DE112023005941T5 - Halbleitervorrichtung und Fertigungsverfahren dafür - Google Patents

Halbleitervorrichtung und Fertigungsverfahren dafür

Info

Publication number
DE112023005941T5
DE112023005941T5 DE112023005941.1T DE112023005941T DE112023005941T5 DE 112023005941 T5 DE112023005941 T5 DE 112023005941T5 DE 112023005941 T DE112023005941 T DE 112023005941T DE 112023005941 T5 DE112023005941 T5 DE 112023005941T5
Authority
DE
Germany
Prior art keywords
heat dissipation
component
semiconductor device
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112023005941.1T
Other languages
German (de)
English (en)
Inventor
Yuki Yoshioka
Yuki Yano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112023005941T5 publication Critical patent/DE112023005941T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112023005941.1T 2023-03-09 2023-03-09 Halbleitervorrichtung und Fertigungsverfahren dafür Pending DE112023005941T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/009053 WO2024185127A1 (ja) 2023-03-09 2023-03-09 半導体装置及びその製造方法

Publications (1)

Publication Number Publication Date
DE112023005941T5 true DE112023005941T5 (de) 2026-01-15

Family

ID=92674541

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112023005941.1T Pending DE112023005941T5 (de) 2023-03-09 2023-03-09 Halbleitervorrichtung und Fertigungsverfahren dafür

Country Status (4)

Country Link
JP (1) JP7778271B2 (https=)
CN (1) CN120814047A (https=)
DE (1) DE112023005941T5 (https=)
WO (1) WO2024185127A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024127170A (ja) * 2023-03-09 2024-09-20 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102495A (ja) * 1999-09-28 2001-04-13 Toshiba Corp 半導体装置
JP2002151633A (ja) * 2000-11-08 2002-05-24 Citizen Watch Co Ltd 樹脂封止型半導体装置
JP2003243582A (ja) * 2002-02-21 2003-08-29 Hitachi Unisia Automotive Ltd 半導体装置
JP2004327555A (ja) * 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置
JP5023604B2 (ja) * 2006-08-09 2012-09-12 富士電機株式会社 半導体装置
JP5633210B2 (ja) * 2010-06-28 2014-12-03 富士通セミコンダクター株式会社 半導体装置
JP2012146711A (ja) * 2011-01-07 2012-08-02 Panasonic Corp 半導体装置
US10410945B2 (en) * 2015-03-23 2019-09-10 Hitachi, Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPWO2024185127A1 (https=) 2024-09-12
WO2024185127A1 (ja) 2024-09-12
CN120814047A (zh) 2025-10-17
JP7778271B2 (ja) 2025-12-01

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Legal Events

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R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023360000

Ipc: H10W0040200000