CN1322587C - 软性电子设备及其制造方法 - Google Patents

软性电子设备及其制造方法 Download PDF

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Publication number
CN1322587C
CN1322587C CNB038093324A CN03809332A CN1322587C CN 1322587 C CN1322587 C CN 1322587C CN B038093324 A CNB038093324 A CN B038093324A CN 03809332 A CN03809332 A CN 03809332A CN 1322587 C CN1322587 C CN 1322587C
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CN
China
Prior art keywords
flexible substrate
opening
face
conductive layer
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB038093324A
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English (en)
Chinese (zh)
Other versions
CN1659702A (zh
Inventor
A·赫尔曼斯
R·W·艾森哈特
G·W·根格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rui Technology Co Ltd
Original Assignee
Alien Technology LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alien Technology LLC filed Critical Alien Technology LLC
Publication of CN1659702A publication Critical patent/CN1659702A/zh
Application granted granted Critical
Publication of CN1322587C publication Critical patent/CN1322587C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688Flexible insulating substrates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0017Etching of the substrate by chemical or physical means
    • H05K3/0026Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/19Segment displays

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Structure Of Printed Boards (AREA)
CNB038093324A 2002-04-23 2003-04-22 软性电子设备及其制造方法 Expired - Fee Related CN1322587C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/131,517 US6864435B2 (en) 2001-04-25 2002-04-23 Electrical contacts for flexible displays
US10/131,517 2002-04-23

Publications (2)

Publication Number Publication Date
CN1659702A CN1659702A (zh) 2005-08-24
CN1322587C true CN1322587C (zh) 2007-06-20

Family

ID=29268732

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB038093324A Expired - Fee Related CN1322587C (zh) 2002-04-23 2003-04-22 软性电子设备及其制造方法

Country Status (7)

Country Link
US (2) US6864435B2 (https=)
EP (1) EP1497865A2 (https=)
JP (1) JP2005524109A (https=)
KR (1) KR20040102168A (https=)
CN (1) CN1322587C (https=)
AU (1) AU2003234184A1 (https=)
WO (1) WO2003092073A2 (https=)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10053334B4 (de) * 2000-10-27 2018-08-02 Robert Bosch Gmbh Verfahren und Vorrichtung zur Steuerung eines Stellelements in einem Fahrzeug
AU2003293161A1 (en) * 2002-11-26 2004-06-18 E Ink Corporation Flexible electronic circuits and displays
US7236151B2 (en) * 2004-01-28 2007-06-26 Kent Displays Incorporated Liquid crystal display
US7737928B2 (en) * 2003-07-02 2010-06-15 Kent Displays Incorporated Stacked display with shared electrode addressing
US8199086B2 (en) * 2004-01-28 2012-06-12 Kent Displays Incorporated Stacked color photodisplay
CN1914031B (zh) * 2004-01-28 2011-11-16 肯特显示器公司 可悬垂液晶转移显示膜
GB2427302B (en) * 2004-01-28 2008-10-15 Incorporated Kent Displays Liquid crystal display films
US8308922B2 (en) 2004-01-29 2012-11-13 Siemens Aktiengesellschaft Electrochemical transducer array and use thereof
US20080055581A1 (en) * 2004-04-27 2008-03-06 Rogers John A Devices and methods for pattern generation by ink lithography
US7195733B2 (en) * 2004-04-27 2007-03-27 The Board Of Trustees Of The University Of Illinois Composite patterning devices for soft lithography
US7799699B2 (en) 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
US8217381B2 (en) 2004-06-04 2012-07-10 The Board Of Trustees Of The University Of Illinois Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics
US7521292B2 (en) * 2004-06-04 2009-04-21 The Board Of Trustees Of The University Of Illinois Stretchable form of single crystal silicon for high performance electronics on rubber substrates
CN102683391B (zh) 2004-06-04 2015-11-18 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
US7943491B2 (en) 2004-06-04 2011-05-17 The Board Of Trustees Of The University Of Illinois Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US7251882B2 (en) 2004-09-03 2007-08-07 Eastman Kodak Company Method for assembling micro-components to binding sites
US20060051517A1 (en) * 2004-09-03 2006-03-09 Eastman Kodak Company Thermally controlled fluidic self-assembly method and support
US20060202925A1 (en) * 2004-12-07 2006-09-14 William Manning Remote cholesteric display
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
BRPI0519478A2 (pt) 2004-12-27 2009-02-03 Quantum Paper Inc display emissivo endereÇÁvel e imprimÍvel
US7301458B2 (en) * 2005-05-11 2007-11-27 Alien Technology Corporation Method and apparatus for testing RFID devices
US7329942B2 (en) * 2005-05-18 2008-02-12 Ching-Fu Tsou Array-type modularized light-emitting diode structure and a method for packaging the structure
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7791700B2 (en) * 2005-09-16 2010-09-07 Kent Displays Incorporated Liquid crystal display on a printed circuit board
EP1991723A2 (en) 2006-03-03 2008-11-19 The Board Of Trustees Of The University Of Illinois Methods of making spatially aligned nanotubes and nanotube arrays
KR100829392B1 (ko) * 2006-08-24 2008-05-13 동부일렉트로닉스 주식회사 SoC 및 그 제조 방법
US8017220B2 (en) 2006-10-04 2011-09-13 Corning Incorporated Electronic device and method of making
US8115326B2 (en) * 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
KR101519038B1 (ko) 2007-01-17 2015-05-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 프린팅­기반 어셈블리에 의해 제조되는 광학 시스템
US8852467B2 (en) 2007-05-31 2014-10-07 Nthdegree Technologies Worldwide Inc Method of manufacturing a printable composition of a liquid or gel suspension of diodes
US9018833B2 (en) 2007-05-31 2015-04-28 Nthdegree Technologies Worldwide Inc Apparatus with light emitting or absorbing diodes
US8674593B2 (en) 2007-05-31 2014-03-18 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9343593B2 (en) 2007-05-31 2016-05-17 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US9425357B2 (en) 2007-05-31 2016-08-23 Nthdegree Technologies Worldwide Inc. Diode for a printable composition
US8877101B2 (en) 2007-05-31 2014-11-04 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, power generating or other electronic apparatus
US8846457B2 (en) 2007-05-31 2014-09-30 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8809126B2 (en) 2007-05-31 2014-08-19 Nthdegree Technologies Worldwide Inc Printable composition of a liquid or gel suspension of diodes
US8384630B2 (en) 2007-05-31 2013-02-26 Nthdegree Technologies Worldwide Inc Light emitting, photovoltaic or other electronic apparatus and system
US8133768B2 (en) * 2007-05-31 2012-03-13 Nthdegree Technologies Worldwide Inc Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
US9419179B2 (en) 2007-05-31 2016-08-16 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US8889216B2 (en) 2007-05-31 2014-11-18 Nthdegree Technologies Worldwide Inc Method of manufacturing addressable and static electronic displays
US8415879B2 (en) 2007-05-31 2013-04-09 Nthdegree Technologies Worldwide Inc Diode for a printable composition
US9534772B2 (en) 2007-05-31 2017-01-03 Nthdegree Technologies Worldwide Inc Apparatus with light emitting diodes
KR100974816B1 (ko) * 2008-02-27 2010-08-10 주식회사 비즈모델라인 전자부품에 알에프아이디 태그 내장 방법 및 시스템과 이를위한 기록매체
CN103872002B (zh) 2008-03-05 2017-03-01 伊利诺伊大学评议会 可拉伸和可折叠的电子器件
DE102008013031B4 (de) * 2008-03-07 2019-07-25 Osram Oled Gmbh Optoelektronisches Bauelement
US8470701B2 (en) * 2008-04-03 2013-06-25 Advanced Diamond Technologies, Inc. Printable, flexible and stretchable diamond for thermal management
US7992332B2 (en) 2008-05-13 2011-08-09 Nthdegree Technologies Worldwide Inc. Apparatuses for providing power for illumination of a display object
US8127477B2 (en) 2008-05-13 2012-03-06 Nthdegree Technologies Worldwide Inc Illuminating display systems
WO2010005707A1 (en) * 2008-06-16 2010-01-14 The Board Of Trustees Of The University Of Illinois Medium scale carbon nanotube thin film integrated circuits on flexible plastic substrates
US8886334B2 (en) * 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) * 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8372726B2 (en) * 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US9289132B2 (en) * 2008-10-07 2016-03-22 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8049327B2 (en) * 2009-01-05 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Through-silicon via with scalloped sidewalls
TWI592996B (zh) * 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
US20110218756A1 (en) * 2009-10-01 2011-09-08 Mc10, Inc. Methods and apparatus for conformal sensing of force and/or acceleration at a person's head
US9723122B2 (en) 2009-10-01 2017-08-01 Mc10, Inc. Protective cases with integrated electronics
US8666471B2 (en) * 2010-03-17 2014-03-04 The Board Of Trustees Of The University Of Illinois Implantable biomedical devices on bioresorbable substrates
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
US10918298B2 (en) 2009-12-16 2021-02-16 The Board Of Trustees Of The University Of Illinois High-speed, high-resolution electrophysiology in-vivo using conformal electronics
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
US9442285B2 (en) 2011-01-14 2016-09-13 The Board Of Trustees Of The University Of Illinois Optical component array having adjustable curvature
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9159635B2 (en) 2011-05-27 2015-10-13 Mc10, Inc. Flexible electronic structure
US8934965B2 (en) 2011-06-03 2015-01-13 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
CN108389893A (zh) 2011-12-01 2018-08-10 伊利诺伊大学评议会 经设计以经历可编程转变的瞬态器件
EP2830492B1 (en) 2012-03-30 2021-05-19 The Board of Trustees of the University of Illinois Appendage mountable electronic devices conformable to surfaces and method of making the same
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9075199B2 (en) 2012-10-30 2015-07-07 Apple Inc. Displays with polarizer layers for electronic devices
CN107851208B (zh) 2015-06-01 2021-09-10 伊利诺伊大学评议会 具有无线供电和近场通信能力的小型化电子系统
WO2016196673A1 (en) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Alternative approach to uv sensing
EP3353771B1 (en) 2015-09-25 2023-06-14 Apple Inc. Redundancy configuration of row driver
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
DE102016112104A1 (de) * 2016-07-01 2018-01-04 Osram Opto Semiconductors Gmbh Modulares modul
CN108682305B (zh) 2018-05-21 2021-04-27 京东方科技集团股份有限公司 柔性基板及其制备方法、和柔性显示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000286549A (ja) * 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法
CN1323505A (zh) * 1998-10-15 2001-11-21 阿梅拉西亚国际技术公司 一种具有嵌入电子装置的物件及其制作方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5065227A (en) * 1990-06-04 1991-11-12 International Business Machines Corporation Integrated circuit packaging using flexible substrate
US5111278A (en) * 1991-03-27 1992-05-05 Eichelberger Charles W Three-dimensional multichip module systems
JP3246927B2 (ja) * 1991-09-17 2002-01-15 電気化学工業株式会社 フレキシブルマトリックス回路基板及び表示板
FR2708170B1 (fr) * 1993-07-19 1995-09-08 Innovation Dev Cie Gle Circuits électroniques à très haute conductibilité et de grande finesse, leurs procédés de fabrication, et dispositifs les comprenant.
US5545291A (en) 1993-12-17 1996-08-13 The Regents Of The University Of California Method for fabricating self-assembling microstructures
US5824186A (en) * 1993-12-17 1998-10-20 The Regents Of The University Of California Method and apparatus for fabricating self-assembling microstructures
US5783360A (en) * 1994-04-13 1998-07-21 Flex Products, Inc. Flexible optical medium with dielectric protective overcoat
JP2863094B2 (ja) * 1994-08-05 1999-03-03 矢崎総業株式会社 配線板の接続方法
DE19527359A1 (de) * 1995-07-26 1997-02-13 Giesecke & Devrient Gmbh Schaltungseinheit und Verfahren zur Herstellung einer Schaltungseinheit
AU6238296A (en) * 1995-08-01 1997-02-26 Austria Card Plastikkarten Und Ausweissysteme Gmbh Data carrier with a component-bearing module and a coil, and a process for fabricating such a data carrier
JP3387714B2 (ja) * 1995-12-11 2003-03-17 キヤノン株式会社 電子源とその製造装置及び製造方法及び画像形成装置
JP3900630B2 (ja) * 1997-12-03 2007-04-04 株式会社デンソー リモートidタグ
TW407364B (en) * 1998-03-26 2000-10-01 Toshiba Corp Memory apparatus, card type memory apparatus, and electronic apparatus
JP2000105548A (ja) * 1998-07-31 2000-04-11 Denso Corp 表示パネル用電極基板及びその製造方法
DE19840220A1 (de) * 1998-09-03 2000-04-20 Fraunhofer Ges Forschung Transpondermodul und Verfahren zur Herstellung desselben
DE19846237A1 (de) * 1998-10-07 2000-04-13 Fraunhofer Ges Forschung Verfahren zur Herstellung eines Mikrotransponders
JP2000132657A (ja) * 1998-10-28 2000-05-12 Dainippon Printing Co Ltd Icカードおよびその製造方法
WO2001026180A1 (en) 1999-10-04 2001-04-12 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
JP2001242476A (ja) * 2000-02-29 2001-09-07 Seiko Epson Corp 液晶装置及びその製造方法、並びに電子機器
JP4444435B2 (ja) * 2000-03-06 2010-03-31 ソニーケミカル&インフォメーションデバイス株式会社 プリント配線基板及びプリント配線基板の製造方法
JP4489899B2 (ja) * 2000-03-08 2010-06-23 イビデン株式会社 多層プリント配線板用両面回路基板の製造方法
JP2001313181A (ja) * 2000-05-01 2001-11-09 Sony Corp 表示装置及びその製造方法
JP3597769B2 (ja) * 2000-09-18 2004-12-08 シャープ株式会社 電子部品の製造方法
JP2002108252A (ja) * 2000-09-29 2002-04-10 Sanyo Electric Co Ltd エレクトロルミネセンス表示パネル
WO2002067329A1 (en) 2001-02-16 2002-08-29 Ignis Innovation Inc. Flexible display device
US6693384B1 (en) 2002-02-01 2004-02-17 Alien Technology Corporation Interconnect structure for electronic devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1323505A (zh) * 1998-10-15 2001-11-21 阿梅拉西亚国际技术公司 一种具有嵌入电子装置的物件及其制作方法
JP2000286549A (ja) * 1999-03-24 2000-10-13 Fujitsu Ltd バイアコネクションを備えた基板の製造方法

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Publication number Publication date
US20050181641A1 (en) 2005-08-18
JP2005524109A (ja) 2005-08-11
KR20040102168A (ko) 2004-12-03
WO2003092073A2 (en) 2003-11-06
EP1497865A2 (en) 2005-01-19
US20030155151A1 (en) 2003-08-21
US6864435B2 (en) 2005-03-08
CN1659702A (zh) 2005-08-24
AU2003234184A1 (en) 2003-11-10
WO2003092073A3 (en) 2004-05-27

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