CN1295121C - 利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置 - Google Patents

利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置 Download PDF

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Publication number
CN1295121C
CN1295121C CNB031010598A CN03101059A CN1295121C CN 1295121 C CN1295121 C CN 1295121C CN B031010598 A CNB031010598 A CN B031010598A CN 03101059 A CN03101059 A CN 03101059A CN 1295121 C CN1295121 C CN 1295121C
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CN
China
Prior art keywords
reticule
disk
subpanel
reticle
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB031010598A
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English (en)
Chinese (zh)
Other versions
CN1433940A (zh
Inventor
格伦·M·弗莱德曼
彼得·克切尔斯伯格
约瑟夫·拉根扎
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ASML US Inc
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ASML US Inc
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Publication date
Application filed by ASML US Inc filed Critical ASML US Inc
Publication of CN1433940A publication Critical patent/CN1433940A/zh
Application granted granted Critical
Publication of CN1295121C publication Critical patent/CN1295121C/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Library & Information Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manipulator (AREA)
CNB031010598A 2002-01-09 2003-01-09 利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置 Expired - Fee Related CN1295121C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/040,375 2002-01-09
US10/040,375 US7004715B2 (en) 2002-01-09 2002-01-09 Apparatus for transferring and loading a reticle with a robotic reticle end-effector

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2005101066596A Division CN1328379C (zh) 2003-11-13 2003-11-13 高亲和力抗肿瘤坏死因子单克隆抗体的可变区基因

Publications (2)

Publication Number Publication Date
CN1433940A CN1433940A (zh) 2003-08-06
CN1295121C true CN1295121C (zh) 2007-01-17

Family

ID=21910641

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB031010598A Expired - Fee Related CN1295121C (zh) 2002-01-09 2003-01-09 利用机器人分划板末端执行器来输送和加装分划板所用的方法和装置

Country Status (7)

Country Link
US (2) US7004715B2 (enExample)
EP (1) EP1327913A3 (enExample)
JP (1) JP2003243301A (enExample)
KR (1) KR100891181B1 (enExample)
CN (1) CN1295121C (enExample)
SG (1) SG102066A1 (enExample)
TW (1) TWI283799B (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7004715B2 (en) * 2002-01-09 2006-02-28 Asml Holding N.V. Apparatus for transferring and loading a reticle with a robotic reticle end-effector
US6862817B1 (en) * 2003-11-12 2005-03-08 Asml Holding N.V. Method and apparatus for kinematic registration of a reticle
KR101474572B1 (ko) * 2006-06-19 2014-12-18 엔테그리스, 아이엔씨. 레티클 스토리지 정화시스템
NL1036673A1 (nl) * 2008-04-09 2009-10-12 Asml Holding Nv Robot Position Calibration Tool (RPCT).
NL1036785A1 (nl) * 2008-04-18 2009-10-20 Asml Netherlands Bv Rapid exchange device for lithography reticles.
US8145349B2 (en) 2008-05-14 2012-03-27 Formfactor, Inc. Pre-aligner search
US8336188B2 (en) * 2008-07-17 2012-12-25 Formfactor, Inc. Thin wafer chuck
JP5667620B2 (ja) * 2009-04-06 2015-02-12 エーエスエムエル ホールディング エヌ．ブイ． パターニングデバイスをロードする方法、高速交換デバイス、及び、半導体デバイスを製造するためのシステム
CN102320472B (zh) * 2011-06-03 2013-07-10 深圳市华星光电技术有限公司 基板传送系统及传送方法
KR102270563B1 (ko) * 2015-03-16 2021-06-30 주식회사 탑 엔지니어링 기판 이송 시스템
WO2023205176A1 (en) * 2022-04-18 2023-10-26 Dextrous Robotics, Inc. System and/or method for grasping objects
US12176228B2 (en) 2022-04-20 2024-12-24 Taiwan Semiconductor Manufacturing Co., Ltd. High density semiconductor storage system
CN116088283B (zh) * 2023-04-12 2023-06-30 深圳市龙图光罩股份有限公司 掩模版预校准方法、系统、电子设备以及可读存储介质

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
US5130747A (en) * 1990-09-28 1992-07-14 Kabushiki Kaisha Toshiba Carrier apparatus
US5636964A (en) * 1993-07-15 1997-06-10 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69123279T2 (de) 1990-04-06 1997-04-24 Canon K.K., Tokio/Tokyo Transportvorrichtung für Substrate und Verfahren zur Kontrolle
US5980187A (en) 1997-04-16 1999-11-09 Kla-Tencor Corporation Mechanism for transporting semiconductor-process masks
JPH1174182A (ja) * 1997-08-28 1999-03-16 Nikon Corp マスク搬送装置及びマスクステージ
US6183026B1 (en) * 1999-04-07 2001-02-06 Gasonics International Corporation End effector
EP1052546B1 (en) * 1999-04-21 2004-09-15 ASML Netherlands B.V. Substrate handler for use in lithographic projection apparatus
EP1052547A3 (en) * 1999-04-21 2002-07-31 Asm Lithography B.V. Mask-handling apparatus for lithographic projection apparatus
JP3513437B2 (ja) * 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
JP4689064B2 (ja) 2000-03-30 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
JP4560182B2 (ja) 2000-07-06 2010-10-13 キヤノン株式会社 減圧処理装置、半導体製造装置およびデバイス製造方法
JP2002050667A (ja) 2000-08-04 2002-02-15 Canon Inc 基板搬送装置、半導体製造装置および半導体デバイス製造方法
US6619903B2 (en) 2001-08-10 2003-09-16 Glenn M. Friedman System and method for reticle protection and transport
US7004715B2 (en) * 2002-01-09 2006-02-28 Asml Holding N.V. Apparatus for transferring and loading a reticle with a robotic reticle end-effector

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4984953A (en) * 1987-02-20 1991-01-15 Canon Kabushiki Kaisha Plate-like article conveying system
US5130747A (en) * 1990-09-28 1992-07-14 Kabushiki Kaisha Toshiba Carrier apparatus
US5636964A (en) * 1993-07-15 1997-06-10 Applied Materials, Inc. Wafer tray and ceramic blade for semiconductor processing apparatus
US6499777B1 (en) * 1999-05-11 2002-12-31 Matrix Integrated Systems, Inc. End-effector with integrated cooling mechanism

Also Published As

Publication number Publication date
TWI283799B (en) 2007-07-11
US7278817B2 (en) 2007-10-09
SG102066A1 (en) 2004-02-27
CN1433940A (zh) 2003-08-06
EP1327913A2 (en) 2003-07-16
JP2003243301A (ja) 2003-08-29
TW200302955A (en) 2003-08-16
US7004715B2 (en) 2006-02-28
US20030129051A1 (en) 2003-07-10
EP1327913A3 (en) 2007-03-21
KR20030080180A (ko) 2003-10-11
US20060182605A1 (en) 2006-08-17
KR100891181B1 (ko) 2009-04-01

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