JP2012175499A5 - - Google Patents
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- Publication number
- JP2012175499A5 JP2012175499A5 JP2011036798A JP2011036798A JP2012175499A5 JP 2012175499 A5 JP2012175499 A5 JP 2012175499A5 JP 2011036798 A JP2011036798 A JP 2011036798A JP 2011036798 A JP2011036798 A JP 2011036798A JP 2012175499 A5 JP2012175499 A5 JP 2012175499A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- piezoelectric
- element mounting
- vibrator
- mounting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims description 122
- 239000000463 material Substances 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 13
- 230000010355 oscillation Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 21
- 239000013078 crystal Substances 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 229910052786 argon Inorganic materials 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 13
- 230000005284 excitation Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 239000002356 single layer Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- -1 argon ions Chemical class 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000283216 Phocidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011036798A JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011036798A JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012175499A JP2012175499A (ja) | 2012-09-10 |
| JP2012175499A5 true JP2012175499A5 (zh) | 2014-04-10 |
Family
ID=46977950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011036798A Withdrawn JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012175499A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5776854B2 (ja) | 2012-09-26 | 2015-09-09 | 株式会社村田製作所 | 圧電振動部品 |
| JP2014146907A (ja) * | 2013-01-28 | 2014-08-14 | Asahi Kasei Electronics Co Ltd | 圧電デバイス |
| CN106031032B (zh) * | 2014-05-07 | 2018-09-25 | 株式会社村田制作所 | 水晶振荡装置 |
| JP2016103746A (ja) * | 2014-11-28 | 2016-06-02 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
| JP6525691B2 (ja) * | 2015-04-08 | 2019-06-05 | 京セラ株式会社 | 金属膜被着用治具および水晶素子の製造方法 |
| JP7087942B2 (ja) * | 2018-11-16 | 2022-06-21 | Tdk株式会社 | 振動デバイス、電子機器、及び、振動デバイスの駆動方法 |
| JP2021190932A (ja) * | 2020-06-03 | 2021-12-13 | セイコーエプソン株式会社 | 振動子及び発振器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645022A (ja) * | 1992-07-21 | 1994-02-18 | Shinko Electric Ind Co Ltd | 表面実装型気密封止端子 |
| JP3926000B2 (ja) * | 1997-09-26 | 2007-06-06 | シチズン電子株式会社 | 圧電振動子とその製造方法 |
| JPH11251863A (ja) * | 1998-03-04 | 1999-09-17 | Toyo Commun Equip Co Ltd | 圧電振動子 |
| JP3846152B2 (ja) * | 2000-04-05 | 2006-11-15 | セイコーエプソン株式会社 | 圧電振動片のマウント構造とマウント方法 |
| JP2007266829A (ja) * | 2006-03-28 | 2007-10-11 | Kyocera Kinseki Corp | 圧電デバイス |
| JP5498677B2 (ja) * | 2008-09-25 | 2014-05-21 | エスアイアイ・クリスタルテクノロジー株式会社 | 水晶発振子の製造方法 |
| JP2010118810A (ja) * | 2008-11-12 | 2010-05-27 | Epson Toyocom Corp | 圧電デバイス |
-
2011
- 2011-02-23 JP JP2011036798A patent/JP2012175499A/ja not_active Withdrawn
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