CN1313723A - 用于在电路板上放置组件的对准装置和方法 - Google Patents
用于在电路板上放置组件的对准装置和方法 Download PDFInfo
- Publication number
- CN1313723A CN1313723A CN00133774A CN00133774A CN1313723A CN 1313723 A CN1313723 A CN 1313723A CN 00133774 A CN00133774 A CN 00133774A CN 00133774 A CN00133774 A CN 00133774A CN 1313723 A CN1313723 A CN 1313723A
- Authority
- CN
- China
- Prior art keywords
- assembly
- circuit board
- pin
- groove
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/022—Feeding of components with orientation of the elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
- Y10T29/4978—Assisting assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
- Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
一种对准装置和方法,它提供一选取和放置工具,该工具从盘中选取带引脚矩阵的组件,将组件放到自对准槽中,从槽中选取组件并把它放到印刷电路板上。槽具有与底成一定角度的光滑斜面。斜面将组件向槽的底部汇集并较正明显的对准误差。在槽的内底面有定位坑,组件的引脚便放在定位坑中,在定位坑之间是滑动面以便组件引脚滑进定位坑,从而校正细微的对准误差。
Description
本发明与把组件装配到电路板上的自动对准方法和装置有关。具体地说,本发明与在一个选取和放置工具(pick and placement tool)中使用一个自对准槽在印刷电路板上恰当地对准带引脚矩阵的组件(matrix leaded module)有关。
象计算机这样的电子设备是由电子线路构成的。这些电子线路被封装成组件。一个组件一般完成一个功能或一个相关功能集。这些组件被安放在印刷电路板(PCB)上并且通过导电物质构成的线路相连,这些线路包含于印刷电路板上或印刷电路板内,组件具有引脚,这些引脚从组件体延伸到导电物质构成的线路中。这样,组件的电路连到组件引脚,引脚连到线路,线路与其它组件的电路相连。多个印刷电路板连在一起就构成电子设备。
在电子设备的生产过程中,被选中的组件必须被放在印刷电路上以便引脚处于正确线路的正确位置上。因为线路和引脚很小,所以在印刷电路板上装配组件期间,在线路中恰当地对准组件引脚就很重要了。在自动化生产操作中,在印刷电路板上放置组件是由机器完成的,该机器叫做选取和放置工具。选取和放置工具从组件盘中选取一个组件,确定组件引脚参照于印刷电路板的方向,把组件放置于印刷电路板的正确位置上,参照于导电物质构成的线路,组件的引脚处于正确对准位置上。
问题在于确定组件引脚的位置,因为盘中的组件可能不在一已知对准位置上。选取和放置工具(如Panasonic Panasert MPA-80)使用一个阴影视觉系统来解决该问题。在组件被放在印刷电路板上之前,选取和放置工具传送组件通过一照相机,该照相机照射一束光线在组件上,摄取一幅组件投下的阴影的照片,通过阴影的视觉检查来确定引脚的方向。该视觉检查对带周边引脚的组件起作用,这样的组件具有从组件周围伸出的引脚。然而,这样的视觉检查过程对带引脚矩阵的组件无效,这是因为在网格模式中,引脚从组件的底部伸出,这样引脚就不具有用于照相机拍摄的阴影。矩阵引脚组件包括如下组件技术:球形网格阵列(ball grid array),列网格阵列(columngrid array),以及焊盘网格阵列组件(land grid array module)。虽然存在能拍摄到矩阵引脚的更成熟的照相机,但这些照相机非常昂贵。
由于上述原因,需要一种制造装置和方法,同一个选取和放置工具一起用来参照印刷电路板对准带引脚矩阵的组件,且不用昂贵的照相机来检测组件引脚的位置。
本发明的一个目标是提供一种增强方法和装置用于对准组件,以便在印刷电路板上装配。
本发明的另一个目标是提供一种方法和装置用于对准组件以便在印刷电路板上装配,而不要求任何移动部分。
本发明的另一个目标是提供一种方法和装置,用于对准组件以便在印刷电路板上装配,而不用照相机来检测组件引脚的位置。
本发明的另一个目标是提供一种方法和装置,用于对准带引脚矩阵的组件(诸如球形网格阵列,列网格阵列,和焊盘网格阵列组件)以便在印刷电路板上装配,而不用阴影视觉照相机。
本发明的另一个目标是提供一种方法和装置,用于精确地对准组件以便在印刷电路板上装配,即使参照组件体组件引脚可能是非对齐的。
前述目标和其它目标通过一个选取和放置工具来达到,该工具选取带引脚矩阵的组件,放下或放置组件到一自对准槽内,从槽中选取组件并把组件放在印刷电路板上。槽参照于印刷电路板的具体位置和方向为选取和放置工具所知。一旦槽对准了组件,工具就从槽中选取组件并把它放在印刷电路板的适当位置上。槽具有斜面,向底倾斜具很光滑。这些面便组件汇集到槽的底部并且使组件初步对齐。槽的内底面是定位坑(locating feature),组件的引脚就插入定位坑当中。在定位坑之间是滑动面,这样组件引脚可以滑进定位坑中,从而校正细微的对准误差。槽的实施例可用于带引脚矩阵的组件,包括球形网格阵列、列网阵列及焊盘网格阵列组件。
图1A显示了选取和放置工具的较佳实施例的等比例视图。
图1B显示了一个印刷电路板例子的上视图,该较佳实施例的选取和放置工具把组件放到该印刷电路板上。
图2A,2B,2C分别显示了自对准槽的较佳实施例的等比例上视图,等比例下视图和上视图。
图2D显示一个球形网格阵列组件例子的截面视图,该组件被放在该较佳实施例的槽中。
图3显示了较佳实施例的传送装置(shuttle)的上视图。
图4显示了一个列网格阵列组件例子的截面视图,该组件位于另一实施例的槽中。
图1A显示了本发明的较佳实施例的选取和放置工具10的等比例视崐图。选取和放置工具10包含盘升降机12,传送头16,传送臂17,传送器14,传送装置18,自对准槽20,工作台支架22,控制器23,放置头24,放置臂25,照相机35,控制器23,以及总线31.在较佳实施例中,盘升降机12,盘34,传送器14,照相机35,传送头16,传送臂17,放置头24,放置臂25以及工作台支架22,这些都与Panasonic Panasert MPA-80相同。然而,本发明也可用于其他许多常用工具比如Panasonic Panasert MPA-10,Universal GSM-1Model4685,以及Phillips CSM-84。
控制器23控制选取和放置工具10的操作。控制器23包含通过总线31连到内存27、传送头16、传送臂17、放置头24、放置臂25、传送器14、盘升降机12以及照相机35的处理器。内存27中包含控制程序33,该程序含有在处理器29上执行的指令,以控制选取和放置工具10的操作。内存27中还包含放下点(drop point)19′的坐标,该坐标标识出传送器14上的放下点19。内存27中还包含拾起点(pickup poinb)21′的坐标,该坐标标识传送器14上的拾起点21。内存27中还包含组件定位信息37,该信息指明哪个组件被放在印刷电路板26上、组件在盘升降机12和盘34中的位置、印刷电路板26上放置组件的坐标以及组件在印刷电路板26上的旋转角度。
盘升降机12含多个盘34。在本较佳实施例中,盘34是JEDEC(联合电子设备工程委员会)盘。控制程序33控制盘升降机12上下移动盘34,使适当的盘被定位于紧接传送头16。盘升降机12将适当的盘滑出,使之处于紧邻传送头16的位置。传送头16从盘34中选取组件28。虽然可以使用任何选取组件的机制,在本较佳实施例中,传送头16是一个吸汽嘴。虽然较佳实施例使用盘升降机,但也可以使用任何传送适当崐的组件到传送头的方法。例如,组件可以放在管中或卷筒上。
控制程序33移动传送器14使传送装置18位于放下点19,该点通过放下点19′的坐标来标识。在该较佳实施例中,传送器14位于一线性轴承上,虽然传送器14可以是传送传送装置的任何装置。如在对图3将进一步叙述的那样,传送装置18被固定在传送器14上,自对准槽20固定在传送装置18上。控制程序33移动传送臂17,使正持有组件28的传送头16处于放下点19处的自对准槽20之上。传送头16把组件放下或放置到自对准槽20中,如下面将对图2和图3的进一步叙述,自对准槽20相对印刷电路板26将组件28推进恰当对准位置。
控制程序33移动传送器14,从而将传送装置18带到拾起点21。控制程序33移动放置臂25,使放置头24定位于拾起点21上,然后放置头25从槽20中拣取组件28。控制程序33使用拾起点21′的坐标以找到拾起点21,在本较佳实施例中,放置头24是一个吸汽嘴,但也可用任何别的装置来拣取组件。
控制程序33用照相机35找到印刷电路板26的精确位置,该印刷电路板安放在工作台支架22上,在一个传送系统中,载着印刷电路板的工作台移动经过选取和放置工具10该系统图中未显示。参看图1B,在本较佳实施例中,印刷电路板26含基准点36,它是为照相机35所能见的铜点。照相机35检测基准点36的位置,将该信息发送给控制程序33,控制程序33使用该信息在印刷电路板26上精确放置组件28。在本较佳实施例中,印刷电路板26包含3个基准点36。
参看图1A,控制程序33使用组件定位信息37和得自基准点36的信息来控制放置头24,使之将组件28放在印刷电路板26的适当位置并转动适当角度。虽然在本较佳实施例中,传送头16和放置头24是分开的,始同样传送17和放置臂25也是分开的,但也可只有附在一个臂上的一个头,其活动范围足以完成传送头16和放置头24两者的任务。
图2A显示了自对准槽20的较佳实施例的等比例视图。槽20有四个斜面42,斜面42成一定角度,使槽20在上面的开口比在下面的大。在本较佳实施例中,斜面约成45度角。斜面42经机床加工,非常光滑。在本较佳实施例中,斜面42具有N9到N12(250-2000微英寸)的表面光洁度(Surface roughness finish)。斜面42及其光滑的表面用来较正组件28的明显的误对准,并且当组件28被传送头16放下时将其汇集到槽20的底部。槽20在其内底面上有定位坑44,用来校正组件28的细微的误对准,这在对图2C的说明中有完整的叙述。
图2B显示了自对准槽20的较佳实施例的等比例下视图。在槽20的底部是对准插头40,它将槽20对准传送装置18,这在对图3的说明中将有更完整的叙述。
图2C显示了自对准槽20的较佳实施例的上视图。在本较佳实施例中,定位坑44是一些凹陷,组件28的引脚插入凹陷当中,这在对图2D的说明中有更完整的叙述。插头40插入到精钻压入孔(precision-drilltd press-fit hole)47中。
图2D显示了已在槽20中对准了的组件28的较佳实施例的截面图。本例中,定位坑44是弯曲凹陷,用以容纳球形网格阵列组件28上的引脚46。在本较佳实施例中,定位坑44的半径比引脚46的半径稍大。在定位坑44之间是滑动面48,它有助于组件引脚46滑进定位坑44中,以完成组件28的精确对准。因为自对准槽20参照槽20的位置来对准组件引脚46,因此组件引脚46和组件28间的任何对准误差都是无关的。在本较佳实施例中,使用了球形网格阵列技术。虽然图2D中显示的是球形网格阵列引脚,但本发明也可应用于其它带引脚矩阵的组件,象列网格阵列以及焊盘网格阵列组件等。在较佳实施例中,滑动面48的长度与坑间中线上定位坑44的直径之比约为1∶4。插头40被压入自对准槽20中的精钻压入孔47中。面接合处50是槽20的面的一部分,它紧接组件体52。面接合处50近乎垂直,便于组件引脚46落入适当的定位坑44中。
图3显示了本较佳实施例的传送装置18的上视图。传送装置18含对准孔30,对准插头40滑进对准孔30以参照传送装置18对准槽20,在本较佳实施例中,孔30是用钻模精密打钻的,用于在传送装置18中滑动插入。
图4显示了自对准槽20a的另一个实施例的截面视图。在本例中,组件28a是列网格阵列组件,它具有列引脚46a,列引脚46a在滑动面48a上滑动,进入定位坑44a。定位坑44a是圆锥形或漏斗形。
虽然本发明是参照较佳实施例和另一个实施例来叙述的,但本技术的专业人员会懂得,在不背离本发明的精神、范围及说明的情况下,可以进行各种细节上的变化。例如,对具体实践本发明来说,传送装置和传送器不一定是必需的。相反,槽可以固定,一个放置臂和放置头可具有足够的运动范围,以便选取组件,把组件放在槽中,从槽中拾取组件并且将它放在印刷电路板上。因此,这里公开的发明只受以下所述权利要求的限制。
Claims (4)
1.用于自对准带引脚矩阵的组件的槽装置,其特征在于包含:
用于将槽对准一已知位置的对准装置;
表面光滑的斜面;以及
在槽的内底面用于对准组件引脚的定位坑。
2.权利要求1中的装置,其特征在于,定位坑还含有凹陷,用于放置球形网格阵列组件的引脚。
3.权利要求1中的装置,其特征在于,定位坑是一些凹陷,用于放置列网格阵列组件的引脚。
4.权利要求1中的装置,其特征在于,对准装置包含连到传送装置的对准插头。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US196329 | 1994-02-15 | ||
US08/196,329 US5446960A (en) | 1994-02-15 | 1994-02-15 | Alignment apparatus and method for placing modules on a circuit board |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95101693A Division CN1077396C (zh) | 1994-02-15 | 1995-01-16 | 用于在电路板上放置组件的对准装置和方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1313723A true CN1313723A (zh) | 2001-09-19 |
CN100341388C CN100341388C (zh) | 2007-10-03 |
Family
ID=22724953
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95101693A Expired - Fee Related CN1077396C (zh) | 1994-02-15 | 1995-01-16 | 用于在电路板上放置组件的对准装置和方法 |
CNB001337742A Expired - Fee Related CN100341388C (zh) | 1994-02-15 | 1995-01-16 | 用于自对准带引脚矩阵的组件的槽装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN95101693A Expired - Fee Related CN1077396C (zh) | 1994-02-15 | 1995-01-16 | 用于在电路板上放置组件的对准装置和方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5446960A (zh) |
KR (1) | KR100189800B1 (zh) |
CN (2) | CN1077396C (zh) |
GB (1) | GB2286485A (zh) |
MY (1) | MY113988A (zh) |
TW (1) | TW327268B (zh) |
Families Citing this family (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5578874A (en) * | 1994-06-14 | 1996-11-26 | Hughes Aircraft Company | Hermetically self-sealing flip chip |
US5983477A (en) * | 1995-10-13 | 1999-11-16 | Jacks; David C. | Ball grid array rework alignment template |
US5768773A (en) * | 1995-12-14 | 1998-06-23 | Eastman Kodak Company | Fixture and method for repositioning components on a circuit board |
US5710733A (en) * | 1996-01-22 | 1998-01-20 | Silicon Graphics, Inc. | Processor-inclusive memory module |
US5731709A (en) * | 1996-01-26 | 1998-03-24 | Motorola, Inc. | Method for testing a ball grid array semiconductor device and a device for such testing |
US6405430B1 (en) * | 1996-02-07 | 2002-06-18 | Micron Technology, Inc. | Workpiece moving methods |
US5867419A (en) * | 1997-01-27 | 1999-02-02 | Silicon Graphics, Inc. | Processor-inclusive memory module |
US6048744A (en) | 1997-09-15 | 2000-04-11 | Micron Technology, Inc. | Integrated circuit package alignment feature |
US6151406A (en) | 1997-10-09 | 2000-11-21 | Cognex Corporation | Method and apparatus for locating ball grid array packages from two-dimensional image data |
JP4425357B2 (ja) * | 1998-06-30 | 2010-03-03 | パナソニック株式会社 | 部品実装装置 |
US6100175A (en) * | 1998-08-28 | 2000-08-08 | Micron Technology, Inc. | Method and apparatus for aligning and attaching balls to a substrate |
US6054682A (en) * | 1999-03-11 | 2000-04-25 | Micron Electronics, Inc. | Method and system for reducing water vapor in integrated circuit packages prior to reflow |
JP2001251104A (ja) | 2000-03-03 | 2001-09-14 | Murata Mfg Co Ltd | 非可逆回路素子及び通信機装置 |
US6988008B2 (en) * | 2000-03-10 | 2006-01-17 | Adept Technology, Inc. | Smart camera |
JP4937482B2 (ja) * | 2000-05-22 | 2012-05-23 | 東レエンジニアリング株式会社 | チップ実装装置およびその装置におけるアライメント方法 |
US6861720B1 (en) * | 2001-08-29 | 2005-03-01 | Amkor Technology, Inc. | Placement template and method for placing optical dies |
US6991960B2 (en) | 2001-08-30 | 2006-01-31 | Micron Technology, Inc. | Method of semiconductor device package alignment and method of testing |
US7173804B2 (en) * | 2004-09-28 | 2007-02-06 | Intel Corporation | Array capacitor with IC contacts and applications |
US7484530B2 (en) * | 2005-04-22 | 2009-02-03 | Parker-Hannifin Corporation | Dual purpose alignment and fluid coupling |
US20070126445A1 (en) * | 2005-11-30 | 2007-06-07 | Micron Technology, Inc. | Integrated circuit package testing devices and methods of making and using same |
CN1993016B (zh) * | 2005-12-26 | 2010-09-29 | 宏达国际电子股份有限公司 | 组合板对准结构及其方法 |
US20090014499A1 (en) * | 2007-07-11 | 2009-01-15 | Honeywell International Inc. | Automated preform attach for vacuum packaging |
US8611636B1 (en) | 2009-01-05 | 2013-12-17 | Cognex Corporation | High speed method of aligning components having a plurality of non-uniformly spaced features |
US7955091B2 (en) * | 2009-06-23 | 2011-06-07 | Tyco Electronics Corporation | Connector assembly having alignment members for holding a module |
CN101990364B (zh) * | 2009-08-04 | 2012-05-09 | 纬创资通股份有限公司 | 组装组件至电路板的方法与相关电路板组装系统 |
US8428339B2 (en) * | 2009-11-05 | 2013-04-23 | Cognex Corporation | System and method for alignment and inspection of ball grid array devices |
TWI476802B (zh) * | 2010-04-28 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | 背光型按鍵組裝裝置 |
JP5658491B2 (ja) * | 2010-06-28 | 2015-01-28 | パナソニック株式会社 | 電子機器収納ケース |
CN104284572B (zh) * | 2013-07-05 | 2017-03-22 | 珠海格力电器股份有限公司 | Ic引脚校正装置及校正方法 |
DE112015004894B4 (de) | 2014-10-28 | 2022-11-03 | Analog Devices, Inc. | Transferdruckverfahren |
US9561914B1 (en) * | 2015-10-13 | 2017-02-07 | Asm Technology Singapore Pte. Ltd | Apparatus and method for transferring electronic devices |
US10109975B2 (en) | 2015-11-11 | 2018-10-23 | International Business Machines Corporation | Module placement apparatus |
US10537050B2 (en) | 2016-06-02 | 2020-01-14 | International Business Machines Corporation | Module installation alignment device |
CN106231790A (zh) * | 2016-07-27 | 2016-12-14 | 上海摩软通讯技术有限公司 | 一种印制电路板及制作方法及移动终端 |
CN107087386B (zh) * | 2017-06-13 | 2018-07-20 | 永州市福源光学技术有限公司 | 贴片元件矫正装置 |
CN115684015A (zh) * | 2022-11-01 | 2023-02-03 | 江苏芯缘半导体有限公司 | 一种芯片外观检测机构 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3931922A (en) * | 1972-01-29 | 1976-01-13 | Ferranti, Limited | Apparatus for mounting semiconductor devices |
US3868764A (en) * | 1973-11-09 | 1975-03-04 | Gen Motors Corp | Multiple magnetic alignment of semiconductor devices for bonding |
US3868765A (en) * | 1973-11-09 | 1975-03-04 | Gen Motors Corp | Laminated template for semiconductor device bonding |
US4342090A (en) * | 1980-06-27 | 1982-07-27 | International Business Machines Corp. | Batch chip placement system |
DE3150945A1 (de) * | 1981-12-23 | 1983-07-07 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Vorrichtung zum ueberbringen von anschlussbeinlosen bauelementen auf eine vorgesehene setzposition einer schaltungsplatine |
US4479298A (en) * | 1983-07-26 | 1984-10-30 | Storage Technology Partners | Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board |
US4633584A (en) * | 1985-02-20 | 1987-01-06 | Molex Incorporated | Accurate positioning of solid components for a robotic pickup |
US4722135A (en) * | 1986-02-07 | 1988-02-02 | General Electric Co. | Apparatus for placing surface mounting devices on a printer circuit board |
US4670981A (en) * | 1986-03-17 | 1987-06-09 | Nitto Kogyo Kabushiki Kaisha | Method of mounting electronic parts on the predetermined positions of a printed circuit board |
US4776080A (en) * | 1986-12-15 | 1988-10-11 | Hewlett-Packard Company | Workpiece transport system with individually characterized offsets |
US4810154A (en) * | 1988-02-23 | 1989-03-07 | Molex Incorporated | Component feeder apparatus and method for vision-controlled robotic placement system |
GB2224600B (en) * | 1988-10-29 | 1992-03-18 | Stc Plc | Circuit assembly |
US5074036A (en) * | 1989-02-10 | 1991-12-24 | Honeywell Inc. | Method of die bonding semiconductor chip by using removable frame |
JPH0821790B2 (ja) * | 1990-02-15 | 1996-03-04 | 松下電器産業株式会社 | ロータリーヘッド式電子部品実装装置 |
US5128834A (en) * | 1990-08-20 | 1992-07-07 | Motorola, Inc. | Surface mount receptacle for leaded components |
US5205032A (en) * | 1990-09-28 | 1993-04-27 | Kabushiki Kaisha Toshiba | Electronic parts mounting apparatus |
US5048178A (en) * | 1990-10-23 | 1991-09-17 | International Business Machines Corp. | Alignment--registration tool for fabricating multi-layer electronic packages |
US5208976A (en) * | 1991-06-05 | 1993-05-11 | At&T Bell Laboratories | Apparatus and method for assembling circuit structures |
-
1994
- 1994-02-15 US US08/196,329 patent/US5446960A/en not_active Expired - Lifetime
- 1994-10-18 TW TW083109653A patent/TW327268B/zh active
- 1994-12-16 MY MYPI94003388A patent/MY113988A/en unknown
- 1994-12-29 KR KR1019940038861A patent/KR100189800B1/ko not_active IP Right Cessation
-
1995
- 1995-01-16 CN CN95101693A patent/CN1077396C/zh not_active Expired - Fee Related
- 1995-01-16 CN CNB001337742A patent/CN100341388C/zh not_active Expired - Fee Related
- 1995-02-09 GB GB9503695A patent/GB2286485A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW327268B (en) | 1998-02-21 |
US5446960A (en) | 1995-09-05 |
GB2286485A (en) | 1995-08-16 |
KR100189800B1 (ko) | 1999-06-01 |
CN1077396C (zh) | 2002-01-02 |
MY113988A (en) | 2002-07-31 |
CN100341388C (zh) | 2007-10-03 |
GB9503695D0 (en) | 1995-04-12 |
CN1111442A (zh) | 1995-11-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100341388C (zh) | 用于自对准带引脚矩阵的组件的槽装置 | |
EP0772381B1 (en) | Method and device for fitting electronic components in a printed circuit board | |
US7559138B2 (en) | Method for replacing defective PCB from PCB panel | |
CN102207369B (zh) | 物品识别装置以及使用该物品识别装置的物品处理装置 | |
US7181089B2 (en) | Method and apparatus for searching for fiducial marks, and method of detecting positions of the fiducial marks | |
US20040098857A1 (en) | Method and apparatus of detecting positioning error of electric component held by suction nozzle, and method of mounting the electric component | |
EP0708587A1 (en) | Method and apparatus for mounting a part at a specific position | |
US6963143B2 (en) | Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly | |
CA1194293A (en) | Method and apparatus for proper registration of mating parts | |
JP3253784B2 (ja) | 多層プリント基板の内層パターン位置検出方法および穴明け加工方法並びにその装置 | |
US20230006373A1 (en) | Electronics housing for automated assembly | |
JP2924943B2 (ja) | ギヤアッシー組付装置 | |
CN108462020A (zh) | 作业装置 | |
EP0395002A2 (en) | Electronic parts mounting apparatus | |
CN215379349U (zh) | 一种电子电路及其制作设备 | |
CN115621170A (zh) | 植球治具与铺球治具自动对准补偿装置及使用方法 | |
US6202031B1 (en) | Method of calibrating an automated placement machine | |
KR0179893B1 (ko) | 칩 마운터의 부품 실장위치 보정방법 | |
JPS63242000A (ja) | 電子部品の実装方法 | |
JP2832992B2 (ja) | 電子部品実装方法 | |
JPS63115205A (ja) | ロボツト制御装置 | |
Brennemann et al. | Sensors for robotic assembly | |
JPS6218087A (ja) | 電子部品の自動実装装置 | |
JPS6363336B2 (zh) | ||
Radhakrishnan | Combined effects of linear and angular errors in pc board assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20071003 Termination date: 20110116 |