GB2220107B - Circuit board assembly - Google Patents

Circuit board assembly

Info

Publication number
GB2220107B
GB2220107B GB8810359A GB8810359A GB2220107B GB 2220107 B GB2220107 B GB 2220107B GB 8810359 A GB8810359 A GB 8810359A GB 8810359 A GB8810359 A GB 8810359A GB 2220107 B GB2220107 B GB 2220107B
Authority
GB
United Kingdom
Prior art keywords
circuit board
board assembly
assembly
circuit
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8810359A
Other versions
GB8810359D0 (en
GB2220107A (en
Inventor
Michael John Jepson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pressac Ltd
Original Assignee
Pressac Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pressac Ltd filed Critical Pressac Ltd
Priority to GB8810359A priority Critical patent/GB2220107B/en
Publication of GB8810359D0 publication Critical patent/GB8810359D0/en
Publication of GB2220107A publication Critical patent/GB2220107A/en
Application granted granted Critical
Publication of GB2220107B publication Critical patent/GB2220107B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0091—Housing specially adapted for small components
    • H05K5/0095—Housing specially adapted for small components hermetically-sealed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
GB8810359A 1988-04-30 1988-04-30 Circuit board assembly Expired - Fee Related GB2220107B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8810359A GB2220107B (en) 1988-04-30 1988-04-30 Circuit board assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8810359A GB2220107B (en) 1988-04-30 1988-04-30 Circuit board assembly

Publications (3)

Publication Number Publication Date
GB8810359D0 GB8810359D0 (en) 1988-06-08
GB2220107A GB2220107A (en) 1989-12-28
GB2220107B true GB2220107B (en) 1992-06-24

Family

ID=10636226

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8810359A Expired - Fee Related GB2220107B (en) 1988-04-30 1988-04-30 Circuit board assembly

Country Status (1)

Country Link
GB (1) GB2220107B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2747113B2 (en) * 1990-11-28 1998-05-06 北川工業株式会社 Housing with built-in conductive wire
US5754398A (en) * 1996-05-28 1998-05-19 Ford Motor Company, Inc. Circuit-carrying automotive component and method of manufacturing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024A (en) * 1979-03-30 1980-11-05 Ferranti Ltd Circuit assembly
GB2146176A (en) * 1983-09-05 1985-04-11 Gec Avionics Encapsulated assemblies of electrical components
GB2166601A (en) * 1984-10-01 1986-05-08 Ferranti Plc High-voltage electrical assembly and method of manufacture thereof
WO1987001558A1 (en) * 1985-09-05 1987-03-12 Caterpillar Inc. Printed circuit board mounting apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2046024A (en) * 1979-03-30 1980-11-05 Ferranti Ltd Circuit assembly
GB2146176A (en) * 1983-09-05 1985-04-11 Gec Avionics Encapsulated assemblies of electrical components
GB2166601A (en) * 1984-10-01 1986-05-08 Ferranti Plc High-voltage electrical assembly and method of manufacture thereof
WO1987001558A1 (en) * 1985-09-05 1987-03-12 Caterpillar Inc. Printed circuit board mounting apparatus

Also Published As

Publication number Publication date
GB8810359D0 (en) 1988-06-08
GB2220107A (en) 1989-12-28

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930430