DE19961842B4 - Mehrschichtleiterplatte - Google Patents

Mehrschichtleiterplatte Download PDF

Info

Publication number
DE19961842B4
DE19961842B4 DE19961842A DE19961842A DE19961842B4 DE 19961842 B4 DE19961842 B4 DE 19961842B4 DE 19961842 A DE19961842 A DE 19961842A DE 19961842 A DE19961842 A DE 19961842A DE 19961842 B4 DE19961842 B4 DE 19961842B4
Authority
DE
Germany
Prior art keywords
circuit board
layer
printed circuit
thermal expansion
board according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE19961842A
Other languages
German (de)
English (en)
Other versions
DE19961842A1 (de
Inventor
Wolfgang Prof. Dr. Scheel
Detlef Dr. Krabe
Manfred Dr. Cygon
Mathias Dr. Dietz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isola 52353 Dueren De GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
ISOLA GmbH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE19961842A priority Critical patent/DE19961842B4/de
Application filed by ISOLA GmbH, Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical ISOLA GmbH
Priority to AT00990013T priority patent/ATE242954T1/de
Priority to JP2001547927A priority patent/JP4657554B2/ja
Priority to DE50002562T priority patent/DE50002562D1/de
Priority to EP00990013A priority patent/EP1240809B1/de
Priority to CA002395080A priority patent/CA2395080C/en
Priority to PCT/EP2000/013121 priority patent/WO2001047326A1/de
Priority to CNB008174733A priority patent/CN1284424C/zh
Priority to AU26759/01A priority patent/AU2675901A/en
Publication of DE19961842A1 publication Critical patent/DE19961842A1/de
Priority to US10/173,625 priority patent/US20030010530A1/en
Priority to US10/648,331 priority patent/US20040037950A1/en
Application granted granted Critical
Publication of DE19961842B4 publication Critical patent/DE19961842B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
  • Structure Of Printed Boards (AREA)
DE19961842A 1999-12-21 1999-12-21 Mehrschichtleiterplatte Expired - Lifetime DE19961842B4 (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
DE19961842A DE19961842B4 (de) 1999-12-21 1999-12-21 Mehrschichtleiterplatte
AU26759/01A AU2675901A (en) 1999-12-21 2000-12-21 Multilayer printed board
DE50002562T DE50002562D1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte
EP00990013A EP1240809B1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte
CA002395080A CA2395080C (en) 1999-12-21 2000-12-21 Multilayer printed board
PCT/EP2000/013121 WO2001047326A1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte
AT00990013T ATE242954T1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte
JP2001547927A JP4657554B2 (ja) 1999-12-21 2000-12-21 多層プリント基板の製造方法
CNB008174733A CN1284424C (zh) 1999-12-21 2000-12-21 多层印刷电路板
US10/173,625 US20030010530A1 (en) 1999-12-21 2002-06-19 Multilayer printed board
US10/648,331 US20040037950A1 (en) 1999-12-21 2003-08-27 Multilayer printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19961842A DE19961842B4 (de) 1999-12-21 1999-12-21 Mehrschichtleiterplatte

Publications (2)

Publication Number Publication Date
DE19961842A1 DE19961842A1 (de) 2001-07-12
DE19961842B4 true DE19961842B4 (de) 2008-01-31

Family

ID=7933689

Family Applications (2)

Application Number Title Priority Date Filing Date
DE19961842A Expired - Lifetime DE19961842B4 (de) 1999-12-21 1999-12-21 Mehrschichtleiterplatte
DE50002562T Expired - Lifetime DE50002562D1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE50002562T Expired - Lifetime DE50002562D1 (de) 1999-12-21 2000-12-21 Mehrschichtleiterplatte

Country Status (9)

Country Link
US (2) US20030010530A1 (enExample)
EP (1) EP1240809B1 (enExample)
JP (1) JP4657554B2 (enExample)
CN (1) CN1284424C (enExample)
AT (1) ATE242954T1 (enExample)
AU (1) AU2675901A (enExample)
CA (1) CA2395080C (enExample)
DE (2) DE19961842B4 (enExample)
WO (1) WO2001047326A1 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608789B2 (en) 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
US8169041B2 (en) 2005-11-10 2012-05-01 Epcos Ag MEMS package and method for the production thereof
US8184845B2 (en) 2005-02-24 2012-05-22 Epcos Ag Electrical module comprising a MEMS microphone
US8229139B2 (en) 2005-11-10 2012-07-24 Epcos Ag MEMS microphone, production method and method for installing
US8582788B2 (en) 2005-02-24 2013-11-12 Epcos Ag MEMS microphone

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10145190A1 (de) * 2001-09-13 2003-04-03 Siemens Ag Verfahren zur Herstellung glasbasierter elektronischer Bauelemente
DE102005008514B4 (de) * 2005-02-24 2019-05-16 Tdk Corporation Mikrofonmembran und Mikrofon mit der Mikrofonmembran
US9101061B2 (en) 2011-09-22 2015-08-04 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
KR102264708B1 (ko) * 2011-09-22 2021-06-11 쇼와덴코머티리얼즈가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
KR20140063712A (ko) * 2011-09-22 2014-05-27 히타치가세이가부시끼가이샤 적층체, 적층판, 다층 적층판, 프린트 배선판 및 적층판의 제조 방법
JPWO2013042750A1 (ja) * 2011-09-22 2015-03-26 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
US20130180760A1 (en) * 2011-09-22 2013-07-18 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
EP2759400B1 (en) * 2011-09-22 2020-04-15 Hitachi Chemical Company, Ltd. Laminated body, laminated board, multi-layer laminated board, printed wiring board, and production method for laminated board
US9050780B2 (en) 2011-09-22 2015-06-09 Hitachi Chemical Company, Ltd. Laminate body, laminate plate, multilayer laminate plate, printed wiring board, and method for manufacture of laminate plate
WO2013042752A1 (ja) * 2011-09-22 2013-03-28 日立化成株式会社 積層体、積層板、多層積層板、プリント配線板及び積層板の製造方法
CN102548199A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 电路基板及其制作方法
CN102548200A (zh) * 2011-12-29 2012-07-04 广东生益科技股份有限公司 电路基板及其制作方法
WO2013097127A1 (zh) * 2011-12-29 2013-07-04 广东生益科技股份有限公司 电路基板及其制作方法
US20140377534A1 (en) * 2011-12-29 2014-12-25 Shengyi Technology Co., Ltd. Circuit substrate and manufacturing method thereof
WO2014098099A1 (ja) * 2012-12-18 2014-06-26 日立化成株式会社 積層体、積層板、プリント配線板、積層体の製造方法、及び積層板の製造方法
CN103129090B (zh) * 2013-01-30 2016-05-25 广东生益科技股份有限公司 一种玻璃膜基覆铜板的制备方法及其所制得的覆铜板
TWI628074B (zh) * 2013-03-27 2018-07-01 日立化成股份有限公司 Laminated body, laminated board, printed wiring board, and method for manufacturing laminated body and laminated board
JP6314337B2 (ja) * 2013-03-28 2018-04-25 味の素株式会社 シート材
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
KR101650938B1 (ko) * 2014-09-25 2016-08-24 코닝정밀소재 주식회사 집적회로 패키지용 기판
JP2016221953A (ja) * 2015-06-03 2016-12-28 日立化成株式会社 積層体の製造方法及び配線板の製造方法
US10459160B2 (en) 2017-01-31 2019-10-29 Corning Optical Communications LLC Glass waveguide assemblies for OE-PCBs and methods of forming OE-PCBs
WO2019208402A1 (ja) * 2018-04-24 2019-10-31 三菱瓦斯化学株式会社 積層板、プリント配線板、多層プリント配線板、積層体、及び、積層板の製造方法
DE102024208645A1 (de) * 2024-09-11 2025-08-07 Schaeffler Technologies AG & Co. KG Leiterplatte und Verfahren zum Herstellen einer solchen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
US4491622A (en) * 1982-04-19 1985-01-01 Olin Corporation Composites of glass-ceramic to metal seals and method of making the same
US4812792A (en) * 1983-12-22 1989-03-14 Trw Inc. High-frequency multilayer printed circuit board
US4609586A (en) * 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
DE3674034D1 (de) * 1985-03-27 1990-10-18 Ibiden Co Ltd Substrate fuer elektronische schaltungen.
JPS63107095A (ja) * 1986-10-23 1988-05-12 富士通株式会社 多層セラミツク回路基板
CA1306513C (fr) * 1987-08-18 1992-08-18 Eric Verna Procede pour terminer une soudure fermee au plasma d'arc avec trou traversant
JP2586423B2 (ja) * 1988-05-26 1997-02-26 日本電装株式会社 混成集積回路
US5073840A (en) * 1988-10-06 1991-12-17 Microlithics Corporation Circuit board with coated metal support structure and method for making same
JPH0582929A (ja) * 1991-09-24 1993-04-02 Ibiden Co Ltd セラミツクス・樹脂複合配線基板
JPH0590720A (ja) * 1991-09-27 1993-04-09 Ibiden Co Ltd 複合プリント配線板
JPH05175625A (ja) * 1991-12-25 1993-07-13 Ibiden Co Ltd 複合プリント配線板とその製造方法
US5306571A (en) * 1992-03-06 1994-04-26 Bp Chemicals Inc., Advanced Materials Division Metal-matrix-composite
ATE180137T1 (de) * 1992-06-15 1999-05-15 Heinze Dyconex Patente Verfahren zur herstellung von leiterplatten unter verwendung eines halbzeuges mit extrem dichter verdrahtung für die signalführung
JPH07249847A (ja) * 1994-03-14 1995-09-26 Mitsubishi Electric Corp 低熱膨張プリント配線板
JPH08181443A (ja) * 1994-12-21 1996-07-12 Murata Mfg Co Ltd セラミック多層基板およびその製造方法
US5687062A (en) * 1996-02-20 1997-11-11 Heat Technology, Inc. High-thermal conductivity circuit board
JPH09270573A (ja) * 1996-03-29 1997-10-14 Cmk Corp プリント配線板及びその製造方法
US6136733A (en) * 1997-06-13 2000-10-24 International Business Machines Corporation Method for reducing coefficient of thermal expansion in chip attach packages
US6287674B1 (en) * 1997-10-24 2001-09-11 Agfa-Gevaert Laminate comprising a thin borosilicate glass substrate as a constituting layer
US6197418B1 (en) * 1998-12-21 2001-03-06 Agfa-Gevaert, N.V. Electroconductive glass laminate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
Huschka, M., Substratauswahl für SMT- Anwendungen. In: Galvanotechnik 80 (1989),Nr. 12, S.4421-4426 *
JP 05-090 720 A (Abstract)
JP 05090720 A (Abstract) *
N.N., 2. Leitron-Symposion 1985. In: Galvano- technik 76 (1985), Nr. 2, S. 2070-2073
N.N., 2. Leitron-Symposion 1985. In: Galvanotechnik 76 (1985), Nr. 2, S. 2070-2073 *

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608789B2 (en) 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
US8184845B2 (en) 2005-02-24 2012-05-22 Epcos Ag Electrical module comprising a MEMS microphone
US8582788B2 (en) 2005-02-24 2013-11-12 Epcos Ag MEMS microphone
US8169041B2 (en) 2005-11-10 2012-05-01 Epcos Ag MEMS package and method for the production thereof
US8229139B2 (en) 2005-11-10 2012-07-24 Epcos Ag MEMS microphone, production method and method for installing
US8432007B2 (en) 2005-11-10 2013-04-30 Epcos Ag MEMS package and method for the production thereof

Also Published As

Publication number Publication date
CA2395080A1 (en) 2001-06-28
CA2395080C (en) 2006-10-17
CN1413427A (zh) 2003-04-23
JP4657554B2 (ja) 2011-03-23
US20040037950A1 (en) 2004-02-26
ATE242954T1 (de) 2003-06-15
US20030010530A1 (en) 2003-01-16
DE19961842A1 (de) 2001-07-12
JP2004512667A (ja) 2004-04-22
AU2675901A (en) 2001-07-03
EP1240809A1 (de) 2002-09-18
EP1240809B1 (de) 2003-06-11
DE50002562D1 (de) 2003-07-17
WO2001047326A1 (de) 2001-06-28
CN1284424C (zh) 2006-11-08

Similar Documents

Publication Publication Date Title
DE19961842B4 (de) Mehrschichtleiterplatte
DE19717611B4 (de) Struktur zum Anbringen von elektronischen Komponenten
DE69008963T2 (de) Elektronisches Schaltungssubstrat.
DE4329696C2 (de) Auf Leiterplatten oberflächenmontierbares Multichip-Modul mit SMD-fähigen Anschlußelementen
DE60001500T2 (de) Poröse speisungs- und erdungsflächen zur reduzierung der leiterplatten-delaminierung und verbesserung der zuverlässigkeit
EP3231261B1 (de) Leiterplatte mit einem asymmetrischen schichtenaufbau
DE102007006706B4 (de) Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu
DE69725689T2 (de) Gedruckte Leiterplatte und elektronische Bauteile
DE60032067T2 (de) Mehrschichtige Leiterplatte und Verfahren zu deren Herstellung
EP3231262B1 (de) Semiflexible leiterplatte mit eingebetteter komponente
DE2330732A1 (de) Schaltungskarte fuer integrierte schaltungen
DE102009001461A1 (de) Verfahren zur Herstellung einer elektronischen Baugruppe
CN103096617A (zh) 导电材料和使用该导电材料的电子器件
DE102011007842A1 (de) Mehrschichtige Leiterplatte
DE102008026710A1 (de) Elektronisches Bauelement aus Keramik
DE19755792A1 (de) Textiles Flächengebilde mit mikrostrukturierter Verdrahtung
DE112009001736T5 (de) Verfahren zum Herstellen eines komponenteneingebetteten Moduls
DE112006000519B4 (de) Integrierter Dünnschicht-Kondensator mit optimierter Temperaturkennlinie
DE102007040876A1 (de) Mehrschicht-Leiterplatte
DE102014210483A1 (de) Verfahren zum Herstellen einer Folienanordnung und entsprechende Folienanordnung
DE202013001560U1 (de) Leiterplatte für elektrische Schaltungen
DE102014219759A1 (de) Leistungsmodul
EP3413342A1 (de) Elektronische baugruppe und verfahren zur herstellung einer solchen
CN114846911A (zh) 伸缩性安装基板以及伸缩性安装基板的制造方法
DE102006031844B4 (de) Verfahren zur Befestigung von elektronischen Bauelementen auf einem Träger durch Drucksinterung und somit hergestellte Schaltungsanordnung

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8127 New person/name/address of the applicant

Owner name: ISOLA AG, 52353 DUEREN, DE

Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAND

8127 New person/name/address of the applicant

Owner name: ISOLA GMBH, 52353 DUEREN, DE

Owner name: FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAND

8364 No opposition during term of opposition
R071 Expiry of right