CN1239609C - 树脂组合物及其用途以及它们的制造方法 - Google Patents

树脂组合物及其用途以及它们的制造方法 Download PDF

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Publication number
CN1239609C
CN1239609C CNB021052034A CN02105203A CN1239609C CN 1239609 C CN1239609 C CN 1239609C CN B021052034 A CNB021052034 A CN B021052034A CN 02105203 A CN02105203 A CN 02105203A CN 1239609 C CN1239609 C CN 1239609C
Authority
CN
China
Prior art keywords
resin combination
mentioned
epoxy
resins
phosphorous compounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB021052034A
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English (en)
Chinese (zh)
Other versions
CN1370802A (zh
Inventor
平井康之
铃木宏典
武田良幸
大堀健一
鸭志田真一
垣谷稔
阿部纪大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of CN1370802A publication Critical patent/CN1370802A/zh
Application granted granted Critical
Publication of CN1239609C publication Critical patent/CN1239609C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
    • C08K5/3155—Dicyandiamide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
CNB021052034A 2001-02-15 2002-02-19 树脂组合物及其用途以及它们的制造方法 Expired - Fee Related CN1239609C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001038553A JP4783984B2 (ja) 2001-02-15 2001-02-15 樹脂組成物およびその用途ならびにそれらの製造方法
JP38553/2001 2001-02-15

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100859622A Division CN100393802C (zh) 2001-02-15 2002-02-19 树脂组合物及其用途以及它们的制造方法

Publications (2)

Publication Number Publication Date
CN1370802A CN1370802A (zh) 2002-09-25
CN1239609C true CN1239609C (zh) 2006-02-01

Family

ID=18901505

Family Applications (2)

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CNB021052034A Expired - Fee Related CN1239609C (zh) 2001-02-15 2002-02-19 树脂组合物及其用途以及它们的制造方法
CNB2005100859622A Expired - Fee Related CN100393802C (zh) 2001-02-15 2002-02-19 树脂组合物及其用途以及它们的制造方法

Family Applications After (1)

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CNB2005100859622A Expired - Fee Related CN100393802C (zh) 2001-02-15 2002-02-19 树脂组合物及其用途以及它们的制造方法

Country Status (4)

Country Link
US (1) US6720077B2 (https=)
JP (1) JP4783984B2 (https=)
CN (2) CN1239609C (https=)
MY (1) MY136400A (https=)

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EP1359175B1 (en) * 2000-12-14 2007-12-05 Hitachi Chemical Company, Ltd. Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
JP2003049051A (ja) * 2001-08-02 2003-02-21 Hitachi Chem Co Ltd 難燃性樹脂組成物及びその用途
JP3923441B2 (ja) * 2003-03-25 2007-05-30 三光株式会社 難燃性合成樹脂組成物
JP2006001967A (ja) * 2004-06-15 2006-01-05 Hitachi Chem Co Ltd 難燃性樹脂組成物およびこの組成物を用いたプリプレグ，金属張り積層板，プリント配線板
CN100371387C (zh) * 2004-12-20 2008-02-27 中国科学院广州化学研究所 两种环氧化硅油改性环氧树脂复合材料
JP5245301B2 (ja) * 2007-06-28 2013-07-24 住友ベークライト株式会社 樹脂組成物、プリプレグ、積層板、及び半導体装置
JP2011505461A (ja) * 2007-11-29 2011-02-24 ダウ グローバル テクノロジーズ インコーポレイティド 熱硬化性エポキシ樹脂用硬化剤としてジシアンジアミドを使用するジメチルホルムアミドを含まない配合物
WO2010026777A1 (ja) * 2008-09-05 2010-03-11 横浜ゴム株式会社 熱硬化性エポキシ樹脂組成物
TWI388567B (zh) * 2008-11-14 2013-03-11 Chang Chun Plastics Co Ltd 含磷化合物及其製法
JP5149917B2 (ja) * 2009-03-27 2013-02-20 日立化成工業株式会社 熱硬化性樹脂組成物、並びにこれを用いたプリプレグ、積層板及び多層プリント配線板
US20120077401A1 (en) 2009-03-27 2012-03-29 Tomohiko Kotake Resin composition for production of clad layer, resin film for production of clad layer utilizing the resin composition, and optical waveguide and optical module each utilizing the resin composition or the resin film
KR101141305B1 (ko) * 2009-03-31 2012-05-04 코오롱인더스트리 주식회사 인-변성 페놀 노볼락 수지, 이를 포함하는 경화제 및 에폭시 수지 조성물
US20130101863A1 (en) * 2010-04-21 2013-04-25 Mitsubishi Gas Chemical Company, Inc. Heat curable composition
US9145488B2 (en) 2011-05-19 2015-09-29 Chemtura Corporation Aluminum phosphorus acid salts as epoxy resin cure inhibitors
JP2013000995A (ja) * 2011-06-17 2013-01-07 Panasonic Corp 金属張積層板、及びプリント配線板
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CN103304883B (zh) * 2012-03-14 2015-10-28 中国科学院化学研究所 含磷杂环化合物的无卤阻燃乙烯-醋酸乙烯共聚物的组合物
CN103897338B (zh) * 2012-12-25 2016-04-20 中山台光电子材料有限公司 无卤素树脂组合物及其应用
CN104497493A (zh) * 2015-01-15 2015-04-08 江苏恒神纤维材料有限公司 一种无卤低烟低毒阻燃环氧树脂体系
JP7211749B2 (ja) * 2018-09-27 2023-01-24 日鉄ケミカル＆マテリアル株式会社 リン含有硬化剤、該リン含有硬化剤とエポキシ樹脂を含有するエポキシ樹脂組成物、およびその硬化物

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JP2002060593A (ja) * 2000-08-23 2002-02-26 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物及びその用途

Also Published As

Publication number Publication date
CN1370802A (zh) 2002-09-25
CN100393802C (zh) 2008-06-11
US6720077B2 (en) 2004-04-13
JP2002241470A (ja) 2002-08-28
US20020155298A1 (en) 2002-10-24
JP4783984B2 (ja) 2011-09-28
MY136400A (en) 2008-09-30
CN1721476A (zh) 2006-01-18

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20060201

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CF01 Termination of patent right due to non-payment of annual fee