CN1304212A - 超薄压电谐振器 - Google Patents

超薄压电谐振器 Download PDF

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CN1304212A
CN1304212A CN00137043A CN00137043A CN1304212A CN 1304212 A CN1304212 A CN 1304212A CN 00137043 A CN00137043 A CN 00137043A CN 00137043 A CN00137043 A CN 00137043A CN 1304212 A CN1304212 A CN 1304212A
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resonator
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CN1252919C (zh
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K·舒尔特斯
T·吕蒂
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Ebauchesfabrik ETA AG
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0595—Holders; Supports the holder support and resonator being formed in one body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

密封的压电谐振器,一方面包括将切割构成支架(6)的压电材料制的中心板(5)和连接到所述支架(6)的中心谐振元件(9),有金属涂层的顶面和底面,另一方面,由金属或合金制成的间隔支架(12,17)和密封板(14,19)构成的,底盖(11)和顶盖(16)其特征是,构成盖(11,16)的零件(12,14,17,19)中的至少一个电连接到中心板(5)的支架(6),并有弯曲成Z形的延伸(10,13,18,20),其末端(10a,13a,18a,20a,)与盖板(14,19)成一直线,并构成位于同一平面内的电和机械的连接装置。

Description

超薄压电谐振器
本发明涉及超薄压电谐振器，特别涉及能扁平固定到印刷电路基片上的尺寸极小的谐振器。
通过减小尺寸，压电元件厚度可小至几十毫米，而且要密封在外壳中，以防止外损坏和污染，它也可放在保护气氛或真空中。
显然，该外壳应包括用作设置在压电元件任何一边上的激励电极的外部电连接装置，这些连接装置通常也构成把谐振器固定到基片上用的固定装置。
由于外壳是用设有贯通连接腿的玻壳，没有陶瓷珠的用作连接腿的金属帽，或金属陶瓷型组件早已被放弃。本发明所参照的最新结构原理例如对应于美国专利US 4451754所公开的装置，该装置包括将切割构成支架的压电材料矩形板，它与设在中心位置的谐振元件连接，两面经金属化形成两个外电极，支架构成与谐振元件上方隔开的两个对称盖的固定装置。
当它们由单一构件构成时，盖用冲压法构成，每个盖的任一边上有平行伸到压电板的连接片。当它们由两个部件构成时，每个盖由金属支架和矩形密封板构成，之后，可构成与上述金属支架延伸相同设置的连接片。
简要说明过的谐振器扁平设置在基片上时，发现在与所述基片平面不同的平行平面中的连接片的缺陷是，这些连接片不能使谐振器单独安装到基片上。发送到基片的振荡功率也不能忽略不计，如果谐振器没有很好设计并简单地安装在基片上，从长远来看，这会对谐振器的质量和寿命带来负面影响。
本发明的目的是，为克服所述现有技术中的缺陷，提供一种超薄皆振器，它的电连接装置位于将其安装到印刷电路板基片上用的同一平面中。
本发明涉及密封的压电谐振器，一方面，它包括将切割成支架的压电材料中心板，和与所述支架连接的中心谐振元件，涂有金属的顶面和底面，另一方面，包括底盖和顶盖，每个盖由金属或合金制成的间隔支架和密封板构成。其特征是，构成盖的至少一个另件与中心板支架电连接，并有弯曲成Z形的延伸，并使其末端部分与盖板成一直线，以构成位于同一平面中的电和机械的连接装置。
优选实施例中，构成盖的所有另件均是金属制成的。之后，只是顶盖的盖板弯曲成Z形的延伸或者，底板也能平面延伸超出中心板。因此，可用激光束很容易地把连接片固定到印刷电路上。
按另一实施例，由至少一个间隔支架构成Z形弯曲延伸。即使每个间隔支架都没有Z形延伸，它们将位于支架周边上完全不同的地方，之后，可用例如薄玻璃板的绝缘材料构成顶盖板和底盖板。
当用金属制成的盖的外部要绝缘时，当然可用已知技术加绝缘化。
通过以下参照附图对实施例的详细说明，将会更清楚了解本发明的其它特征和优点。
图1是按本发明的装配好的并分解的谐振器的透视图；
图2至6是不同实施例的侧视图。
图1示出了透视的超薄压电谐器1，为了更好地理解，将其拆开，分解图中示出不同的构件。图2是同一谐振器的侧视图。按已知方式它包括，尺寸极小的压电材料制成的中心板5。例如，板有5×1.8mm的矩形表面和0.15mm的厚度，它的中心切割部分可以构成支架6，用其小边之一与它连接，谐振元件9在这里用单叉表示。当然，发明并不限于音叉形谐振元件，使用其它构形的谐振元件也属本发明范围之内。支架6和谐振元件9的底面和顶面均有用已知方法如真空淀积制得到的薄的导电涂层7。支架6的外表面8(图1中只能看到其中之一)构成谐振器其它构件的支承面和密封表面。底盖11，即要加到印刷电路基片去的盖用两个金属件构成，即：与中心板5的表面8尺寸相同的间隔支架12和盖板14构成。顶盖也用两个金属件构成，即由与支架12相同的间隔支架17和有弯曲Z形延伸20的盖板19构成。图2所示的侧视图看得更清楚。图中组件厚度已大大地放大了。第一折弯设置有一叠元件的绝缘间隔，延伸20的末端构成其底表面与底盖板14的外表面14a在同一平面的夹紧装置20a。位于同一平面内的表面14a和20b既构成电极的电连接装置也构成印刷电路基片上的安装装置，并保证超薄谐振器有高稳定性。按图3所示的另一实施例，可以看出底盖板14必有Z形弯曲延伸，所述延伸与顶盖板19的延伸20相对于谐振器的中间平面对称。具有该结构的谐振器的优点是，在组装线上不会损坏谐振器。可用任一表面20a,14a,延伸10或表面10a,19a，延伸20把谐振器机械的和电的安装到印刷电路基片上，而这些表面和延伸在以后不再使用。
用已知的方法，如熔焊或焊接或加粘接剂或导电粘接胶使所述的各种元件相互组装。
按没画出的其它实施例，可用合金制成间隔支架12,17，以允许盖板14,19能焊到支架上，并使谐振元件9的移动空间能隔开。支架12,17可用热熔材料薄板切割而成，例如冲压Au-Sn(80/20)合金制成。按同样的方式，用这种合金可把电成形支架12、17直接加到盖板14、19上，或加到中心压电元件的支架的表面8上，或两者同时进行。同样，可把绝缘漆加到除固定区和连接区之外的整个外表面上。
按图4所示的另一实施例，底盖板14也可以有能容易地把谐振器固定到基片上的平面延伸15。按图5所示的另一实施例，按上述的相同原理，用间隔支架17的Z形延伸18构成顶激励电极用的连接装置，这种情况下，盖板19与支架17有相外形，而且可用绝缘材料制造。
图6所示实施例中，顶和底间隔支架17和12均有Z形弯曲的延伸18和13。该实施例也允许底盖板14用绝缘材料制成。
已说明过的实施例中，Z形弯曲延伸或延伸设置在谐振器的宽度部分中。当然也可设置在谐振器的所有部分或长度部分中。

Claims (8)

1、密封的压电谐振器，一方面包括将切割压构成支架(6)的电材料制成的中心板(5)和与所说支架(6)连接的中心谐振元件(9)，有金属涂层的顶面和底面，另一方面，包括用由金属或合金制成的间隔支架(12,17)构成的底盖(11)和顶盖(16)及密封盖(14,19)，其特征是，构成盖(11,16)的至少一个另件(12,14,17,19)电连接到中心板(5)的支架(6)，并有弯曲成Z形的延伸(10,13,18,20)，其末端(10a,13a,18a,20a)与盖板(14,19)成一直线，以构成位于同一平面中的电的和机械的连接装置。
2、按权利要求1的谐振器，其特征是，从顶盖板(19)构成弯曲成Z形的延伸。
3、权利要求1的谐振器，其特征是顶盖板(19)和底盖板(14)有相对于谐振器的中间平面对称的弯曲成Z形的延伸(20,10)。
4、按权利要求2的谐振器，其特征是，底盖(11)的盖板(14)也有超过中心板(5)的平面延伸(15)。
5、按权利要求1至4的任一权利要求的谐振器，其特征是，间隔支架(12,17)是冲压热熔材料薄板法，或在盖板(14,19)上，或在中心板的支架(16)上电成形法构成的。
6、按权利要求1的谐振器，其特征是，从间隔支架(12,17)中的至少一个形成弯曲Z形的延伸(13,18)。
7、按权利要求16的谐振器，其特征是，两个间隔支架(12,17)有弯曲成Z形的延伸(13,18)。
8、按权利要求7的谐振器，其特征是，底盖(11)和顶盖(16)的盖板(14,19)是电绝缘的。
CNB00137043XA 1999-12-21 2000-12-20 超薄压电谐振器 Expired - Lifetime CN1252919C (zh)

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TW564560B (en) 2003-12-01
US20010004125A1 (en) 2001-06-21
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CA2327734A1 (en) 2001-06-21
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