CN1284424C - 多层印刷电路板 - Google Patents

多层印刷电路板 Download PDF

Info

Publication number
CN1284424C
CN1284424C CNB008174733A CN00817473A CN1284424C CN 1284424 C CN1284424 C CN 1284424C CN B008174733 A CNB008174733 A CN B008174733A CN 00817473 A CN00817473 A CN 00817473A CN 1284424 C CN1284424 C CN 1284424C
Authority
CN
China
Prior art keywords
printed circuit
circuit board
multilayer printed
layer
glass film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008174733A
Other languages
English (en)
Chinese (zh)
Other versions
CN1413427A (zh
Inventor
沃尔夫冈·谢尔
德特夫勒·克拉贝
曼弗雷迪·齐冈
马蒂亚斯·迪茨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of CN1413427A publication Critical patent/CN1413427A/zh
Application granted granted Critical
Publication of CN1284424C publication Critical patent/CN1284424C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Structure Of Printed Boards (AREA)
CNB008174733A 1999-12-21 2000-12-21 多层印刷电路板 Expired - Fee Related CN1284424C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19961842A DE19961842B4 (de) 1999-12-21 1999-12-21 Mehrschichtleiterplatte
DE19961842.9 1999-12-21

Publications (2)

Publication Number Publication Date
CN1413427A CN1413427A (zh) 2003-04-23
CN1284424C true CN1284424C (zh) 2006-11-08

Family

ID=7933689

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008174733A Expired - Fee Related CN1284424C (zh) 1999-12-21 2000-12-21 多层印刷电路板

Country Status (9)

Country Link
US (2) US20030010530A1 (enExample)
EP (1) EP1240809B1 (enExample)
JP (1) JP4657554B2 (enExample)
CN (1) CN1284424C (enExample)
AT (1) ATE242954T1 (enExample)
AU (1) AU2675901A (enExample)
CA (1) CA2395080C (enExample)
DE (2) DE19961842B4 (enExample)
WO (1) WO2001047326A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009721A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN103009722A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN103009720A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10145190A1 (de) * 2001-09-13 2003-04-03 Siemens Ag Verfahren zur Herstellung glasbasierter elektronischer Bauelemente
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US9101061B2 (en) 2011-09-22 2015-08-04 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
KR102264708B1 (ko) * 2011-09-22 2021-06-11 쇼와덴코머티리얼즈가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
KR20140063712A (ko) * 2011-09-22 2014-05-27 히타치가세이가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
US20130180760A1 (en) * 2011-09-22 2013-07-18 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
US9050780B2 (en) 2011-09-22 2015-06-09 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
CN102548199A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 电路基板及其制作方法
CN102548200A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 电路基板及其制作方法
WO2013097127A1 (zh) * 2011-12-29 2013-07-04 广东生益科技股份有限公司 电路基板及其制作方法
US20140377534A1 (en) * 2011-12-29 2014-12-25 Shengyi Technology Co., Ltd. Circuit substrate and manufacturing method thereof
WO2014098099A1 (ja) * 2012-12-18 2014-06-26 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
CN103129090B (zh) * 2013-01-30 2016-05-25 广东生益科技股份有限公司 一种玻璃膜基覆铜板的制备方法及其所制得的覆铜板
TWI628074B (zh) * 2013-03-27 2018-07-01 日立化成股份有限公司 Laminated body, laminated board, printed wiring board, and method for manufacturing laminated body and laminated board
JP6314337B2 (ja) * 2013-03-28 2018-04-25 味の素株式会社 シート材
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
JP2016221953A (ja) * 2015-06-03 2016-12-28 日立化成株式会社 積層体の製造方法及び配線板の製造方法
US10459160B2 (en) 2017-01-31 2019-10-29 Corning Optical Communications LLC Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs
WO2019208402A1 (ja) * 2018-04-24 2019-10-31 三菱瓦斯化学株式会社 積層板、プリント配線板、多層プリント配線板、積層体、及び、積層板の製造方法
DE102024208645A1 (de) * 2024-09-11 2025-08-07 Schaeffler Technologies AG & Co. KG Leiterplatte und Verfahren zum Herstellen einer solchen

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
US4609586A (en) * 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
DE3674034D1 (de) * 1985-03-27 1990-10-18 Ibiden Co Ltd Substrate fuer elektronische schaltungen.
JPS63107095A (ja) * 1986-10-23 1988-05-12 富士通株式会社 多層セラミツク回路基板
CA1306513C (fr) * 1987-08-18 1992-08-18 Eric Verna Procede pour terminer une soudure fermee au plasma d'arc avec trou traversant
JP2586423B2 (ja) * 1988-05-26 1997-02-26 日本電装株式会社 混成集積回路
US5073840A (en) * 1988-10-06 1991-12-17 Microlithics Corporation Circuit board with coated metal support structure and method for making same
JPH0582929A (ja) * 1991-09-24 1993-04-02 Ibiden Co Ltd セラミツクス・樹脂複合配線基板
JPH0590720A (ja) * 1991-09-27 1993-04-09 Ibiden Co Ltd 複合プリント配線板
JPH05175625A (ja) * 1991-12-25 1993-07-13 Ibiden Co Ltd 複合プリント配線板とその製造方法
US5306571A (en) * 1992-03-06 1994-04-26 Bp Chemicals Inc., Advanced Materials Division Metal-matrix-composite
ATE180137T1 (de) * 1992-06-15 1999-05-15 Heinze Dyconex Patente Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung
JPH07249847A (ja) * 1994-03-14 1995-09-26 Mitsubishi Electric Corp 低熱膨張プリント配線板
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
JPH08181443A (ja) * 1994-12-21 1996-07-12 Murata Mfg Co Ltd セラミック多層基板およびその製造方法
US5687062A (en) * 1996-02-20 1997-11-11 Heat Technology, Inc. High-thermal conductivity circuit board
JPH09270573A (ja) * 1996-03-29 1997-10-14 Cmk Corp プリント配線板及びその製造方法
US6136733A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6287674B1 (en) * 1997-10-24 2001-09-11 Agfa-Gevaert Laminate comprising a thin borosilicate glass substrate as a constituting layer
US6197418B1 (en) * 1998-12-21 2001-03-06 Agfa-Gevaert, N.V. Electroconductive glass laminate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009721A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN103009722A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法
CN103009720A (zh) * 2011-09-22 2013-04-03 日立化成工业株式会社 层叠体、层叠板、多层层叠板、印刷配线板及层叠板的制造方法

Also Published As

Publication number Publication date
CA2395080A1 (en) 2001-06-28
CA2395080C (en) 2006-10-17
CN1413427A (zh) 2003-04-23
JP4657554B2 (ja) 2011-03-23
US20040037950A1 (en) 2004-02-26
ATE242954T1 (de) 2003-06-15
US20030010530A1 (en) 2003-01-16
DE19961842A1 (de) 2001-07-12
JP2004512667A (ja) 2004-04-22
DE19961842B4 (de) 2008-01-31
AU2675901A (en) 2001-07-03
EP1240809A1 (de) 2002-09-18
EP1240809B1 (de) 2003-06-11
DE50002562D1 (de) 2003-07-17
WO2001047326A1 (de) 2001-06-28

Similar Documents

Publication Publication Date Title
CN1284424C (zh) 多层印刷电路板
US8314343B2 (en) Multi-layer board incorporating electronic component and method for producing the same
JP4881460B2 (ja) 電子部品内蔵型多層基板
CN1996585B (zh) 具有嵌入到塑料壳体中的半导体结构组件的半导体构件
JP3236818B2 (ja) 素子内蔵多層配線基板の製造方法
JP5093353B2 (ja) 部品内蔵モジュールの製造方法及び部品内蔵モジュール
US8186042B2 (en) Manufacturing method of a printed board assembly
US7820916B2 (en) Composite ceramic substrate
JP2009170891A (ja) リジッドプリント回路板用の改良された絶縁層
US5576518A (en) Via-structure of a multilayer interconnection ceramic substrate
WO2008073678A1 (en) Microelectronic substrate including embedded components and spacer layer and method of forming same
HK1041154A1 (en) Printed wiring board
JP2004274035A (ja) 電子部品内蔵モジュールとその製造方法
US11963310B2 (en) Component carrier having component covered with ultra-thin transition layer
US20120314390A1 (en) Multilayer circuit board
US5041699A (en) Laminated thermally conductive substrate
KR102026214B1 (ko) 인쇄회로 기판 및 그 제조 방법
JP3071764B2 (ja) 金属箔付きフィルム及びそれを用いた配線基板の製造方法
US20080237894A1 (en) Integrated circuit package and method for the same
JP3085649B2 (ja) 転写シート及びそれを用いた配線基板の製造方法
JPH11163524A (ja) 多層配線基板および該多層配線基板を用いた半導体装置
JP2003229509A (ja) 多層プリント配線板
JPH098426A (ja) 金属ベース多層配線板
JP5078451B2 (ja) 電子部品内蔵モジュール
JPH0781002A (ja) 積層板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20061108

Termination date: 20191221