JP7778271B2 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法

Info

Publication number
JP7778271B2
JP7778271B2 JP2025505031A JP2025505031A JP7778271B2 JP 7778271 B2 JP7778271 B2 JP 7778271B2 JP 2025505031 A JP2025505031 A JP 2025505031A JP 2025505031 A JP2025505031 A JP 2025505031A JP 7778271 B2 JP7778271 B2 JP 7778271B2
Authority
JP
Japan
Prior art keywords
semiconductor device
heat dissipation
dissipation member
semiconductor
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2025505031A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024185127A1 (https=
JPWO2024185127A5 (https=
Inventor
佑毅 吉岡
佑樹 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2024185127A1 publication Critical patent/JPWO2024185127A1/ja
Publication of JPWO2024185127A5 publication Critical patent/JPWO2024185127A5/ja
Application granted granted Critical
Publication of JP7778271B2 publication Critical patent/JP7778271B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2025505031A 2023-03-09 2023-03-09 半導体装置及びその製造方法 Active JP7778271B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/009053 WO2024185127A1 (ja) 2023-03-09 2023-03-09 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JPWO2024185127A1 JPWO2024185127A1 (https=) 2024-09-12
JPWO2024185127A5 JPWO2024185127A5 (https=) 2025-05-09
JP7778271B2 true JP7778271B2 (ja) 2025-12-01

Family

ID=92674541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505031A Active JP7778271B2 (ja) 2023-03-09 2023-03-09 半導体装置及びその製造方法

Country Status (4)

Country Link
JP (1) JP7778271B2 (https=)
CN (1) CN120814047A (https=)
DE (1) DE112023005941T5 (https=)
WO (1) WO2024185127A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024127170A (ja) * 2023-03-09 2024-09-20 三菱電機株式会社 半導体装置および半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102495A (ja) 1999-09-28 2001-04-13 Toshiba Corp 半導体装置
JP2002151633A (ja) 2000-11-08 2002-05-24 Citizen Watch Co Ltd 樹脂封止型半導体装置
JP2004327555A (ja) 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置
JP2012146711A (ja) 2011-01-07 2012-08-02 Panasonic Corp 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003243582A (ja) * 2002-02-21 2003-08-29 Hitachi Unisia Automotive Ltd 半導体装置
JP5023604B2 (ja) * 2006-08-09 2012-09-12 富士電機株式会社 半導体装置
JP5633210B2 (ja) * 2010-06-28 2014-12-03 富士通セミコンダクター株式会社 半導体装置
US10410945B2 (en) * 2015-03-23 2019-09-10 Hitachi, Ltd. Semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102495A (ja) 1999-09-28 2001-04-13 Toshiba Corp 半導体装置
JP2002151633A (ja) 2000-11-08 2002-05-24 Citizen Watch Co Ltd 樹脂封止型半導体装置
JP2004327555A (ja) 2003-04-22 2004-11-18 Matsushita Electric Works Ltd 半導体装置
JP2012146711A (ja) 2011-01-07 2012-08-02 Panasonic Corp 半導体装置

Also Published As

Publication number Publication date
JPWO2024185127A1 (https=) 2024-09-12
WO2024185127A1 (ja) 2024-09-12
CN120814047A (zh) 2025-10-17
DE112023005941T5 (de) 2026-01-15

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