GB2224600B - Circuit assembly - Google Patents

Circuit assembly

Info

Publication number
GB2224600B
GB2224600B GB8825357A GB8825357A GB2224600B GB 2224600 B GB2224600 B GB 2224600B GB 8825357 A GB8825357 A GB 8825357A GB 8825357 A GB8825357 A GB 8825357A GB 2224600 B GB2224600 B GB 2224600B
Authority
GB
United Kingdom
Prior art keywords
circuit assembly
assembly
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8825357A
Other versions
GB8825357D0 (en
GB2224600A (en
Inventor
John Christopher Greenwood
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STC PLC
Original Assignee
STC PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STC PLC filed Critical STC PLC
Priority to GB8825357A priority Critical patent/GB2224600B/en
Publication of GB8825357D0 publication Critical patent/GB8825357D0/en
Publication of GB2224600A publication Critical patent/GB2224600A/en
Application granted granted Critical
Publication of GB2224600B publication Critical patent/GB2224600B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/147—Semiconductor insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0657—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape of the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB8825357A 1988-10-29 1988-10-29 Circuit assembly Expired - Fee Related GB2224600B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8825357A GB2224600B (en) 1988-10-29 1988-10-29 Circuit assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8825357A GB2224600B (en) 1988-10-29 1988-10-29 Circuit assembly

Publications (3)

Publication Number Publication Date
GB8825357D0 GB8825357D0 (en) 1988-11-30
GB2224600A GB2224600A (en) 1990-05-09
GB2224600B true GB2224600B (en) 1992-03-18

Family

ID=10645997

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8825357A Expired - Fee Related GB2224600B (en) 1988-10-29 1988-10-29 Circuit assembly

Country Status (1)

Country Link
GB (1) GB2224600B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5446960A (en) * 1994-02-15 1995-09-05 International Business Machines Corporation Alignment apparatus and method for placing modules on a circuit board
DE102005007423B3 (en) * 2005-02-18 2006-06-14 Atmel Germany Gmbh Integration of electronic component (8) into substrate by formation of dielectric insulating layers on substrate front side useful in structural element modelling in semiconductor flip-chip technology with photoresistive layer in cavity
GB2436164A (en) * 2006-03-16 2007-09-19 Uvasol Ltd Improvements in electrical connections between electronic components and conductive tracks
FR2917234B1 (en) * 2007-06-07 2009-11-06 Commissariat Energie Atomique MULTI-COMPONENT DEVICE INTEGRATED IN A SEMICONDUCTOR MATRIX
FR2934082B1 (en) 2008-07-21 2011-05-27 Commissariat Energie Atomique MULTI-COMPONENT DEVICE INTEGRATED IN A MATRIX
FR2947948B1 (en) 2009-07-09 2012-03-09 Commissariat Energie Atomique HANDLE PLATE HAVING VISUALIZATION WINDOWS
EP4068346A1 (en) * 2021-03-31 2022-10-05 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Composite substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202673A (en) * 1987-03-26 1988-09-28 Haroon Ahmed Multiplechip assembly

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2202673A (en) * 1987-03-26 1988-09-28 Haroon Ahmed Multiplechip assembly

Also Published As

Publication number Publication date
GB8825357D0 (en) 1988-11-30
GB2224600A (en) 1990-05-09

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19941029