 1993-09-14 Shores A Andrew Enclosure for electronic devices
US5458716A (en) * 1994-05-25 1995-10-17 Texas Instruments Incorporated Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
US5817544A (en) * 1996-01-16 1998-10-06 Olin Corporation Enhanced wire-bondable leadframe
JPH1041423A (ja) * 1996-07-22 1998-02-13 Sony Corp 半導体パッケージの製造方法
AU4749997A (en) * 1996-10-10 1998-05-05 Rjr Polymers, Inc. Inverted stamping process
US5785791A (en) * 1997-05-05 1998-07-28 Motorola, Inc. Method of manufacturing semiconductor component
DE19731424C1 (de) * 1997-07-22 1998-08-13 Daimler Benz Ag Verfahren zum Einbetten von metallischen Leitern mikroelektronischer Bauelemente in eine Kunststoffmasse

Also Published As

Publication number Publication date
JP2002540600A (ja) 2002-11-26
AU3912500A (en) 2000-10-09
AP1317A (en) 2004-10-19
MXPA01009488A (es) 2003-08-19
FI20011860A (fi) 2001-09-21
NO20082268L (no) 2001-09-18
WO2000057466A1 (en) 2000-09-28
NO20014533D0 (no) 2001-09-18
CN1344425A (zh) 2002-04-10
IL145050A (en) 2006-12-10
KR20020010895A (ko) 2002-02-06
NO20014533L (no) 2001-09-18
TW446742B (en) 2001-07-21
HK1044224A1 (en) 2002-10-11
NO326807B1 (no) 2009-02-16
CA2372172C (en) 2009-10-27
IL145050A0 (en) 2002-06-30
EP1171911A1 (en) 2002-01-16
JP4351809B2 (ja) 2009-10-28
CN1146975C (zh) 2004-04-21
KR100605328B1 (ko) 2006-07-28
CA2372172A1 (en) 2000-09-28
AP2001002271A0 (en) 2001-09-30
US6214152B1 (en) 2001-04-10

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