CN1293373C - 校正红外辐射多元件传感器输出信号的方法和一种红外辐射多元件传感器系统 - Google Patents
校正红外辐射多元件传感器输出信号的方法和一种红外辐射多元件传感器系统 Download PDFInfo
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- CN1293373C CN1293373C CNB008177074A CN00817707A CN1293373C CN 1293373 C CN1293373 C CN 1293373C CN B008177074 A CNB008177074 A CN B008177074A CN 00817707 A CN00817707 A CN 00817707A CN 1293373 C CN1293373 C CN 1293373C
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- 230000005855 radiation Effects 0.000 title claims abstract description 58
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000012937 correction Methods 0.000 title abstract description 26
- 238000003860 storage Methods 0.000 claims abstract description 13
- 230000035945 sensitivity Effects 0.000 claims description 13
- 230000001915 proofreading effect Effects 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000007613 environmental effect Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000008054 signal transmission Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009102 absorption Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 241001269238 Data Species 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000008246 gaseous mixture Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
- G01J1/4257—Photometry, e.g. photographic exposure meter using electric radiation detectors applied to monitoring the characteristics of a beam, e.g. laser beam, headlamp beam
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/10—Arrangements of light sources specially adapted for spectrometry or colorimetry
- G01J3/108—Arrangements of light sources specially adapted for spectrometry or colorimetry for measurement in the infrared range
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
- G01J5/14—Electrical features thereof
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J5/22—Electrical features thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19962938.2 | 1999-12-24 | ||
DE19962938A DE19962938A1 (de) | 1999-12-24 | 1999-12-24 | Verfahren zum Korrigieren des Ausgangssignals eines Infrarotstrahlungsmehrelementsensors, Infrarotstrahlungsmehrelementsensor und Infrarotstrahlungsmehrelementsensorsystem |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1636129A CN1636129A (zh) | 2005-07-06 |
CN1293373C true CN1293373C (zh) | 2007-01-03 |
Family
ID=7934447
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB008177074A Expired - Fee Related CN1293373C (zh) | 1999-12-24 | 2000-12-22 | 校正红外辐射多元件传感器输出信号的方法和一种红外辐射多元件传感器系统 |
Country Status (9)
Country | Link |
---|---|
US (1) | US6871999B2 (zh) |
EP (1) | EP1240487B1 (zh) |
JP (1) | JP2003518615A (zh) |
KR (1) | KR100720796B1 (zh) |
CN (1) | CN1293373C (zh) |
AT (1) | ATE240509T1 (zh) |
DE (2) | DE19962938A1 (zh) |
HK (1) | HK1079564A1 (zh) |
WO (1) | WO2001048449A2 (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7324598B2 (en) * | 2002-07-15 | 2008-01-29 | Intel Corporation | Apparatus and method to reduce quantization error |
DE10240083A1 (de) | 2002-08-30 | 2004-03-11 | Austriamicrosystems Ag | Verfahren zur Kalibrierung einer Fotodiode, Halbleiterchip und Betriebsverfahren |
DE10321640B4 (de) * | 2003-05-13 | 2016-12-22 | Heimann Sensor Gmbh | Infrarotsensor mit verbesserter Strahlungsausbeute |
DE10322860B4 (de) * | 2003-05-21 | 2005-11-03 | X-Fab Semiconductor Foundries Ag | Schaltungsanordnung zum Auslesen elektronischer Signale aus hochauflösenden thermischen Sensoren |
DE10356508B4 (de) * | 2003-12-03 | 2019-05-02 | Robert Bosch Gmbh | Mikromechanische Infrarotquelle |
DE102004018923B4 (de) * | 2004-04-20 | 2016-05-04 | Behr-Hella Thermocontrol Gmbh | Elektronische Schaltungsanordnung, insbesondere Lichtsensor, Verfahren zum Klassifizieren einer solchen Schaltungsanordnung, Anordnung aus einem Steuergerät und einem Lichtsensor und ein Verfahren zum Abgleich einer solchen Anordnung |
US7186978B2 (en) * | 2004-10-15 | 2007-03-06 | Millennium Enginerring And Integration Company | Compact emissivity and temperature measuring infrared detector |
US20060178857A1 (en) * | 2005-02-10 | 2006-08-10 | Barajas Leandro G | Quasi-redundant smart sensing topology |
US20090083275A1 (en) * | 2007-09-24 | 2009-03-26 | Nokia Corporation | Method, Apparatus and Computer Program Product for Performing a Visual Search Using Grid-Based Feature Organization |
JP2011112509A (ja) * | 2009-11-26 | 2011-06-09 | Nippon Ceramic Co Ltd | サーモパイル型赤外線検出装置 |
US9706138B2 (en) | 2010-04-23 | 2017-07-11 | Flir Systems, Inc. | Hybrid infrared sensor array having heterogeneous infrared sensors |
JP5542090B2 (ja) * | 2011-04-27 | 2014-07-09 | 旭化成エレクトロニクス株式会社 | 赤外線センサ信号の補正方法及び温度測定方法並びに温度測定装置 |
JP5890261B2 (ja) | 2012-06-21 | 2016-03-22 | アズビル株式会社 | 温度検出範囲特定装置および方法 |
JP6275333B2 (ja) * | 2015-05-21 | 2018-02-07 | 富士フイルム株式会社 | 赤外線撮像装置および赤外線撮像装置による信号補正方法 |
JP6795758B2 (ja) * | 2016-09-29 | 2020-12-02 | ミツミ電機株式会社 | センサ回路及びセンサ装置 |
Citations (6)
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DE4113266A1 (de) * | 1990-04-23 | 1991-10-31 | Keller Gmbh | Temperatur-messgeraet zur beruehrungslosen bestimmung der temperatur |
DE4114369A1 (de) * | 1990-05-02 | 1991-11-28 | Keller Gmbh | Pyrometer |
WO1996010883A1 (en) * | 1994-09-30 | 1996-04-11 | Honeywell Inc. | Compact thermal camera |
US5811808A (en) * | 1996-09-12 | 1998-09-22 | Amber Engineering, Inc. | Infrared imaging system employing on-focal plane nonuniformity correction |
EP0898159A2 (de) * | 1997-08-14 | 1999-02-24 | Heimann Optoelectronics GmbH | Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren |
US5876120A (en) * | 1996-06-11 | 1999-03-02 | Lg Electronics, Inc. | Apparatus and method for measuring food temperature in microwave oven |
Family Cites Families (24)
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JPS633231A (ja) * | 1986-06-24 | 1988-01-08 | Minolta Camera Co Ltd | 放射温度計 |
US4752694A (en) * | 1987-01-12 | 1988-06-21 | Honeywell Inc. | Array uniformity correction |
JPH03103726A (ja) * | 1989-09-18 | 1991-04-30 | Fujitsu Ltd | 赤外線検知器の感度補正方式 |
JP2932532B2 (ja) * | 1989-10-19 | 1999-08-09 | ミノルタ株式会社 | 赤外線撮像装置 |
US5150969A (en) * | 1990-03-12 | 1992-09-29 | Ivac Corporation | System and method for temperature determination and calibration in a biomedical probe |
JPH03270580A (ja) * | 1990-03-20 | 1991-12-02 | Fujitsu Ltd | 赤外線撮像装置 |
JPH04175626A (ja) * | 1990-11-08 | 1992-06-23 | Kubota Corp | トルクセンサの特性補償方法 |
KR940004051B1 (ko) * | 1991-10-12 | 1994-05-11 | 주식회사 금성사 | 소닉 디바이스 센서를 이용한 가열방법 |
DE4139122C1 (zh) * | 1991-11-28 | 1993-04-08 | Fenzlein, Paul-Gerhard, 8500 Nuernberg, De | |
US5521708A (en) * | 1992-11-25 | 1996-05-28 | Canon Information & Systems, Inc. | Correlated color temperature detector |
JPH06333644A (ja) * | 1993-05-20 | 1994-12-02 | Otax Kk | 測定装置用コネクタ装置 |
JP3119542B2 (ja) * | 1993-05-25 | 2000-12-25 | 日本電気株式会社 | 半導体加速度センサおよび製造方法 |
TW230808B (en) * | 1993-06-04 | 1994-09-21 | Philips Electronics Nv | A two-line mixed analog/digital bus system and a station for use in such a system |
DE4331574C2 (de) * | 1993-09-16 | 1997-07-10 | Heimann Optoelectronics Gmbh | Infrarot-Sensormodul |
KR0133476B1 (ko) * | 1994-03-18 | 1998-04-23 | 구자홍 | 마이크로 웨이브 오븐 |
US5695283A (en) * | 1994-07-01 | 1997-12-09 | Wahl Instruments, Inc. | Compensating infrared thermopile detector |
JPH0965214A (ja) * | 1995-08-25 | 1997-03-07 | Fujitsu Ltd | 受光素子特性補正方法及び装置並びにそれらを備えた撮像装置 |
SE505555C2 (sv) * | 1995-12-21 | 1997-09-15 | Whirlpool Europ | Förfarande för styrning av ett uppvärmningsförlopp i en mikrovågsugn samt mikrovågsugn |
JP3123919B2 (ja) * | 1996-02-29 | 2001-01-15 | 三洋電機株式会社 | 電子レンジ |
DE19619459C2 (de) * | 1996-05-14 | 2000-06-08 | Heimann Optoelectronics Gmbh | Schaltung zur Erfassung elektromagnetischer Strahlung |
US5857777A (en) * | 1996-09-25 | 1999-01-12 | Claud S. Gordon Company | Smart temperature sensing device |
AU5425198A (en) * | 1996-10-21 | 1998-05-29 | Electronics Development Corporation | Smart sensor module |
JPH10253572A (ja) * | 1997-03-07 | 1998-09-25 | Toa Denpa Kogyo Kk | メモリー付き電極を備えた計測装置 |
US6354733B2 (en) * | 1999-01-15 | 2002-03-12 | Ametex, Inc. | System and method for determining combustion temperature using infrared emissions |
-
1999
- 1999-12-24 DE DE19962938A patent/DE19962938A1/de not_active Ceased
-
2000
- 2000-12-22 CN CNB008177074A patent/CN1293373C/zh not_active Expired - Fee Related
- 2000-12-22 DE DE60002760T patent/DE60002760T2/de not_active Expired - Lifetime
- 2000-12-22 EP EP00985247A patent/EP1240487B1/en not_active Expired - Lifetime
- 2000-12-22 JP JP2001548913A patent/JP2003518615A/ja active Pending
- 2000-12-22 AT AT00985247T patent/ATE240509T1/de not_active IP Right Cessation
- 2000-12-22 US US10/168,484 patent/US6871999B2/en not_active Expired - Fee Related
- 2000-12-22 WO PCT/EP2000/013185 patent/WO2001048449A2/en active IP Right Grant
- 2000-12-22 KR KR1020027008202A patent/KR100720796B1/ko not_active IP Right Cessation
-
2005
- 2005-12-16 HK HK05111640A patent/HK1079564A1/xx not_active IP Right Cessation
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4113266A1 (de) * | 1990-04-23 | 1991-10-31 | Keller Gmbh | Temperatur-messgeraet zur beruehrungslosen bestimmung der temperatur |
DE4114369A1 (de) * | 1990-05-02 | 1991-11-28 | Keller Gmbh | Pyrometer |
WO1996010883A1 (en) * | 1994-09-30 | 1996-04-11 | Honeywell Inc. | Compact thermal camera |
US5876120A (en) * | 1996-06-11 | 1999-03-02 | Lg Electronics, Inc. | Apparatus and method for measuring food temperature in microwave oven |
US5811808A (en) * | 1996-09-12 | 1998-09-22 | Amber Engineering, Inc. | Infrared imaging system employing on-focal plane nonuniformity correction |
EP0898159A2 (de) * | 1997-08-14 | 1999-02-24 | Heimann Optoelectronics GmbH | Sensorsystem und Herstellungsverfahren sowie Selbsttestverfahren |
Also Published As
Publication number | Publication date |
---|---|
DE60002760D1 (de) | 2003-06-18 |
EP1240487A2 (en) | 2002-09-18 |
DE19962938A1 (de) | 2001-07-19 |
US20030091090A1 (en) | 2003-05-15 |
EP1240487B1 (en) | 2003-05-14 |
ATE240509T1 (de) | 2003-05-15 |
WO2001048449A3 (en) | 2001-12-13 |
JP2003518615A (ja) | 2003-06-10 |
HK1079564A1 (en) | 2006-04-07 |
CN1636129A (zh) | 2005-07-06 |
US6871999B2 (en) | 2005-03-29 |
KR20020079759A (ko) | 2002-10-19 |
WO2001048449A2 (en) | 2001-07-05 |
KR100720796B1 (ko) | 2007-05-22 |
DE60002760T2 (de) | 2004-02-26 |
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