CN1238906C - 在杂质扩散区之间具有减小的寄生电容的半导体器件 - Google Patents
在杂质扩散区之间具有减小的寄生电容的半导体器件 Download PDFInfo
- Publication number
- CN1238906C CN1238906C CNB031209289A CN03120928A CN1238906C CN 1238906 C CN1238906 C CN 1238906C CN B031209289 A CNB031209289 A CN B031209289A CN 03120928 A CN03120928 A CN 03120928A CN 1238906 C CN1238906 C CN 1238906C
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- Prior art keywords
- impurity diffusion
- marker space
- groove
- diffusion zone
- semiconductor device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000012535 impurity Substances 0.000 title claims abstract description 111
- 238000009792 diffusion process Methods 0.000 title claims abstract description 86
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 230000003071 parasitic effect Effects 0.000 title description 24
- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000003989 dielectric material Substances 0.000 claims abstract description 9
- 238000000926 separation method Methods 0.000 claims abstract 3
- 239000003550 marker Substances 0.000 claims description 65
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 23
- 229920005591 polysilicon Polymers 0.000 claims description 23
- 230000003667 anti-reflective effect Effects 0.000 claims description 12
- 230000005611 electricity Effects 0.000 claims description 2
- 239000010410 layer Substances 0.000 abstract description 36
- 239000002344 surface layer Substances 0.000 abstract 2
- 230000003287 optical effect Effects 0.000 description 38
- 229910052796 boron Inorganic materials 0.000 description 27
- -1 boron ion Chemical class 0.000 description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 16
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 229910052814 silicon oxide Inorganic materials 0.000 description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 9
- 229910052698 phosphorus Inorganic materials 0.000 description 9
- 239000011574 phosphorus Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000009977 dual effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910001439 antimony ion Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229940090044 injection Drugs 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02024—Position sensitive and lateral effect photodetectors; Quadrant photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/761—PN junctions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76202—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using a local oxidation of silicon, e.g. LOCOS, SWAMI, SILO
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/763—Polycrystalline semiconductor regions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/1446—Devices controlled by radiation in a repetitive configuration
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Light Receiving Elements (AREA)
- Bipolar Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002081041A JP4342142B2 (ja) | 2002-03-22 | 2002-03-22 | 半導体受光素子 |
JP081041/2002 | 2002-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1447445A CN1447445A (zh) | 2003-10-08 |
CN1238906C true CN1238906C (zh) | 2006-01-25 |
Family
ID=28449108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031209289A Expired - Lifetime CN1238906C (zh) | 2002-03-22 | 2003-03-21 | 在杂质扩散区之间具有减小的寄生电容的半导体器件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6828644B2 (zh) |
JP (1) | JP4342142B2 (zh) |
KR (1) | KR100878543B1 (zh) |
CN (1) | CN1238906C (zh) |
TW (1) | TW587333B (zh) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI244117B (en) * | 2003-03-26 | 2005-11-21 | Komatsu Denshi Kinzoku Kk | Semiconductor epitaxy wafer |
WO2005001939A1 (ja) * | 2003-06-30 | 2005-01-06 | Rohm Co., Ltd. | イメージセンサおよびフォトダイオードの分離構造の形成方法 |
KR100555526B1 (ko) * | 2003-11-12 | 2006-03-03 | 삼성전자주식회사 | 포토 다이오드 및 그 제조방법 |
JP4841834B2 (ja) * | 2004-12-24 | 2011-12-21 | 浜松ホトニクス株式会社 | ホトダイオードアレイ |
US7307327B2 (en) * | 2005-08-04 | 2007-12-11 | Micron Technology, Inc. | Reduced crosstalk CMOS image sensors |
JP2008066446A (ja) * | 2006-09-06 | 2008-03-21 | Sony Corp | 半導体積層構造および半導体素子 |
JP2010103221A (ja) * | 2008-10-22 | 2010-05-06 | Panasonic Corp | 光半導体装置 |
EP2202795A1 (en) * | 2008-12-24 | 2010-06-30 | S.O.I. TEC Silicon | Method for fabricating a semiconductor substrate and semiconductor substrate |
DE102011009373B4 (de) * | 2011-01-25 | 2017-08-03 | Austriamicrosystems Ag | Fotodiodenbauelement |
DE102011056369A1 (de) * | 2011-12-13 | 2013-06-13 | Pmdtechnologies Gmbh | Halbleiterbauelement mit trench gate |
US9006833B2 (en) * | 2013-07-02 | 2015-04-14 | Texas Instruments Incorporated | Bipolar transistor having sinker diffusion under a trench |
WO2015136418A1 (en) * | 2014-03-13 | 2015-09-17 | Semiconductor Energy Laboratory Co., Ltd. | Imaging device |
KR102380829B1 (ko) * | 2014-04-23 | 2022-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 촬상 장치 |
CN105448945B (zh) | 2015-12-29 | 2019-07-05 | 同方威视技术股份有限公司 | 同面电极光电二极管阵列及其制作方法 |
US10672934B2 (en) * | 2017-10-31 | 2020-06-02 | Taiwan Semiconductor Manufacturing Company Ltd. | SPAD image sensor and associated fabricating method |
US11217718B2 (en) | 2019-02-11 | 2022-01-04 | Allegro Microsystems, Llc | Photodetector with a buried layer |
US11296247B2 (en) * | 2019-02-11 | 2022-04-05 | Allegro Microsystems, Llc | Photodetector with a buried layer |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0695571B2 (ja) | 1985-10-12 | 1994-11-24 | 新技術事業団 | 光電変換装置 |
JPH0389550A (ja) | 1989-08-31 | 1991-04-15 | Hamamatsu Photonics Kk | バイポーラトランジスタの製造方法 |
JP2662062B2 (ja) * | 1989-12-15 | 1997-10-08 | キヤノン株式会社 | 光電変換装置 |
JPH0745912A (ja) | 1993-07-30 | 1995-02-14 | Sony Corp | 半導体レーザ装置 |
US6054365A (en) * | 1998-07-13 | 2000-04-25 | International Rectifier Corp. | Process for filling deep trenches with polysilicon and oxide |
JP2000156521A (ja) | 1998-11-19 | 2000-06-06 | Mitsubishi Electric Corp | 半導体装置及び半導体装置の製造方法 |
-
2002
- 2002-03-22 JP JP2002081041A patent/JP4342142B2/ja not_active Expired - Lifetime
-
2003
- 2003-03-18 TW TW092105956A patent/TW587333B/zh not_active IP Right Cessation
- 2003-03-21 CN CNB031209289A patent/CN1238906C/zh not_active Expired - Lifetime
- 2003-03-21 KR KR1020030017737A patent/KR100878543B1/ko active IP Right Grant
- 2003-03-21 US US10/393,389 patent/US6828644B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP4342142B2 (ja) | 2009-10-14 |
CN1447445A (zh) | 2003-10-08 |
KR100878543B1 (ko) | 2009-01-14 |
TW587333B (en) | 2004-05-11 |
KR20030082372A (ko) | 2003-10-22 |
TW200305281A (en) | 2003-10-16 |
US6828644B2 (en) | 2004-12-07 |
JP2003282848A (ja) | 2003-10-03 |
US20030197190A1 (en) | 2003-10-23 |
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Legal Events
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C06 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FUJITSU MICROELECTRONICS CO., LTD. Free format text: FORMER OWNER: FUJITSU LIMITED Effective date: 20090327 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090327 Address after: Tokyo, Japan Co-patentee after: Sharp Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Kanagawa Co-patentee before: Sharp Corp. Patentee before: FUJITSU Ltd. |
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C56 | Change in the name or address of the patentee |
Owner name: FUJITSU SEMICONDUCTOR CO., LTD. Free format text: FORMER NAME: FUJITSU MICROELECTRON CO., LTD. |
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CP03 | Change of name, title or address |
Address after: Kanagawa Co-patentee after: Sharp Corp. Patentee after: FUJITSU MICROELECTRONICS Ltd. Address before: Tokyo, Japan Co-patentee before: Sharp Corp. Patentee before: Fujitsu Microelectronics Ltd. |
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TR01 | Transfer of patent right |
Effective date of registration: 20190718 Address after: Osaka Japan Patentee after: Sharp Corp. Address before: Kanagawa Co-patentee before: Sharp Corp. Patentee before: FUJITSU MICROELECTRONICS Ltd. |
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Granted publication date: 20060125 |
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