MXPA04001545A - Contraelectrodo segmentado para un sistema de tratamiento electrolitico. - Google Patents
Contraelectrodo segmentado para un sistema de tratamiento electrolitico.Info
- Publication number
- MXPA04001545A MXPA04001545A MXPA04001545A MXPA04001545A MXPA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A MX PA04001545 A MXPA04001545 A MX PA04001545A
- Authority
- MX
- Mexico
- Prior art keywords
- workpieces
- contact
- electrolytic treatment
- treatment system
- electrode segment
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
A fin de hacer iguales el tratamiento electrolitico de piezas de trabajo 9 hechas de material electricamente no conductivo y tener una metalizacion base muy delgada 6,8, se emplea un dispositivo en una manera de acuerdo a la invencion, que comprende medios para llevar el liquido de tratamiento a contacto con las piezas de trabajo 9, medios para hacer contacto electrico las piezas de trabajo 9 en sitios de contacto y contraelectrodos 5.x, los cuales estan dispuestos de modo que las piezas de trabajo 9 puedan ser colocadas opuestas a ellos, por lo cual los contraelectrodos 5.x son cada uno subdivididos en al menos dos segmentos de electrodo 13.x de manera que al menos un segmento de electrodo cercano de contacto 13.1 y al menos un segmento de electrodo remoto de contacto 13.4 y posiblemente segmentos de electrodo adicionales 13.2, 13.3 dispuestos entre ellos, sean provistos y cada segmento de electrodo 13.x es alimentado por una fuente de corriente separada 15.x.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10141056A DE10141056C2 (de) | 2001-08-22 | 2001-08-22 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen |
PCT/EP2002/009343 WO2003018878A2 (en) | 2001-08-22 | 2002-08-21 | Segmented counterelectrode for an electrolytic treatment system |
Publications (1)
Publication Number | Publication Date |
---|---|
MXPA04001545A true MXPA04001545A (es) | 2004-05-14 |
Family
ID=7696199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MXPA04001545A MXPA04001545A (es) | 2001-08-22 | 2002-08-21 | Contraelectrodo segmentado para un sistema de tratamiento electrolitico. |
Country Status (15)
Country | Link |
---|---|
US (1) | US7473344B2 (es) |
EP (1) | EP1419290B1 (es) |
JP (1) | JP4257203B2 (es) |
KR (1) | KR100866821B1 (es) |
CN (1) | CN1289719C (es) |
AT (1) | ATE289636T1 (es) |
AU (1) | AU2002336089A1 (es) |
BR (1) | BR0211270B1 (es) |
CA (1) | CA2449807A1 (es) |
DE (2) | DE10141056C2 (es) |
HK (1) | HK1060906A1 (es) |
MX (1) | MXPA04001545A (es) |
MY (1) | MY127490A (es) |
TW (1) | TW548349B (es) |
WO (1) | WO2003018878A2 (es) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004025827B3 (de) * | 2004-05-24 | 2005-06-30 | Höllmüller Maschinenbau GmbH | Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen |
DE102004029894B3 (de) * | 2004-06-17 | 2005-12-22 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut |
EP1865094B1 (de) * | 2006-06-08 | 2009-10-21 | BCT Coating Technologies AG | Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem |
US20090047783A1 (en) * | 2007-08-13 | 2009-02-19 | Bchir Omar J | Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same |
CN102165106B (zh) * | 2008-09-30 | 2014-09-17 | 富士胶片株式会社 | 电解处理方法及电解处理装置 |
DE102009023768A1 (de) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen |
DE102009023763A1 (de) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten |
EA201792049A1 (ru) | 2009-06-08 | 2018-05-31 | Модьюметал, Инк. | Электроосажденные наноламинатные покрытия и оболочки для защиты от коррозии |
EA201500949A1 (ru) | 2013-03-15 | 2016-02-29 | Модьюметл, Инк. | Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие |
WO2014146114A1 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Nanolaminate coatings |
WO2014146117A2 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
CN110273167A (zh) | 2013-03-15 | 2019-09-24 | 莫杜美拓有限公司 | 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金 |
AR102068A1 (es) | 2014-09-18 | 2017-02-01 | Modumetal Inc | Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva |
CN106795645B (zh) | 2014-09-18 | 2020-03-27 | 莫杜美拓有限公司 | 用于连续施加纳米层压金属涂层的方法和装置 |
CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
JP6672572B2 (ja) * | 2015-12-25 | 2020-03-25 | 住友電工プリントサーキット株式会社 | プリント配線板用めっき装置及びプリント配線板の製造方法 |
KR101880599B1 (ko) | 2016-06-22 | 2018-07-23 | (주)포인텍 | 애노드 이동형 수평도금장치 |
EA201990655A1 (ru) | 2016-09-08 | 2019-09-30 | Модьюметал, Инк. | Способы получения многослойных покрытий на заготовках и выполненные ими изделия |
JP7051823B2 (ja) | 2016-09-14 | 2022-04-11 | モジュメタル インコーポレイテッド | 高信頼性、高スループットの複素電界生成のためのシステム、およびそれにより皮膜を生成するための方法 |
EP3535118A1 (en) | 2016-11-02 | 2019-09-11 | Modumetal, Inc. | Topology optimized high interface packing structures |
CN110770372B (zh) | 2017-04-21 | 2022-10-11 | 莫杜美拓有限公司 | 具有电沉积涂层的管状制品及其生产系统和方法 |
WO2019210264A1 (en) | 2018-04-27 | 2019-10-31 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
EP4028582A1 (en) | 2019-09-12 | 2022-07-20 | Atotech Deutschland GmbH & Co. KG | Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus |
WO2021156415A1 (en) | 2020-02-07 | 2021-08-12 | Atotech Deutschland Gmbh | Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program |
CN111826689B (zh) * | 2020-07-28 | 2022-02-11 | 翔声科技(厦门)有限公司 | 一种多阶段镀镍工艺 |
CN114808057B (zh) * | 2021-01-29 | 2024-06-21 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
US20240003039A1 (en) * | 2022-06-29 | 2024-01-04 | Xiamen Hithium Energy Storage Technology Co.,Ltd.. | Film plating machine and electroplating production line |
CN117802557A (zh) * | 2022-09-23 | 2024-04-02 | 奥特斯科技(重庆)有限公司 | 用于对部件承载件结构进行电镀覆的电镀覆设备和方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5915014A (ja) * | 1982-05-28 | 1984-01-26 | ドウ・ラ・リユ・システムズ・リミテイド | 結束方法及び装置 |
DE3624481A1 (de) | 1986-07-19 | 1988-01-28 | Schering Ag | Anordnung zur elektrolytischen behandlung von plattenfoermigen gegenstaenden |
DE3732476A1 (de) * | 1987-09-24 | 1989-04-13 | Schering Ag | Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad |
US5188721A (en) | 1989-02-10 | 1993-02-23 | Eltech Systems Corporation | Plate anode having bias cut edges |
US5156730A (en) * | 1991-06-25 | 1992-10-20 | International Business Machines | Electrode array and use thereof |
DE4132418C1 (es) | 1991-09-28 | 1993-02-11 | Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De | |
DE19633797B4 (de) | 1996-08-22 | 2005-08-04 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen |
DE19736351C1 (de) * | 1997-08-21 | 1998-10-01 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken |
EP1541719A3 (en) | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
US6395152B1 (en) * | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
DE10100297A1 (de) | 2001-01-04 | 2002-07-18 | Gesimat Gmbh | Vorrichtung und Verahren zur elektrochemischen Beschichtung |
-
2001
- 2001-08-22 DE DE10141056A patent/DE10141056C2/de not_active Expired - Fee Related
-
2002
- 2002-08-21 JP JP2003523719A patent/JP4257203B2/ja not_active Expired - Lifetime
- 2002-08-21 KR KR1020037017223A patent/KR100866821B1/ko active IP Right Grant
- 2002-08-21 CA CA002449807A patent/CA2449807A1/en not_active Abandoned
- 2002-08-21 CN CNB028164512A patent/CN1289719C/zh not_active Expired - Lifetime
- 2002-08-21 US US10/485,654 patent/US7473344B2/en not_active Expired - Fee Related
- 2002-08-21 WO PCT/EP2002/009343 patent/WO2003018878A2/en active IP Right Grant
- 2002-08-21 EP EP02769978A patent/EP1419290B1/en not_active Expired - Lifetime
- 2002-08-21 MY MYPI20023077A patent/MY127490A/en unknown
- 2002-08-21 BR BRPI0211270-1A patent/BR0211270B1/pt not_active IP Right Cessation
- 2002-08-21 AU AU2002336089A patent/AU2002336089A1/en not_active Abandoned
- 2002-08-21 AT AT02769978T patent/ATE289636T1/de active
- 2002-08-21 MX MXPA04001545A patent/MXPA04001545A/es active IP Right Grant
- 2002-08-21 DE DE60203047T patent/DE60203047T2/de not_active Expired - Lifetime
- 2002-08-22 TW TW091119014A patent/TW548349B/zh not_active IP Right Cessation
-
2004
- 2004-06-02 HK HK04103944A patent/HK1060906A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE10141056A1 (de) | 2003-05-08 |
CN1289719C (zh) | 2006-12-13 |
WO2003018878A2 (en) | 2003-03-06 |
US20040232005A1 (en) | 2004-11-25 |
HK1060906A1 (en) | 2004-08-27 |
DE60203047T2 (de) | 2006-01-12 |
WO2003018878A3 (en) | 2004-02-26 |
KR100866821B1 (ko) | 2008-11-04 |
JP4257203B2 (ja) | 2009-04-22 |
ATE289636T1 (de) | 2005-03-15 |
BR0211270A (pt) | 2004-12-21 |
CA2449807A1 (en) | 2003-03-06 |
KR20040028802A (ko) | 2004-04-03 |
CN1561409A (zh) | 2005-01-05 |
US7473344B2 (en) | 2009-01-06 |
TW548349B (en) | 2003-08-21 |
AU2002336089A1 (en) | 2003-03-10 |
DE10141056C2 (de) | 2003-12-24 |
JP2005501181A (ja) | 2005-01-13 |
DE60203047D1 (de) | 2005-03-31 |
EP1419290B1 (en) | 2005-02-23 |
BR0211270B1 (pt) | 2011-10-18 |
MY127490A (en) | 2006-12-29 |
EP1419290A2 (en) | 2004-05-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration |