TW327268B - Alignment apparatus and method for placing modules on a circuit board - Google Patents

Alignment apparatus and method for placing modules on a circuit board

Info

Publication number
TW327268B
TW327268B TW083109653A TW83109653A TW327268B TW 327268 B TW327268 B TW 327268B TW 083109653 A TW083109653 A TW 083109653A TW 83109653 A TW83109653 A TW 83109653A TW 327268 B TW327268 B TW 327268B
Authority
TW
Taiwan
Prior art keywords
module
circuit board
nest
alignment apparatus
placing modules
Prior art date
Application number
TW083109653A
Other languages
English (en)
Inventor
Duane Isaacs Phillip
Donald Kidd Thomas
Harlan Redfield Bradley
Lynn Stone Jeffrey
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW327268B publication Critical patent/TW327268B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/022—Feeding of components with orientation of the elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49895—Associating parts by use of aligning means [e.g., use of a drift pin or a "fixture"]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53261—Means to align and advance work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
TW083109653A 1994-02-15 1994-10-18 Alignment apparatus and method for placing modules on a circuit board TW327268B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/196,329 US5446960A (en) 1994-02-15 1994-02-15 Alignment apparatus and method for placing modules on a circuit board

Publications (1)

Publication Number Publication Date
TW327268B true TW327268B (en) 1998-02-21

Family

ID=22724953

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083109653A TW327268B (en) 1994-02-15 1994-10-18 Alignment apparatus and method for placing modules on a circuit board

Country Status (6)

Country Link
US (1) US5446960A (zh)
KR (1) KR100189800B1 (zh)
CN (2) CN1077396C (zh)
GB (1) GB2286485A (zh)
MY (1) MY113988A (zh)
TW (1) TW327268B (zh)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578874A (en) * 1994-06-14 1996-11-26 Hughes Aircraft Company Hermetically self-sealing flip chip
US5983477A (en) * 1995-10-13 1999-11-16 Jacks; David C. Ball grid array rework alignment template
US5768773A (en) * 1995-12-14 1998-06-23 Eastman Kodak Company Fixture and method for repositioning components on a circuit board
US5710733A (en) * 1996-01-22 1998-01-20 Silicon Graphics, Inc. Processor-inclusive memory module
US5731709A (en) * 1996-01-26 1998-03-24 Motorola, Inc. Method for testing a ball grid array semiconductor device and a device for such testing
US6405430B1 (en) * 1996-02-07 2002-06-18 Micron Technology, Inc. Workpiece moving methods
US5867419A (en) * 1997-01-27 1999-02-02 Silicon Graphics, Inc. Processor-inclusive memory module
US6048744A (en) 1997-09-15 2000-04-11 Micron Technology, Inc. Integrated circuit package alignment feature
US6151406A (en) 1997-10-09 2000-11-21 Cognex Corporation Method and apparatus for locating ball grid array packages from two-dimensional image data
JP4425357B2 (ja) * 1998-06-30 2010-03-03 パナソニック株式会社 部品実装装置
US6100175A (en) * 1998-08-28 2000-08-08 Micron Technology, Inc. Method and apparatus for aligning and attaching balls to a substrate
US6054682A (en) * 1999-03-11 2000-04-25 Micron Electronics, Inc. Method and system for reducing water vapor in integrated circuit packages prior to reflow
JP2001251104A (ja) 2000-03-03 2001-09-14 Murata Mfg Co Ltd 非可逆回路素子及び通信機装置
US6988008B2 (en) * 2000-03-10 2006-01-17 Adept Technology, Inc. Smart camera
JP4937482B2 (ja) * 2000-05-22 2012-05-23 東レエンジニアリング株式会社 チップ実装装置およびその装置におけるアライメント方法
US6861720B1 (en) * 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6991960B2 (en) 2001-08-30 2006-01-31 Micron Technology, Inc. Method of semiconductor device package alignment and method of testing
US7173804B2 (en) * 2004-09-28 2007-02-06 Intel Corporation Array capacitor with IC contacts and applications
US7484530B2 (en) * 2005-04-22 2009-02-03 Parker-Hannifin Corporation Dual purpose alignment and fluid coupling
US20070126445A1 (en) * 2005-11-30 2007-06-07 Micron Technology, Inc. Integrated circuit package testing devices and methods of making and using same
CN1993016B (zh) * 2005-12-26 2010-09-29 宏达国际电子股份有限公司 组合板对准结构及其方法
US20090014499A1 (en) * 2007-07-11 2009-01-15 Honeywell International Inc. Automated preform attach for vacuum packaging
US8611636B1 (en) 2009-01-05 2013-12-17 Cognex Corporation High speed method of aligning components having a plurality of non-uniformly spaced features
US7955091B2 (en) * 2009-06-23 2011-06-07 Tyco Electronics Corporation Connector assembly having alignment members for holding a module
CN101990364B (zh) * 2009-08-04 2012-05-09 纬创资通股份有限公司 组装组件至电路板的方法与相关电路板组装系统
US8428339B2 (en) * 2009-11-05 2013-04-23 Cognex Corporation System and method for alignment and inspection of ball grid array devices
TWI476802B (zh) * 2010-04-28 2015-03-11 Hon Hai Prec Ind Co Ltd 背光型按鍵組裝裝置
JP5658491B2 (ja) * 2010-06-28 2015-01-28 パナソニック株式会社 電子機器収納ケース
CN104284572B (zh) * 2013-07-05 2017-03-22 珠海格力电器股份有限公司 Ic引脚校正装置及校正方法
DE112015004894B4 (de) 2014-10-28 2022-11-03 Analog Devices, Inc. Transferdruckverfahren
US9561914B1 (en) * 2015-10-13 2017-02-07 Asm Technology Singapore Pte. Ltd Apparatus and method for transferring electronic devices
US10109975B2 (en) 2015-11-11 2018-10-23 International Business Machines Corporation Module placement apparatus
US10537050B2 (en) 2016-06-02 2020-01-14 International Business Machines Corporation Module installation alignment device
CN106231790A (zh) * 2016-07-27 2016-12-14 上海摩软通讯技术有限公司 一种印制电路板及制作方法及移动终端
CN107087386B (zh) * 2017-06-13 2018-07-20 永州市福源光学技术有限公司 贴片元件矫正装置
CN115684015A (zh) * 2022-11-01 2023-02-03 江苏芯缘半导体有限公司 一种芯片外观检测机构

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3931922A (en) * 1972-01-29 1976-01-13 Ferranti, Limited Apparatus for mounting semiconductor devices
US3868764A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Multiple magnetic alignment of semiconductor devices for bonding
US3868765A (en) * 1973-11-09 1975-03-04 Gen Motors Corp Laminated template for semiconductor device bonding
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
DE3150945A1 (de) * 1981-12-23 1983-07-07 Philips Patentverwaltung Gmbh, 2000 Hamburg Vorrichtung zum ueberbringen von anschlussbeinlosen bauelementen auf eine vorgesehene setzposition einer schaltungsplatine
US4479298A (en) * 1983-07-26 1984-10-30 Storage Technology Partners Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
US4633584A (en) * 1985-02-20 1987-01-06 Molex Incorporated Accurate positioning of solid components for a robotic pickup
US4722135A (en) * 1986-02-07 1988-02-02 General Electric Co. Apparatus for placing surface mounting devices on a printer circuit board
US4670981A (en) * 1986-03-17 1987-06-09 Nitto Kogyo Kabushiki Kaisha Method of mounting electronic parts on the predetermined positions of a printed circuit board
US4776080A (en) * 1986-12-15 1988-10-11 Hewlett-Packard Company Workpiece transport system with individually characterized offsets
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
GB2224600B (en) * 1988-10-29 1992-03-18 Stc Plc Circuit assembly
US5074036A (en) * 1989-02-10 1991-12-24 Honeywell Inc. Method of die bonding semiconductor chip by using removable frame
JPH0821790B2 (ja) * 1990-02-15 1996-03-04 松下電器産業株式会社 ロータリーヘッド式電子部品実装装置
US5128834A (en) * 1990-08-20 1992-07-07 Motorola, Inc. Surface mount receptacle for leaded components
US5205032A (en) * 1990-09-28 1993-04-27 Kabushiki Kaisha Toshiba Electronic parts mounting apparatus
US5048178A (en) * 1990-10-23 1991-09-17 International Business Machines Corp. Alignment--registration tool for fabricating multi-layer electronic packages
US5208976A (en) * 1991-06-05 1993-05-11 At&T Bell Laboratories Apparatus and method for assembling circuit structures

Also Published As

Publication number Publication date
US5446960A (en) 1995-09-05
GB2286485A (en) 1995-08-16
KR100189800B1 (ko) 1999-06-01
CN1077396C (zh) 2002-01-02
MY113988A (en) 2002-07-31
CN100341388C (zh) 2007-10-03
GB9503695D0 (en) 1995-04-12
CN1111442A (zh) 1995-11-08
CN1313723A (zh) 2001-09-19

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