TW548349B - Segmented counterelectrodes for an electrolytic treatment system - Google Patents
Segmented counterelectrodes for an electrolytic treatment system Download PDFInfo
- Publication number
- TW548349B TW548349B TW091119014A TW91119014A TW548349B TW 548349 B TW548349 B TW 548349B TW 091119014 A TW091119014 A TW 091119014A TW 91119014 A TW91119014 A TW 91119014A TW 548349 B TW548349 B TW 548349B
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- anode
- work piece
- scope
- section
- Prior art date
Links
- 238000011282 treatment Methods 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 claims abstract 3
- 238000000926 separation method Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 26
- 238000012545 processing Methods 0.000 claims description 18
- 238000009434 installation Methods 0.000 claims description 16
- 238000013461 design Methods 0.000 claims description 10
- 238000010292 electrical insulation Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 64
- 239000002184 metal Substances 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 21
- 238000007747 plating Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 16
- 238000001465 metallisation Methods 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- 239000010949 copper Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 239000003792 electrolyte Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 239000000969 carrier Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 8
- 238000009413 insulation Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 230000011218 segmentation Effects 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
- 238000000866 electrolytic etching Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 206010029412 Nightmare Diseases 0.000 description 1
- 235000009827 Prunus armeniaca Nutrition 0.000 description 1
- 244000018633 Prunus armeniaca Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000000454 electroless metal deposition Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10141056A DE10141056C2 (de) | 2001-08-22 | 2001-08-22 | Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW548349B true TW548349B (en) | 2003-08-21 |
Family
ID=7696199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091119014A TW548349B (en) | 2001-08-22 | 2002-08-22 | Segmented counterelectrodes for an electrolytic treatment system |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7473344B2 (enExample) |
| EP (1) | EP1419290B1 (enExample) |
| JP (1) | JP4257203B2 (enExample) |
| KR (1) | KR100866821B1 (enExample) |
| CN (1) | CN1289719C (enExample) |
| AT (1) | ATE289636T1 (enExample) |
| AU (1) | AU2002336089A1 (enExample) |
| BR (1) | BR0211270B1 (enExample) |
| CA (1) | CA2449807A1 (enExample) |
| DE (2) | DE10141056C2 (enExample) |
| MX (1) | MXPA04001545A (enExample) |
| MY (1) | MY127490A (enExample) |
| TW (1) | TW548349B (enExample) |
| WO (1) | WO2003018878A2 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004025827B3 (de) * | 2004-05-24 | 2005-06-30 | Höllmüller Maschinenbau GmbH | Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen |
| DE102004029894B3 (de) * | 2004-06-17 | 2005-12-22 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut |
| EP1865094B1 (de) * | 2006-06-08 | 2009-10-21 | BCT Coating Technologies AG | Vorrichtung zur galvanischen Abscheidung von Oberflächen und Galvanisierungssystem |
| US20090047783A1 (en) * | 2007-08-13 | 2009-02-19 | Bchir Omar J | Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same |
| JP5405475B2 (ja) * | 2008-09-30 | 2014-02-05 | 富士フイルム株式会社 | 電解粗面化処理方法および電解粗面化処理装置 |
| DE102009023768A1 (de) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen |
| DE102009023763A1 (de) | 2009-05-22 | 2010-11-25 | Hübel, Egon, Dipl.-Ing. (FH) | Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten |
| BR122013014461B1 (pt) | 2009-06-08 | 2020-10-20 | Modumetal, Inc | revestimento de multicamadas resistente à corrosão em um substrato e método de eletrodeposição para produção de um revestimento de multicamada |
| HK1220743A1 (zh) | 2013-03-15 | 2017-05-12 | Modumetal, Inc. | 具有高硬度的镍铬纳米层压涂层 |
| CN105189826B (zh) | 2013-03-15 | 2019-07-16 | 莫杜美拓有限公司 | 通过添加制造工艺制备的制品的电沉积的组合物和纳米层压合金 |
| EP2971264A4 (en) | 2013-03-15 | 2017-05-31 | Modumetal, Inc. | Nanolaminate coatings |
| EP2971266A4 (en) | 2013-03-15 | 2017-03-01 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
| EP3194163A4 (en) | 2014-09-18 | 2018-06-27 | Modumetal, Inc. | Methods of preparing articles by electrodeposition and additive manufacturing processes |
| CA2961508C (en) | 2014-09-18 | 2024-04-09 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
| CN104862768B (zh) * | 2015-05-27 | 2017-09-22 | 广州杰赛科技股份有限公司 | 一种电路板的电镀方法及装置 |
| JP6672572B2 (ja) * | 2015-12-25 | 2020-03-25 | 住友電工プリントサーキット株式会社 | プリント配線板用めっき装置及びプリント配線板の製造方法 |
| KR101880599B1 (ko) | 2016-06-22 | 2018-07-23 | (주)포인텍 | 애노드 이동형 수평도금장치 |
| CA3036191A1 (en) | 2016-09-08 | 2018-03-15 | Modumetal, Inc. | Processes for providing laminated coatings on workpieces, and articles made therefrom |
| US12227869B2 (en) | 2016-09-09 | 2025-02-18 | Modumetal, Inc. | Application of laminate and nanolaminate materials to tooling and molding processes |
| KR102412452B1 (ko) | 2016-09-14 | 2022-06-23 | 모두메탈, 인크. | 신뢰가능한 고처리량 복합 전기장 발생을 위한 시스템, 및 그로부터 코팅을 제조하는 방법 |
| US12076965B2 (en) | 2016-11-02 | 2024-09-03 | Modumetal, Inc. | Topology optimized high interface packing structures |
| CN110770372B (zh) | 2017-04-21 | 2022-10-11 | 莫杜美拓有限公司 | 具有电沉积涂层的管状制品及其生产系统和方法 |
| WO2019210264A1 (en) | 2018-04-27 | 2019-10-31 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
| EP4028582A1 (en) | 2019-09-12 | 2022-07-20 | Atotech Deutschland GmbH & Co. KG | Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus |
| US20230062477A1 (en) * | 2020-02-07 | 2023-03-02 | Atotech Deutschland GmbH & Co. KG | Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program |
| CN111826689B (zh) * | 2020-07-28 | 2022-02-11 | 翔声科技（厦门）有限公司 | 一种多阶段镀镍工艺 |
| CN114808057B (zh) * | 2021-01-29 | 2024-06-21 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
| CN215925133U (zh) * | 2021-06-30 | 2022-03-01 | 厦门海辰新能源科技有限公司 | 一种用于镀膜机的阳极板及镀膜机 |
| US20240003039A1 (en) * | 2022-06-29 | 2024-01-04 | Xiamen Hithium Energy Storage Technology Co.,Ltd.. | Film plating machine and electroplating production line |
| CN117802557A (zh) * | 2022-09-23 | 2024-04-02 | 奥特斯科技(重庆)有限公司 | 用于对部件承载件结构进行电镀覆的电镀覆设备和方法 |
| KR20250131513A (ko) * | 2024-02-27 | 2025-09-03 | 주식회사 웨스코일렉트로드 | 동박 제조용 양극 어셈블리 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3369294D1 (en) * | 1982-05-28 | 1987-02-26 | De La Rue Syst | Banding method and apparatus |
| DE3645319C3 (de) | 1986-07-19 | 2000-07-27 | Atotech Deutschland Gmbh | Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen |
| DE3732476A1 (de) * | 1987-09-24 | 1989-04-13 | Schering Ag | Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad |
| US5188721A (en) | 1989-02-10 | 1993-02-23 | Eltech Systems Corporation | Plate anode having bias cut edges |
| US5156730A (en) * | 1991-06-25 | 1992-10-20 | International Business Machines | Electrode array and use thereof |
| DE4132418C1 (enExample) | 1991-09-28 | 1993-02-11 | Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De | |
| DE19633797B4 (de) | 1996-08-22 | 2005-08-04 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen |
| DE19736351C1 (de) * | 1997-08-21 | 1998-10-01 | Atotech Deutschland Gmbh | Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken |
| EP1541719A3 (en) | 1998-05-20 | 2006-05-31 | Process Automation International Limited | An electroplating machine |
| US6395152B1 (en) | 1998-07-09 | 2002-05-28 | Acm Research, Inc. | Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| DE10100297A1 (de) | 2001-01-04 | 2002-07-18 | Gesimat Gmbh | Vorrichtung und Verahren zur elektrochemischen Beschichtung |
-
2001
- 2001-08-22 DE DE10141056A patent/DE10141056C2/de not_active Expired - Fee Related
-
2002
- 2002-08-21 US US10/485,654 patent/US7473344B2/en not_active Expired - Fee Related
- 2002-08-21 WO PCT/EP2002/009343 patent/WO2003018878A2/en not_active Ceased
- 2002-08-21 AT AT02769978T patent/ATE289636T1/de active
- 2002-08-21 AU AU2002336089A patent/AU2002336089A1/en not_active Abandoned
- 2002-08-21 MY MYPI20023077A patent/MY127490A/en unknown
- 2002-08-21 EP EP02769978A patent/EP1419290B1/en not_active Expired - Lifetime
- 2002-08-21 DE DE60203047T patent/DE60203047T2/de not_active Expired - Lifetime
- 2002-08-21 MX MXPA04001545A patent/MXPA04001545A/es active IP Right Grant
- 2002-08-21 JP JP2003523719A patent/JP4257203B2/ja not_active Expired - Lifetime
- 2002-08-21 CA CA002449807A patent/CA2449807A1/en not_active Abandoned
- 2002-08-21 BR BRPI0211270-1A patent/BR0211270B1/pt not_active IP Right Cessation
- 2002-08-21 CN CNB028164512A patent/CN1289719C/zh not_active Expired - Lifetime
- 2002-08-21 KR KR1020037017223A patent/KR100866821B1/ko not_active Expired - Lifetime
- 2002-08-22 TW TW091119014A patent/TW548349B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| BR0211270B1 (pt) | 2011-10-18 |
| MXPA04001545A (es) | 2004-05-14 |
| DE60203047D1 (de) | 2005-03-31 |
| MY127490A (en) | 2006-12-29 |
| JP4257203B2 (ja) | 2009-04-22 |
| DE10141056A1 (de) | 2003-05-08 |
| EP1419290B1 (en) | 2005-02-23 |
| EP1419290A2 (en) | 2004-05-19 |
| DE10141056C2 (de) | 2003-12-24 |
| AU2002336089A1 (en) | 2003-03-10 |
| BR0211270A (pt) | 2004-12-21 |
| KR20040028802A (ko) | 2004-04-03 |
| CA2449807A1 (en) | 2003-03-06 |
| DE60203047T2 (de) | 2006-01-12 |
| CN1289719C (zh) | 2006-12-13 |
| US20040232005A1 (en) | 2004-11-25 |
| WO2003018878A2 (en) | 2003-03-06 |
| HK1060906A1 (en) | 2004-08-27 |
| JP2005501181A (ja) | 2005-01-13 |
| ATE289636T1 (de) | 2005-03-15 |
| CN1561409A (zh) | 2005-01-05 |
| WO2003018878A3 (en) | 2004-02-26 |
| KR100866821B1 (ko) | 2008-11-04 |
| US7473344B2 (en) | 2009-01-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |