KR100866821B1 - 전해 처리 시스템을 위한 분할된 상대전극 - Google Patents

전해 처리 시스템을 위한 분할된 상대전극 Download PDF

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Publication number
KR100866821B1
KR100866821B1 KR1020037017223A KR20037017223A KR100866821B1 KR 100866821 B1 KR100866821 B1 KR 100866821B1 KR 1020037017223 A KR1020037017223 A KR 1020037017223A KR 20037017223 A KR20037017223 A KR 20037017223A KR 100866821 B1 KR100866821 B1 KR 100866821B1
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South Korea
Prior art keywords
electrode
workpiece
compartments
electrolytic treatment
compartment
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KR1020037017223A
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English (en)
Korean (ko)
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KR20040028802A (ko
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휘벨에곤
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아토테크 도이칠란드 게엠베하
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrolytic Production Of Metals (AREA)
KR1020037017223A 2001-08-22 2002-08-21 전해 처리 시스템을 위한 분할된 상대전극 Expired - Lifetime KR100866821B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10141056.5 2001-08-22
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
PCT/EP2002/009343 WO2003018878A2 (en) 2001-08-22 2002-08-21 Segmented counterelectrode for an electrolytic treatment system

Publications (2)

Publication Number Publication Date
KR20040028802A KR20040028802A (ko) 2004-04-03
KR100866821B1 true KR100866821B1 (ko) 2008-11-04

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037017223A Expired - Lifetime KR100866821B1 (ko) 2001-08-22 2002-08-21 전해 처리 시스템을 위한 분할된 상대전극

Country Status (14)

Country Link
US (1) US7473344B2 (enExample)
EP (1) EP1419290B1 (enExample)
JP (1) JP4257203B2 (enExample)
KR (1) KR100866821B1 (enExample)
CN (1) CN1289719C (enExample)
AT (1) ATE289636T1 (enExample)
AU (1) AU2002336089A1 (enExample)
BR (1) BR0211270B1 (enExample)
CA (1) CA2449807A1 (enExample)
DE (2) DE10141056C2 (enExample)
MX (1) MXPA04001545A (enExample)
MY (1) MY127490A (enExample)
TW (1) TW548349B (enExample)
WO (1) WO2003018878A2 (enExample)

Cited By (1)

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KR20180000133A (ko) 2016-06-22 2018-01-02 (주)포인텍 애노드 이동형 수평도금장치

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DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
ATE446393T1 (de) * 2006-06-08 2009-11-15 Bct Coating Technologies Ag Vorrichtung zur galvanischen abscheidung von oberflächen und galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
US8968530B2 (en) * 2008-09-30 2015-03-03 Fujifilm Corporation Electrolytic treatment method and electrolytic treatment device
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
CN105143521B (zh) 2013-03-15 2020-07-10 莫杜美拓有限公司 用于连续施加纳米叠层金属涂层的方法和装置
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
EP2971261A4 (en) 2013-03-15 2017-05-31 Modumetal, Inc. Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes
CN108486622B (zh) 2013-03-15 2020-10-30 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
WO2016044712A1 (en) 2014-09-18 2016-03-24 Modumetal, Inc. Methods of preparing articles by electrodeposition and additive manufacturing processes
EA201790643A1 (ru) 2014-09-18 2017-08-31 Модьюметал, Инк. Способ и устройство для непрерывного нанесения нанослоистых металлических покрытий
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
WO2018075156A1 (en) 2016-09-09 2018-04-26 Modumetal, Inc. Manufacturing of molds by deposition of material layers on a workpiece, molds and articles obtained by said process
US20190360116A1 (en) 2016-09-14 2019-11-28 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
EP3535118A1 (en) 2016-11-02 2019-09-11 Modumetal, Inc. Topology optimized high interface packing structures
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
TWI887266B (zh) * 2019-09-12 2025-06-21 德商德國艾托特克公司 用於一平面工件之濕式處理的設備、用於該設備之一單元的裝置及操作該設備之方法
WO2021156415A1 (en) 2020-02-07 2021-08-12 Atotech Deutschland Gmbh Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技（厦门）有限公司 一种多阶段镀镍工艺
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法
KR20250131513A (ko) * 2024-02-27 2025-09-03 주식회사 웨스코일렉트로드 동박 제조용 양극 어셈블리

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EP0095915A1 (en) * 1982-05-28 1983-12-07 De La Rue Systems Limited Banding method and apparatus
WO2000003426A1 (en) * 1998-07-09 2000-01-20 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices

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DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
DE3732476A1 (de) * 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
US5188721A (en) 1989-02-10 1993-02-23 Eltech Systems Corporation Plate anode having bias cut edges
US5156730A (en) * 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
DE4132418C1 (enExample) 1991-09-28 1993-02-11 Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De
DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
EP0959153A3 (en) 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
DE10100297A1 (de) 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
EP0095915A1 (en) * 1982-05-28 1983-12-07 De La Rue Systems Limited Banding method and apparatus
WO2000003426A1 (en) * 1998-07-09 2000-01-20 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180000133A (ko) 2016-06-22 2018-01-02 (주)포인텍 애노드 이동형 수평도금장치

Also Published As

Publication number Publication date
CA2449807A1 (en) 2003-03-06
WO2003018878A2 (en) 2003-03-06
US7473344B2 (en) 2009-01-06
DE10141056A1 (de) 2003-05-08
JP4257203B2 (ja) 2009-04-22
BR0211270A (pt) 2004-12-21
TW548349B (en) 2003-08-21
CN1561409A (zh) 2005-01-05
HK1060906A1 (en) 2004-08-27
EP1419290A2 (en) 2004-05-19
MY127490A (en) 2006-12-29
US20040232005A1 (en) 2004-11-25
DE10141056C2 (de) 2003-12-24
DE60203047D1 (de) 2005-03-31
CN1289719C (zh) 2006-12-13
BR0211270B1 (pt) 2011-10-18
AU2002336089A1 (en) 2003-03-10
ATE289636T1 (de) 2005-03-15
MXPA04001545A (es) 2004-05-14
DE60203047T2 (de) 2006-01-12
KR20040028802A (ko) 2004-04-03
JP2005501181A (ja) 2005-01-13
EP1419290B1 (en) 2005-02-23
WO2003018878A3 (en) 2004-02-26

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