CN120814047A - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法

Info

Publication number
CN120814047A
CN120814047A CN202380095365.4A CN202380095365A CN120814047A CN 120814047 A CN120814047 A CN 120814047A CN 202380095365 A CN202380095365 A CN 202380095365A CN 120814047 A CN120814047 A CN 120814047A
Authority
CN
China
Prior art keywords
semiconductor device
semiconductor element
semiconductor
heat radiation
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380095365.4A
Other languages
English (en)
Chinese (zh)
Inventor
吉冈佑毅
矢野佑树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120814047A publication Critical patent/CN120814047A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380095365.4A 2023-03-09 2023-03-09 半导体装置及其制造方法 Pending CN120814047A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/009053 WO2024185127A1 (ja) 2023-03-09 2023-03-09 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
CN120814047A true CN120814047A (zh) 2025-10-17

Family

ID=92674541

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380095365.4A Pending CN120814047A (zh) 2023-03-09 2023-03-09 半导体装置及其制造方法

Country Status (4)

Country Link
JP (1) JP7778271B2 (https=)
CN (1) CN120814047A (https=)
DE (1) DE112023005941T5 (https=)
WO (1) WO2024185127A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024127170A (ja) * 2023-03-09 2024-09-20 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102495A (ja) * 1999-09-28 2001-04-13 Toshiba Corp 半導体装置
JP2002151633A (ja) * 2000-11-08 2002-05-24 Citizen Watch Co Ltd 樹脂封止型半導体装置
JP2003243582A (ja) * 2002-02-21 2003-08-29 Hitachi Unisia Automotive Ltd 半導体装置
JP2004327555A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置
JP5023604B2 (ja) * 2006-08-09 2012-09-12 富士電機株式会社 半導体装置
JP5633210B2 (ja) * 2010-06-28 2014-12-03 富士通セミコンダクター株式会社 半導体装置
JP2012146711A (ja) * 2011-01-07 2012-08-02 Panasonic Corp 半導体装置
US10410945B2 (en) * 2015-03-23 2019-09-10 Hitachi, Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPWO2024185127A1 (https=) 2024-09-12
WO2024185127A1 (ja) 2024-09-12
DE112023005941T5 (de) 2026-01-15
JP7778271B2 (ja) 2025-12-01

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