BR0211270A - Contra-eletrodo segmentado para um sistema de tratamento eletrolìtico - Google Patents

Contra-eletrodo segmentado para um sistema de tratamento eletrolìtico

Info

Publication number
BR0211270A
BR0211270A BR0211270-1A BR0211270A BR0211270A BR 0211270 A BR0211270 A BR 0211270A BR 0211270 A BR0211270 A BR 0211270A BR 0211270 A BR0211270 A BR 0211270A
Authority
BR
Brazil
Prior art keywords
workpieces
electrolytic treatment
contact
counter electrode
treatment system
Prior art date
Application number
BR0211270-1A
Other languages
English (en)
Other versions
BR0211270B1 (pt
Inventor
Egon Huebel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BR0211270A publication Critical patent/BR0211270A/pt
Publication of BR0211270B1 publication Critical patent/BR0211270B1/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing the conductive pattern
    • H05K3/241Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

"CONTRA-ELETRODO SEGMENTADO PARA UM SISTEMA DE TRATAMENTO ELETROLìTICO". De maneira a uniformizar o tratamento eletrolítico de peças 9 constituídas de material eletricamente não-condutivo e recebendo uma metalização de base muito delgada 6, 8, um dispositivo é empregado de uma maneira de acordo com a invenção que compreende dispositivos para levar o líquido de tratamento a entrar em contato com as peças 9, meios 10 para contato elétrico das peças 9 em locais de contato e contra-eletrodos 5.x que são de tal maneira situados que as peças 9 podem ser dispostas em relação oposta aos mesmos, com isto os contra-eletrodos 5.x são individualmente subdivididos em pelo menos segmentos de eletrodo 13.x de tal maneira que pelo menos um segmento de eletrodo próximo ao contato 13.1 e pelo menos um segmento de eletrodo distal do contato 13.4 e possivelmente segmentos de eletrodo adicionais 13.2, 13.3 entre estes interpostos são fornecidos e cada segmento de eletrodo 13.x é alimentado por uma fonte de corrente em separado 15.x.
BRPI0211270-1A 2001-08-22 2002-08-21 dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças. BR0211270B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
PCT/EP2002/009343 WO2003018878A2 (en) 2001-08-22 2002-08-21 Segmented counterelectrode for an electrolytic treatment system

Publications (2)

Publication Number Publication Date
BR0211270A true BR0211270A (pt) 2004-12-21
BR0211270B1 BR0211270B1 (pt) 2011-10-18

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0211270-1A BR0211270B1 (pt) 2001-08-22 2002-08-21 dispositivo para tratamento eletrolìtico de peças e método de tratamento eletrolìtico de peças.

Country Status (15)

Country Link
US (1) US7473344B2 (pt)
EP (1) EP1419290B1 (pt)
JP (1) JP4257203B2 (pt)
KR (1) KR100866821B1 (pt)
CN (1) CN1289719C (pt)
AT (1) ATE289636T1 (pt)
AU (1) AU2002336089A1 (pt)
BR (1) BR0211270B1 (pt)
CA (1) CA2449807A1 (pt)
DE (2) DE10141056C2 (pt)
HK (1) HK1060906A1 (pt)
MX (1) MXPA04001545A (pt)
MY (1) MY127490A (pt)
TW (1) TW548349B (pt)
WO (1) WO2003018878A2 (pt)

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DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
EP1865094B1 (de) * 2006-06-08 2009-10-21 BCT Coating Technologies AG Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
JP5405475B2 (ja) * 2008-09-30 2014-02-05 富士フイルム株式会社 電解粗面化処理方法および電解粗面化処理装置
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
EA201792049A1 (ru) 2009-06-08 2018-05-31 Модьюметал, Инк. Электроосажденные наноламинатные покрытия и оболочки для защиты от коррозии
CA2905575C (en) 2013-03-15 2022-07-12 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
BR112017005464A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc método e aparelho para aplicar continuamente revestimentos de metal nanolaminado
AR102068A1 (es) 2014-09-18 2017-02-01 Modumetal Inc Métodos de preparación de artículos por electrodeposición y procesos de fabricación aditiva
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
KR101880599B1 (ko) 2016-06-22 2018-07-23 (주)포인텍 애노드 이동형 수평도금장치
AR109584A1 (es) 2016-09-08 2018-12-26 Modumetal Inc Procesos para proveer recubrimientos laminados sobre piezas de trabajo, y los artículos que se obtienen con los mismos
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN114502779A (zh) * 2019-09-12 2022-05-13 德国艾托特克有限两合公司 用于平面工件的湿式处理的设备、用于所述设备的单元的装置及操作所述设备的方法
KR20220139354A (ko) 2020-02-07 2022-10-14 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 피가공물을 전해 처리하기 위한 전극 및 장치, 장치의 셀을 형성하기 위한 어셈블리, 방법 및 컴퓨터 프로그램
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技(厦门)有限公司 一种多阶段镀镍工艺
CN114808057A (zh) * 2021-01-29 2022-07-29 泰科电子(上海)有限公司 电镀装置和电镀系统
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

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EP0095915B1 (en) * 1982-05-28 1987-01-21 De La Rue Systems Limited Banding method and apparatus
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
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US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
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DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
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DE10100297A1 (de) * 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Also Published As

Publication number Publication date
MXPA04001545A (es) 2004-05-14
MY127490A (en) 2006-12-29
KR100866821B1 (ko) 2008-11-04
DE10141056A1 (de) 2003-05-08
ATE289636T1 (de) 2005-03-15
TW548349B (en) 2003-08-21
CA2449807A1 (en) 2003-03-06
KR20040028802A (ko) 2004-04-03
CN1561409A (zh) 2005-01-05
AU2002336089A1 (en) 2003-03-10
EP1419290A2 (en) 2004-05-19
WO2003018878A2 (en) 2003-03-06
JP4257203B2 (ja) 2009-04-22
DE10141056C2 (de) 2003-12-24
WO2003018878A3 (en) 2004-02-26
US20040232005A1 (en) 2004-11-25
US7473344B2 (en) 2009-01-06
DE60203047D1 (de) 2005-03-31
DE60203047T2 (de) 2006-01-12
CN1289719C (zh) 2006-12-13
JP2005501181A (ja) 2005-01-13
EP1419290B1 (en) 2005-02-23
BR0211270B1 (pt) 2011-10-18
HK1060906A1 (en) 2004-08-27

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Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 21/08/2002, OBSERVADAS AS CONDICOES LEGAIS.

B21A Patent or certificate of addition expired [chapter 21.1 patent gazette]

Free format text: PATENTE EXTINTA EM 21.08.2022