CN1324338C - 采用塑料光纤的传送装置 - Google Patents
采用塑料光纤的传送装置 Download PDFInfo
- Publication number
- CN1324338C CN1324338C CNB031378633A CN03137863A CN1324338C CN 1324338 C CN1324338 C CN 1324338C CN B031378633 A CNB031378633 A CN B031378633A CN 03137863 A CN03137863 A CN 03137863A CN 1324338 C CN1324338 C CN 1324338C
- Authority
- CN
- China
- Prior art keywords
- optical fiber
- temperature
- plastic optical
- semiconductor light
- adopt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/46—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources characterised by using glass fibres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4271—Cooling with thermo electric cooling
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/02—Optical fibres with cladding with or without a coating
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/0607—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature
- H01S5/0612—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium by varying physical parameters other than the potential of the electrodes, e.g. by an electric or magnetic field, mechanical deformation, pressure, light, temperature controlled by temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Optical Communication System (AREA)
- Optical Couplings Of Light Guides (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Multicomponent Fibers (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002164038A JP2004014677A (ja) | 2002-06-05 | 2002-06-05 | プラスチックファイバーを用いた伝送装置 |
JP2002164038 | 2002-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1467523A CN1467523A (zh) | 2004-01-14 |
CN1324338C true CN1324338C (zh) | 2007-07-04 |
Family
ID=29545768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031378633A Expired - Fee Related CN1324338C (zh) | 2002-06-05 | 2003-05-28 | 采用塑料光纤的传送装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6874951B2 (zh) |
EP (1) | EP1369722A3 (zh) |
JP (1) | JP2004014677A (zh) |
KR (1) | KR20030094120A (zh) |
CN (1) | CN1324338C (zh) |
TW (1) | TWI243260B (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1605560B1 (de) | 2004-02-25 | 2016-08-03 | OSRAM Opto Semiconductors GmbH | Vorrichtung mit einem strahlungsemittierenden Halbleiterbauelement und Verfahren zur Temperaturstabilisierung eines strahlungsemittierenden Halbleiterbauelements |
WO2005106546A2 (en) * | 2004-04-15 | 2005-11-10 | Infinera Corporation | COOLERLESS AND FLOATING WAVELENGTH GRID PHOTONIC INTEGRATED CIRCUITS (PICs) FOR WDM TRANSMISSION NETWORKS |
EP1648057A1 (en) * | 2004-10-13 | 2006-04-19 | Harman Becker Automotive Systems GmbH | Semiconductor laser device |
KR100637930B1 (ko) * | 2004-11-08 | 2006-10-24 | 한국전자통신연구원 | 파장 분할 다중방식 광가입자망을 위한 파장가변 광원 모듈 |
DE102005009642B4 (de) * | 2005-03-03 | 2010-01-21 | Schott Ag | Optischer Signalaufnehmer mit Strahlformungseinrichtung |
JP5034345B2 (ja) * | 2006-07-07 | 2012-09-26 | ソニー株式会社 | 半導体レーザ装置の製造方法および製造装置 |
CN102809786A (zh) * | 2011-06-01 | 2012-12-05 | 深圳市博特光通讯设备有限公司 | 一种塑料光纤用电光模块的封装 |
TWI683073B (zh) * | 2019-02-01 | 2020-01-21 | 達豐通訊科技股份有限公司 | 燈箱結構 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1227421A (zh) * | 1998-02-27 | 1999-09-01 | 日本电气株式会社 | 光学半导体器件 |
US6152588A (en) * | 1994-09-28 | 2000-11-28 | Sdl, Inc. | Addressable vehicular lighting system |
US6244754B1 (en) * | 1998-03-30 | 2001-06-12 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module and method of manufacturing the same |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19817738C2 (de) * | 1998-04-21 | 2003-02-06 | Karl-Friedrich Klein | Hohle optische Wellenleiter für die Spurenanalyse in wässrigen Lösungen |
JP2001094200A (ja) * | 1999-09-21 | 2001-04-06 | Hitachi Ltd | 半導体レーザモジュール |
JP2002171023A (ja) * | 2000-11-30 | 2002-06-14 | Hitachi Ltd | 集積化光素子及び半導体レーザモジュール並びに光送信機 |
JP2002250846A (ja) * | 2001-02-26 | 2002-09-06 | Seiko Epson Corp | 光モジュール及びその製造方法並びに光伝達装置 |
-
2002
- 2002-06-05 JP JP2002164038A patent/JP2004014677A/ja active Pending
-
2003
- 2003-05-28 CN CNB031378633A patent/CN1324338C/zh not_active Expired - Fee Related
- 2003-06-03 EP EP03012617A patent/EP1369722A3/en not_active Withdrawn
- 2003-06-03 TW TW092114980A patent/TWI243260B/zh not_active IP Right Cessation
- 2003-06-05 KR KR10-2003-0036279A patent/KR20030094120A/ko not_active Application Discontinuation
- 2003-06-05 US US10/454,601 patent/US6874951B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6152588A (en) * | 1994-09-28 | 2000-11-28 | Sdl, Inc. | Addressable vehicular lighting system |
CN1227421A (zh) * | 1998-02-27 | 1999-09-01 | 日本电气株式会社 | 光学半导体器件 |
US6244754B1 (en) * | 1998-03-30 | 2001-06-12 | Sumitomo Electric Industries, Ltd. | Semiconductor laser module and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US6874951B2 (en) | 2005-04-05 |
JP2004014677A (ja) | 2004-01-15 |
EP1369722A2 (en) | 2003-12-10 |
EP1369722A3 (en) | 2004-06-30 |
KR20030094120A (ko) | 2003-12-11 |
TW200401127A (en) | 2004-01-16 |
US20030228113A1 (en) | 2003-12-11 |
TWI243260B (en) | 2005-11-11 |
CN1467523A (zh) | 2004-01-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJI PHOTO FILM CO., LTD. Free format text: FORMER OWNER: FUJIFILM HOLDINGS CORP. Effective date: 20070727 |
|
C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee |
Owner name: FUJIFILM HOLDINGS CORP. Free format text: FORMER NAME OR ADDRESS: FUJI PHOTO FILM CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Tokyo, Japan Patentee after: Fujifilm Corp. Address before: Kanagawa Patentee before: FUJIFILM Corp. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20070727 Address after: Tokyo, Japan Patentee after: FUJIFILM Corp. Address before: Tokyo, Japan Patentee before: Fujifilm Corp. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070704 Termination date: 20120528 |