DE60030045D1 - Harzverkapselte elektronische Vorrichtung - Google Patents

Harzverkapselte elektronische Vorrichtung

Info

Publication number
DE60030045D1
DE60030045D1 DE60030045T DE60030045T DE60030045D1 DE 60030045 D1 DE60030045 D1 DE 60030045D1 DE 60030045 T DE60030045 T DE 60030045T DE 60030045 T DE60030045 T DE 60030045T DE 60030045 D1 DE60030045 D1 DE 60030045D1
Authority
DE
Germany
Prior art keywords
electronic device
encapsulated electronic
resin encapsulated
resin
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60030045T
Other languages
English (en)
Other versions
DE60030045T2 (de
Inventor
Satoshi Hirakawa
Toshiaki Kaminaga
Ryoichi Kobayashi
Noboru Sugiura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Automotive Systems Engineering Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Car Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Car Engineering Co Ltd filed Critical Hitachi Ltd
Publication of DE60030045D1 publication Critical patent/DE60030045D1/de
Application granted granted Critical
Publication of DE60030045T2 publication Critical patent/DE60030045T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P3/00—Other installations
    • F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE60030045T 1999-06-28 2000-06-26 Harzverkapselte elektronische Vorrichtung Expired - Lifetime DE60030045T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18107199A JP3866880B2 (ja) 1999-06-28 1999-06-28 樹脂封止型電子装置
JP18107199 1999-06-28

Publications (2)

Publication Number Publication Date
DE60030045D1 true DE60030045D1 (de) 2006-09-28
DE60030045T2 DE60030045T2 (de) 2007-01-11

Family

ID=16094303

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60030045T Expired - Lifetime DE60030045T2 (de) 1999-06-28 2000-06-26 Harzverkapselte elektronische Vorrichtung

Country Status (4)

Country Link
US (1) US6484708B2 (de)
EP (1) EP1065916B1 (de)
JP (1) JP3866880B2 (de)
DE (1) DE60030045T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3719506B2 (ja) * 2001-12-19 2005-11-24 株式会社デンソー 半導体装置及びその製造方法
US6925980B2 (en) * 2000-07-27 2005-08-09 Visteon Global Technologies, Inc. Integrated powertrain control system for large engines
JP2002295351A (ja) * 2001-03-30 2002-10-09 Diamond Electric Mfg Co Ltd 内燃機関用点火装置のイグナイタ
JP4631205B2 (ja) * 2001-04-27 2011-02-16 株式会社デンソー 半導体装置及びその製造方法
JP4672902B2 (ja) * 2001-05-11 2011-04-20 株式会社三社電機製作所 電力用半導体モジュール
US6655367B2 (en) * 2001-07-03 2003-12-02 Honda Giken Kogyo Kabushiki Kaisha Plug-hole-installed ignition coil unit for internal combustion engines
JP2003309028A (ja) * 2002-04-12 2003-10-31 Diamond Electric Mfg Co Ltd 内燃機関用点火装置
US7390845B2 (en) * 2002-07-26 2008-06-24 Illinois Tool Works Inc Sealing system and process therefor
JP3867639B2 (ja) * 2002-07-31 2007-01-10 株式会社デンソー 混成集積回路装置
US6758200B2 (en) * 2002-08-06 2004-07-06 Delphi Technologies, Inc. Ignition coil driver chip on printed circuit board for plughole coil housing
JP3740117B2 (ja) * 2002-11-13 2006-02-01 三菱電機株式会社 電力用半導体装置
JP3938067B2 (ja) * 2003-02-18 2007-06-27 株式会社日立製作所 電子回路装置
JP3891208B2 (ja) * 2005-07-12 2007-03-14 株式会社デンソー 点火コイル及びその製造方法
US7742309B2 (en) 2006-12-29 2010-06-22 Nokia Corporation Electronic device and method of assembling an electronic device
JP5331322B2 (ja) * 2007-09-20 2013-10-30 株式会社日立製作所 半導体装置
JP2009278074A (ja) * 2008-04-15 2009-11-26 Denso Corp 内燃機関用点火コイルおよびその製造方法
JP2010147153A (ja) * 2008-12-17 2010-07-01 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
DE102010039587A1 (de) * 2010-08-20 2012-02-23 Robert Bosch Gmbh Zündvorrichtung mit verbessertem Wärmeverhalten
DE102010062349A1 (de) 2010-12-02 2012-06-06 Robert Bosch Gmbh Zündspule mit integrierter Elektronik
JP6385234B2 (ja) 2014-10-16 2018-09-05 三菱電機株式会社 半導体装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2507343B2 (ja) * 1986-09-08 1996-06-12 株式会社東芝 樹脂封止型半導体装置
JPH0831548B2 (ja) * 1987-04-04 1996-03-27 株式会社日立製作所 半導体装置
US5157478A (en) * 1989-04-19 1992-10-20 Mitsubishi Denki Kabushiki Kaisha Tape automated bonding packaged semiconductor device incorporating a heat sink
JP2590601B2 (ja) 1990-09-28 1997-03-12 松下電器産業株式会社 電子点火装置
JP2765606B2 (ja) * 1992-07-02 1998-06-18 シャープ株式会社 半導体パッケージ構造
JP2851491B2 (ja) * 1992-08-13 1999-01-27 三菱電機株式会社 内燃機関用点火装置
JP3186408B2 (ja) * 1994-03-25 2001-07-11 日立電線株式会社 多層リードフレーム及びその製造方法
JP3514884B2 (ja) * 1994-08-31 2004-03-31 株式会社ルネサステクノロジ 表面保護膜、樹脂封止型半導体装置およびその製造方法
JPH08116012A (ja) * 1994-10-18 1996-05-07 Dainippon Printing Co Ltd 放熱板とそれを用いたリードフレーム部材及び樹脂封止型半導体装置、および放熱板の製造方法
JP2686240B2 (ja) * 1995-02-14 1997-12-08 ローム株式会社 樹脂封止型半導体装置の製造方法
WO1996042107A1 (en) * 1995-06-13 1996-12-27 Hitachi Chemical Company, Ltd. Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device
US5691567A (en) * 1995-09-19 1997-11-25 National Semiconductor Corporation Structure for attaching a lead frame to a heat spreader/heat slug structure
JP3192074B2 (ja) * 1995-12-27 2001-07-23 株式会社日立製作所 内燃機関用点火装置
US5760465A (en) * 1996-02-01 1998-06-02 International Business Machines Corporation Electronic package with strain relief means
JP3201277B2 (ja) * 1996-09-11 2001-08-20 株式会社日立製作所 半導体装置
JP2885723B2 (ja) * 1996-09-20 1999-04-26 九州日本電気株式会社 リードフレームを用いた半導体装置の製造方法
JP3284925B2 (ja) * 1997-06-03 2002-05-27 株式会社デンソー 点火装置
JP2970609B2 (ja) * 1997-07-02 1999-11-02 サンケン電気株式会社 樹脂封止型電子回路装置
JPH11111543A (ja) * 1997-10-07 1999-04-23 Mitsubishi Electric Corp 内燃機関用点火コイル装置

Also Published As

Publication number Publication date
US20020104519A1 (en) 2002-08-08
JP2001015682A (ja) 2001-01-19
US6484708B2 (en) 2002-11-26
DE60030045T2 (de) 2007-01-11
EP1065916A3 (de) 2001-10-04
EP1065916A2 (de) 2001-01-03
EP1065916B1 (de) 2006-08-16
JP3866880B2 (ja) 2007-01-10

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Legal Events

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