CN1264174A - 树脂密封的半导体器件 - Google Patents

树脂密封的半导体器件 Download PDF

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CN1264174A
CN1264174A CN00100781A CN00100781A CN1264174A CN 1264174 A CN1264174 A CN 1264174A CN 00100781 A CN00100781 A CN 00100781A CN 00100781 A CN00100781 A CN 00100781A CN 1264174 A CN1264174 A CN 1264174A
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川原良德
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Renesas Electronics Corp
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Abstract

本发明的树脂密封半导体器件包括:具有其上安装半导体元件的岛和内引线的引线框;用于发散半导体元件中产生的热的散热器,在散热器、岛的下部和内引线不用粘合剂相互面接触的情况下进行树脂密封,散热器的一部分在其外周部分与内引线的一部分接触。提高了散热器的散热效率。

Description

树脂密封的半导体器件
本发明涉及一种半导体器件，特别涉及一种提高了封装的热辐射性的树脂密封半导体器件。
关于工作期间其内部通常发热的大功耗半导体器件，已提出了各种方法增强从封装散热的能力。
例如，如图12所示，半导体器件包括其上安装半导体元件101的岛102，具有内引线104的引线框103和散热器106。半导体器件的散热器106、岛104和引线框103利用低熔点金属镀层105固定。另一种情况是，在日本未决公开专利申请5-36862中，散热器和引线框彼此间利用粘合剂粘附。
然而，这种常规树脂密封半导体器件都具有自身的问题。
即，在岛利用低熔点金属镀层固定于散热器上的上述情况下，在树脂注入时，低熔点金属镀层会熔化，所以无法确保固定。因此，散热器和岛间的接触有时不完全。对于散热器和岛利用粘合剂彼此粘附的情况，其缺点是由于粘合剂昂贵，而提高了生产成本。
本发明的目的是提供一种树脂密封的半导体器件，而引线框的一部分和散热器不用粘合剂彼此接触。
本发明的半导体器件包括：半导体元件；耦合到所述半导体元件的引线；其上安装半导体元件的岛；直接与岛接触的散热器，散热器在其与引线接触的角部具有悬空部分；用于密封的树脂，其密封半导体元件、引线、岛和包括悬空部分在内的散热器。
本发明的制造半导体器件的方法包括：
把半导体元件置于引线框的岛的上部；
利用键合线连接引线框上的内引线与半导体元件上的焊盘；
将散热器放入下模具中；
把其上安装有半导体元件的引线框设置于散热器上，使引线框与下模具上的散热器接触；
用上模具覆盖下模具上的引线框和散热器；
在由上下模具压住引线框和散热器的周边部分，并将它们保持在上下模具之间的同时，在上下模具限定的内部空间中注入树脂，
树脂固化后，切割散热器的悬空支撑杆。
图1是展示本发明第一实施例的半导体器件的示图；
图2A和2B是图1所示半导体器件的剖视图；图2A是沿线A-A’取的图1所示半导体器件的剖视图，图2B是线B-B’取的图1所示半导体器件的剖视图；
图3是展示图1所示半导体器件所用引线框的平面图；
图4是展示图1所示半导体器件所用散热器的平面图；
图5是展示图4所示散热器的放大部分的平面图；
图6A-6D是展示根据本发明的半导体器件制造方法的例示图；
图7A-7D是介绍根据本发明的半导体器件的效果的剖视图；
图8是展示本发明第二实施例的半导体器件的剖视图；
图9是展示本发明第三实施例的半导体器件的剖视图；
图10是展示本发明第四实施例的半导体器件的剖视图；
图11是展示图9和10所示散热器的一部分的平面图；
图12是展示常规树脂密封半导体器件的剖视平面图。
图1是展示本发明第一实施例的树脂密封半导体器件的示图。图2A是沿线A-A’取的图1所示半导体器件的剖视图，图2B是线B-B’取的图1所示半导体器件的剖视图。
本发明的半导体器件10包括具有岛12的引线框14和用于发散半导体元件11产生的热的散热器15。半导体元件11安装在岛12上。引线框14具有连接到金属线22的内引线13和从树脂封装25延伸到外部的外引线26。散热器15在以预定宽度或以点的方式与岛12接触的散热部分15a具有凸起27。因此，散热器15不通过粘合剂与岛12粘附。
图3是切割前的引线框14的平面图。引线框14在其中心部分具有岛12，在其外围部分具有内引线13。内引线13和外引线26用连接条(tie bar)17固定。悬空引线33连接到岛12的四个角。引线框14具有孔18，用于切割散热器15的悬空支撑杆15b。引线框14具有引线框对准孔30。尺寸M是模制线16，以便将模具密封在模制线16内。尺寸B是连接条线。
图4是切割前的散热器15的平面图。散热器15具有散热部分15a、外部部分15c和连接各散热部分15a与各外部部分15c的悬空支撑杆15b。散热部分15a上形成有凹坑20、槽21、和凸起27。散热器15的凸起27连接到岛12，用于提高散热效率。散热器15由金属制成。引线框14的悬空引线33与散热器15的外围部分即悬空支撑杆15b接触，以提高辐射效率。凹坑20和槽21可以提高树脂的流动性和树脂与散热器15间的粘附性。尺寸A是树脂密封线。
图5是在其悬空支撑杆15b处的散热器15的放大平面图。每个悬空支撑杆15b在与模制线16的交叉点处都具有一个收缩部分32。代替收缩部分32，可以形成凹口或切割端。
图6A-6D分别是展示沿图3和4的线X-Y取的半导体器件的剖视图，用于介绍根据本发明的树脂密封半导体器件的制造方法。在安装步骤，如图6A所示，半导体元件11被放置于引线框14的镀银岛12的上面。元件11可用树脂粘合剂粘附于岛12上。在接下来的键合步骤中，引线框14上的内引线13和半导体元件11上的焊盘借金属线22彼此键合。在引线框14上形成孔18。接着，制备具有销钉(未示出)的下模具23。将下模具23的销钉插入散热器15的孔31中，使散热器15被下模具23定位和支撑，从而将散热器15沉放在下模具23的凹部中，如图6B所示。如图6C所示，通过将下模具23的销钉插入引线框14的孔30中，将其上安装有半导体元件11的引线框14沉入到下模具23的凹部中，从而使引线框14设置于散热器15上，并使引线框14与散热器15接触。然后，上模具24盖于其上，并在模具23和24问的空间用压力注入熔化的树脂。由于此时引线框14和散热器15的外周部分被上下模具24和23压住并保持于其间，所以不必担心这些部分发生位移。在进行树脂固化和去掉上模具24后，通过将销钉33插入引线框14的孔18，并插到散热器15的位置18a，切断散热器15的悬空支撑杆15b，如图6D所示。通过上述这些步骤，完成了树脂密封半导体器件的制造。
图7A-7D展示了散热器15的树脂密封尺寸A、模制线尺寸M和连接条尺寸B的关系。尺寸A大于尺寸M，小于尺寸B，如图7A所示。
散热器15和引线框14通过销钉以预定的精度例如相对于下模具23为±50微米定位。在这种情况下，尺寸A设定为比尺寸M大50微米，或分别在左右方向上较宽。因此，如图7B所示，即便散热器15偏离该侧50微米(图7B所示的散热器15相对于下模具23向左方向滑动)，散热器15外部部分15c的下表面也不会被模制树脂25覆盖(见图7B的圆C)。另一方面，树脂密封尺寸A小于模制线尺寸M预定的精度，例如树脂密封尺寸A与模制线尺寸M相同(见图7C)，外部部分15c进入到模制树脂25中，结果可以防止散热器15在随后的步骤中脱落(见图7D)。密封尺寸A小于连接条尺寸B，以防止模制树脂25覆盖将在以后的步骤中被切割的连接条17。
图8是展示本发明第二实施例的树脂密封半导体器件的剖视图。该实施例中，散热器15的背面未覆盖树脂，而是直接暴露于空气。由于散热器15的背面未被树脂覆盖，所以这种结构可以进一步提高散热效果。由于第二实施例的其它结构基本上与第一实施例相同，所以不再做介绍。
图9是本发明第三实施例的树脂密封半导体器件的剖视图。散热器15与岛12以表面接触的方式被密封。由于其它结构和形成半导体器件的方法基本与第一实施例的半导体器件相同，所以不再做介绍。
图10是本发明第四实施例的树脂密封半导体器件的剖视图。散热器15的背面未覆盖树脂，而是直接暴露于空气。由于第四实施例的其它结构基本与第三实施例相同，所以不再做介绍。
图11是图9和10所示半导体器件所用的散热器15的平面图。凹坑20以矩阵形式设于其热散热部分，槽21设置于热散热部分的中心部分。图11所示的散热器15的其它结构基本与图4所示散热器15相同，所以不再做介绍。
本发明的第一效果与任何常规树脂密封半导体器件显著不同，常规树脂密封半导体器件中的插入式(drop-in)散热器不稳固，易于从封装内的固定位置偏离，导致了可靠性不好。由于本发明中引线框和散热器的外围部分被上下模具压住并被固定在其间，同时在压力下注入树脂，所以在不用粘合剂时也可以实现引线框和散热器间的稳定接触。本发明的第二效果是，由于不象现有技术那样，本发明不需要使用任何粘合剂，所以价格便宜。注意，本发明不限于上述实施例，但根据本发明的技术思想，可以对设计做出各种改进。

Claims (19)

1.一种半导体器件，包括：
半导体元件；
连接到所述半导体元件的引线；
其上安装半导体元件的岛；
直接与所述岛接触的散热器，所述散热器在其与所述引线接触的角部具有悬空部分；
用于密封的树脂，其密封所述半导体元件、所述引线、所述岛和包括悬空部分在内的所述散热器。
2.根据权利要求1的器件，其中所述散热器由金属板制造。
3.根据权利要求2的器件，其中所述散热器不用粘合剂与所述岛粘附。
4.根据权利要求3的器件，其中所述散热器具有与所述岛的所述下表面接触的凸起。
5.根据权利要求4的器件，其中所述散热器具有多个槽和多个凹坑。
6.根据权利要求5的器件，其中所述凹坑布置于所述散热器的角部。
7.根据权利要求6的器件，其中所述槽布置于所述两凹坑之间。
8.根据权利要求7的器件，其中所述凸起布置于所述散热器的中心。
9.根据权利要求8的器件，其中所述散热器的背面未被所述树脂覆盖，从而暴露于空气中。
10.半导体器件，包括：
岛；
形成于所述岛的上表面上的半导体元件；
多根内引线；
从所述岛的角部延伸出的悬空引线；
连接在所述内引线和所述半导体元件间的多根键合线；
具有散热部分和从所述散热部分的角部延伸出的悬空部分的散热器，所述散热部分具有直接与所述岛的下表面接触的第一表面，所述悬空部分直接与所述悬空引线接触；
多根外引线，每根连接到各内引线；
覆盖的树脂，其覆盖所述岛、所述半导体元件、内引线、所述悬空引线、所述键合线、包括所述散热部分和所述悬空部分在内的所述散热器。
11.根据权利要求10的器件，其中在所述散热部分的所述第一表面形成凸起，以便所述凸起直接与所述岛接触。
12.根据权利要求11的器件，其中所述散热部分大于所述岛。
13.根据权利要求12的器件，其中所述散热部分具有多个槽和多个凹坑。
14.根据权利要求13的器件，其中所述凹坑布置于所述散热部分的角部。
15.根据权利要求14的器件，其中所述槽布置于所述两凹坑之间。
16.根据权利要求15的器件，其中所述散热部分的第二表面未被所述树脂覆盖，而暴露于空气中。
17.一种制造半导体器件的方法，包括：
把半导体元件置于引线框的岛的上部；
利用键合线连接所述引线框上的内引线与所述半导体元件上的焊盘；
将散热器放入下模具中；
把其上安装有半导体元件的引线框设置于所述散热器上，使引线框与所述下模具上的所述散热器接触；
用上模具覆盖所述下模具上的所述引线框和所述散热器；
在由所述上下模具压住引线框和散热器的周边部分，并将它们保持在上下模具之间的同时，在所述上下模具限定的内部空间中注入树脂；
树脂固化后，切割所述散热器的悬空支撑杆。
18.根据权利要求17的方法，其中所述散热器的所述悬空支撑杆具有被切割的凹口。
19.根据权利要求18的方法，其中密封尺寸大于模制线尺寸，小于连接条尺寸。
CNB001007815A 1999-02-04 2000-02-03 树脂密封的半导体器件 Expired - Fee Related CN1163961C (zh)

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