MXPA04001545A - Contraelectrodo segmentado para un sistema de tratamiento electrolitico. - Google Patents

Contraelectrodo segmentado para un sistema de tratamiento electrolitico.

Info

Publication number
MXPA04001545A
MXPA04001545A MXPA04001545A MXPA04001545A MXPA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A
Authority
MX
Mexico
Prior art keywords
workpieces
contact
electrolytic treatment
treatment system
electrode segment
Prior art date
Application number
MXPA04001545A
Other languages
English (en)
Inventor
Huebel Egon
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of MXPA04001545A publication Critical patent/MXPA04001545A/es

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

A fin de hacer iguales el tratamiento electrolitico de piezas de trabajo 9 hechas de material electricamente no conductivo y tener una metalizacion base muy delgada 6,8, se emplea un dispositivo en una manera de acuerdo a la invencion, que comprende medios para llevar el liquido de tratamiento a contacto con las piezas de trabajo 9, medios para hacer contacto electrico las piezas de trabajo 9 en sitios de contacto y contraelectrodos 5.x, los cuales estan dispuestos de modo que las piezas de trabajo 9 puedan ser colocadas opuestas a ellos, por lo cual los contraelectrodos 5.x son cada uno subdivididos en al menos dos segmentos de electrodo 13.x de manera que al menos un segmento de electrodo cercano de contacto 13.1 y al menos un segmento de electrodo remoto de contacto 13.4 y posiblemente segmentos de electrodo adicionales 13.2, 13.3 dispuestos entre ellos, sean provistos y cada segmento de electrodo 13.x es alimentado por una fuente de corriente separada 15.x.
MXPA04001545A 2001-08-22 2002-08-21 Contraelectrodo segmentado para un sistema de tratamiento electrolitico. MXPA04001545A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
PCT/EP2002/009343 WO2003018878A2 (en) 2001-08-22 2002-08-21 Segmented counterelectrode for an electrolytic treatment system

Publications (1)

Publication Number Publication Date
MXPA04001545A true MXPA04001545A (es) 2004-05-14

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
MXPA04001545A MXPA04001545A (es) 2001-08-22 2002-08-21 Contraelectrodo segmentado para un sistema de tratamiento electrolitico.

Country Status (15)

Country Link
US (1) US7473344B2 (es)
EP (1) EP1419290B1 (es)
JP (1) JP4257203B2 (es)
KR (1) KR100866821B1 (es)
CN (1) CN1289719C (es)
AT (1) ATE289636T1 (es)
AU (1) AU2002336089A1 (es)
BR (1) BR0211270B1 (es)
CA (1) CA2449807A1 (es)
DE (2) DE10141056C2 (es)
HK (1) HK1060906A1 (es)
MX (1) MXPA04001545A (es)
MY (1) MY127490A (es)
TW (1) TW548349B (es)
WO (1) WO2003018878A2 (es)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
EP1865094B1 (de) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
CN102165106B (zh) * 2008-09-30 2014-09-17 富士胶片株式会社 电解处理方法及电解处理装置
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
EA201792049A1 (ru) 2009-06-08 2018-05-31 Модьюметал, Инк. Электроосажденные наноламинатные покрытия и оболочки для защиты от коррозии
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
WO2014146114A1 (en) 2013-03-15 2014-09-18 Modumetal, Inc. Nanolaminate coatings
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN110273167A (zh) 2013-03-15 2019-09-24 莫杜美拓有限公司 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
CN106795645B (zh) 2014-09-18 2020-03-27 莫杜美拓有限公司 用于连续施加纳米层压金属涂层的方法和装置
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
KR101880599B1 (ko) 2016-06-22 2018-07-23 (주)포인텍 애노드 이동형 수평도금장치
EA201990655A1 (ru) 2016-09-08 2019-09-30 Модьюметал, Инк. Способы получения многослойных покрытий на заготовках и выполненные ими изделия
JP7051823B2 (ja) 2016-09-14 2022-04-11 モジュメタル インコーポレイテッド 高信頼性、高スループットの複素電界生成のためのシステム、およびそれにより皮膜を生成するための方法
EP3535118A1 (en) 2016-11-02 2019-09-11 Modumetal, Inc. Topology optimized high interface packing structures
CN110770372B (zh) 2017-04-21 2022-10-11 莫杜美拓有限公司 具有电沉积涂层的管状制品及其生产系统和方法
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
EP4028582A1 (en) 2019-09-12 2022-07-20 Atotech Deutschland GmbH & Co. KG Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
WO2021156415A1 (en) 2020-02-07 2021-08-12 Atotech Deutschland Gmbh Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技(厦门)有限公司 一种多阶段镀镍工艺
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5915014A (ja) * 1982-05-28 1984-01-26 ドウ・ラ・リユ・システムズ・リミテイド 結束方法及び装置
DE3624481A1 (de) 1986-07-19 1988-01-28 Schering Ag Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
US5188721A (en) 1989-02-10 1993-02-23 Eltech Systems Corporation Plate anode having bias cut edges
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
DE4132418C1 (es) 1991-09-28 1993-02-11 Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De
DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
EP1541719A3 (en) 1998-05-20 2006-05-31 Process Automation International Limited An electroplating machine
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
DE10100297A1 (de) 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Also Published As

Publication number Publication date
DE10141056A1 (de) 2003-05-08
CN1289719C (zh) 2006-12-13
WO2003018878A2 (en) 2003-03-06
US20040232005A1 (en) 2004-11-25
HK1060906A1 (en) 2004-08-27
DE60203047T2 (de) 2006-01-12
WO2003018878A3 (en) 2004-02-26
KR100866821B1 (ko) 2008-11-04
JP4257203B2 (ja) 2009-04-22
ATE289636T1 (de) 2005-03-15
BR0211270A (pt) 2004-12-21
CA2449807A1 (en) 2003-03-06
KR20040028802A (ko) 2004-04-03
CN1561409A (zh) 2005-01-05
US7473344B2 (en) 2009-01-06
TW548349B (en) 2003-08-21
AU2002336089A1 (en) 2003-03-10
DE10141056C2 (de) 2003-12-24
JP2005501181A (ja) 2005-01-13
DE60203047D1 (de) 2005-03-31
EP1419290B1 (en) 2005-02-23
BR0211270B1 (pt) 2011-10-18
MY127490A (en) 2006-12-29
EP1419290A2 (en) 2004-05-19

Similar Documents

Publication Publication Date Title
MXPA04001545A (es) Contraelectrodo segmentado para un sistema de tratamiento electrolitico.
TW365039B (en) Method and apparatus for balancing an electrostatic force produced by an electrostatic chuck
TW200510577A (en) Device and method for electrolytically treating electrically insulated structures
ES2138450T3 (es) Procedimiento y dispositivo para el tratamiento electroquimico de articulos con un liquido.
BR9612561A (pt) Processo eletrolìtico para limpar e revestir superfìcies eletricamente condutoras.
MY104577A (en) Solid state electrochromic device.
AU7420091A (en) Method and apparatus for ionizing fluids utilizing a capacitive effect
DE69734571D1 (de) Überspannungsschutzanordnung und herstellungsverfahren
BRPI0413909A (pt) eletrodo biomédico, e, método para preparar um eletrodo biomédico
NZ603542A (en) Electroporation system with two electrodes having dielectric coatings forming a fluid pathway
HK1056752A1 (en) Device and method for electrically contacting withthe product to be electrolytic treated.
BR0014872B1 (pt) processo e dispositivo para o tratamento eletrolÍtico de estruturas eletricamente condutoras, eletricamente isoladas umas em relaÇço Às outras, fixadas em superfÍcies de material de folha eletricamente isolante, assim como utilizaÇÕes do processo.
JPS6452305A (en) Continuous flexble electric conductor which can function as electric switch
HK1044806A1 (en) Method and device for the electrolytic treatment of electrically conducting surfaces separated plates and film material pieces in addition to uses of said method
AU7370001A (en) Electro-adhesion device
HK1102970A1 (en) Device and method for electrolytically treating flat work pieces
DE3888946D1 (de) Ansteuereinrichtung für die Vorrichtung zur elektrischen Funktionsprüfung von Verdrahtungsfeldern.
EP1427277A4 (en) ELECTRIC FENCE
JPS5757896A (en) Electrolyzing device for strip-like metallic plate
SU1701453A1 (ru) Устройство дл электрохимического маркировани
ATE233835T1 (de) Elektroplattierungsanlage, verwendung von elektrode und gegenhalter dafür und elektroplattierungsverfahren
SE0003824L (sv) Metod och anordning vid betning

Legal Events

Date Code Title Description
FG Grant or registration