JP2012175499A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2012175499A5 JP2012175499A5 JP2011036798A JP2011036798A JP2012175499A5 JP 2012175499 A5 JP2012175499 A5 JP 2012175499A5 JP 2011036798 A JP2011036798 A JP 2011036798A JP 2011036798 A JP2011036798 A JP 2011036798A JP 2012175499 A5 JP2012175499 A5 JP 2012175499A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- piezoelectric
- element mounting
- vibrator
- mounting pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 claims description 122
- 239000000463 material Substances 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 239000011521 glass Substances 0.000 claims description 13
- 230000010355 oscillation Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 21
- 239000013078 crystal Substances 0.000 description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 14
- 229910052786 argon Inorganic materials 0.000 description 13
- 238000001020 plasma etching Methods 0.000 description 13
- 230000005284 excitation Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 9
- 239000002356 single layer Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- -1 argon ions Chemical class 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- IHWJXGQYRBHUIF-UHFFFAOYSA-N [Ag].[Pt] Chemical compound [Ag].[Pt] IHWJXGQYRBHUIF-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000283216 Phocidae Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011036798A JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011036798A JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012175499A JP2012175499A (ja) | 2012-09-10 |
| JP2012175499A5 true JP2012175499A5 (zh) | 2014-04-10 |
Family
ID=46977950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011036798A Withdrawn JP2012175499A (ja) | 2011-02-23 | 2011-02-23 | 圧電振動子、圧電発振器、及び電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2012175499A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5776854B2 (ja) * | 2012-09-26 | 2015-09-09 | 株式会社村田製作所 | 圧電振動部品 |
| JP2014146907A (ja) * | 2013-01-28 | 2014-08-14 | Asahi Kasei Electronics Co Ltd | 圧電デバイス |
| WO2015170484A1 (ja) * | 2014-05-07 | 2015-11-12 | 株式会社村田製作所 | 水晶振動装置 |
| JP2016103746A (ja) * | 2014-11-28 | 2016-06-02 | 京セラクリスタルデバイス株式会社 | 圧電デバイス |
| JP6525691B2 (ja) * | 2015-04-08 | 2019-06-05 | 京セラ株式会社 | 金属膜被着用治具および水晶素子の製造方法 |
| JP7087942B2 (ja) * | 2018-11-16 | 2022-06-21 | Tdk株式会社 | 振動デバイス、電子機器、及び、振動デバイスの駆動方法 |
| JP2021190932A (ja) * | 2020-06-03 | 2021-12-13 | セイコーエプソン株式会社 | 振動子及び発振器 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645022A (ja) * | 1992-07-21 | 1994-02-18 | Shinko Electric Ind Co Ltd | 表面実装型気密封止端子 |
| JP3926000B2 (ja) * | 1997-09-26 | 2007-06-06 | シチズン電子株式会社 | 圧電振動子とその製造方法 |
| JPH11251863A (ja) * | 1998-03-04 | 1999-09-17 | Toyo Commun Equip Co Ltd | 圧電振動子 |
| JP3846152B2 (ja) * | 2000-04-05 | 2006-11-15 | セイコーエプソン株式会社 | 圧電振動片のマウント構造とマウント方法 |
| JP2007266829A (ja) * | 2006-03-28 | 2007-10-11 | Kyocera Kinseki Corp | 圧電デバイス |
| JP5498677B2 (ja) * | 2008-09-25 | 2014-05-21 | エスアイアイ・クリスタルテクノロジー株式会社 | 水晶発振子の製造方法 |
| JP2010118810A (ja) * | 2008-11-12 | 2010-05-27 | Epson Toyocom Corp | 圧電デバイス |
-
2011
- 2011-02-23 JP JP2011036798A patent/JP2012175499A/ja not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012175499A5 (zh) | ||
| JP2012175499A (ja) | 圧電振動子、圧電発振器、及び電子機器 | |
| JP2009016949A (ja) | 圧電発振器 | |
| JP2017118370A (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス | |
| JP6363328B2 (ja) | 水晶デバイス | |
| JP5911349B2 (ja) | 水晶デバイス | |
| JP6659288B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス。 | |
| JP2007013569A (ja) | 圧電発振器 | |
| JP2017011674A (ja) | 水晶デバイス | |
| JP4380419B2 (ja) | 電子装置の製造方法 | |
| JP2008252795A (ja) | 圧電振動デバイス | |
| JP2015154371A (ja) | 水晶デバイス | |
| JP4443306B2 (ja) | 水晶振動子の製造方法 | |
| JP6777496B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス。 | |
| JP2013207549A (ja) | 圧電デバイス | |
| JP6901383B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子を用いた水晶デバイス | |
| JP6901378B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子を用いた水晶デバイス | |
| JP6892315B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子を用いた水晶デバイス | |
| JP6698338B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス | |
| JP6599760B2 (ja) | 水晶デバイス | |
| JP2017098913A (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス。 | |
| JP2022127791A (ja) | 振動素子、振動子および電子デバイス | |
| JP6612649B2 (ja) | 音叉型水晶素子及びそれを用いた水晶デバイス | |
| JP6603162B2 (ja) | 音叉型水晶素子及びその音叉型水晶素子が実装された水晶デバイス。 | |
| JP2006157511A (ja) | 水晶振動子 |