CN1289719C - 用于电解处理系统的分段式对向电极 - Google Patents

用于电解处理系统的分段式对向电极 Download PDF

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Publication number
CN1289719C
CN1289719C CNB028164512A CN02816451A CN1289719C CN 1289719 C CN1289719 C CN 1289719C CN B028164512 A CNB028164512 A CN B028164512A CN 02816451 A CN02816451 A CN 02816451A CN 1289719 C CN1289719 C CN 1289719C
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CN
China
Prior art keywords
electrode
workpiece
contact
anode
conveying direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CNB028164512A
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English (en)
Chinese (zh)
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CN1561409A (zh
Inventor
埃贡·许贝尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Publication of CN1561409A publication Critical patent/CN1561409A/zh
Application granted granted Critical
Publication of CN1289719C publication Critical patent/CN1289719C/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)
CNB028164512A 2001-08-22 2002-08-21 用于电解处理系统的分段式对向电极 Expired - Lifetime CN1289719C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
DE10141056.5 2001-08-22

Publications (2)

Publication Number Publication Date
CN1561409A CN1561409A (zh) 2005-01-05
CN1289719C true CN1289719C (zh) 2006-12-13

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028164512A Expired - Lifetime CN1289719C (zh) 2001-08-22 2002-08-21 用于电解处理系统的分段式对向电极

Country Status (14)

Country Link
US (1) US7473344B2 (enExample)
EP (1) EP1419290B1 (enExample)
JP (1) JP4257203B2 (enExample)
KR (1) KR100866821B1 (enExample)
CN (1) CN1289719C (enExample)
AT (1) ATE289636T1 (enExample)
AU (1) AU2002336089A1 (enExample)
BR (1) BR0211270B1 (enExample)
CA (1) CA2449807A1 (enExample)
DE (2) DE10141056C2 (enExample)
MX (1) MXPA04001545A (enExample)
MY (1) MY127490A (enExample)
TW (1) TW548349B (enExample)
WO (1) WO2003018878A2 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
EP1865094B1 (de) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
JP5405475B2 (ja) * 2008-09-30 2014-02-05 富士フイルム株式会社 電解粗面化処理方法および電解粗面化処理装置
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
BR122013014461B1 (pt) 2009-06-08 2020-10-20 Modumetal, Inc revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada
HK1220743A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 具有高硬度的镍铬纳米层压涂层
CN105189826B (zh) 2013-03-15 2019-07-16 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
EP2971264A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Nanolaminate coatings
EP2971266A4 (en) 2013-03-15 2017-03-01 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP3194163A4 (en) 2014-09-18 2018-06-27 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
CA2961508C (en) 2014-09-18 2024-04-09 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
KR101880599B1 (ko) 2016-06-22 2018-07-23 (주)포인텍 애노드 이동형 수평도금장치
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
US12227869B2 (en) 2016-09-09 2025-02-18 Modumetal, Inc. Application of laminate and nanolaminate materials to tooling and molding processes
KR102412452B1 (ko) 2016-09-14 2022-06-23 모두메탈, 인크. 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
EP4028582A1 (en) 2019-09-12 2022-07-20 Atotech Deutschland GmbH & Co. KG Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
US20230062477A1 (en) * 2020-02-07 2023-03-02 Atotech Deutschland GmbH & Co. KG Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技（厦门）有限公司 一种多阶段镀镍工艺
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法
KR20250131513A (ko) * 2024-02-27 2025-09-03 주식회사 웨스코일렉트로드 동박 제조용 양극 어셈블리

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3369294D1 (en) * 1982-05-28 1987-02-26 De La Rue Syst Banding method and apparatus
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
US5188721A (en) 1989-02-10 1993-02-23 Eltech Systems Corporation Plate anode having bias cut edges
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
DE4132418C1 (enExample) 1991-09-28 1993-02-11 Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De
DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
EP1541719A3 (en) 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6395152B1 (en) 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
DE10100297A1 (de) 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Also Published As

Publication number Publication date
BR0211270B1 (pt) 2011-10-18
TW548349B (en) 2003-08-21
MXPA04001545A (es) 2004-05-14
DE60203047D1 (de) 2005-03-31
MY127490A (en) 2006-12-29
JP4257203B2 (ja) 2009-04-22
DE10141056A1 (de) 2003-05-08
EP1419290B1 (en) 2005-02-23
EP1419290A2 (en) 2004-05-19
DE10141056C2 (de) 2003-12-24
AU2002336089A1 (en) 2003-03-10
BR0211270A (pt) 2004-12-21
KR20040028802A (ko) 2004-04-03
CA2449807A1 (en) 2003-03-06
DE60203047T2 (de) 2006-01-12
US20040232005A1 (en) 2004-11-25
WO2003018878A2 (en) 2003-03-06
HK1060906A1 (en) 2004-08-27
JP2005501181A (ja) 2005-01-13
ATE289636T1 (de) 2005-03-15
CN1561409A (zh) 2005-01-05
WO2003018878A3 (en) 2004-02-26
KR100866821B1 (ko) 2008-11-04
US7473344B2 (en) 2009-01-06

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